JPH0775771A - Reusing method of waste copper-plated laminate substrate as resource - Google Patents
Reusing method of waste copper-plated laminate substrate as resourceInfo
- Publication number
- JPH0775771A JPH0775771A JP22407993A JP22407993A JPH0775771A JP H0775771 A JPH0775771 A JP H0775771A JP 22407993 A JP22407993 A JP 22407993A JP 22407993 A JP22407993 A JP 22407993A JP H0775771 A JPH0775771 A JP H0775771A
- Authority
- JP
- Japan
- Prior art keywords
- copper
- waste
- clad laminate
- resin
- plated laminate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002699 waste material Substances 0.000 title claims abstract description 38
- 238000000034 method Methods 0.000 title claims description 20
- 239000000758 substrate Substances 0.000 title abstract description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 73
- 229910052802 copper Inorganic materials 0.000 claims abstract description 55
- 239000010949 copper Substances 0.000 claims abstract description 55
- 238000007667 floating Methods 0.000 claims abstract description 3
- 238000004064 recycling Methods 0.000 claims description 5
- 229920005989 resin Polymers 0.000 abstract description 25
- 239000011347 resin Substances 0.000 abstract description 25
- 239000011889 copper foil Substances 0.000 abstract description 19
- 239000000835 fiber Substances 0.000 abstract description 6
- 239000000463 material Substances 0.000 description 15
- 239000011521 glass Substances 0.000 description 14
- 239000004744 fabric Substances 0.000 description 9
- 239000007789 gas Substances 0.000 description 8
- 239000002440 industrial waste Substances 0.000 description 7
- 239000002966 varnish Substances 0.000 description 7
- 239000003822 epoxy resin Substances 0.000 description 6
- 229920000647 polyepoxide Polymers 0.000 description 6
- 239000000843 powder Substances 0.000 description 6
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 5
- 238000005452 bending Methods 0.000 description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 description 4
- 230000007613 environmental effect Effects 0.000 description 4
- 239000003365 glass fiber Substances 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 239000004745 nonwoven fabric Substances 0.000 description 4
- 229910001873 dinitrogen Inorganic materials 0.000 description 3
- 239000000945 filler Substances 0.000 description 3
- FBAFATDZDUQKNH-UHFFFAOYSA-M iron chloride Chemical compound [Cl-].[Fe] FBAFATDZDUQKNH-UHFFFAOYSA-M 0.000 description 3
- 239000002994 raw material Substances 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- 238000009841 combustion method Methods 0.000 description 2
- 238000002485 combustion reaction Methods 0.000 description 2
- -1 copper laminated copper Chemical class 0.000 description 2
- 238000004090 dissolution Methods 0.000 description 2
- 239000008187 granular material Substances 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000005011 phenolic resin Substances 0.000 description 2
- 238000007873 sieving Methods 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 2
- 239000000057 synthetic resin Substances 0.000 description 2
- 239000000454 talc Substances 0.000 description 2
- 229910052623 talc Inorganic materials 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 description 1
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 1
- KZBUYRJDOAKODT-UHFFFAOYSA-N Chlorine Chemical compound ClCl KZBUYRJDOAKODT-UHFFFAOYSA-N 0.000 description 1
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 1
- 239000005751 Copper oxide Substances 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 description 1
- 229910052794 bromium Inorganic materials 0.000 description 1
- 150000001879 copper Chemical class 0.000 description 1
- 229910000431 copper oxide Inorganic materials 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 238000007670 refining Methods 0.000 description 1
- 230000001172 regenerating effect Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
- Y02W30/00—Technologies for solid waste management
- Y02W30/50—Reuse, recycling or recovery technologies
- Y02W30/62—Plastics recycling; Rubber recycling
Landscapes
- Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
- Separation, Recovery Or Treatment Of Waste Materials Containing Plastics (AREA)
- Processing Of Solid Wastes (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明は、廃銅張り積層板から、
銅と基材成分に分離回収して、再資源化する方法に関す
るものである。分離回収された銅は、銅原料として、基
材成分は、自動車部品のような各種合成樹脂成形品、熱
硬化性合成樹脂積層板等の充填剤として再利用できる。
なお、本発明でいう銅張り積層板には、銅張り積層板に
回路加工を施して得られる、プリント配線板を含む。The present invention relates to a waste copper clad laminate,
The present invention relates to a method of recovering by separating and recovering copper and a base material component. The separated and recovered copper can be reused as a copper raw material, and the base material component can be reused as a filler for various synthetic resin molded articles such as automobile parts and thermosetting synthetic resin laminates.
The copper-clad laminate referred to in the present invention includes a printed wiring board obtained by subjecting the copper-clad laminate to circuit processing.
【0002】[0002]
【従来の技術】銅張り積層板そのものの製造工程におい
ても、この銅張り積層板を加工して得られるプリント配
線板の製造工程でも、不良品及び製品の加工により発生
する切断耳屑のような、銅を含む廃材が発生する。これ
らの廃材は、産業廃棄物の専門処理会社により収集さ
れ、銅分を種々の方法で回収し、残余物は、産業廃棄物
として廃棄処理されている。2. Description of the Related Art In a manufacturing process of a copper-clad laminate itself and a manufacturing process of a printed wiring board obtained by processing the copper-clad laminate, defective products and cutting ear scraps generated by the processing of the product are generated. , Waste materials containing copper are generated. These waste materials are collected by a professional disposal company of industrial wastes, the copper content is recovered by various methods, and the residuals are disposed of as industrial wastes.
【0003】銅を含む廃材から銅を回収する方法とし
て、次のような方法が一般的に知られている。The following methods are generally known as methods for recovering copper from waste materials containing copper.
【0004】その1は、塩化鉄溶液にて廃材に含まれる
銅を溶解し、液中に鋼材を投入し、鉄と銅のイオン化傾
向の差を利用して銅を鋼材上に析出させるとともに、塩
化鉄溶液を再生する置換法である。[0004] The first is to dissolve copper contained in a waste material with an iron chloride solution, to put a steel material in the solution, and to use the difference in ionization tendency between iron and copper to precipitate copper on the steel material. This is a substitution method of regenerating an iron chloride solution.
【0005】その2は、塩化銅溶液で銅を含む廃材に含
まれる銅を溶解し、これを電解処理して陰極上に銅を析
出させる電解処理法である(特開平2−254188号
公報参照)。The second method is an electrolytic treatment method in which copper contained in a waste material containing copper is dissolved in a copper chloride solution, and this is electrolytically treated to deposit copper on the cathode (see JP-A-2-254188). ).
【0006】その3は、銅を含む廃材を、塩化銅溶液に
浸漬して銅を溶解し、得られた溶液を高温雰囲気に曝し
て、銅を酸化物として分離回収する方法である。The third method is a method of immersing a waste material containing copper in a copper chloride solution to dissolve the copper, exposing the resulting solution to a high temperature atmosphere, and separating and recovering the copper as an oxide.
【0007】その4は、銅を含む廃材を直接特定の温度
で、かつ空気の供給を少なくして焙焼し、次いで粉砕し
て銅を死範別する直接燃焼法である(特開平2−887
25号公報参照)。No. 4 is a direct combustion method in which a waste material containing copper is directly roasted at a specific temperature and with a reduced supply of air, and then crushed to classify copper (JP-A-2- 887
25 publication).
【0008】[0008]
【発明が解決しようとする課題】近年産業廃棄物の増大
に伴う輸送事情の悪化や処理施、能力の不足、及び法的
規制の強化等により処理コストの急激な高騰を招き、深
刻な社会問題となってきている。この対策として、産業
廃棄物の発生抑制、又は減量、再資源化の技術開発が社
会的にも強く望まれている。しかしながら、前記各方法
は、いずれも、以下に述べるように種々の課題を含んで
いる。[Problems to be Solved by the Invention] In recent years, due to the worsening of transportation conditions due to the increase of industrial waste, treatment treatment, lack of capacity, and stricter legal regulation, the treatment cost has soared sharply, causing a serious social problem. Is becoming. As measures against this, it is strongly desired socially to suppress the generation of industrial waste, reduce the amount of the waste, and develop technologies for recycling. However, each of the above methods has various problems as described below.
【0009】塩化鉄溶液による置換法は、回収される銅
に鉄分を多く含み、低品位であるとともに、銅はく溶解
後の残余物は、産業廃棄物として焼却又は埋立て処分し
なければならない。The substitution method with an iron chloride solution has a low quality because the recovered copper contains a large amount of iron, and the residue after dissolution of the copper foil must be incinerated or landfilled as industrial waste. .
【0010】塩化銅溶液による電解処理法は、陽極で同
時に発生する塩素ガス発生の環境対策が必要で、かつ電
析銅の陰極から剥離回収に人手を要するのと、多額の設
備投資が必要となる。また、電析銅は純度が比較的高い
が、溶液中の微量成分も含み再利用する際精製に再びコ
ストを要する。銅溶解後の残余物は、置換法と同様、産
業廃棄物として焼却又は埋立て処分しなければならな
い。The electrolytic treatment method using a copper chloride solution requires an environmental measure for chlorine gas generation at the same time at the anode, requires labor for peeling and collecting the deposited copper from the cathode, and requires a large amount of capital investment. Become. Further, although the electrodeposited copper has a relatively high purity, it also requires a small amount of cost for refining when it is reused because it contains trace components in the solution. The residue after dissolution of copper shall be incinerated or landfilled as industrial waste, as in the replacement method.
【0011】銅を含む廃材を塩化銅溶液に浸漬して銅を
溶解し、得られた溶液を高温雰囲気に曝して、銅を酸化
物として回収する方法は、高純度の酸化銅が得られ、経
済的に、かつ環境対策上非常に有効な手法であるが、設
備コストが比較的割高であることと、銅溶解後の残余物
の廃材処理の問題は、前二者と同様である。A method of recovering copper as an oxide by dipping a waste material containing copper into a copper chloride solution to dissolve the copper, exposing the resulting solution to a high temperature atmosphere, to obtain copper oxide of high purity, Although it is a very effective method economically and in terms of environmental measures, the equipment cost is relatively high and the problem of waste material disposal of the residue after copper melting is the same as the former two.
【0012】直接燃焼法は、比較的安価で大量の廃材を
一度に処理出来る利点はあるが、銅回収効率が極めて悪
く、また廃材中に含有される臭素、リン系その他難燃剤
として樹脂中に含まれている物質の後処理、燃焼炉の材
質、その他燃焼物の残余物の処理等を考慮した場合、処
理コストの増加を招く。The direct combustion method has an advantage that a large amount of waste materials can be treated at a relatively low cost at one time, but the efficiency of recovering copper is extremely poor, and the bromine, phosphorus-based and other flame retardants contained in the waste materials are added to the resin. When the post-treatment of the contained substances, the material of the combustion furnace, and the treatment of the remaining materials of the combustion products are taken into consideration, the treatment cost is increased.
【0013】本発明はこのような点に鑑み、環境安全上
問題のある廃銅張り積層板を、安全で、経済的に効率良
く処理し、しかも銅はくを高純度の銅としてを分離で
き、残余物も再利用可能な形で回収可能な方法を提供す
るものである。In view of the above points, the present invention is capable of safely and economically treating a waste copper clad laminate having environmental problems and separating copper foil as high-purity copper. It also provides a method by which residues can be recovered in a reusable form.
【0014】[0014]
【課題を解決するための手段】本発明は、廃銅張り積層
板を切断し、加熱された状態に保持しつつ浮遊状態で相
互に衝突させて、銅とその他の成分とに分離させること
を特徴とする、廃銅張り積層板の再資源化方法である。DISCLOSURE OF THE INVENTION According to the present invention, a waste copper clad laminate is cut and kept in a heated state and collided with each other in a floating state to separate copper and other components. It is a characteristic method for recycling a waste copper-clad laminate.
【0015】廃銅張り積層板の加熱粉砕は、図1に示す
ように、廃銅張り積層板を円錐状のサイクロン3の中で
処理できる程度に切断し、シューター1から、切断され
た廃銅張り積層板2を、加熱された気体とともに円錐状
のサイクロン3の中に送りこみ、切断された廃銅張り積
層板2を互いに衝突させて、銅5、繊維6、樹脂4に容
易にかつ効率よく分離できる。加熱温度は、基板の材質
によって若干差異があるが、およそ300〜500℃と
するのが好ましい。処理すべき銅張り積層板を加熱しな
いでサイクロンに供給して加熱した気体により加熱され
るようにしてもよいが、あらかじめ加熱した銅張り積層
板をサイクロンに加熱した気体とともに供給するように
すると処理時間が短くてすみ、好ましい。As shown in FIG. 1, the waste copper-clad laminate is heated and crushed by cutting the waste copper-clad laminate in a conical cyclone 3 to an extent such that it can be processed, and the waste copper cut from the shooter 1 is cut. The laminated copper plate 2 is fed into the cyclone 3 having a conical shape together with the heated gas, and the cut waste copper laminated copper plates 2 are made to collide with each other, so that the copper 5, the fiber 6 and the resin 4 can be easily and efficiently. Can be well separated. Although the heating temperature varies slightly depending on the material of the substrate, it is preferably about 300 to 500 ° C. The copper-clad laminate to be treated may be supplied to the cyclone without being heated and heated by the heated gas, but if the pre-heated copper-clad laminate is supplied to the cyclone together with the heated gas, it is treated. The time is short, which is preferable.
【0016】300℃より低いと銅はくが剥がれず(理
由は作用の項で説明する)、500℃を超えると樹脂成
分が分解して可燃性のガスを発生し発火する危険があ
り、かつ樹脂が炭化する。When the temperature is lower than 300 ° C., the copper foil does not come off (the reason is explained in the section of action), and when the temperature is higher than 500 ° C., there is a risk that the resin component is decomposed to generate a flammable gas and ignite, and The resin carbonizes.
【0017】気体としては、空気を使用でき、ブロワ8
から空気をヒータ7により加熱してサイクロン3に送り
こむ。シューター1から供給された銅張り積層板2は、
サイクロン中で空気により加熱され、かつ互いに衝突す
ることにより、銅はく5、繊維6、樹脂4に分離して排
出される。銅はくは、分離して顆粒状になり、樹脂は粉
状になって、繊維から分離する。基材の材質特に樹脂の
材質によっては処理中に引火性のガスを発生することが
ある。このような材質を処理するときは、気体として窒
素ガス供給源10から、窒素ガスを送って酸素分圧を低
くして危険を避ける。Air can be used as the gas, and the blower 8
The air is heated by the heater 7 and sent to the cyclone 3. The copper-clad laminate 2 supplied from the shooter 1
By being heated by air in the cyclone and colliding with each other, the copper foil 5, fibers 6 and resin 4 are separated and discharged. The copper foil separates into granules and the resin powders and separates from the fibers. Depending on the material of the base material, especially the resin material, flammable gas may be generated during processing. When treating such a material, nitrogen gas is sent from the nitrogen gas supply source 10 as a gas to reduce the oxygen partial pressure to avoid danger.
【0018】[0018]
【作用】銅張り積層板において、銅はくの引きはがし強
さは、積層板の温度が上昇するとともに小さくなる。図
2に、ガラス布基材エポキシ樹脂銅張り積層板について
の、銅はくの引きはがし強さの温度特性を示す。加熱さ
れた銅張り積層板を冷却すると、銅はくの引きはがし強
さは再び元に戻る。銅はくの引きはがし強さの温度特性
は、紙基材エポキシ樹脂銅張り積層板、紙基材フェノー
ル樹脂銅張り積層板についても、ほぼ同様な変化を示
す。In the copper-clad laminate, the peel strength of the copper foil becomes smaller as the temperature of the laminate rises. FIG. 2 shows the temperature characteristics of the peel strength of the copper foil for the glass cloth-based epoxy resin copper-clad laminate. When the heated copper-clad laminate is cooled, the peel strength of the copper foil returns to its original value. The temperature characteristics of the peel strength of copper foil show almost the same changes for the paper-based epoxy resin copper-clad laminate and the paper-based phenol resin copper-clad laminate.
【0019】図2のグラフから、300℃程度に加熱す
ると、銅はくがはがれやすくなることがわかる。したが
って、銅張り積層板を300℃以上に加熱したまま他の
銅張り積層板と相互に衝突させると、その衝撃により銅
はくがはがれる。加熱によって、樹脂自体の結合力も小
さくなり、基材繊維との結合も弱くなって、相互の衝突
の衝撃によりばらばらになり、分離する。From the graph of FIG. 2, it can be seen that the copper foil is easily peeled off when heated to about 300.degree. Therefore, when the copper-clad laminate is made to collide with another copper-clad laminate while being heated to 300 ° C. or more, the copper peeling occurs due to the impact. By the heating, the binding force of the resin itself is weakened, the binding with the base fiber is weakened, and they are separated by the impact of mutual collision and separated.
【0020】次に、ガラス布基材エポキシ樹脂銅張り積
層板を20〜500℃の各温度に10分間保持した後、
銅はくを引きはがし、その品位を調べた。その結果を図
3に示す。200℃以下では、銅はくに基板の樹脂が付
着したままはがれるため、品位が低い。品位は、200
℃から300℃にかけてよくなり、300℃で銅はくの
みはがれていることがわかる。Next, after holding the glass cloth base material epoxy resin copper clad laminate at each temperature of 20 to 500 ° C. for 10 minutes,
I peeled off the copper foil and checked its quality. The result is shown in FIG. At 200 ° C. or less, the resin of the substrate is peeled off while remaining attached to the copper foil, resulting in poor quality. The grade is 200
It can be seen that the temperature is improved from 0 ° C to 300 ° C, and only the copper foil is peeled off at 300 ° C.
【0021】[0021]
【実施例】次に実施例によって本発明を説明する。 実施例1 3cm平方の大きさに切断した、銅はくの厚さが35μ
mの紙布基材フェノール樹脂銅張り積層板の廃材を、あ
らかじめ、300℃に加熱し、図1に示す円錐状のサイ
クロンを用いて、窒素ガスをと圧縮空気を300℃に加
熱して送り、廃材同士を10分間高速回転させた。これ
により、積層板の廃材は、銅はく、粒径5〜200μm
の樹脂粉及び炭化した紙に分離した。銅は、顆粒状とな
っており、篩別けにより他の成分と分離でき、純度は9
9.9%以上であった。EXAMPLES The present invention will now be described with reference to examples. Example 1 The thickness of a copper foil cut into a size of 3 cm square has a thickness of 35 μm.
The waste material of the paper cloth base material phenol resin copper clad laminate of m is heated to 300 ° C. in advance, and nitrogen gas and compressed air are heated to 300 ° C. and sent by using the conical cyclone shown in FIG. The waste materials were rotated at high speed for 10 minutes. As a result, the waste material of the laminated plate is copper foil, and the particle size is 5 to 200 μm.
Separated into resin powder and carbonized paper. Copper is granular and can be separated from other components by sieving and has a purity of 9
It was 9.9% or more.
【0022】実施例2 3cm平方の大きさに切断した、銅はくの厚さが35μ
mのガラス布基材エポキシ樹脂銅張り積層板の廃材を、
あらかじめ、300℃に加熱し、図1に示す円錐状のサ
イクロンを用いて、窒素と空気ガス雰囲気中で300℃
10分間強制的に圧縮空気を送り廃材同士を高速回転で
衝突させた。これにより、積層板の廃材は、銅、粒径5
〜200μmの樹脂粉、最大長さ30mmのガラス単繊
維に分離していた。銅は、顆粒状となっており、篩別け
により他の成分と分離でき、純度は99.9%以上であ
った。Example 2 A copper foil having a thickness of 35 μ was cut into a size of 3 cm square.
m glass cloth base material epoxy resin copper clad laminate waste material,
Preheat to 300 ° C and use the conical cyclone shown in Fig. 1 to 300 ° C in nitrogen and air gas atmosphere.
Compressed air was forcibly sent for 10 minutes to cause the waste materials to collide at high speed. As a result, the waste material of the laminated plate is copper and the grain size is 5
Separated into resin powder of ˜200 μm and glass single fiber with a maximum length of 30 mm. Copper was in the form of granules, which could be separated from other components by sieving, and the purity was 99.9% or more.
【0023】分離したガラス繊維20重量部を、ポリプ
ロピレン樹脂100重量部に混練して、加熱成形して試
験片を作成した。この試験片について、引張強度、曲げ
強度及び熱変形温度を調べた。その結果を表1に示す。
比較のため、一般的に使用されている充填剤(タルク)
についての結果も表1に示す。試験方法は、引張強度は
JISK7113に、曲げ強度はJISK7203に、
熱変形温度はJISK7207に準拠した。20 parts by weight of the separated glass fiber was kneaded with 100 parts by weight of polypropylene resin and heat-molded to prepare a test piece. The tensile strength, bending strength and heat distortion temperature of this test piece were examined. The results are shown in Table 1.
Commonly used filler (talc) for comparison
The results are also shown in Table 1. As for the test method, tensile strength is JISK7113, bending strength is JISK7203,
The heat distortion temperature was based on JISK7207.
【0024】[0024]
【表1】 ───────────────────────────── 項目 単位 ガラス繊維混練品 タルク混練品 ───────────────────────────── 引張強度 MPa 45 40 ───────────────────────────── 曲げ強度 MPa 60 50 ───────────────────────────── 熱変形温度 ℃ 140 135 ─────────────────────────────[Table 1] ───────────────────────────── Item Unit Glass fiber kneaded product Talc kneaded product ──────── ───────────────────── Tensile strength MPa 45 40 ───────────────────────── ───── Bending strength MPa 60 50 ─────────────────────────────Heat deformation temperature ℃ 140 135 135───── ────────────────────────
【0025】次に、エポキシ樹脂(ビスフェノールA
型:エポキシ当量480)90重量部、クレゾールノボ
ラック型エポキシ樹脂(エポキシ当量190)に対して
ジシアンジアミド2重量部、2−エチル−4−メチルイ
ミダゾール0.15重量部を配合し溶剤で希釈し、樹脂
分60%の樹脂ワニスAを得た。この樹脂ワニスAに、
前記廃銅張り積層板を処理して得た樹脂粉100重量部
を配合した。これを樹脂ワニスBとする。Next, the epoxy resin (bisphenol A
Type: 90 parts by weight of epoxy equivalent 480), 2 parts by weight of dicyandiamide and 0.15 parts by weight of 2-ethyl-4-methylimidazole to a cresol novolac type epoxy resin (epoxy equivalent of 190), and diluted with a solvent to prepare a resin. Resin varnish A having a content of 60% was obtained. In this resin varnish A,
100 parts by weight of resin powder obtained by treating the waste copper clad laminate was mixed. This is designated as resin varnish B.
【0026】樹脂ワニスAをガラス布(日東紡績株式会
社のWE−18K−RB84)に樹脂含有量が42〜4
5%になるように含浸乾燥し、ガラス布プリプレグとし
た。また、樹脂ワニスBをガラス不織布基材にワニス固
形分が90%になるように含浸乾燥しガラス不織布プリ
プレグとした。The resin varnish A was applied to a glass cloth (WE-18K-RB84 manufactured by Nitto Boseki Co., Ltd.) with a resin content of 42-4.
The glass cloth prepreg was impregnated and dried to 5% to obtain a glass cloth prepreg. Further, the resin varnish B was impregnated into a glass nonwoven fabric base material so that the solid content of the varnish was 90%, and dried to obtain a glass nonwoven fabric prepreg.
【0027】上下表面層にガラス布プリプレを配置し、
ガラス不織布プリプレグを中間層とする構成で、ガラス
布プリプレグの外側に厚さ35μmの銅はくを重ね、成
形温度170℃、圧力4MPaで90分加熱加圧して、
厚さ1.6mmの両面銅張り積層板を得た。Glass cloth prepregs are arranged on the upper and lower surface layers,
With a configuration in which a glass non-woven fabric prepreg is used as an intermediate layer, a copper foil having a thickness of 35 μm is laid on the outside of the glass fabric prepreg and heated and pressed for 90 minutes at a molding temperature of 170 ° C. and a pressure of 4 MPa,
A double-sided copper-clad laminate having a thickness of 1.6 mm was obtained.
【0028】得られた積層板の曲げ強度は、縦:450
MPa、横:320MPa、吸水率は、D−24/2
3:0.06%、1MHzの誘電率は、受理状態:4.
4%、D−48/50:4.4、プレッシャークッカー
2.1気圧121℃処理後のはんだ耐熱性試験(260
℃はんだ槽20秒浸漬)で、まったく以上がなかった。The bending strength of the obtained laminated plate was 450 in the vertical direction.
MPa, horizontal: 320 MPa, water absorption is D-24 / 2
3: 0.06%, dielectric constant of 1 MHz, Accepted state: 4.
4%, D-48 / 50: 4.4, Pressure cooker 2.1 atm 121 ° C. Solder heat resistance test after treatment (260
In a solder bath at ℃ for 20 seconds), there was no more than that.
【0029】次に、樹脂粉に代えて、水酸化アルミニウ
ム(ハイジライトH3211)を100重量部配合した
樹脂ワニスを用いて不織布プリプレグを得たほかは同様
にして、厚さ1.6mmの両面銅張り積層板を得た。Next, in place of the resin powder, a non-woven fabric prepreg was obtained by using a resin varnish containing 100 parts by weight of aluminum hydroxide (Hidilite H3211). A tension laminate was obtained.
【0030】得られた積層板の曲げ強度は、縦:400
MPa、横:290MPa、吸水率は、D−24/2
3:0.08%、1MHzの誘電率は、受理状態:4.
6%、D−48/50:4.5、プレッシャークッカー
2.1気圧121℃処理後のはんだ耐熱性試験(260
℃はんだ槽20秒浸漬)で、プレッシャークッカー2時
間で、試験片5個中1個にミーズリング発生、3時間で
試験片5個中3個にミーズリング発生、4時間で試験片
5個中1個にミーズリング発生、4個にふくれ発生があ
った。The bending strength of the obtained laminate was 400: length.
MPa, horizontal: 290 MPa, water absorption is D-24 / 2
3: 0.08%, dielectric constant of 1 MHz, Accepted state: 4.
6%, D-48 / 50: 4.5, Pressure cooker 2.1 atmosphere, Solder heat resistance test after treatment at 121 ° C (260
In a solder bath at ℃ for 20 seconds), pressure cooker 2 hours, one of 5 test pieces produced measling, 3 hours 5 out of 5 test pieces produced measling, 4 hours out of 5 test pieces One had measling and four had blisters.
【0031】[0031]
【発明の効果】本発明によれば、環境安全上問題のある
廃銅張り積層板に含まれている銅と、ガラス繊維及び樹
脂分を低コストで分離、回収することができる。得られ
た銅は高品位の溶融メタルとして回収後各種銅原料とし
て産業上広い範囲の分野に再資源化できる。またガラス
フィラメントは熱可塑、熱硬化プラスチックの充填剤に
直接使用することができる他、各種ガラスの素原料とし
ても活用できるため産業廃棄物の発生抑制、再資源化等
産業上極めて有効である。EFFECTS OF THE INVENTION According to the present invention, copper contained in a waste copper-clad laminate having a problem in terms of environmental safety, glass fiber and resin can be separated and recovered at low cost. The obtained copper can be recycled into various industrial fields as various copper raw materials after being recovered as high-grade molten metal. Further, the glass filament can be directly used as a filler for thermoplastics and thermosetting plastics, and can also be utilized as a raw material for various kinds of glass, which is extremely effective in industry such as suppressing the generation of industrial waste and recycling.
【図1】本発明を実施するための装置の概略を示す図面
である。1 is a schematic diagram of an apparatus for carrying out the present invention.
【図2】加熱温度による銅はく引き剥がし強度の変化を
示すグラフである。FIG. 2 is a graph showing changes in copper foil peeling strength with heating temperature.
【図3】加熱温度による銅品位の変化を示すグラフであ
る。FIG. 3 is a graph showing changes in copper quality depending on heating temperature.
1 シューター 2 廃銅張り積層板 3 サイクロン 4 樹脂粉 5 銅 6 ガラス繊維 7 ヒータ 8 ブロワ 1 Shooter 2 Waste copper clad laminate 3 Cyclone 4 Resin powder 5 Copper 6 Glass fiber 7 Heater 8 Blower
───────────────────────────────────────────────────── フロントページの続き (72)発明者 手島 照雄 茨城県下館市大字五所宮1150番地 日立化 成工業株式会社五所宮工場内 (72)発明者 森田 実 茨城県下館市大字小川1500番地 日立化成 工業株式会社下館工場内 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Teruo Teshima 1150 Gozamiya, Shimodate City, Ibaraki Prefecture Goseimiya Plant, Hitachi Chemical Co., Ltd. (72) Minor Morita 1500 Ogawa, Shimodate City, Ibaraki Prefecture Hitachi Chemical Shimodate Factory of Industrial Co., Ltd.
Claims (2)
態に保持しつつ浮遊状態で相互に衝突させて、銅とその
他の成分とに分離させることを特徴とする、廃銅張り積
層板の再資源化方法。1. A waste copper-clad laminate, characterized in that the waste copper-clad laminate is cut and kept in a heated state and collided with each other in a floating state to separate copper and other components. Plate recycling method.
の中で処理できる程度に切断し、加熱された気体ととも
に円錐状のサイクロンの中に送りこみ、切断された廃銅
張り積層板を相互に衝突させて、銅とその他の成分とに
分離させることを特徴とする、廃銅張り積層板の再資源
化方法。2. A waste copper-clad laminate is cut into a cone-shaped cyclone to such an extent that it can be processed, and is sent into a cone-shaped cyclone together with heated gas to produce a cut waste copper-clad laminate. A method for recycling a waste copper-clad laminate, which is characterized by colliding with each other to separate copper and other components.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP22407993A JPH0775771A (en) | 1993-09-09 | 1993-09-09 | Reusing method of waste copper-plated laminate substrate as resource |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP22407993A JPH0775771A (en) | 1993-09-09 | 1993-09-09 | Reusing method of waste copper-plated laminate substrate as resource |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0775771A true JPH0775771A (en) | 1995-03-20 |
Family
ID=16808235
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP22407993A Pending JPH0775771A (en) | 1993-09-09 | 1993-09-09 | Reusing method of waste copper-plated laminate substrate as resource |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0775771A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009293055A (en) * | 2008-06-02 | 2009-12-17 | Tetsuyuki Koizumi | Method for recovering valuable metal from waste material |
JP2011122229A (en) * | 2009-12-14 | 2011-06-23 | Astec Irie Co Ltd | Method for treating plastic component with plating |
CN111069234A (en) * | 2019-12-18 | 2020-04-28 | 徐州德慧企业管理有限公司 | Copper wire recycling equipment and method for recycling photovoltaic solar panel |
-
1993
- 1993-09-09 JP JP22407993A patent/JPH0775771A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009293055A (en) * | 2008-06-02 | 2009-12-17 | Tetsuyuki Koizumi | Method for recovering valuable metal from waste material |
JP2011122229A (en) * | 2009-12-14 | 2011-06-23 | Astec Irie Co Ltd | Method for treating plastic component with plating |
CN111069234A (en) * | 2019-12-18 | 2020-04-28 | 徐州德慧企业管理有限公司 | Copper wire recycling equipment and method for recycling photovoltaic solar panel |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
Luda | Recycling of printed circuit boards | |
EP2684911A1 (en) | Epoxy resin hardened material and decomposition method for same | |
JP3544834B2 (en) | Mixed waste treatment equipment | |
PL269370A1 (en) | The method of rotation of electric batteries,equiped with printed plates and electronic elements | |
CA1328842C (en) | Process for recovery of metals from metal / plastic waste and the like | |
JPH02218486A (en) | Recovery of metal copper from cutting refuse of printed circuit board | |
Yokoyama et al. | Recycling system for printed wiring boards with mounted parts | |
JPH0775771A (en) | Reusing method of waste copper-plated laminate substrate as resource | |
CN113412167A (en) | Method for treating waste electronic substrate | |
JPH1176980A (en) | Treatment of printed board | |
JPH11188335A (en) | Method for treating waste copper wire | |
JPH06256863A (en) | Method for recovering metal from circuit board and device therefor | |
CN104342553A (en) | Method for processing printed circuit board, and apparatus thereof | |
JPH0871521A (en) | Treatment of waste printed circuit board | |
CN110434159A (en) | A method of quickly recycling copper foil in waste and old copper-clad plate | |
JPH09262573A (en) | Resource recycling method from electronic part-mounted waste printed circuit board | |
Sover et al. | The Use Of Laser Technology For Recycling Hybrid Electronic Waste | |
EP1077747B1 (en) | Method for the material decomposition of composites containing artificial resin | |
JP2003154283A (en) | Method of pulverizing prepreg end material | |
JPS6213544A (en) | Method of carrying out recovery of copper component from waste material of printed wiring board simultaneously with production of polychlorinated aluminum | |
JPH07144324A (en) | Phenol resin molding material | |
CN102716896B (en) | Method for recycling copper foils and glass fibers in discarded circuit board by means of hydro-thermal treatment | |
JP4090645B2 (en) | Method for decomposing thermosetting resin | |
JP2003096233A (en) | Method for decomposing thermosetting resin and method for recycling the resin | |
CN101358284A (en) | Stripping method of metal copper foil on waste phenolic circuit board |