JPH0778845A - Semiconductor device - Google Patents

Abstract

PURPOSE:To obviate the short-circuit defects in the packaging time of semiconductor device thereby enhancing the yield of an electronic device by removing at least a part of the second wiring layer on the periphery of an outer lead hole. CONSTITUTION:A Cu conductor layer and an insulating tape 2 formed on the rear surface are patterned by photolithographic and etching technologies so as to make a device hole and an outer lead hole. At this time, the second wiring layer 4 is removed on the periphery of an outer lead hole. Thus, even if an outer lead 3c is bent on the insulating tape 2 side near the terminal end of the insulating tape 2 to be soldered onto a printed substrate 6, the solder 7 for packaging the outer lead 3c does not come into contact with the second conductor layer 4. Accordingly, the outer lead 3c is not short-circuited with the second conductor layer 4 thereby enabling the short-circuit defects in the packaging time to be obviated further enhancing the yield of an electrode device.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION The present invention relates to TCP (Tape Carri).
The present invention relates to a semiconductor device having an er package structure, and more particularly to a technique effective in reducing short circuit defects during mounting.

[0002]

2. Description of the Related Art A semiconductor device having a TCP structure is a TA in which a wiring layer is provided on the surface of an insulating tape (polyimide resin or the like).
A semiconductor pellet is mounted on a B (Tape Automated Bonding) tape.

The double-layer metal TAB tape is a TAB tape having wiring layers provided on both sides of an insulating tape.
The first wiring layer includes a bonding pad connected to the electrode of the semiconductor pellet and an outer lead for mounting on an electronic device. The second wiring layer provided on the main surface other than the first wiring layer is A TAB tape having a first wiring layer provided on one main surface of an insulating tape connecting the bonding pad and the outer lead with a through hole and a second wiring layer provided on the other main surface.

The first wiring layer is composed of a bonding pad connected to the electrode of the semiconductor pellet, an inner lead connected to the bonding pad, and an outer lead for mounting in an electronic device. The signal is mainly processed by the semiconductor device. It is used as a signal line for transmitting.

The second wiring layer is connected to a part of the first wiring layer through a predetermined through hole and is connected to an external power source through an outer lead so that it is mainly used as a power source ground line. There is.

The outer lead is bent toward the insulating tape at the end of the insulating tape, and the tip of the outer lead is
An insulating tape and a second wiring layer are provided so that adjacent outer leads do not come into contact with each other.

[0007]

However, as a result of examining the above-mentioned prior art, the present inventor has found the following problems.

1. The outer leads of a semiconductor device including a conventional two-layer metal TAB tape are bent toward the insulating tape near the end of the insulating tape and soldered to a printed circuit board in order to reduce the mounting area and volume.
Therefore, the solder for mounting the outer lead comes into contact with the second wiring layer provided on the main surface of the insulating tape end. Therefore, the first wiring layer and the second wiring layer are short-circuited. As a result, there is a problem that the yield of the electronic device is reduced due to a short circuit failure during mounting.

2. A conventional semiconductor device including a two-layer metal TAB tape is provided with an insulating tape and the second wiring layer across the tips of a plurality of outer leads so that adjacent outer leads do not contact each other. There is. Thus, when the outer lead is soldered to the printed board, the solder comes into contact with the second wiring layer. Therefore, the plurality of outer leads are short-circuited through the second wiring layer. As a result, there is a problem that the yield of the electronic device is reduced due to a short circuit failure during mounting.

An object of the present invention is to provide a technique capable of improving the yield of electronic devices when mounting semiconductor devices.

The above and other objects and novel features of the present invention will be apparent from the description of this specification and the accompanying drawings.

[0012]

Among the inventions disclosed in the present application, a brief description will be given to the outline of typical ones.
It is as follows.

A first wiring layer including a bonding pad, an inner lead and an outer lead is provided on one main surface of the insulating tape, and a second wiring layer is connected to the inner lead on the main surface opposite to the one main surface of the insulating tape. Provide a wiring layer,
A device hole that constitutes the bonding pad is provided by removing the second wiring layer and the insulating tape, and an outer lead hole that constitutes the outer lead is provided by removing the second wiring layer and the insulating tape. In a semiconductor device in which a semiconductor pellet is mounted by connecting to the bonding pad from the device hole side, at least a part of the second wiring layer on the outer edge of the outer lead hole is removed.

[0014]

The above-mentioned means have the following effects.

1. At least a part of the second wiring layer on the outer edge of the outer lead hole is removed. That is, the second wiring layer provided on the main surface at the end of the insulating tape is removed. As a result, in order to reduce the mounting area and volume of the semiconductor device, even if the outer lead is bent toward the insulating tape near the end of the insulating tape and soldered to the printed circuit board, the solder does not come into contact with the second wiring layer. Therefore, the first wiring layer and the second wiring layer do not short-circuit.
As a result, short-circuit defects during mounting of the semiconductor device are reduced, and the yield of electronic devices can be improved.

2. At least a part of the second wiring layer on the outer edge of the outer lead hole is removed. That is, the second wiring layer on the main surface of the insulating tape provided over the tip portions of the plurality of outer leads is removed. Thus, when the outer leads are soldered to the printed board, the solder does not come into contact with the second wiring layer. Therefore, the plurality of outer leads do not short-circuit through the second wiring layer. As a result, short circuit defects during mounting are reduced,
It is possible to improve the yield of electronic devices.

[0017]

Embodiments of the present invention will now be described in detail with reference to the drawings.

In all the drawings for explaining the embodiments, parts having the same functions are designated by the same reference numerals, and repeated description will be omitted.

FIG. 1 is a cross-sectional view of essential parts showing a schematic structure of an embodiment of a semiconductor device according to the present invention.

FIG. 2 is a cross-sectional view of the double-layer metal TAB tape during the manufacturing process of the double-layer metal TAB tape which constitutes the semiconductor device of this embodiment.

1 and 2, 1 is a semiconductor pellet, 2 is an insulating tape, 3 is a first wiring layer, 3a is a bonding pad which is a part of the first wiring layer, 3b is an inner lead, 3c is an external device. Is a second wiring layer, and 5 is a bump for connecting the semiconductor pellet 1 to the bonding pad 3a.
6 is a printed circuit board on which the semiconductor device is mounted, 7 is solder for connecting the outer leads 3c to the printed circuit board, and 8
Is a protective film for protecting the semiconductor pellet 1.

Reference numeral 9 is a through hole, 10 is an outer lead hole, 11 is a device hole for mounting the semiconductor pellet 1, and 12 is a resist which serves as a mask during etching.

A method of manufacturing a two-layer metal TAB tape constituting the semiconductor device of this embodiment will be described with reference to FIG.

First, as shown in FIG. 2A, a thin Cu film (Cr, Ni or the like may be used) is formed on both surfaces of the insulating tape 2 by a sputtering technique or an electroless plating technique.

Next, as shown in FIG. 2B, Cu is deposited on one main surface (front surface) of the insulating tape 2 by an electrolytic plating technique to form a first wiring layer 3. At this time, the resist 12 is applied to the portion where the Cu layer is unnecessary so that Cu is not deposited. Next, from the main surface (back surface) opposite to the front surface of the insulating tape 2, the through holes 9 are formed in the insulating tape 2.
Are formed by etching technology or laser processing technology.

Next, as shown in FIG. 2C, a resist 12 is applied to the portion where the metal layer is unnecessary, the through hole 9 is filled by the electroplating technique, and the second wiring layer 4 is formed.

Next, as shown in FIG. 2D, the insulating tape 2 is etched and opened using the resist 12 as a mask.

Next, as shown in FIG. 2E, the thin Cu layer on the insulating tape 2 is etched to form a two-layer metal TAB.
The tape is complete.

A mounting procedure of the semiconductor device of this embodiment will be described.

First, the semiconductor pellet 1 is mounted on the two-layer metal TAB tape, and the bumps 5 formed on the electrodes of the semiconductor pellet 1 are connected to the bonding pads 3a. Next, the protective film 8 is formed. The protective film 8 is formed by applying a polyimide-based resin to the semiconductor pellet 1 with a potting device and applying heat to cure the polyimide.

Next, the outer leads 3c of the first wiring layer are bent toward the insulating tape 2 and solder 7 is applied to the printed circuit board 6.
Connect to.

A method of manufacturing a two-layer metal TAB tape which constitutes a semiconductor device will be described with reference to FIG.

Next, the Cu conductor layer and the insulating tape formed on the back surface are patterned by the photolithography technique and the etching technique to form the device hole 11 and the outer lead hole 10 to complete the two-layer TAB tape.

As can be seen from the above description, according to this embodiment, the second wiring layer 4 at the tip of the outer lead 3c is removed and only the insulating tape 2 is left. Thus, when the outer leads 3c are soldered to the printed board 6, the solder 7 does not come into contact with the second wiring layer 4 and the plurality of outer leads 3c are not short-circuited through the second wiring layer 4. As a result, short circuit defects during mounting are reduced, and the yield can be improved.

The second wiring layer 4 is removed at the outer edge of the outer lead hole 10. Thereby, even if the outer lead 3c is bent toward the insulating tape 2 near the end of the insulating tape 2 and soldered to the printed circuit board 6,
The solder 7 for mounting the outer lead 3c does not come into contact with the second conductor layer 4. Therefore, the outer lead 3c and the second conductor layer 4 are not short-circuited. As a result, short-circuit defects during mounting are reduced and the yield can be improved.

Although the invention made by the inventor has been specifically described based on the embodiments, the present invention is not limited to the above embodiments, and various modifications can be made without departing from the scope of the invention. Needless to say.

[0037]

The effects obtained by the typical ones of the inventions disclosed in the present application will be briefly described as follows.

Short circuit defects during mounting of the semiconductor device are reduced, and the yield of the electronic device can be improved.

[Brief description of drawings]

FIG. 1 is a cross-sectional view of an essential part showing a schematic configuration of an embodiment of a semiconductor device according to the present invention,

FIG. 2 is a cross-sectional view of the double-layer metal TAB tape during the manufacturing process of the double-layer metal TAB tape which constitutes the semiconductor device of this embodiment.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Semiconductor pellet, 2 ... Insulation tape, 3 ... 1st wiring layer, 3a ... Bonding pad, 3b ... Inner lead, 3c ... Outer lead, 4 ... 2nd wiring layer, 5 ... Bump, 6 ... Printed circuit board, 7 ... Solder, 8 ... Protective film, 9 ...
Through hole, 10 ... Outer lead hole, 11 ... Device hole, 12 ... Resist.

Claims (1)

[Claims] 1. A first wiring layer including a bonding pad, an inner lead and an outer lead is provided on one main surface of the insulating tape, and the inner lead is connected to the main surface opposite to the one main surface of the insulating tape. Providing a second wiring layer,
A device hole that constitutes the bonding pad is provided by removing the second wiring layer and the insulating tape, and an outer lead hole that constitutes the outer lead is provided by removing the second wiring layer and the insulating tape. A semiconductor device in which a semiconductor pellet is mounted from the device hole side to the bonding pad, wherein at least a part of the second wiring layer at the outer edge of the outer lead hole is removed. .