JPH0782346A - Resin composition for sealing semiconductor - Google Patents

Abstract

PURPOSE:To obtain a resin composition for sealing semiconductor excellent in soldering-heat resistance and moldability by forming a resin composition comprising an epoxy resin, a phenolic curing agent and an inorganic filler, wherein said curing agent contains a specified phenolic curing agent. CONSTITUTION:The resin composition is one essentially consisting of an epoxy resin, a phenolic curing agent and an inorganic filler, wherein said epoxy resin contains an epoxy resin represented by formula I (wherein two of R<1> to R<8> are 2,3-epoxypropoxyl groups, and the rest of them are H, 1-4 C alkyl and halogen) and the phenolic curing agent contains a phenolic compound obtained by reacting a phenol with an aromatic aldehyde and a xylene compound represented by formula II (wherein R<9> and R<10> are each H, 1-4C alkyl or 2-4C acyl). The mixing ratio of the epoxy resin to the phenolic curing agent is desirably such that the chemical equivalent ratio of the hydroxyl groups to the epoxy groups is in the range of 0.7/1.3.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor encapsulating epoxy resin composition having excellent solder heat resistance and moldability.

[0002]

2. Description of the Related Art Epoxy resin is mainly used for encapsulating electronic circuit parts such as semiconductor devices. In recent years, with the miniaturization and thinning of semiconductor packages and surface mounting of mounting process, encapsulating resin has been used. However, different characteristics are required. Semiconductor packages have been made smaller and thinner in order to increase the mounting density, and the mounting method has also changed from the conventional method of inserting lead pins into the holes of the board to the surface mounting method of soldering components to the surface of the board. In the conventional pin insertion mounting method, partial heating of the lead part was sufficient for soldering, and there was no particular effect on the sealing material.
In the surface mounting method, the entire package is immersed in a heating medium and heated. Therefore, the moisture resistance and heat resistance of the encapsulant become a problem, and the conventional orthocresol novolac type epoxy resin, the novolac type phenolic resin, and the resin composition composed of silica powder were insufficient as encapsulants in the surface mounting method. . That is, there is a problem in that, when the absorbed moisture becomes vapor due to the heating at the time of soldering, a crack is generated in the resin portion and the reliability is lowered. In order to eliminate such a defect, various sealing materials have been studied.

For example, a method of using a curing agent in combination with tris (hydroxyphenyl) methane and a phenol aralkyl resin (Japanese Patent Laid-Open No. 1-292029), and a method of modifying an epoxy resin or a phenol type curing agent with silicone (Japanese Patent Laid-Open No. 2-2980). JP-A-4-127590, JP-A-2-202914), a method using a mixture of a phenol aralkyl resin and a dicyclopentadiene phenol resin as a curing agent (JP-A-4-359013), and the like have been proposed.

[0004]

However, none of these resins has sufficient solder heat resistance, and the properties required as a sealing material for thin surface mounting have not been sufficiently satisfied. For example, even when a combination of tris (hydroxyphenyl) methane and phenol aralkyl resin is used as a curing agent, if the conventional orthocresol novolac type epoxy resin is used as the epoxy resin, the moisture absorption rate of the cured product is high and the solder heat resistance is high. Is low.

Therefore, it has been proposed to use an epoxy resin having a biphenyl skeleton as the epoxy resin (JP-A-1-108256), but if a conventional novolac type phenol resin is used as a curing agent, the moisture resistance is poor. As a result, sufficient solder heat resistance cannot be obtained. If an epoxy resin having a biphenyl or naphthalene skeleton is used as the epoxy resin, and a phenol aralkyl resin is used as the curing agent (Japanese Patent Laid-Open No. Hei.
No. 325517), the heat resistance of solder is considerably improved, but the moldability such as fluidity, curability, and mold release property is lowered, and the glass transition temperature is also lowered.

An object of the present invention is to solve the above problems and provide an epoxy resin composition for semiconductor encapsulation which is excellent in solder heat resistance and is excellent in moldability (fluidity / curability / releasing property). Especially.

[0007]

The present inventors have found that the above problems can be solved by combining a specific epoxy resin and a specific curing agent, and have completed the present invention. That is, the present invention is a resin composition containing an epoxy resin, a phenolic curing agent and an inorganic filler as essential components, wherein the epoxy resin has the formula (1)

[0008]

[Chemical 3]

(In the formula, two of R ^{1 to} R ⁸ are 2,
3-epoxypropoxy group, the other groups are each independently a hydrogen atom, a C ₁ -C ₄ lower alkyl group or a halogen atom) containing an epoxy resin represented by
The phenol-based curing agent comprises phenols, an aromatic aldehyde, and the formula (2)

[0010]

[Chemical 4]

(In the formula, R ⁹ and R ¹⁰ are each a hydrogen atom, a C ₁ -C ₄ lower alkyl group, or a carbon number of 2-4.
The present invention is directed to a resin composition for semiconductor encapsulation, which comprises a phenolic compound obtained by reacting with a xylylene compound represented by Hereinafter, the configuration of the present invention will be described in detail. The epoxy resin used in the present invention has the formula (1)

[0012]

[Chemical 5]

(In the formula, two of R ^{1 to} R ⁸ are 2,
It is a 3-epoxypropoxy group, and the other groups each independently contain an epoxy resin represented by a hydrogen atom, a C ₁ -C ₄ lower alkyl group or a halogen atom) as an essential component. These epoxy resins are bifunctional epoxy resins having two epoxy groups in one molecule and have a naphthalene skeleton, and thus have extremely high heat resistance.

Preferred examples of the epoxy resin of the above formula (1) include 1,5-di (2,3-epoxypropoxy) naphthalene and 1,5-di (2,3-epoxypropoxy) -7-methyl. Naphthalene, 1,6-di (2,3-
Epoxy propoxy) naphthalene, 1,6-di (2,3
-Epoxypropoxy) -2-methylnaphthalene, 1,
6-di (2,3-epoxypropoxy) -8-methylnaphthalene, 1,6-di (2,3-epoxypropoxy)
-4,8-Dimethylnaphthalene, 2-bromo-1,6-
Examples include di (2,3-epoxypropoxy) naphthalene, 8-bromo-1,6-di (2,3-epoxypropoxy) naphthalene, and 2,7-di (2,3-epoxypropoxy) naphthalene. , 5-Di (2,3-epoxypropoxy) naphthalene, 1,6-di (2,3-epoxypropoxy) naphthalene and 2,7-di (2,3-epoxypropoxy) naphthalene are particularly preferred.

The epoxy resin in the resin composition of the present invention may contain the epoxy resin of the above formula (1),
It can be used alone or in combination with other epoxy resins. The proportion of the epoxy resin of the formula (1) in the epoxy resin is not particularly limited, but it is preferably 50% by weight or more. Other epoxy resins that can be mixed are not limited,
Preferably ortho-cresol novolac type epoxy resin,
Phenol novolac type epoxy resin, bisphenol A type epoxy resin, bisphenol F type epoxy resin,
Halogenated epoxy resin and the like. Also, equation (3)

[0016]

[Chemical 6]

(In the formula, R ^{11 to} R ¹⁸ are each independently a hydrogen atom, a C _{1 to} C ₄ lower alkyl group or a halogen atom. In the formula, n represents 0 or an integer of 1 or more. A mixture with an epoxy resin represented by () is also used.

Preferred specific examples of the epoxy resin of the above formula (3) are 4,4'-bis (2,3-epoxypropoxy) biphenyl and 4,4'-bis (2,3-epoxypropoxy) -3. 3 ', 5,5'-tetramethylbiphenyl, 4,4'-bis (2,3-epoxypropoxy)
-3,3 ', 5,5'-tetramethyl-2-bromobiphenyl, 4,4'-bis (2,3-epoxypropoxy) -3,3', 5,5'-tetraethylbiphenyl,
4,4'-bis (2,3-epoxypropoxy) -3,3
3 ', 5,5'-tetrabutylbiphenyl and the like are mentioned, and 4,4'-bis (2,3-epoxypropoxy) biphenyl, 4,4'-bis (2,3-epoxypropoxy) -3,3 Particularly preferred is', 5,5'-tetramethylbiphenyl.

The content of the epoxy resin in the resin composition of the present invention is usually 3 to 20% by weight, preferably 4 to 15% by weight. Phenolic curing agents used in the present invention, phenols and aromatic aldehyde and formula (2)

[0020]

[Chemical 7]

(In the formula, R ⁹ and R ¹⁰ are each a hydrogen atom, a C ₁ -C ₄ lower alkyl group or a carbon number of 2-4.
(Which is an acyl group), a phenolic compound obtained by reacting with a xylylene compound.

This phenolic compound can be easily produced by reacting a phenol, an aromatic aldehyde and a xylylene compound represented by the above formula (2) in the presence of an acid catalyst.

Examples of phenols used as raw materials for the above-mentioned phenol compounds include phenol, cresol, xylenol, ethylphenol, butylphenol, halogenated phenol, resorcin, bisphenol A, bisphenol S and bisphenol F. Further, phenols having a polycyclic aromatic skeleton such as α-naphthol, β-naphthol, anthracenol, and naphthalenediol have the same effect and can be used similarly. Of these phenols having a monocyclic or polycyclic aromatic skeleton, preferably phenol,
Cresol and naphthol are used. These phenols can be used alone or as a mixture of two or more kinds.

Aromatic aldehydes used as raw materials for the above phenolic compounds include benzaldehyde,
Examples thereof include naphthaldehyde and anthracene aldehyde, but benzaldehyde and naphthaldehyde are preferably used.

The xylylene compound used as a raw material for the above phenolic compound is represented by the above formula (2), and examples of such a compound include xylylene glycol, xylylene glycol dimethyl ether, xylylene glycol diethyl ether, and xylylene glycol. Examples thereof include ren glycol diacetoxy ester and xylylene glycol dipropoxy ester, and xylylene glycol and xylylene glycol dimethyl ether are particularly preferable.

As the acid catalyst used for producing the above-mentioned phenolic compound, inorganic acids such as phosphoric acid, sulfuric acid and hydrochloric acid,
And organic acids such as oxalic acid, benzenesulfonic acid, toluenesulfonic acid and methanesulfonic acid, or Friedel-Crafts catalysts such as zinc chloride, stannic chloride, ferric chloride and diethylsulfate, used alone or in combination. It may be selected according to the kind of the xylylene compound.

The reaction between the phenols, the aromatic aldehydes and the xylylene compound is usually carried out within the range of 100 to 180 ° C.
~ 10 hours. This reaction proceeds while producing alcohol or carboxylic acid depending on the type of xylylene compound used, in addition to water produced by condensation. After the completion of the condensation reaction, the unreacted phenols remaining in the system are distilled off under vacuum or by a suitable method such as steam distillation to obtain the phenol compound used in the present invention.

When a phenol, an aromatic aldehyde and a xylylene compound are reacted in the presence of an acid catalyst, the aromatic aldehyde and the xylylene compound may be added simultaneously to proceed the reaction, or either one may be added first. It is also possible to carry out the reaction and then add the other to continue the reaction further.

In the production of the above-mentioned phenolic compound, the total ratio of the aromatic aldehyde and the xylylene compound to the phenols is based on 1 mol of the phenols.
0.1 to 0.8 mol is preferred. If it is less than 0.1, the amount of unreacted phenol increases and the yield decreases, which is not preferable. Also
When it exceeds 0.8, the molecular weight of the produced resin increases, the softening temperature rises, and the fluidity at the time of molding tends to be lowered, which is not preferable.

In the production of this phenolic compound,
The ratio of the xylylene compound to the aromatic aldehyde is
The range of 0.1 to 5 is suitable for 1 mol of the aromatic aldehyde. If it is less than 0.1, the cured product obtained by adding and curing the epoxy resin tends to be slightly stiff and brittle. If this ratio is larger than 5, the glass transition point becomes low, which is not preferable.

The phenolic compound obtained as described above varies depending on the types of phenols and aromatic aldehydes used as raw materials, but its typical structure is represented by the following formula.
Shown in (4) to (6). However, the structural units in [] are randomly distributed in the copolymer.

[0032]

[Chemical 8]

[0033]

[Chemical 9]

[0034]

[Chemical 10]

(In the formula, R ^{19 to} R ²⁴ are each independently
It is a hydrogen atom, a C ₁ -C ₄ lower alkyl group, or a halogen atom. Further, in the formula, m and n represent integers of 1 or more and 10 or less. ) In the above formulas, the values of m and n are arbitrary so as to achieve the desired physical properties by changing the charging ratio of the raw materials phenols, aromatic aldehydes and the xylylene compound represented by the general formula (2). Can be adjusted to The phenolic compound of the present invention has the formula (4), the formula (5) and the formula (6)
It is not limited in any way.

This phenolic compound has a number average molecular weight of
Phenolic hydroxyl group equivalent is 140 to 22 at about 500 to 3000
It is preferably about 0. There is no particular limitation on the ratio of the above-mentioned phenolic compound contained in the phenolic curing agent, but in order to exert a more sufficient effect, this phenolic compound is contained in the phenolic curing agent in an amount of 40% by weight or more. Preferably.

Further, the phenol-based curing agent in the present invention may be a mixture of the phenol-based compound of the formula (3) and another epoxy resin curing agent, and the other curing agent is not particularly limited. Novolac resin, cresol novolac resin, phenol aralkyl resin, tris (hydroxyphenyl) methane, 1,1,2-tris
(Hydroxyphenyl) ethane, 1,1,3-tris
(Hydroxyphenyl) propane, bisphenol A, bisphenol F, dihydroxybiphenyl and the like can be preferably used.

In the resin composition of the present invention, the compounding ratio of the epoxy resin and the phenolic curing agent is such that the chemical equivalent ratio of hydroxyl group / epoxy group is 0.7 to 1.3 from the viewpoint of mechanical properties and moisture resistance.
Is more preferable, and it is particularly preferable that it is in the range of 0.8 to 1.2.

In the present invention, a curing accelerator is used if necessary, but any accelerator can be used as long as it accelerates the curing reaction of the epoxy resin and the phenolic curing agent. For example, 2-methylimidazole, 2,4-dimethylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, imidazole compound such as 2-heptadecylimidazole, triethylamine, triethylamine Tertiary amines such as ethylenediamine, benzyldimethylamine, 2,4,6-tris (dimethylaminomethyl) phenol, 1,8-diazabicyclo (5,4,0) undecene-7, triphenylphosphine, trimethylphosphine, triethylphosphine. , Tributylphosphine, tri (p-methylphenyl) phosphine, tri (nonylphenyl) phosphine and other organic phosphine compounds, tetraphenylphosphonium tetraphenylborate, triphenylphosphine tetraphenyl Examples include tetraphenylboron salts such as ruborate and 2-ethyl-4-methylimidazole tetraphenylborate. From the viewpoint of moisture resistance, organic phosphine compounds are preferable, and triphenylphosphine is particularly preferable.

These curing catalysts may be used singly or in combination of two or more kinds, and they are added to 100 parts by weight of the epoxy resin.
It is preferably added in the range of 0.5 to 5 parts by weight. The inorganic filler used in the present invention can be used without particular limitation as long as it is a commonly used filler, and specific examples include amorphous silica, crystalline silica, silicon nitride, silicon carbide, calcium carbonate. , Magnesium carbonate, alumina, magnesia, clay, talc, calcium silicate,
Examples thereof include titanium oxide and glass fiber. Among them, crystalline silica is preferably used from the viewpoint of low stress.

The proportion of the inorganic filler in the resin composition of the present invention is preferably 60 to 95% by weight based on the total weight in view of moldability and low stress. Moldability (melt viscosity, fluidity)
From the viewpoint of low stress and low hygroscopicity, it is preferable that the amount of the filler is large, and it is preferable to use a spherical filler having a wide particle size distribution.

The moisture resistance reliability can be improved by surface-treating the inorganic filler with a coupling agent such as a silane coupling agent or a titanate coupling agent. As a coupling agent, epoxy silane, amino silane,
Silane coupling agents such as acrylic silane and vinyl silane are suitable.

Other conventional additives can be appropriately added to the epoxy resin composition of the present invention. For example,
Halogenated epoxy resins, halogen compounds, flame retardants such as phosphorus compounds, flame retardant aids such as antimony trioxide, colorants such as carbon black, silicone rubber, modified nitrile rubber, modified polybutadiene rubber, elastomer such as modified silicone oil, A thermoplastic resin such as polyethylene, a long-chain fatty acid, a metal salt of a long-chain fatty acid, an ester of a long-chain fatty acid, and a release agent such as paraffin wax can be added.

The epoxy resin composition of the present invention may be prepared by a kneading method such as melt kneading. For example, a mixture of the above components is kneader, roll, uniaxial or biaxial extruder or cokneader. Melt kneading is performed using a known kneading device, and after cooling, an epoxy resin molding material having an appropriate shape is obtained. Hereinafter, the present invention will be specifically described with reference to examples.

[0045]

【Example】

[Production Example 1] (Production of Phenol Compound A) A four-necked flask equipped with a stirrer, a thermometer, a condenser, and a nitrogen gas inlet tube was charged with 620 parts by weight of phenol.
230 parts by weight of benzaldehyde, 350 parts by weight of p-xylylene glycol dimethyl ether, and 2 parts by weight of p-toluenesulfonic acid (monohydrate) were added, and the mixture was heated to 100 to 150 ° C. for dehydration and demethanol removal. The reaction was carried out until no generation of condensation by-products was observed. Then, the unreacted phenol in the system was removed by vacuum distillation to obtain the target product. The condensation reaction product thus obtained had a softening point of 72 ° C. and a hydroxyl group equivalent of 165 g / eq.

Production Example 2 (Production of Phenolic Compound B) Using the apparatus used in Production Example 1, 1-naphthol 640 parts by weight, p-xylylene glycol 160 parts by weight, benzaldehyde 120 parts by weight, p-toluene. 1 part by weight of sulfonic acid (monohydrate) was added, the mixture was heated to 100 to 165 ° C., and the reaction was carried out with dehydration until no generation of condensed water was observed. After that, unreacted 1-naphthol was removed by steam distillation under reduced pressure to obtain a target product. The obtained condensation reaction product has a softening point of 77 ° C and a hydroxyl equivalent of 196 g.
It was / eq.

[Production Example 3] (Production of Phenolic Compound C) The apparatus used in Production Example 1 was charged with 620 parts by weight of phenol, 340 parts by weight of 2-naphthaldehyde, 350 parts by weight of p-xylylene glycol dimethyl ether, and p-toluene. Sulfonic acid
(1 hydrate) Add 2 parts by weight and heat to 100-160 ° C.
While performing dehydration and demethanol, the reaction was carried out until no generation of condensation by-products was observed. Then, the reaction product was dissolved in methyl isobutyl ketone, washed with a separating funnel, and the solvent and unreacted phenol were removed from the organic layer by vacuum distillation to obtain the target product. The obtained condensation reaction product has a softening point of 80 ° C and a hydroxyl equivalent of 182 g / eq.
Met.

[Examples 1 to 5] The epoxy resin shown in Table 1 and the phenolic compound (curing agent) and the compounding agent shown in Table 2 were added.
After blending in the proportions shown in Table 2 and thoroughly premixing, the mixture was kneaded at a kneading temperature of 80 to 100 ° C. for about 8 minutes using a heating roll. Then, it cooled and grind | pulverized and obtained the epoxy resin composition. Various physical properties of the obtained epoxy resin composition were measured and evaluated. The results are shown in Table 4. The physical properties of these resin compositions were measured by the following methods.

(1) Spiral Flow Using the resin composition, a spiral flow distance was measured by applying a pressure of 70 kgf / cm ^{2 with} a mold at 175 ° C.

(2) Curable resin composition was transfer molded in a mold at 175 ° C. for 10 minutes.
The curability was evaluated by measuring the hardness after 2 seconds.

(3) Glass transition temperature The resin composition was transferred to a transfer molding machine at 175 ° C. ×
After molding under the condition of 120 seconds, 180 ° C for another 2 hours at 180 ℃
A test piece of an appropriate size was cut out from a molded product that had been post-cured at ℃ for 6 hours, and the glass transition temperature was measured by the TMA method.

(4) Moisture absorption QFP package (Package size: 17 × 17 × 1.8 mm,
Chip size: 8 × 8 × 0.5 mm) was molded using a transfer molding machine under the conditions of 175 ° C × 120 seconds, and then 150
It was post-cured at 2 ° C for 2 hours and at 180 ° C for 6 hours. The moisture absorption of this package was measured from the weight change after absorbing moisture for 72 hours at 85 ° C and 85% RH.

(5) Solder heat resistance Twenty test packages immediately after measuring the moisture absorption rate were
The number of packages with cracks was determined by immersing in a solder bath at ℃ for 20 seconds.

[Comparative Examples 1 to 3] Phenol aralkyl resin and phenol novolac resin were used alone as the phenol-based curing agent,
Epoxy resin and other compounding agents were blended in the proportions shown in Table 3 in the same manner as in Examples 1 to 5 to produce a semiconductor encapsulating resin composition molding material, and the obtained encapsulating material sample was subjected to physical properties. It measured like Example 1-5. The results are shown in Table 4.

As is clear from the results shown in Table 4, the epoxy resin compositions of the present invention (Examples 1 to 5) had excellent fluidity, low moisture absorption and high glass transition temperature. Also, the occurrence of cracks after immersion in the solder bath was very small.

On the other hand, in Comparative Example 3 containing no epoxy resin having a naphthalene skeleton, the moisture absorption was high and the solder heat resistance was inferior. Further, even if the epoxy resin having a naphthalene skeleton was contained, Comparative Example 2 in which only the conventional phenol novolac resin was used as the curing agent also had a high moisture absorption rate and poor solder heat resistance. Further, in Comparative Example 1 containing the epoxy resin having a naphthalene skeleton and using only the phenol aralkyl resin as the curing agent, the moisture absorption rate and the solder heat resistance were almost the same as those of the Examples.
The flowability and curability were low, and the glass transition temperature was low.

[0057]

[Table 1]

[0058]

[Table 2]

[0059]

[Table 3]

[0060]

[Table 4]

[0061]

EFFECTS OF THE INVENTION According to the present invention, by combining a specific epoxy resin and a specific curing agent, it has a low moisture absorption rate and excellent solder heat resistance, and also has both moldability and heat resistance (high glass transition temperature). An epoxy resin composition is obtained. Therefore, when this is used as a sealing material for a semiconductor device, cracks do not occur even in the soldering process by the surface mounting method, and it is possible to easily obtain a semiconductor excellent in solder heat resistance and reliability. .

[Procedure amendment]

[Submission date] May 19, 1994

[Procedure Amendment 1]

[Document name to be amended] Statement

[Correction target item name] 0004

[Correction method] Change

[Correction content]

[0004]

However, none of these resins has sufficient solder heat resistance, and the properties required as a sealing material for thin surface mounting have not been sufficiently satisfied. For example, even when used in combination with tris (hydroxyphenyl) methane and phenol aralkyl resin as a curing agent, moisture absorption is high solder heat resistance of the in the cured product was used ortho-cresol novolak type epoxy resin of the conventional epoxy resin Is low.

[Procedure Amendment 2]

[Document name to be amended] Statement

[Name of item to be corrected] 0023

[Correction method] Change

[Correction content]

Examples of phenols used as raw materials for the above-mentioned phenol compounds include phenol, cresol, xylenol, ethylphenol, butylphenol, halogenated phenol, resorcin, bisphenol A, bisphenol S and bisphenol F. Also, alpha-naphthol, beta chromatography naphthol, anthracenol, it can be used to phenol also same as having a polycyclic aromatic skeleton of naphthalene diols.
Among these phenols having a monocyclic or polycyclic aromatic skeleton, phenol, cresol and naphthol are preferably used. These phenols can be used alone or as a mixture of two or more kinds.

[Procedure 3]

[Document name to be amended] Statement

[Correction target item name] 0026

[Correction method] Change

[Correction content]

As the acid catalyst used for producing the above-mentioned phenolic compound, inorganic acids such as phosphoric acid, sulfuric acid and hydrochloric acid,
And oxalic acid, benzenesulfonic acid, toluenesulfonic acid, methanesulfonic acid , trifluoromethanesulfone
An organic acid such as an acid, or a Friedel-Crafts catalyst such as zinc chloride, stannic chloride, ferric chloride, or diethylsulfate can be used alone or in combination, and can be selected according to the type of xylylene compound. Good.

[Procedure amendment 4]

[Document name to be amended] Statement

[Correction target item name] 0031

[Correction method] Change

[Correction content]

The phenolic compound obtained as described above varies depending on the types of phenols and aromatic aldehydes used as raw materials, but typical structural examples are shown in the following formulas (4) to (6). . However, the structural units in [] are randomly distributed in the copolymer.

[Procedure Amendment 5]

[Document name to be amended] Statement

[Name of item to be corrected] 0032

[Correction method] Change

[Correction content]

[0032]

[Chemical 8]

[Procedure correction 6]

[Document name to be amended] Statement

[Correction target item name] 0033

[Correction method] Change

[Correction content]

[0033]

[Chemical 9]

[Procedure Amendment 7]

[Document name to be amended] Statement

[Correction target item name] 0034

[Correction method] Change

[Correction content]

[0034]

[Chemical 10]

[Procedure Amendment 8]

[Document name to be amended] Statement

[Correction target item name] 0035

[Correction method] Change

[Correction content]

(In the formula, R ^{19 to} R ²² are each independently a hydrogen atom, a C _{1 to} C ₄ lower alkyl group, or a halogen atom. In the formula, m and n are 1 or more and 10 or less. The phenolic compound of the present invention is not limited by the formula (4), the formula (5) and the formula (6).

[Procedure Amendment 9]

[Document name to be amended] Statement

[Correction target item name] 0036

[Correction method] Change

[Correction content]

[0036] The number average molecular weight is the phenolic compound at about 500 to 3000, water group equivalent 140 to 220
Something is preferable .

[Procedure Amendment 10]

[Document name to be amended] Statement

[Name of item to be corrected] 0037

[Correction method] Change

[Correction content]

The phenolic curing agent used in the present invention is
It may be a mixture of the above-mentioned phenolic compound and another epoxy resin curing agent, and the other curing agent is not particularly limited, and examples thereof include phenol novolac resin, cresol novolac resin, phenol aralkyl resin, tris (hydroxyphenyl) methane. , 1,1,2-Tris (hydroxyphenyl) ethane, 1,1,3-tris (hydroxyphenyl) propane, bisphenol A, bisphenol F, dihydroxybiphenyl and the like can be preferably used. The pheno contained in the phenolic curing agent
There is no particular limitation regarding the proportion of the ruthenium compound, but it is more limited.
This phenolic compound is necessary to exert a sufficient effect.
40% by weight or more in a phenolic curing agent
It is preferable.

[Procedure Amendment 11]

[Document name to be amended] Statement

[Correction target item name] 0050

[Correction method] Change

[Correction content]

(2) Curability The resin composition was transfer molded with a mold at 175 ° C.,
The curability was evaluated by measuring the hardness immediately after demolding.

[Procedure Amendment 12]

[Document name to be amended] Statement

[Correction target item name] 0060

[Correction method] Change

[Correction content]

[0060]

[Table 4]

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁶ Identification code Internal reference number FI technical display location H01L 23/29 23/31

Claims (1)

[Claims] 1. A resin composition comprising an epoxy resin, a phenolic curing agent and an inorganic filler as essential components, wherein the epoxy resin has the formula (1): (In the formula, two of R ^{1 to} R ⁸ are 2,3-epoxypropoxy groups, and the other groups are each independently a hydrogen atom, a C _{1 to} C ₄ lower alkyl group or a halogen atom. There is an epoxy resin represented by, the phenol-based curing agent, a phenol and aromatic aldehyde and formula
(2) [Chemical 2] (In the formula, R ⁹ and R ¹⁰ are each a hydrogen atom, C ₁ to
A resin composition for semiconductor encapsulation, which comprises a phenolic compound obtained by reacting with a xylylene compound represented by a C ₄ lower alkyl group or an acyl group having 2 to 4 carbon atoms.