JPH0787167B2 - Electronic component manufacturing method - Google Patents

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing an electronic component that is molded and coated with a resin material.

2. Description of the Related Art Conventionally, as shown in FIG. 6, an electronic component, such as a tantalum solid electrolytic capacitor, which is externally molded with a resin material, is obtained by pressure-molding and sintering tantalum powder into a prismatic shape, and forming an oxide film layer on the surface thereof. Capacitor element 2 is formed by sequentially forming a manganese dioxide layer and a cathode conductive layer of carbon, silver or the like. Reference numeral 1 is an anode lead derived from the element 2. Next, as shown in FIG. 5, a base plating layer of nickel, copper, silver, etc. and / or solder is formed on the outer surface of the strip-shaped base metal 12.
After forming the top plating layer 13 such as tin, the opposite terminal pieces 14 and 15 and the feed holes 16 are continuously formed at equal intervals by a punching process and washed, and one of the opposite terminal pieces 14 and 15 is cleaned. (6th
In the embodiment shown in the figure, the anode lead 1 is welded to 15), and the cathode conductive layer of the capacitor element 2 is connected to the other (14 in the embodiment of FIG. 6) with solder, conductive resin, etc. It is configured as a mold exterior. Further, a method of masking the above-mentioned upper plating layer to form only the required portion is also adopted.

Problems to be Solved by the Invention However, the electronic component manufactured by the above-described conventional manufacturing method is
The terminal strip is plated and then stamped, and the resin is used to mold the package so that the base metal is exposed on the stamped section. If the base metal material is copper or iron, surface oxidation will cause rust. It's easy to do. After the punching process, a degreasing and washing process for removing the attached machine oil is required, resulting in high cost.
If the punching process and the degreasing and cleaning process are continuously automated, there is a problem that the equipment becomes large.

Means for Solving the Problems The present invention solves the above-mentioned problems, in which a strip-shaped base metal is continuously formed at equal intervals by a punching process before a plating process. The surface of the base metal and all the surfaces of the punched cross-section are washed and plated to form a plated layer and washed, and the electrode portion of the electronic component element is connected to the counter terminal piece to form the electronic component element. Characterized by molding the opposite terminal piece with a plating layer formed on the surface and all the surfaces of the punched section with a resin material, and bending the lead-out portion of the opposite terminal piece along the side surface and the bottom surface of the molding material. And a method for manufacturing an electronic component.

Action After stamping the strip-shaped base metal before plating, in order to form and wash the plating layer on the surface of the base metal and all surfaces of the punched cross section, the base is applied to the cross section of the opposing terminal piece in the mold exterior. Since the metal is not exposed and the base metal does not come into direct contact with the resin material, rust due to surface oxidation does not occur. Since the washing process at the time of punching can be omitted and the washing before and after the plating treatment can be utilized, the punching process and the plating treatment process can be easily linked, and the productivity is remarkably improved.

Examples Hereinafter, the present invention will be described with reference to Examples of the method for manufacturing the tantalum solid electrolytic capacitor shown in FIGS. 1 to 4.

First, as shown in FIG. 2, tantalum powder was pressure-molded into a prism shape and sintered, and an oxide film layer, a manganese dioxide layer and carbon were formed on the surface of a sintered body having an anode lead 1 at one end.
Capacitor element 2 is formed by sequentially forming a cathode conductive layer of silver or the like. Next, as shown in FIG. 1, the strip-shaped base metal 3
After forming the opposing terminal pieces 4 and 5 and the feed holes 6 at equal intervals by punching, the surface and punching cross-section of the base metal 3 are washed and plated, and nickel,
A plating layer 7 (hatched portion in FIG. 1) consisting of a base plating layer of copper, silver or the like and a top plating layer of solder, tin or the like is formed, and one of the opposing terminal pieces 4 and 5 (see FIG. 2) is formed. In the embodiment, the cathode conductive layer which is the electrode portion of the capacitor element 2 is electrically connected to 4) by solder, conductive resin or the like, and the anode lead 1 is welded to the other (5 in the embodiment of FIG. 2). Connected. Then, the capacitor element 2 is molded with a resin material 8, the connecting rod 9 provided on the strip-shaped base metal 3 and one of the opposite terminal pieces 4 or 5 are cut, and the opposite terminal piece is subjected to an aging step of energizing the capacitor. 4 and 5 are cut, and the lead-out portions of the opposite terminal pieces 4 and 5 are completed by bending along the side surface and the bottom surface of the mold exterior. The base plating layer may be omitted in the above-mentioned embodiment.

FIG. 3 and FIG. 4 show another embodiment, in which after the above-mentioned stamping process, the base plating layer 10 is formed, and masking paint or The tape is covered and immersed in a plating solution to form an upper plating layer 11 (a portion where diagonal lines intersect in the embodiment of FIG. 3) at the lead-out portion of the opposite terminal piece, and then the masking paint or tape is applied. Remove the above-mentioned counter terminal pieces 4, 5
The cathode conductive layer, which is the electrode portion of the capacitor element 2, and the anode lead 1 are connected to the above, and the resin material 8 is molded and packaged. Then, the same steps as described above are performed, and the structure is as shown in FIG.

In addition to the above-described embodiments, the present invention can be applied to other electronic components such as chip type film capacitors, which are molded with resin material.

EFFECTS OF THE INVENTION The method for manufacturing an electronic component of the present invention has a significantly improved antirust effect as described above, and the punching process and the plating process can be easily linked, which is extremely advantageous in terms of productivity. It has the effect of, and has great industrial value.

[Brief description of drawings]

1 and 3 are perspective views of a main part of a strip-shaped base metal in the process of manufacturing an electronic component according to the present invention, and FIGS. 2 and 4 show different embodiments of the electronic component manufactured according to the present invention. A completed sectional view, FIG. 5 is a perspective view of an essential part of a strip-shaped base metal in the process of manufacturing an electronic component by a conventional method, FIG.
The figure is a completed cross-sectional view of an electronic component manufactured by a conventional method. 1: Anode lead, 2: Capacitor element 3: Band-shaped base metal, 4, 5: Counter terminal piece 6: Feed hole, 7, 10, 11: Plating layer 8: Resin material

Claims (2)

[Claims] 1. A strip-shaped base metal is continuously punched to form opposed terminal pieces and feed holes at regular intervals before plating, and then the surface of the base metal and all surfaces of a punched cross section are cleaned. And a plating layer is formed through a plating process, and the electrode portion of the electronic component element is connected to the counter terminal piece,
The electronic component element and a facing terminal piece having a plated layer formed on the surface and all the surfaces of the punched cross section are molded with a resin material, and the lead-out portion of the facing terminal piece is provided along the side surface and the bottom surface of the mold housing. A method for manufacturing an electronic component, which is characterized by bending by bending. 2. A base plating layer is formed on the surface of the base metal and all the surfaces of the punched cross-section, and then masking paint or tape is coated on the base metal except for the portion of the opposing terminal piece that is pulled out from the mold exterior. Immersing the base metal in a plating solution to form an upper plating layer on the lead-out portion of the opposite terminal piece, and then removing the masking paint or tape,
The method of manufacturing an electronic component according to claim 1, wherein an electrode portion of an electronic component element is connected to the opposing terminal piece, and the electronic component element body is molded with a resin material.