JPH0779073A - Jig for assembling electronic part into three-dimensional printed board - Google Patents

Abstract

PURPOSE:To make it possible to simultaneously assemble a plurality of three- dimensional printed boards, and perform subsequent soldering of parts at a time, by moving each of a pair of part holders in and outside the space between a front side printed board and a back side printed board. CONSTITUTION:The front side leads 9a of all electronic parts 7 are inserted into the proper through holes in a front side printed board 6a. A back side printed board 6b is positioned using a positioning means 10, and placed on the electronic parts 7. Thus the back side leads 9 of the electronic parts 7 are inserted into the proper through holes in the back side printed board 6b, and a three-dimensional printed board is temporarily assembled. The temporarily assembled three-dimensional printed board is set on a soldering apparatus 4. This makes it possible to solder leads on the bottom side at a time by dip soldering in a subsequent soldering process, and thus enables leads soldering on both sides to be made simultaneously.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a jig for assembling electronic parts used in a manufacturing process of a three-dimensionally mounted printed circuit board.

[0002]

2. Description of the Related Art Recent electronic devices are strongly required to be small and lightweight and have high processing speed.
As one of the measures to meet this demand, there has been proposed a technique for supporting a so-called three-dimensionally mounted printed wiring board on a motherboard, which is capable of compactly mounting a large number of electronic components on the printed board.

In a three-dimensionally mounted printed circuit board, a plurality of electronic components are arranged in the thickness direction with their leads oriented in the same direction and are arranged on both sides thereof, as disclosed in, for example, Japanese Patent Laid-Open No. 345083/1992. The leads of each electronic component are connected to the printed circuit board thus formed, so that each electronic component is supported by both printed circuit boards.

In the manufacturing process of the three-dimensionally mounted printed circuit board, the following procedure is adopted in order to insert the leads of the predetermined electronic parts into the predetermined through holes of the printed circuit boards on both sides and solder them.

First, for example, as shown in FIG. 7, a predetermined electronic component 101 is held by a positioning jig 103 having a groove 102 corresponding to the predetermined electronic component 101 so that the leads 104 are oriented vertically. After that, the printed board 105 on which one of the terminals is previously inserted is attached to the predetermined through hole 1
The position of 06 is aligned with the position of the lead 104 of the predetermined electronic component, the leads 104 corresponding to the through holes 106 are inserted, and the leads 104 are soldered.

Soldering is carried out manually by using a thread solder, and the place to be soldered is determined by the number of leads 104 per electronic component 101 and the number of electronic components 101. For example, 2 per electronic component 101
When using six electronic components 101 at 0 locations, soldering is performed at a total of about 120 locations only by connecting one side of the electronic components 101.

After that, as shown in FIG. 8, for example, a soldered component, that is, one printed circuit board 105.
And the electronic component 101 is turned upside down together with the positioning jig 103, and then the other printed circuit board 10 is subjected to the same procedure.
7, the leads 104 corresponding to the respective through holes 108 are inserted, and the electronic component 101 is mounted on the other printed circuit board 107.
Of the lead 104 are soldered. The number of soldering points here is about 120, for example.

After the soldering of the electronic component 101 is completed, as shown in FIG. 9, a pin 10 for balancing the ground and the power source of both printed circuit boards 105 and 107.
8 is inserted over both printed circuit boards 105 and 107, and soldered to both printed circuit boards 105 and 107.
The number of pins is determined by the scale of the three-dimensional mounting printed circuit board. For example, in a three-dimensional mounting printed circuit board including six electronic components 101, about 10 pins are used. Therefore, the number of places to be soldered is 20. It will be about a place.

Finally, the terminals 109 are soldered. For example, the number of soldering points is 20 per one printed circuit board 105/107, and the total number of the printed circuit boards 105/107 is 40.

[0010]

In the conventional method for manufacturing a three-dimensional printed circuit board, the steps are performed for each one three-dimensional printed circuit board, so that the number of steps is large.
Further, for example, in the case of a three-dimensional electronic component using six electronic components 101 each having about 20 leads 104 on one side,
It is necessary to perform soldering at 300 places, which requires a lot of man-hours for soldering. Moreover, since soldering relies on manual work, there is a problem in that there are variations in quality.

The present invention has been proposed in view of the above-mentioned conventional circumstances, and a plurality of three-dimensional printed circuit boards can be assembled at the same time, and the subsequent soldering can be performed on one side at a time or collectively. It is an object of the present invention to provide a jig for assembling electronic components of a three-dimensionally mounted printed circuit board, which can be performed on both sides at once.

[0012]

According to the present invention, leads of a plurality of electronic components are provided in through holes 8a, 8b of the two printed boards 6a, 6b between the front printed board 6a and the back printed board 6b. To achieve the above object in a jig for assembling electronic components for manufacturing a three-dimensional mounting printed circuit board, which is soldered by inserting 9a and 9b,
For example, the configuration is as shown in FIGS.

That is, a disk-shaped base 2 having a reference plane 3
And the front surface half 4a of the soldering jig 4, the front surface side printed circuit board 6a, the back surface side printed circuit board 6b, and the back surface side of the soldering jig 4 which are arranged on the reference plane 3 in this order from the front surface side to the back surface side. Positioning means 10 for positioning the half 4b, and a plurality of pairs of component holders 15 arranged at a plurality of positions at appropriate intervals in the surface direction between the front side printed circuit board 6a and the back side printed circuit board 6b. The electronic parts 7 are provided on the surfaces of the pair of component holders 15 that face each other, so that the leads 9a and 9b of each of the electronic components 7 are directed toward the front and back sides of the edges of the electronic components 7. Holding groove 16 for holding the component 7 at a predetermined interval in the thickness direction
And an opening / closing means 20 for opening and closing the space between the pair of component holders 15, and the pair of component holders 15 are moved inside and outside the space between the front surface side printed circuit board 6a and the back surface side printed circuit board 6b. The moving device 21 is provided.

[0014]

[Operation] In the above configuration, first, the component holders 15 forming each pair by the moving device 21 are placed outside the space between the front side printed circuit board 6a and the back side printed circuit board 6b (hereinafter referred to as the component mounting space). Then, the front side half 4a of the soldering jig 4 and the front side printed circuit board 6a are sequentially positioned in the plane direction by the positioning means 10 and stacked on the reference plane 3 of the base 2.

Thereafter, the pair of component holders 15 are moved into the component mounting space by the moving device 21, and the edge portions of the electronic components 7 are inserted into the holding grooves 16 of the pair of component holders 15, respectively. When the leads 9a and 9b of the electronic component 7 are inserted so as to face the front and back sides, the front surface side lead 9a of each electronic component 7 is inserted into the corresponding through hole of the front surface side printed circuit board 6a.

By repeating such an operation for each pair of component holders 15, the front surface side leads 9a of all electronic components 7 are inserted into the corresponding through holes of the front surface side printed circuit board 6a, and then the rear surface side. When the printed board 6b is positioned by the positioning means 10 and the electronic parts 7 are covered with the above, the back side leads 9b of each electronic part 7 are inserted into the corresponding through holes of the back side printed board 6b, and the three-dimensional mounting printed board is obtained. Temporarily assembled.

It should be noted that it is not obstructive to insert a spacer for adjusting the distance between the front side printed circuit board 6a and the back side printed circuit board 6b. After that, the back surface half 4b of the soldering jig 4 is positioned by the positioning means 10, overlapped on the back surface of the three-dimensional mounting printed circuit board, and fixed to the front surface half 4a. Are fixed in the soldering jig 4.

When the temporarily assembled three-dimensionally mounted printed circuit board is fixed in the soldering jig 4 in this manner, the leads are soldered by jet type or immersion type dip soldering in the subsequent soldering step. Soldering can be done on both the front and back sides at once, and the leads on both sides can be soldered together by reflow soldering such as resistance method, hot air method, infrared method, laser method, VSP method (vapor phase soldering method). You can do it.

The three-dimensional structure of the three-dimensional mounting printed circuit board is completed by soldering, the soldering jig is disassembled after the soldering, and the printed circuit boards on both front and back sides are cut off to obtain a plurality of three-dimensional mounting printed circuit boards. To be

[0020]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The following will describe the embodiments of the present invention in detail with reference to the drawings. However, the present invention is not limited to these embodiments, and is described in this specification and the accompanying drawings. It covers the entire true scope of the invention as will be apparent from the drawings.

As shown in the plan view of FIG. 1, the front view of FIG. 2, the side view of FIG. 3, and the longitudinal side view of FIG. The tool) includes a substantially rectangular frame 1 that is fixed to the installation surface in the left-right direction in plan view, and a rectangular base 2 that is fixed to the upper surface of the central portion of the frame 1 in the left-right direction in plan view.

A flat horizontal upper surface of the base 2 serves as a reference plane 3, and a positioning means 10 is provided on the reference plane 3, and the positioning means 10 serves as shown in the explanatory views of FIGS. 5 and 6. In addition, the front surface half 4a of the soldering jig 4, the front surface printed circuit board 6a, the back surface printed circuit board 6b, and the back surface half 4b of the soldering jig 4 which are sequentially assembled from the lower side to the upper side are positioned with respect to each other in the horizontal direction. It

As the positioning means 10, for example, a positioning block which receives and positions these edges can be used, but in this embodiment, positioning in a two-dimensional direction along the reference plane 3 is simple with a simple structure. 2 or more positioning pins capable of performing the above-mentioned positioning pins are provided, and the positioning holes 11 to 14 corresponding to these positioning pins are provided on the front half 4a of the soldering jig 4, the front printed board 6a, the back printed board 6b, and the soldering jig. 4 back half 4b
Are formed respectively.

As shown in FIG. 4, between the front-side printed circuit board 6a and the back-side printed circuit board 6b which are arranged above the reference plane 3, a plurality of pairs are formed at appropriate intervals in the plane direction. A plurality of pairs of component holders 15 are provided.

It is possible to freely design at which position on the reference plane 3 the component holders 15 forming each pair are arranged. However, here, six three-dimensional mounting printed circuit boards can be assembled at once. In front and back,
The component holders 15 forming a pair are arranged at six places arranged in a row and three rows on the left and right.

As shown in FIGS. 1 and 4, the component holders 15 forming each pair have a plurality of electronic components 7 on the surfaces facing each other.
2 has a predetermined number of holding grooves 16 in the vertical direction into which both end edges in the longitudinal direction (direction perpendicular to the leads 9a, 9b) are inserted.

Then, by inserting both longitudinal edge portions of each electronic component 7 into the holding groove 16, as shown in FIG. 5, each electronic component 7 is spaced at a predetermined interval in the thickness direction thereof. The leads 9a and 9b face in the front-back direction (vertical direction), and the through hole 8a of the front-side printed circuit board 6a
The lead 9a on the front side is held at a position opposite to the above.

As shown in FIG. 1 to FIG. 4, each pair of component holders 15 is provided with an opening / closing device 2 for opening and closing the space between them.
It is supported by the frame 1 via the zero and the moving device 21.
The moving device 21 has a pair of rails 22 and 23 fixed to the upper surface of the frame 1 on both outer sides of the base 2 in the left-right direction at appropriate intervals, and is movable in the front-back direction on the rails 22 and 23. It is equipped with four saddles 24 and 25 that are mounted.

Two saddles 24 and 25 are mounted on the rails 22 and 23 so as to move in the front-rear direction in front of and behind the base 2, and as shown in FIG. 2 saddles 24 and 25 paired on the left and right
The support shafts 28, 29 forming a pair of upper and lower sides on the front side of the switchgear 20.
Are inserted so that they can move forward and backward respectively.

These support shafts 28 and 29 are also inserted through the base ends of the three pairs of component holders 15 on the front side, and the component holder 15 on the left side of the pair of component holders 15 on the left and right respectively.
Is fixed to the upper support shaft 28, and the lower support shaft 29 is slidably inserted. Further, of the pair of left and right component holders 15, the right component holder 15 is fixed to the lower support shaft 29, and the upper support shaft 28 is slidably inserted.

At the left end of the upper support shaft 28, the left front saddle 2 is provided to limit the rightward movement of the support shaft 28.
A stopper collar 30, which is received on the left side surface of 4, is fixed so that its position can be adjusted. In order to urge the support shaft 28 to the right, a spring seat 31 is externally fitted and fixed to the support shaft 28 on the right side of the left front saddle 24. A compression coil spring 32 is interposed between the two.

At the right end of the lower support shaft 29, the saddle 2 on the right front side is provided to limit the movement of the support shaft 29 to the left.
A stopper collar 33, which is received on the right side surface of 5, is fixed in a positionally adjustable manner. In order to bias the support shaft 29 to the left, a spring seat 34 is externally fitted and fixed to the support shaft 29 on the left side of the front right saddle 25. A compression coil spring 35 is interposed between the two.

An operation is performed on the upper surfaces of the right-side holders 15 of the front-to-left centered paired component holders 15 and the left-sided holders 15 of the right-sided paired component holders 15. The pins 36 and 37 are erected, and the upper support shaft 28
Moves to the left, the lower support shaft 29 moves to the right, and the component holders 15 forming each pair on the front side are opened more than the length of the electronic component 7 in the longitudinal direction.

That is, the opening / closing device 20 includes the upper and lower support shafts 28 and 29 as well as the stopper collars 30 and 33,
It includes spring seats 31 and 34, compression coil springs 32 and 34, and pins 36 and 37.

Positioning device 3 of ball stopper type extending over the saddles 24 and 25 on both front left and right sides and the frame 1.
8.39 are provided, and the saddles 24 and 25 are positioned at predetermined positions by the positioning devices 38 and 39.
Also, the front side lead 9a is positioned at a position where the electronic component 7 is held at a position where the front side lead 9a faces the through hole 8a of the front side printed circuit board 6a placed on the upper side of the front side half 4a of the soldering jig 4.

Further, on both left and right sides on the front side of the frame 1, stopper columns 40 for receiving the ends of the support shafts 28 and 29 located in the working position from the front are provided upright, and both pins 36 are provided.
The component holder 15, the opening / closing device 20, and the saddles 24 and 25 are provided unless the component holders 15 forming the front pairs are opened by a larger amount than the length of the electronic component 7 by grasping 37 by hand. From the working position to the front, that is, the component holder 1
The tip of 5 is prevented from moving to the retracted position where it is retracted from the component mounting space.

Then, both pins 36 and 37 in the operating position
By holding the component holders 15 forming the pair on the front side by more than the length of the electronic component 7 in the longitudinal direction.
When 29 is moved to the retracted position in front of the stopper column 40, the component holders 15 forming each pair mount the components above the base 2, the front half 4a of the soldering jig 4 and the front printed board 6a. I try to leave the space forward.

When the pins 36 and 37 are released at the retracted position, the pressures of the compression coil springs 32 and 34 cause the support shafts 28 to move.
-29 is biased to the left or right, the ends of the support shafts 28 and 29 are received by the stopper pillar 40 from the rear, and both pins 36 and 37 are grasped by hand, and each pair of front side component holders. 1
The component holder 15, the opening / closing device 20, and the saddles 24 and 25 cannot be moved rearward from the retracted position unless the component 5 is opened more than the length of the electronic component 7 in the longitudinal direction.

Similarly, the three pairs of component holders 15 on the rear side are similarly supported on the frame 1 by the opening / closing device 20 and the moving device 21, positioned by the positioning devices 38 and 39 at the working position, and acted by the stopper column 40. Movement from the position to the rear and movement from the retracted position to the front are restricted.

However, since these structures are constructed symmetrically with the corresponding structures on the front side with respect to the central longitudinal axis of the frame 1, it is not necessary to give the same reference numerals and names to the corresponding parts. Detailed description is omitted.

The left and right edges of the front half 4a of the soldering jig 4 are raised upward, and the left and right edges of the back half 4b are lowered downward. By fixing the left and right side edge portions and the left and right side edge portions of the back surface half 4b with a pair of left and right screws 41, the front side printed circuit board 6a in the soldering jig 4,
The electronic component 7 and the back side printed circuit board 6b are held at predetermined positions.

Next, an embodiment of a method of manufacturing a three-dimensionally mounted printed circuit board using this jig will be specifically described with reference to the drawings. First, the component holders 15 forming each pair are shown in FIG.
After retracting to the retracted position indicated by the chain double-dashed line, the front surface half 4a of the soldering jig 4 is placed on the reference plane 3 of the base 2.
Is positioned and placed by the positioning device 10, and further the front side printed circuit board 6a is positioned and placed by the positioning device 10.

As shown in FIG. 1, the front side printed circuit board 6a is surrounded by dust removing grooves B on both front and rear edges, and is connected to the peripheral portion by a pair of left and right connecting portions C.
Two practical zones A are provided.

Through holes 8a corresponding to the leads 9a on the front surface side of the six electronic components 7 arranged in the front-rear direction are formed in each practical zone A, and the motherboard is provided at the front edge or rear edge of the practical zone A. Terminal 10 used for connection with
9 (see FIG. 9) is inserted.

After the front side printed circuit board 6a is placed on the front side half 4a of the soldering jig 4, for example, both pins 36 and 37 on the front side are grasped by hand and each pair of component holders 15 is held.
Is opened larger than the length of the electronic component 7 in the longitudinal direction, and the component holder 15, the opening / closing device 20, and the saddles 24 and 25 are moved from the retracted position to the operating position behind them, and then the pins 36 and 37 are released. .

As a result, each pair of component holders 15 is located at a position where the electronic component 7 can be held at a position where the front side lead 9a faces the through hole 8a of the front side printed circuit board 6a, and each pair is held. The space between the component holders 15 is narrowed to a space smaller than the length of the electronic component 7 in the longitudinal direction.

In this state, the pins 37 and 38 are grasped to widen the space between the component holders 15, and the longitudinal ends of the electronic component 7 are inserted into the holding grooves 16 of the component holders 15 from above, so that the compression coil spring is formed. The electronic component 7 is held by the component holder 15 by the biasing forces of 32 and 35. Further, at this time, since the front surface side lead 9a is held at a position facing the through hole 8a of the front surface side printed circuit board 6a, each front surface side lead 9a is connected to the front surface side printed circuit board 6a through hole 8a.
Plugged into.

After that, when the back side printed circuit board 6b is positioned by the positioning means 10 and is covered from above the electronic component 7, the back side printed circuit board 6b is provided with through holes 8b corresponding to the leads 9b on the back side of the electronic component 7. , The lead 9b on the back surface side is inserted into the through hole 8b. After that, the required number of pins 108 (see FIG. 9)
And the three-dimensional mounting printed circuit board is temporarily assembled.

It should be noted that it is not obstructive to insert a spacer for adjusting the distance between the front side printed circuit board 6a and the back side printed circuit board 6b. After that, the back surface side half 4b of the soldering jig 4 is positioned by the positioning means 10 and overlapped on the back surface of the three-dimensional mounting printed circuit board, and the left and right side edges of the front surface side half 4a and the back surface side half 4b are joined together. When fixed with a pair of left and right screws 41, the three-dimensional mounting printed circuit board temporarily assembled as shown in FIG.
Fixed inside.

After that, the pins 36 and 37 are grasped by hand, the pair of component holders 15 are opened and moved to the retracted position, and then the soldering jig 4 and the three-dimensional fixture fixed therein. The mounting printed circuit board is lifted out of the base 2 and sent to the soldering process.

At the portions corresponding to the practical zone A of the front surface half 4a and the rear surface half 4b of the soldering jig 4, the melted solder is joined to the front surface printed board 6a and the lead 9a, or the back surface printing is performed. Board 6b and lead 9
A through hole 43 for contacting the joint with b is formed, and in the soldering process, the leads 9a and 9b are formed by, for example, jet type or immersion type dip soldering.
The soldering of the terminals and the terminals is performed collectively on the front and back sides.

It is to be noted that the solder paste is adhered to the front side printed circuit board 6a and the back side printed circuit board 6b in advance, and the resistance method, the hot air method, the infrared method, the laser method,
Leads 9a and 9b on both front and back sides of the electronic component 7 by reflow soldering such as VSP method (vapor phase soldering method)
Also, the terminals can be soldered together.

After the completion of soldering, six three-dimensional mounting printed boards each having a predetermined shape including a practical zone A from the three-dimensional structure including the front surface side printed circuit board 6a, the electronic component 7 and the back surface side printed circuit board 6b. Is cut off.

In this manner, by using this jig, the six three-dimensional mounting printed boards can be assembled and soldered together, so that one three-dimensional mounting printed board can be used. The number of steps can be reduced, and the manufacturing time per one three-dimensionally mounted printed circuit board can be shortened.

Further, since the soldering can be performed on each side or collectively on both sides, the number of man-hours for soldering can be remarkably reduced and the variation in soldering quality can be eliminated.

[0056]

As described above, according to the jig for assembling electronic components of the three-dimensional mounting printed circuit board of the present invention,
A plurality of three-dimensionally mounted printed circuit boards can be assembled at the same time, and the soldering can be performed by dip soldering on one side at a time or by reflow soldering on both sides at a time.

Therefore, the number of steps per one three-dimensional mounting printed circuit board can be reduced, and the manufacturing time per one three-dimensional mounting printed circuit board can be shortened to improve the productivity.

Further, the number of soldering steps can be remarkably reduced, the production cost can be reduced, and the quality can be homogenized to improve the reliability of the quality of the product.

[Brief description of drawings]

FIG. 1 is a plan view of an embodiment of the present invention.

FIG. 2 is a front view of an embodiment of the present invention.

FIG. 3 is a side view of an embodiment of the present invention.

FIG. 4 is a vertical side view of an embodiment of the present invention.

FIG. 5 is an explanatory diagram of a method for incorporating electronic components in a three-dimensionally mounted printed circuit board using an embodiment of the present invention.

FIG. 6 is an explanatory diagram of a method for incorporating electronic components in a three-dimensionally mounted printed circuit board according to an embodiment of the present invention.

FIG. 7 is an explanatory diagram of a conventional method for incorporating electronic components in a three-dimensionally mounted printed circuit board.

FIG. 8 is an explanatory diagram of a conventional method of incorporating electronic components in a three-dimensionally mounted printed circuit board.

FIG. 9 is a perspective view of a three-dimensional mounting printed circuit board.

[Explanation of symbols]

 2 base 3 reference plane 4 soldering jig 4a (4b) front side (back side) half 6a (6b) front side (back side) printed circuit board 7 electronic component 8a (8b) through hole 9a (9b) lead 10 positioning means 15 parts holder 16 holding groove 20 opening / closing means 21 moving device

Claims (1)

[Claims] 1. A plurality of through-holes (8a), (8b) of the two printed boards (6a), (6b) are provided between the front-side printed board (6a) and the back-side printed board (6b). Electronic component leads (9
In a jig for assembling electronic components for manufacturing a three-dimensionally mounted printed circuit board that has been soldered by inserting a) and (9b), a board-shaped base (2) having a reference plane (3) and this base ( The front half of the soldering jig (4), which is placed in order from the front side to the back side on the reference plane (3) in 2).
(4a), front side printed circuit board (6a), back side printed circuit board (6
b) and the positioning means (10) for positioning the back side half (4b) of the soldering jig (4), the above-mentioned front side printed circuit board (6a) and back side printed circuit board (6b)
At least a pair of component holders (15) arranged at least at one place while having an appropriate gap in the surface direction between
And the opposite ends of the plurality of electronic components (7) on the surfaces of the pair of component holders (15) facing each other, the leads (9) of each electronic component (7).
a) and (9b) are facing the front and back, and each electronic component
(7) Holding groove (1) that holds at a predetermined interval in the thickness direction.
6) and opening / closing means (20) for opening / closing the gap between each pair of component holders (15) and each pair of component holders (15) on the front side printed circuit board (6a) and the back side. A moving device (21) for moving the inside and outside of the space between the printed board (6b) and the
A jig for assembling electronic components on a three-dimensionally mounted printed circuit board.