JPH0780382B2 - Semiconductor device card - Google Patents
Semiconductor device cardInfo
- Publication number
- JPH0780382B2 JPH0780382B2 JP62306114A JP30611487A JPH0780382B2 JP H0780382 B2 JPH0780382 B2 JP H0780382B2 JP 62306114 A JP62306114 A JP 62306114A JP 30611487 A JP30611487 A JP 30611487A JP H0780382 B2 JPH0780382 B2 JP H0780382B2
- Authority
- JP
- Japan
- Prior art keywords
- frame
- panel
- semiconductor device
- card
- shaped
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000004065 semiconductor Substances 0.000 title claims description 14
- 239000000853 adhesive Substances 0.000 claims description 17
- 230000001070 adhesive effect Effects 0.000 claims description 17
- 239000002184 metal Substances 0.000 claims description 4
- 230000000694 effects Effects 0.000 description 1
Landscapes
- Credit Cards Or The Like (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 この発明は、ゲームカード及び産業用カードなどに用い
られる半導体装置カードに係り、特に、パネルとフレー
ムとの接合に関するものである。Description: TECHNICAL FIELD The present invention relates to a semiconductor device card used for game cards, industrial cards, and the like, and more particularly to joining a panel and a frame.
例えば、テレビゲーム用ソフトを内蔵したゲームカード
や産業用メモリカードなどに用いられる従来の半導体装
置カード（以下単にカードと称する）は、第３図、第４
図に示すように構成されている。図において、１はカー
ド基本となるフレーム、２はこのフレームの表裏に装着
され内部の半導体素子を保護するパネル、３はシヤツ
タ、４はパネル２上の接着部である。For example, a conventional semiconductor device card (hereinafter simply referred to as a card) used for a game card having a built-in video game software or an industrial memory card is shown in FIGS.
It is configured as shown in the figure. In the figure, 1 is a frame which is a basic card, 2 is a panel which is mounted on the front and back of this frame and protects internal semiconductor elements, 3 is a shutter and 4 is an adhesive portion on the panel 2.
次に動作について説明する。ここでは、シヤツタ付きの
カードエツジタイプの半導体装置カードを示している。
このカードをカードリーダ側のコネクタ（図示せず）に
挿入した場合、常時は閉じているシヤツタ３が開き、シ
ヤツタの下に設けられた電極端子（図示せず）がコネク
タの各電極接触面（図示せず）に接触することにより、
情報のやり取りを行つている。Next, the operation will be described. Here, a card edge type semiconductor device card with a shutter is shown.
When this card is inserted into a connector (not shown) on the card reader side, the normally closed shutter 3 is opened, and the electrode terminals (not shown) provided under the shutter are connected to the respective electrode contact surfaces of the connector ( (Not shown)
We are exchanging information.
また半導体素子を保護するために、パネル２が両面に接
合されているが、この接合は、フレーム１とパネル２の
間に接着面を設け、パネルの周囲の接着部４に接着剤を
つけることによつて接合している。Further, in order to protect the semiconductor element, the panel 2 is bonded to both sides. This bonding is performed by providing an adhesive surface between the frame 1 and the panel 2 and applying an adhesive to the adhesive portion 4 around the panel. It is joined by.
従来の半導体装置カードは以上のように構成されている
ので、両面の金属パネルをフレームに接着するための接
着面積が非常に少なく、接着力が弱いという問題があつ
た。Since the conventional semiconductor device card is configured as described above, there is a problem that the bonding area for bonding the metal panels on both sides to the frame is very small and the bonding strength is weak.
この発明は上記のような問題点を解消するためになされ
たもので、接着面積を多く取り、パネルとフレームとの
接着力を上げるとともに、パネルの強度も上げることを
目的とする。The present invention has been made in order to solve the above problems, and an object thereof is to increase the adhesive strength between a panel and a frame by increasing the adhesive area between the panel and the frame.
この発明における半導体装置カードは、パネルの周囲に
設けた接着部の外に折り曲げ部を設けて、この折り曲げ
部をフレームに設けた溝に嵌め込んだものである。In the semiconductor device card according to the present invention, a bent portion is provided outside the adhesive portion provided around the panel, and the bent portion is fitted into a groove provided in the frame.
この発明に係る半導体装置カードは、折り曲げ部を設け
ることによつて、接着面積を大きくとり接着力を上げる
とともに、パネルの強度も向上する。In the semiconductor device card according to the present invention, by providing the bent portion, a large adhesive area is obtained to increase the adhesive force and also the strength of the panel is improved.
以下、この発明の一実施例を図について説明する。第１
図、第２図において、１は周りにコ字形の溝６を有する
フレーム、２はパネル、４は上記溝６の内周で上記パネ
ルの周囲に設けられたコ字形の接着部、５はパネルの周
囲に設けられたコ字形の折り曲げ部で、上記フレームの
周りに設けたコ字形のくぼんだ溝６に嵌め込まれ互いに
接合される。An embodiment of the present invention will be described below with reference to the drawings. First
In FIG. 2 and FIG. 1, 1 is a frame having a U-shaped groove 6 around it, 2 is a panel, 4 is a U-shaped adhesive portion provided around the panel on the inner periphery of the groove 6, and 5 is a panel. The U-shaped bent portion provided around the frame is fitted into the U-shaped recessed groove 6 provided around the frame and joined to each other.
以上のようなものにおいて、カードを組立てる場合は、
フレーム１上の接着部４にパネル２を接着するととも
に、その周りに設けられた溝６にパネル２の折り曲げ部
５を嵌め込むことによつて、接着面積が多くとれて接着
力を強めることができるとともに、一枚の平板で作られ
たパネルに比べて、パネルの強度も向上する。When assembling the card in the above things,
By bonding the panel 2 to the bonding part 4 on the frame 1 and fitting the bent part 5 of the panel 2 into the groove 6 provided around the bonding part 4, a large bonding area can be obtained and the bonding strength can be increased. In addition to being able to do it, the strength of the panel is improved compared to the panel made of one flat plate.
以上のようにこの発明によれば、フレームのコ字形接着
部の周りに溝を設け、一方、パネルの周囲にコ字形の折
り曲げた部分を設けて、パネルをフレームの接着部に接
着するとともに、パネルの折り曲げ部をこれに対向する
フレームの溝に嵌め込んで接合するように構成したの
で、パネルとフレームとの接着強度が大幅に増し、ま
た、パネル自身の強度も向上するという効果がある。As described above, according to the present invention, the groove is provided around the U-shaped adhesive portion of the frame, while the U-shaped bent portion is provided around the panel to bond the panel to the adhesive portion of the frame, Since the bent portion of the panel is configured to be fitted and joined in the groove of the frame facing it, the adhesive strength between the panel and the frame is significantly increased, and the strength of the panel itself is also improved.
第１図はこの発明の一実施例によるカードを示す斜視
図、第２図はそのパネルのみの斜視図、第３図は従来の
カードを示す斜視図、第４図は第３図のＡ部の拡大図で
ある。 図中、１はフレーム、２はパネル、３はシヤツタ、４は
接着部、５は折り曲げ部、６は溝である。 尚、図中同一符号は同一または相当部分を示す。FIG. 1 is a perspective view showing a card according to an embodiment of the present invention, FIG. 2 is a perspective view showing only its panel, FIG. 3 is a perspective view showing a conventional card, and FIG. 4 is a part A in FIG. FIG. In the figure, 1 is a frame, 2 is a panel, 3 is a shutter, 4 is an adhesive portion, 5 is a bent portion, and 6 is a groove. The same reference numerals in the drawings indicate the same or corresponding parts.
Claims (1)
内部半導体素子を保護するために金属パネルを接合して
なる半導体装置カードにおいて、上記半導体装置を内部
に収納するフレームの周りにコ字形の接着部を形成する
とともに、この接着部の周りに沿ってコ字形の溝を設
け、一方、上記表裏金属パネルの周りにコ字形の折り曲
げ部を形成し、この金属パネルの周辺を上記フレームの
コ字形接着部に接着するとともに、上記コ字形折り曲げ
部を上記フレームに設けたコ字形の溝に嵌め込んで接合
したことを特徴とする半導体装置カード。1. A front and back of a frame accommodating a semiconductor device,
In a semiconductor device card formed by joining a metal panel to protect an internal semiconductor element, a U-shaped adhesive portion is formed around a frame that houses the semiconductor device therein, and along the periphery of the adhesive portion. A U-shaped groove is provided, while a U-shaped bent portion is formed around the front and back metal panels, and the periphery of the metal panel is bonded to the U-shaped adhesive portion of the frame, and the U-shaped bent portion is A semiconductor device card characterized by being fitted and joined in a U-shaped groove provided in a frame.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62306114A JPH0780382B2 (en) | 1987-12-02 | 1987-12-02 | Semiconductor device card |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62306114A JPH0780382B2 (en) | 1987-12-02 | 1987-12-02 | Semiconductor device card |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01146794A JPH01146794A (en) | 1989-06-08 |
| JPH0780382B2 true JPH0780382B2 (en) | 1995-08-30 |
Family
ID=17953213
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62306114A Expired - Fee Related JPH0780382B2 (en) | 1987-12-02 | 1987-12-02 | Semiconductor device card |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0780382B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11149539A (en) * | 1997-11-17 | 1999-06-02 | Mitsubishi Electric Corp | Ic card |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0632389Y2 (en) * | 1987-11-18 | 1994-08-24 | ファナック株式会社 | IC card case |
-
1987
- 1987-12-02 JP JP62306114A patent/JPH0780382B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH01146794A (en) | 1989-06-08 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| S111 | Request for change of ownership or part of ownership |
Free format text: JAPANESE INTERMEDIATE CODE: R313111 |
|
| R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
| LAPS | Cancellation because of no payment of annual fees |