JPH0783173B2 - Flux deposition device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial field of application] The present invention relates to a flux deposition apparatus, more specifically a hybrid IC.
The present invention relates to a flux depositing device for depositing flux on a printed circuit board in preprocessing for soldering electronic components such as the above to a printed circuit board.

[Prior Art] Conventionally, as a device of this type, a rotatable hollow drum is disposed so that a part thereof is immersed in the flux stored in a flux tank, and a large number of holes are formed through the drum. Along with
There is a drum provided with an air nozzle capable of injecting compressed air upward. In this device, the drum is rotated and compressed air is jetted from the air nozzle, and the flux attached to the surface of the drum is blown upward through the holes as the drum rotates, and is positioned above the device. It is attached to the printed circuit board.

[Problems to be Solved by the Invention] However, in the above flux depositing apparatus, since a certain gap is formed between the apparatus and the printed circuit board, the flux depositing apparatus can be applied to a place other than a portion where the flux depositing of the printed circuit board is desired. There is a problem that not only the flux adheres, but also the flux blown off by the compressed air may escape to the outside from this gap.

An object of the present invention is to provide a flux depositing device that can deposit flux only on a desired portion of a printed circuit board and does not allow flux to escape to the outside.

[Means for Solving the Problems] A first invention is to provide a spray chamber having one side opened, a flux deposition surface of a printed circuit board exposed in the spray chamber, and the substrate and the opening of the spray chamber. A blocking member that closes the space, a spraying unit that is installed in the spray chamber and sprays the flux toward the opening of the spray chamber so that the flux is deposited on the flux deposition surface of the printed circuit board, and a spray in the spray chamber. The gist of the invention is a flux depositing device including an exhaust device for discharging outward.

A second aspect of the invention is a spray chamber that opens upward, a blocking member that exposes a flux deposition surface of a printed circuit board to the spray chamber, and that blocks between the substrate and the opening of the spray chamber; Injecting means for injecting the flux toward the opening of the spray chamber in order to apply the flux to the flux-adhered surface of the substrate, and to convey the printed circuit board above the spray chamber and to spray the same. Flux consisting of a transport means for transporting from above the chamber to another process, and an upward moving means capable of moving the spray chamber upward so as to lift the printed circuit board located above the spray chamber at the opening of the spray chamber. The subject is a deposition device.

A third invention is, in the flux deposition apparatus of the second invention, a flux deposition apparatus provided with an exhaust device for discharging the spray in the spray chamber to the outside.

[Operation] In the first invention, the flux ejected by the ejecting means is adhered only to the flux adhered surface of the printed circuit board exposed in the spray chamber, and is not adhered to other places. Since the printed board and the opening of the spray chamber are closed by the closing member, the injected flux does not leak from the spray chamber to the outside. Further, of the fluxes ejected by the ejecting means, those not adhered to the printed circuit board are exhausted outward in the form of mist by the exhaust device, so that the flux not adhered to the substrate enters the spray chamber. It does not gradually accumulate and hinder the injection operation of the injection means.

A second aspect of the invention is that the printed circuit board that has been transported to a position above the spray chamber by the transport means is lifted up by the upward movement means to the opening of the spray chamber, and the substrate and the opening of the spray chamber The space is closed by a closing member. The cracks ejected by the ejecting means are adhered only to the flux adhered surface of the printed circuit board exposed in the spray chamber, and are not adhered to other places. Moreover, the injected flux does not leak from the spray chamber to the outside.

The third invention is, among the fluxes injected into the injection means,
Those which are not adhered to the printed circuit board are exhausted to the outside in the form of mist by the exhaust device. Therefore, the flux that has not been deposited on the substrate does not gradually accumulate in the spray chamber and interferes with the spraying operation of the spraying means.

[Embodiment] A first embodiment of the present invention will be described below with reference to FIG.

The spray chamber 1 has a box-like shape and is opened at the upper side to form an opening 1a. A spray nozzle 2 serving as an injection unit is arranged in the lower part of the spray chamber 1 so as to face upward,
One of the pair of pipes 2a provided in the nozzle 2 is connected to a tank (not shown) that stores flux, and the other is connected to a compressor via a valve (not shown).

A flat plate-shaped pallet 3 serving as a closing member is detachably mounted on the spray chamber 1 so as to close the opening 1a, and the inside of the spray chamber 1 is a through hole provided through the pallet 3.
It is open upward only through 3a.

The case of applying the flux to the printed circuit board W by the flux applying apparatus configured as described above will be described. First, the printing with the surface to be applied with the flux (hereinafter referred to as the flux applied surface) facing down When the operator places the substrate W on the pallet 3 as shown by the phantom line,
Only the adhered surface of the substrate W is exposed to the inside of the spray chamber 1 through the through hole 3a, and the inside of the spray chamber 1 is completely closed.

Next, when the operator opens the valve, the flux is ejected upward from the spray nozzle 2 together with the compressed air of the compressor, and the flux is deposited on the flux deposition surface of the printed circuit board W. The operator removes the printed circuit board W treated in this way from the pallet 3 and places a new unprocessed substrate W on the pallet 3 and repeats the above-described operation.

Thus, according to the flux deposition apparatus of this embodiment,
Since the flux is injected with the spray chamber 1 completely closed by the pallet 3, the injected flux does not leak to the outside.

Further, in the flux deposition apparatus of the present embodiment, only the deposition surface of the printed circuit board W is exposed in the spray chamber 1 by the pallet 3, so that the sprayed flux is deposited on other parts of the substrate W. Never.

Next, a second embodiment in which the present invention is embodied in another flux deposition apparatus will be described with reference to FIGS. Only in the second embodiment, one mode of the exhaust device, the conveying means and the moving means of the present invention will be described.

As shown in FIGS. 2 (a) and 2 (b), the deposition apparatus of this embodiment is installed on the line of a conveyor 4 as a conveying means, and the conveyors 4 are arranged in parallel at a predetermined interval. It consists of a pair of chains 4a and is driven by a sprocket 5. A work supply unit 6 is provided on the upstream side of the conveyor 4, and a heater (not shown) for drying flux is installed on the downstream side of the conveyor 4.

The work supply section 6 of the conveyor 4 is provided with a pallet 3 as a closing member, which is the same as that of the first embodiment, so as to be bridged between both chains 4a. The spray chamber 1 is the conveyor 4
Is installed between both chains 4a on the lower side, and an opening 1a is formed in the upper part as in the first embodiment,
A spray nozzle 2 as an injection means is provided inside. Further, a limit switch (not shown) is installed on the conveyor 4 so that the conveyor 4 can detect that the pallet 3 is conveyed to the spray chamber 1.

The spray chamber 1 is vertically moved by a cylinder 7 as an upward moving means while being guided by a guide rail (not shown), and as shown in FIGS. 2 (a) and 2 (b), the opening 1a of the spray chamber 1 is As shown in FIGS. 3 (a) and 3 (b), a lower position located below the conveying surface of the conveyor 1 and an opening 1a projecting above the space between both chains 4, A switching operation is performed between two positions, an upper position located on the upper side and an upper position. A discharge hole 8 is provided on one side of the spray chamber 1, and an exhaust device (not shown) connected to the discharge hole 8 exhausts the air in the spray chamber 1 to the outside through the discharge hole 8. Has become. The spray chamber 1 is usually on standby at the lower position.

A case of applying flux to the printed circuit board W by the flux applying apparatus configured as described above will be described. First, as shown in FIGS. 2 (a) and 2 (b), the surface on which wax is to be applied is first described. The printed circuit board W with the
After the operator places the pallet 3 on the pallet 3 as shown by a virtual line, the conveyor 4 is operated. The pallet 3 is conveyed to the conveyor 4 and reaches above the spray chamber 1, and when this is detected by the limit switch, FIG. 3 (a),
As shown in (b), the spray chamber 1 is moved by the cylinder 7.
Moves up from the lower position to the upper position and lifts the pallet 3. Only the adhered surface of the printed circuit board W is exposed in the spray chamber 1 through the through hole 3a, and the spray chamber 1 is completely closed.

Then, the valve is opened, and the flux is jetted upward from the spray nozzle 2 together with the compressed air of the compressor, and is deposited on the flux deposition surface of the printed circuit board W. After that, when the spray chamber 1 descends from the upper position to the lower position and the pallet 3 is placed on the conveyor 4 again, the pallet 3 is conveyed to the conveyor 4 and its flux is dried by the heater. On the other hand, the worker is the conveyor 4
A new pallet 3 is placed on the work supply section 6, and an unprocessed printed circuit board W is placed on the pallet 3 and the same work as described above is repeated.

Thus, according to the flux deposition apparatus of this embodiment,
When the spray chamber 1 is pushed up by the pallet 3 on the conveyor 4, the spray chamber 1 is completely closed by the pallet 3, so that the injected flux leaks to the outside as in the first embodiment described above. There is no.

Further, in the flux deposition apparatus of the present embodiment, as in the first embodiment, only the deposition surface of the printed circuit board W is exposed in the spray chamber 1, so that the injected flux causes the substrate W to flow.
It does not adhere to other parts of the.

Furthermore, the flux depositing apparatus of this embodiment includes the conveyor 4
Since the automatic conveyance is performed by the method, the flux deposition work of the printed circuit board W can be performed with high efficiency.

On the other hand, since the exhaust chamber is connected to the spray chamber 1 of the flux depositing apparatus of the present embodiment, of the flux ejected by the spray nozzle 2, the flux not deposited on the printed circuit board W is atomized. It can be exhausted to the outside. Therefore, the flux not deposited on the substrate W gradually accumulates in the spray chamber 1 and does not hinder the spraying operation of the spray nozzle 2.

In the flux deposition apparatus of this embodiment, the printed board W and the opening 1a of the spray chamber 1 are closed by the pallet 3 to prevent the flux in the spray chamber 1 from leaking to the outside. The closing member of the present invention is not limited to this, and for example, as shown in FIG.
It is also possible to connect an umbrella-shaped attachmet 9 having an open top as a closing member, and to close the space between the printed board W and the opening 1a of the spray chamber 1 by the attachment 9. Also in this case, not only can the flux in the spray chamber 1 be prevented from leaking to the outside by the attachment 9, but by changing the shape of the attachment 9, it is possible to deal with various types of printed circuit boards W.

[Effects of the Invention] As described in detail above, according to the first invention, the flux can be applied only to a desired portion of the printed circuit board, and there is no fear that the flux will escape to the outside, and moreover, the printed circuit board can be covered. Since the atomized flux that has not been deposited does not gradually accumulate in the spray chamber and interferes with the jetting operation of the jetting means, there is an excellent effect that the flux depositing operation can be performed efficiently.

Further, according to the second aspect of the invention, the flux can be applied only to a desired portion of the printed board, there is no fear that the flux will escape to the outside, and the prints sequentially conveyed by moving the spray chamber upward. Since it can be adhered to the substrate via the blocking member, the excellent effect that the flux deposition work can be performed more efficiently is achieved.

Furthermore, according to the third invention, in addition to the effect of the second invention,
The excellent effect that the flux deposition operation can be performed more efficiently without the mist-like flux not deposited on the printed circuit board gradually accumulating in the spray chamber and impeding the jetting operation of the jetting means .

[Brief description of drawings]

FIG. 1 is a partially cutaway perspective view showing the flux depositing apparatus of the first embodiment, and FIG. 2 (a) is a sectional view showing a case where the flux depositing apparatus of the second embodiment is in a lower position. 2 (b) is a partial side view showing the case where the pallet of FIG. 2 (a) has moved to above the spray chamber, and FIG. 3 (a) shows a case where the flux depositing device is also at the upper position. Cross section,
FIG. 3 (b) is a partial side view of FIG. 3 (a), and FIG. 4 is a cross-sectional view showing another example of a flux deposition device using an attachment instead of a pallet. 1 is a spray chamber, 1a is an opening, 3 is a pallet as a closing member, 4 is a conveyor as a conveying means, 7 is a cylinder as an upward moving means, and W is a printed circuit board.

Claims (3)

[Claims] 1. A spray chamber (1) having an opening on one side, and a flux deposition surface of a printed circuit board (W) is exposed in the spray chamber (1), and the substrate (W) and the spray chamber (1) are also exposed. ) A closing member (3) for closing the opening (1a)
And an injection means (injecting means for injecting the flux toward the opening (1a) of the spray chamber (1) so that the flux is adhered to the flux adhered surface of the printed circuit board (W). A flux depositing device comprising 2) and an exhaust device for discharging the spray in the spray chamber (1) to the outside. 2. A spray chamber (1) having an opening on one side, and a flux-coated surface of a printed circuit board (W) is exposed in the spray chamber (1) and the substrate (W) and the spray chamber (1) are exposed. ) A closing member (3) for closing the opening (1a)
And an injection means (injecting means for injecting the flux toward the opening (1a) of the spray chamber (1) so that the flux is adhered to the flux adhered surface of the printed circuit board (W). 2) and a transfer means (4) for transferring the printed circuit board (W) to the upper side of the spray chamber (1) and transferring it from above the spray chamber (1) to another process, and In order to lift the printed circuit board (W) located above in the opening (1a) of the spray chamber (1), a flux cover composed of an upward moving means (7) capable of moving the spray chamber (1) upward. Wearing device. 3. The flux depositing device according to claim 2, further comprising an exhaust device for discharging the spray in the spray chamber (1) to the outside.