JPH077297A - Flat package ic mount apparatus - Google Patents

Abstract

PURPOSE:To provide a flat package IC mount apparatus in which erroneous recognition of an image of IC leads due to superposition of gloss with reflected light from the lead due to wear of a sucking surface at an end of a suction nozzle is prevented when the leads are image-recognized. CONSTITUTION:An end 4 of a slidable second suction nozzle 3 so arranged as to surround a first suction nozzle 2 for sucking a flat package IC is formed of synthetic resin.hard rubber or stone material of a material which does not reflect a black color by a light to eliminate reflection of a light from an illuminator 6 by a sucking surface 3a.

Description

Detailed Description of the Invention

[0001]

FIELD OF THE INVENTION The present invention relates to a flat package IC.
The present invention relates to a mounting device for a flat package IC, in which the shape of an IC lead is compared and recognized with a lead in a normal state to perform selection and mounting.

[0002]

2. Description of the Related Art Conventionally, this type of flat package I
As shown in FIG. 2 (A), the mounting device for C takes out the flat package IC1 that is lined up and stored in a component supply tray (not shown) by the suction nozzle 32,
An image is recognized by a recognition device 5 provided with a CCD camera or the like for reflection of light from a lighting device 6 arranged below the suction nozzle 32 while being conveyed in the horizontal direction. The light emitted from 6 is reflected from the lead portion 1a of the flat package IC1 and only the lead portion glows white, and the binarization level is adjusted so that the portion other than the lead portion looks black, and the flat package IC1
Of the lead package and the center deviation of the flat package IC1 with respect to the center of the suction nozzle 32 are measured and calculated,
The flat package IC1 is mounted at a predetermined position on a substrate (not shown) with desired position accuracy.

When carrying a large flat package IC 1 ', as shown in FIG.
The suction tip portion 7 which is detachable from the suction nozzle 2 and has a large suction surface is attached to the suction nozzle 32.

Further, a suction nozzle used when carrying flat package ICs of various sizes is shown in FIG.
As shown in (C), a small flat package IC1
A first suction nozzle 32 'for sucking the first suction nozzle 32' and a second suction nozzle 33 having a large suction surface 33a slidably provided so as to surround the outside of the first suction nozzle 32 '. The composite suction nozzle 30 is used.

[0005]

In the flat package IC mounting apparatus having the conventional composite suction nozzle 30 shown in FIG. 2C, the large flat package I is used.
Adsorption surface 3 in contact with the IC of the second adsorption nozzle 33 for C
When 3a is worn, a metallic glossy surface is generated, so that a small flat package IC1 is provided by the first suction nozzle 32 '.
In the case of mounting the device, the light emitted from the illumination device 6 is reflected from the adsorption surface 33a and the small flat package I
There is a drawback in that the reflected light from the lead portion 1a of C1 overlaps with each other to cause erroneous recognition of an image.

An object of the present invention is to provide a first suction nozzle and a second suction nozzle.
Provided is a mounting device of a flat package IC having a composite suction nozzle together with the above suction nozzle, in which the recognition device can accurately detect the bending without causing erroneous recognition in image recognition of the bending of the lead portion. Especially.

[0007]

A mounting device for a flat package IC according to the present invention is provided with a first suction nozzle for sucking the flat package IC and an outer periphery of the first suction nozzle, and the sliding device is provided. A second suction nozzle that is movably provided, and the surface of the second suction nozzle that performs suction is formed of a black material that does not reflect light.

For the black material, black synthetic resin, hard rubber or stone is suitable.

[0009]

Since the surface of the tip of the second suction nozzle for performing suction is made of a black material that does not reflect light, light is not reflected from the suction surface, and the flat package IC sucked by the first suction nozzle. Only the reflected light from the lead portion of the image is recognized by the recognition device.

[0010]

Embodiments of the present invention will now be described with reference to the drawings. 1 is a schematic cross-sectional view of an essential part of an embodiment of an apparatus for mounting a flat package IC according to the present invention.
1A is a diagram when a small flat package IC is mounted, and FIG. 1B is a diagram when a large flat package IC is mounted.

The first suction nozzle 2 is a nozzle for sucking and taking out IC1s which are aligned and accommodated in a tray (not shown) in order to convey a small flat package IC1 (hereinafter referred to as IC1). . The second suction nozzle 3 is slidably provided so as to surround the outside of the first suction nozzle 2, and has a large flat package IC.
It is a nozzle for adsorbing and taking out IC1 'from a tray (not shown) for carrying 1' (hereinafter referred to as IC1 '). The tip portion 4 is provided at the tip portion of the second suction nozzle 3 to form a suction surface 3a, and can suck a large IC 1 '. As the material of the tip portion 4, a black material that does not reflect light and is resistant to abrasion is used, and synthetic resin, hard rubber or stone material is preferable. The first suction nozzle 2 and the second suction nozzle 3 are combined suction nozzles 10.
When the small IC 1 is formed by forming the above, the first suction nozzle 2 is lowered (or the second suction nozzle 3 is raised).
When the IC1 'is mounted by a large size and the large IC1' is mounted, the second suction nozzle 3 is lowered (or the first suction nozzle 2 is used).
Is raised) to adsorb IC1 'and carry it. The recognition device 5 is provided below the nozzle 10 in the transport direction, and reflects light from the illuminating device 6 and the leads 1a and 1'a of the IC1 and IC1 'that illuminate the IC1 or IC1' that is transported through the top from below. This is an apparatus that includes a CCD camera (not shown) for detecting an image and recognizes the detected image in comparison with an image of a lead in a normal state at a binarization level in image processing.

Next, the operation of the apparatus for mounting the flat package IC will be described. In order to mount the flat package ICs, which are aligned and stored in a tray (not shown), on the substrate (not shown), the first or the first of the composite suction nozzles 10 of the mounting device corresponding to the dimensions of the flat package ICs. Either of the suction nozzles 2 is selected. For example, when mounting a large IC1 ', the second suction nozzle 3 adapted to the dimensions of this IC1' is moved directly above the IC1 'to be mounted, and is sucked down and conveyed. When passing above the recognition device 5 in the middle of conveyance, the image of the IC 1'is recognized by the recognition device 5 by the light emitted from the illumination device 6, and the bending of the lead portion 1'a and the deviation of the suction position are caused. Detection is measured. In this case, since the first suction nozzle 2 serves as a large IC 1 ', the light from the illumination device does not reach and does not affect the image. Also small IC
1 is mounted, the first suction nozzle 2 adapted to the size of the IC 1 is used, and image recognition is performed in the same manner as in the above case to detect bending of the lead portion 1a and deviation of the suction position. To be measured. In this case, the light emitted from the illumination device 6 reaches the tip portion 4 of the second suction nozzle 3, but since the material forming the suction surface 3a provided at the tip portion is a black material, the light is emitted. It absorbs light and does not reflect it. Therefore, the image processed by the recognition device 5 is only the reflection from the IC 1.

[0013]

As described above, according to the present invention, the first suction nozzle capable of sucking the small flat package IC and the large flat package arranged so as to surround the outer side of the first suction nozzle. In a device for mounting a flat package IC having a second suction nozzle for sucking the IC, the first suction nozzle is formed by forming a suction surface of the second suction nozzle with a black material that does not reflect light. Even if the light reaches the second suction nozzle when using, the reflected light from the second suction nozzle does not occur. Therefore, in the recognition device for recognizing an image, erroneous recognition with respect to bending of the lead does not occur, and accurate bending Is effective.

[Brief description of drawings]

FIG. 1 is a schematic cross-sectional view of a main part of a flat package IC mounting device according to the present invention, in which FIG. 1A shows a case where a small flat package IC is mounted and FIG. It is a figure in the case of mounting a flat package IC.

FIG. 2 is a schematic cross-sectional view of a main part of a mounting device for a flat package IC according to the related art, where FIG. 2A is a small flat package IC and FIG.
In the case of large flat package IC by the modification of (A),
FIG. 2C is a diagram in the case of a composite suction nozzle.

[Explanation of symbols]

 1 Small flat package IC 1'Large flat package IC 1a, 1'a Lead part 2, 32 'First suction nozzle 3, 33 Second suction nozzle 10, 30 Composite suction nozzle 32 Suction nozzle 3a, 33a Adsorption surface 4 Tip 5 Recognition device 6 Lighting device 7 Adsorption tip

Claims (2)

[Claims] 1. A first suction nozzle capable of suctioning a flat package IC, and a second suction nozzle arranged so as to surround the outside of the first suction nozzle, and below the suction nozzle. A recognition device for recognizing an image of the flat package IC and the flat package IC
Flat package I with illuminating device for irradiating light
In the mounting device of C, the mounting device of the flat package IC, wherein a surface of the second suction nozzle that performs suction is made of a black material that does not reflect light. 2. The flat package I according to claim 1, wherein the black material is synthetic resin, hard rubber or stone.
C mounting device.