JPH0774479B2 - Electroplating equipment - Google Patents
Electroplating equipmentInfo
- Publication number
- JPH0774479B2 JPH0774479B2 JP2074028A JP7402890A JPH0774479B2 JP H0774479 B2 JPH0774479 B2 JP H0774479B2 JP 2074028 A JP2074028 A JP 2074028A JP 7402890 A JP7402890 A JP 7402890A JP H0774479 B2 JPH0774479 B2 JP H0774479B2
- Authority
- JP
- Japan
- Prior art keywords
- plating
- cathode
- processed product
- power supply
- power
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
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- Electroplating Methods And Accessories (AREA)
- Manufacturing Of Printed Wiring (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、めっき液中で処理品を陰極とし、かつ、電解
によって処理品の表面にめっき膜を生成する電気めっき
装置に関する。TECHNICAL FIELD The present invention relates to an electroplating apparatus that uses a treated product as a cathode in a plating solution and produces a plating film on the surface of the treated product by electrolysis.
従来から、この種の電気めっき装置としては、第２図で
示すように構成されたものがある。2. Description of the Related Art Conventionally, there is an electroplating apparatus of this type configured as shown in FIG.
すなわち、この電気めっき装置10は、めっき液を貯溜し
ためっき槽11と、めっき処理すべき処理品Ｗを支持する
陰極部分12aの列からなる陰極12とを備えるとともに、
その陰極部分12aごとに対して設けられたうえ、電気的
に連結された複数の陽極13を備えている。そして、この
陰極部分12aと陽極13との一対ごとによって各処理品Ｗ
のめっき処理を行う個々の給電ステージ14が構成されて
いる。また、この電気めっき装置10には、給電ステージ
14の全て、すなわち、全ての陰極部分12aと全ての陽極1
3とに対して所要のめっき電流を一括して給電する単一
の電源15が設けられている。That is, the electroplating apparatus 10 includes a plating tank 11 that stores a plating solution, and a cathode 12 that is composed of a row of cathode portions 12a that supports a product W to be plated.
A plurality of anodes 13 are provided for each of the cathode portions 12a and electrically connected to each other. Then, each pair of the cathode portion 12a and the anode 13 is treated as a processed product W.
The individual power supply stages 14 for performing the plating process are configured. In addition, this electroplating apparatus 10 has a power feeding stage.
All 14, ie all cathode parts 12a and all anodes 1
A single power supply 15 for collectively supplying the required plating current to 3 and 3 is provided.
そこで、この電気めっき装置10では、めっき前処理が完
了した処理品Ｗをめっき槽11の一端側から投入し、投入
された処理品Ｗのそれぞれが給電ステージ14ごとに搬
送、すなわち、陰極部分12aごとに支持されながら間歇
送り（タクト処理）されることにより、めっき処理され
ていく。そして、めっき処理が完了した処理品Ｗは、め
っき槽11の他端側から次工程へ送り出されていくことに
なる。なお、この処理品Ｗを搬送する機構の図示は省略
している。Therefore, in this electroplating apparatus 10, the processed product W for which the pretreatment for plating has been completed is introduced from one end side of the plating tank 11, and each of the introduced processed products W is conveyed to each power feeding stage 14, that is, the cathode portion 12a. The plating process is performed by intermittently feeding (tact process) while being supported by each. Then, the processed product W for which the plating process has been completed is sent to the next process from the other end side of the plating tank 11. It should be noted that the illustration of the mechanism that conveys the processed product W is omitted.
ところで、前記従来構成の電気めっき装置10において
は、つぎのような不都合が生じることになっていた。By the way, in the electroplating apparatus 10 having the above-mentioned conventional configuration, the following disadvantages would occur.
すなわち、この電気めっき装置10を用いて一群の処理品
Ｗを連続的にめっき処理した場合、これらの処理品Ｗの
形状や面積というようなめっき条件が互いに異なってい
ると、各処理品Ｗの表面に生成されためっき膜の膜厚が
ばらつくことになってしまうそして、この不都合は、処
理品Ｗのめっき条件に関わることなく、所要のめっき電
流が電源15から給電ステージ14の全てに対して一律的に
給電されることに起因するものと考えられる。That is, when a group of processed products W are continuously plated using this electroplating apparatus 10, if the plating conditions such as the shape and area of these processed products W are different from each other, The thickness of the plating film generated on the surface will vary, and this inconvenience is that the required plating current is applied to all of the power supply stage 14 from the power supply 15 regardless of the plating conditions of the processed product W. It is considered that this is because the power is uniformly supplied.
また、めっき槽11内に一群の処理品Ｗを連続投入する
と、その最初及び最後に投入された処理品Ｗの前側もし
くは後側位置には他の処理品Ｗが存在していないことか
ら、最端位置でめっき処理された処理品Ｗにおけるめっ
き膜厚、特に、その隣接する処理品Ｗがない側のめっき
膜厚が厚くなってしまう。そして、この不都合は、最端
に位置する給電ステージ14の陰極部分12aで支持されて
めっき処理中の処理品Ｗが隣接もしくは遠方に位置して
処理品Ｗを支持していない給電ステージ14の影響を受け
る結果と考えられる。そこで、これを避けるためには、
わざわざ最端に位置する処理品Ｗの前側もしくは後側に
別のダミー品を投入することが行われていた。Further, when a group of processed products W is continuously charged into the plating tank 11, there is no other processed product W at the front or rear position of the first and last processed products W. The plating film thickness of the processed product W plated at the edge position, especially the thickness of the adjacent processed product W-less side is increased. This inconvenience is due to the influence of the power feeding stage 14 which is supported by the cathode portion 12a of the power feeding stage 14 located at the extreme end and which is being processed by plating and is not adjacent to the processed product W and does not support the processed product W. It is considered that the result is. So to avoid this,
It has been performed to put another dummy product on the front side or the rear side of the processed product W located at the extreme end.
本発明は、このような不都合を解消すべく創案されたも
のであって、めっき条件の相違に関わることなく、処理
品におけるめっき膜厚の均一化を図ることができ、しか
も、ダミー品を投入することなく、一群のうちの最端に
位置する処理品のめっき膜厚が他よりも厚くなることを
防止することが可能な電気めっき装置の提供を目的とし
ている。The present invention was devised to eliminate such inconveniences, and it is possible to make the plating film thickness of treated products uniform regardless of the difference in plating conditions. It is an object of the present invention to provide an electroplating apparatus that can prevent the plated film thickness of the processed product located at the end of the group from becoming thicker than the other without doing so.
本発明に係る電気めっき装置は、このような目的を達成
するために、めっき処理すべき処理品を支持する陰極及
びこの陰極に対する陽極からなる給電ステージの複数を
絶縁して連続配置し、かつ、上記給電ステージのそれぞ
れに給電する電源を設け、上記処理品を上記給電ステー
ジ間で順次搬送することを特徴とするものである。Electroplating apparatus according to the present invention, in order to achieve such an object, a plurality of feeding stages consisting of a cathode supporting the treated product to be plated and an anode for this cathode are insulated and continuously arranged, and, A power supply for supplying power to each of the power supply stages is provided, and the processed product is sequentially conveyed between the power supply stages.
上記構成によれば、複数の給電ステージ（陰極および陽
極）間を絶縁しそれぞれの給電ステージに電源を設ける
ことによって、給電ステージ相互の影響をなくすととも
に、処理品が搬送され陰極に支持された給電ステージの
電源が陰極−処理品−めっき液−陽極の通電経路を通じ
て通電され、処理品が支持されていない給電ステージは
通電経路が断たれ通電されないので、搬送された始まり
あるいは終わりの処理品は、これが支持された給電ステ
ージの前あるいは後の給電ステージの影響が全くなく、
そのめっき厚のばらつきを防止することができる。According to the above configuration, the plurality of power feeding stages (cathode and anode) are insulated from each other and a power source is provided for each of the power feeding stages, so that mutual influence of the power feeding stages is eliminated, and the processed product is transported and supported by the cathode. The power supply of the stage is energized through the energization path of cathode-processed product-plating solution-anode, and the power supply stage where the processed product is not supported is not energized because the energized path is cut off. There is no influence of the feeding stage before or after the feeding stage where this is supported,
It is possible to prevent variations in the plating thickness.
以下、この発明の実施例を図面に基づいて説明する。 Embodiments of the present invention will be described below with reference to the drawings.
第１図は本実施例に関る電気めっき装置の概略構成を示
す平面図であり、この図における符号１は電気めっき装
置である。そして、この電気めっき装置１は、めっき液
を貯溜しためっき槽２と、このめっき槽２内に連続配置
されて投入された処理品Ｗのめっき処理を行う複数の給
電ステージ３とを備えており、各給電ステージ３はめっ
き処理すべき処理品Ｗを支持する陰極４とこれに対する
陽極５とから構成されている。FIG. 1 is a plan view showing a schematic configuration of an electroplating apparatus according to this embodiment, and reference numeral 1 in this figure is an electroplating apparatus. The electroplating apparatus 1 is provided with a plating tank 2 that stores a plating solution, and a plurality of power feeding stages 3 that perform a plating process on the processed products W that are continuously arranged and placed in the plating tank 2. Each power supply stage 3 is composed of a cathode 4 that supports a product W to be plated and an anode 5 for the cathode 4.
また、この電気めっき装置１には、給電ステージ３のそ
れぞれごとに給電する複数の電源６が設けられており、
個々の電源６から対応する各給電ステージ３、すなわ
ち、これを構成する陰極４及び陽極５に対しては、個別
に制御された所要のめっき電流が給電されるようになっ
ている。なお、この図における給電ステージ３の各々は
２つの陽極５によって構成されており、陽極５同士は陰
極４を介して互いに配向配置されているが、この構成に
限定されるものではなく、陽極５の個数やめっき槽１の
形状などについては作業上の必要によって定めればよい
ものである。In addition, the electroplating apparatus 1 is provided with a plurality of power sources 6 for supplying power to each of the power supply stages 3.
A required individually controlled plating current is supplied from each power supply 6 to the corresponding power supply stage 3, that is, the cathode 4 and the anode 5 constituting the power supply stage 3. Each of the power feeding stages 3 in this figure is composed of two anodes 5, and the anodes 5 are oriented with respect to each other via the cathode 4. However, the configuration is not limited to this, and the anode 5 The number of plates and the shape of the plating tank 1 may be determined according to operational needs.
つぎに、本実施例に関る電気めっき装置１の動作を説明
する。Next, the operation of the electroplating apparatus 1 according to this embodiment will be described.
まず、めっき槽２の一端側からは、めっき前処理が完了
してめっき処理すべき処理品Ｗが投入され、この投入さ
れた処理品Ｗは第１番目の給電ステージ３を構成する陰
極４によって支持される。そこで、この第１番目の給電
ステージ３に対しては、対応する第１番目の電源６から
処理品Ｗの形状や面積というようなめっき条件に応じて
設定された所要のめっき電流が給電され、この処理品Ｗ
のめっき処理が行われる。そして、間歇送り（タクト処
理）に伴う所定時間（タクトタイム）が経過するたびご
とに、処理品Ｗは搬送機構（図示していない）によって
第２番目，第３番目，…の給電ステージ３へと順次搬送
されていき、それぞれの陰極４によって支持されたうえ
でめっき処理されていく。このとき、搬送されてきた処
理品Ｗを支持する陰極４から構成された給電ステージ３
に対しては、これと対応する電源６のそれぞれから処理
品Ｗのめっき条件に応じた所要のめっき電流が給電され
る。First, from one end side of the plating tank 2, a processed product W to be plated after the pretreatment of plating is completed, and this processed product W is supplied by the cathode 4 constituting the first power feeding stage 3. Supported. Therefore, a required plating current set in accordance with the plating conditions such as the shape and area of the processed product W is supplied from the corresponding first power supply 6 to the first power supply stage 3, This processed product W
Plating treatment is performed. Then, every time a predetermined time (tact time) associated with intermittent feeding (tact processing) elapses, the processed product W is transferred to the second, third, ... Power feeding stages 3 by a transfer mechanism (not shown). Then, they are sequentially transported, supported by the respective cathodes 4, and then plated. At this time, the power feeding stage 3 composed of the cathode 4 supporting the transported processed product W
, A power supply 6 corresponding thereto supplies a required plating current according to the plating conditions of the processed product W.
また、この処理品Ｗを送り出した第１番目の給電ステー
ジ３には、続いてめっき処理すべき処理品Ｗが新たに搬
送されてき、この新たな処理品Ｗは給電ステージ３の陰
極４によって支持される。そして、この給電ステージ３
に対しては、対応する第１番目の電源６から新たな処理
品Ｗのめっき条件に応じた所要のめっき電流が給電され
て処理品Ｗのめっき処理が行われる。Further, the processed product W to be plated is newly conveyed to the first power supply stage 3 that has sent out the processed product W, and the new processed product W is supported by the cathode 4 of the power supply stage 3. To be done. And this feeding stage 3
In contrast, the corresponding first power supply 6 supplies a required plating current according to the plating condition of the new processed product W to perform the plating process of the processed product W.
したがって、この電気めっき装置１においては、上記の
ような動作の繰り返しにより、連続投入された処理品Ｗ
のそれぞれが給電ステージ３ごとに搬送、すなわち、陰
極４ごとに支持されながら間歇送り（タクト処理）され
ることによってめっき処理されていき、めっき処理が完
了した処理品Ｗはめっき槽２の他端側から送り出されて
いく。すなわち、本実施例の処理品Ｗを支持する陰極４
及び陽極５からなる給電ステージ３のそれぞれごとに対
しては対応する電源６の各々から給電が行われ、各電源
６から給電するめっき電流を処理品Ｗのめっき条件に応
じて個別に制御することになる。Therefore, in this electroplating apparatus 1, the processed products W continuously fed by repeating the above-described operation.
Are transported to each power feeding stage 3, that is, are intermittently fed (tact treatment) while being supported by each cathode 4, and the plating treatment is completed. The processed product W is the other end of the plating tank 2. It is sent out from the side. That is, the cathode 4 supporting the processed product W of this embodiment.
Power is supplied from each of the corresponding power supplies 6 to each of the power supply stages 3 including the anode 5 and the anode 5, and the plating current supplied from each power supply 6 is individually controlled according to the plating conditions of the processed product W. become.
ところで、連続投入された一群の処理品Ｗの最初及び最
後に投入された処理品Ｗの前側もしくは後側位置には他
の処理品Ｗが存在していない。この処理品を支持してい
ない陰極４及び陽極５からなる給電ステージ３は電源６
の通電経路が断たれるので、通電されず、この給電ステ
ージ３による処理品Ｗに対する影響は全くなくなる。By the way, there is no other processed product W at the front side or rear side position of the first and last processed products W of the group of continuously processed products W. The power supply stage 3 consisting of the cathode 4 and the anode 5 that does not support this treated product is the power source 6
Since the current-carrying path is cut off, no current is supplied, and the power supply stage 3 has no influence on the processed product W.
以上説明したように、本発明においては、めっき処理す
べき処理品を支持する陰極及びこの陰極に対する陽極か
らなる給電ステージの複数を絶縁して連続配置し、か
つ、上記給電ステージのそれぞれに給電する電源を設
け、上記処理品を上記給電ステージ間で順次搬送する。
従って、本発明によれば、給電ステージ相互の影響をな
くすとともに、処理品が搬送され陰極に支持された給電
ステージの電源が陰極−処理品−めっき液−陽極の通電
経路を通じて通電され、処理品が支持されていない給電
ステージは通電経路が断たれ通電されないので、搬送さ
れた始まりあるいは終わりの処理品は、これが支持され
た給電ステージの前あるいは後の給電ステージの影響が
全くなく、そのめっき厚のばらつきを防止することがで
きるという効果が得られる。As described above, in the present invention, a plurality of feed stages each including a cathode supporting an object to be plated and an anode for the cathode are insulated and continuously arranged, and power is fed to each of the feed stages. A power source is provided and the processed products are sequentially transported between the power feeding stages.
Therefore, according to the present invention, it is possible to eliminate the mutual influence of the power feed stages and to energize the power source of the power feed stage in which the processed product is transported and supported by the cathode through the energization path of cathode-processed product-plating solution-anode. Since the power supply stage that does not support is not energized because the power supply path is cut off, the processed products at the beginning or end that have been transported are completely unaffected by the power supply stage before or after the power supply stage on which they are supported, and their plating thickness The effect that it is possible to prevent the variation of
第１図は本発明の実施例に係る電気めっき装置の概略構
成を示す平面図であり、第２図は従来例に係る電気めっ
き装置の概略構成を示す平面図である。 図における符号１は電気めっき装置、２はめっき槽、３
は給電ステージ、４は陰極、５は陽極、６は電源、Ｗは
処理品である。FIG. 1 is a plan view showing a schematic configuration of an electroplating apparatus according to an embodiment of the present invention, and FIG. 2 is a plan view showing a schematic configuration of an electroplating apparatus according to a conventional example. In the figure, reference numeral 1 is an electroplating apparatus, 2 is a plating tank, and 3
Is a feeding stage, 4 is a cathode, 5 is an anode, 6 is a power source, and W is a processed product.
Claims (1)
びこの陰極に対する陽極からなる給電ステージの複数を
絶縁して連続配置し、かつ、上記給電ステージのそれぞ
れに給電する電源を設け、上記処理品を上記給電ステー
ジ間で順次搬送することを特徴とする電気めっき装置。1. A plurality of power feeding stages, each of which is composed of a cathode supporting a product to be plated and an anode for the cathode, are insulated and continuously arranged, and a power source is provided to feed power to each of the power feeding stages. An electroplating apparatus which sequentially conveys products between the power feeding stages.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2074028A JPH0774479B2 (en) | 1990-03-22 | 1990-03-22 | Electroplating equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2074028A JPH0774479B2 (en) | 1990-03-22 | 1990-03-22 | Electroplating equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03271398A JPH03271398A (en) | 1991-12-03 |
| JPH0774479B2 true JPH0774479B2 (en) | 1995-08-09 |
Family
ID=13535274
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2074028A Expired - Lifetime JPH0774479B2 (en) | 1990-03-22 | 1990-03-22 | Electroplating equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0774479B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5457010B2 (en) * | 2007-11-01 | 2014-04-02 | アルメックスＰｅ株式会社 | Continuous plating equipment |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60135599A (en) * | 1983-12-22 | 1985-07-18 | Nippon Light Metal Co Ltd | Surface treatment of metal |
| JPS61133400A (en) * | 1984-12-03 | 1986-06-20 | Kosaku:Kk | Electroplating device |
| JPS61227197A (en) * | 1985-04-02 | 1986-10-09 | Toshiba Corp | Plating method |
-
1990
- 1990-03-22 JP JP2074028A patent/JPH0774479B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH03271398A (en) | 1991-12-03 |
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