JPH077281A - Heat dissipating device - Google Patents

Abstract

PURPOSE:To provide a spring for simultaneously fixing a plurality of fins for dissipating heats of a plurality of ICs mounted on a printed wiring board to remarkably dissipate heats in the case of standing and using the board. CONSTITUTION:The heat dissipating device comprises a counter spring 2 for retaining heat dissipating fins 1 and a stay 3 for fixing them, wherein the fins 1 are mounted at the spring 2, integrated units are matched at rear and front sides by the stay 3, a through hole is formed at a printed wiring board and clamped by a screw.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an integrated circuit (IC) when a plurality of integrated circuits (hereinafter referred to as ICs) mounted on a printed wiring board and generating a large amount of heat are efficiently radiated. The present invention relates to an integral spring for simultaneously pressing a plurality of heat radiation fins based on the arrangement rule described in 1.

[0002]

2. Description of the Related Art When a plurality of ICs mounted on a printed wiring board and generating a large amount of heat are radiated, a conventional radiating fin holding spring is mounted by attaching a holding spring to each IC.

An example of a conventional device will be described below with reference to the drawings. FIG. 4 is a perspective view showing a method of using a conventional radiation fin pressing spring. With the radiating fins 1 for radiating the plurality of ICs 9 that generate a great deal of heat mounted on the printed wiring board 10 placed on the ICs 9, the clamp springs 11 are installed so as to fit into the grooves of the radiating fins 1. Then, the clamp spring 11 is fitted and fixed in the hole 12 provided in the printed wiring board 10. Since a force to spread is applied to the clamp spring 11, the clamp spring 11 fits into the hole 12 so that it cannot be easily removed. In this way, a pressing spring is attached to each IC that generates heat.

[0004]

However, the above-mentioned conventional structure requires as many pressing springs as the number of ICs that need to radiate heat, and also requires holes for fixing the pressing springs to the printed wiring board. Therefore, there is a problem that space is restricted.

The present invention solves the above-mentioned conventional problems and provides a heat dissipation device for simultaneously fixing a plurality of fins for dissipating a plurality of ICs mounted on a printed wiring board and generating a great deal of heat. To aim.

[0006]

In order to achieve this object, the heat dissipation device of the present invention comprises a spring for pressing the heat dissipation fin and a stay for fixing it, and a unit in which the spring and the stay are integrated. Has a structure in which a through hole is provided in the printed wiring board and the back side and the front side are aligned and fixed by passing screws.

[0007]

With this configuration, in order to efficiently dissipate a plurality of ICs mounted on a printed wiring board and generating a great amount of heat, it is not necessary to individually fix the heat dissipating fins with springs.
A plurality of IC heat radiation fins based on the IC arrangement rule can be simultaneously fixed by a unit in which a spring and a stay portion are integrated, and the heat radiation fins can be fixed so as not to come off.

[0008]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings.

As shown in FIG. 1, the pressing spring 2 is attached so that it fits into the projection 5 provided on the stay 3, and then the projection 5 is caulked to fix the pressing spring 2. The radiation fin 1 is attached to the pressing spring 2. At this time, the radiating fin 1 is set so as to fit into the tip of the pressing spring 2, and the radiating fin 1 is fixed so as not to fall off.

In order to efficiently dissipate heat from the printed wiring board 10 on which the IC 9 that generates a large amount of heat is mounted when the board is used upright, the rules for arranging the ICs are determined as follows. (1) Arrange so that the total power consumption of the front surface and the back surface are equal (2) Arrange so that the front side IC and the back side IC do not overlap (3) The upper side IC does not come directly above the IC mounted on the lower side (4) ICs with high power consumption are arranged in the upper stage and ICs with low power consumption are arranged in the lower stage. Heat dissipation from a plurality of heat generating ICs 9 mounted on the printed wiring board 10 based on the above IC arrangement rule. On fin 1
The claw 8 provided at both ends of the stay 3 of the unit in which the stay 3 and the pressing spring 2 are integrated is hooked and placed on the shield case body 6 so as not to move. As shown in FIG. 2, the unit is placed on the opposite side of the printed wiring board 10 in the same manner and fixed with screws. When fixing with screws, the printed wiring board 10 is fixed by alternately tightening one screw each on the front side and the back side.

When the screws are tightened alternately on the front side and the back side of the printed wiring board 10, the radiating fins 1 are pressed against the heat-generating IC 9 by the pressing spring and are brought into closer contact with each other.
The heat generated by the heat can be efficiently transmitted to the radiation fins.

In FIG. 3, stays 3 are provided on the back side and the front side, respectively.
And a plan view in which a unit is formed by attaching a radiation fin to the pressing spring 2 and the unit is integrated, and the dotted line indicates the unit on the back side. When the back side and front side units are attached based on the IC arrangement rule, the heat radiation fins 1 can be pressed without overlapping in the vertical and horizontal directions.

When the substrate is used upright, it must be taken into consideration that the temperature of the upper IC rises due to natural convection of the lower heat generating IC, unlike the case where the substrate is used horizontally. According to the IC arrangement rule, by arranging an IC having a large heat generation amount in the upper stage, natural convection is used to prevent other ICs from being heated, and the positions of the upper and lower ICs are further shifted. By doing so, the flow of natural convection due to self-heating is not hindered and the upper IC is not heated, so that the heat radiation efficiency can be improved.

Due to the integration of the pressing springs of the plurality of heat radiation fins and the IC arrangement rule, it is possible to form the printed wiring board 10 at two clearance holes, so that there is no space restriction and high density mounting is possible.

[0015]

As described above, according to the present invention, by providing the pressing spring and the stay portion capable of fixing a plurality of the pressing springs, the shape of the spring can be made common even if the arrangement of the IC is changed. It is possible and greatly helps to reduce the manufacturing cost. Further, since the heat radiation fins of a plurality of ICs can be fixed only by providing two through holes without separately providing holes for fixing the springs on the printed circuit board for heat generating ICs, the space is not restricted. I'm done. This enables high-density mounting.

[Brief description of drawings]

FIG. 1 is a plan view of an embodiment of the present invention.

FIG. 2 is a sectional view taken along the line AA ′ in the embodiment of the present invention as seen from the direction A.

FIG. 3 is a plan view in which the back side unit and the front side unit are attached in the embodiment of the present invention.

FIG. 4 is a perspective view of a conventional radiating fin mounting spring.

[Explanation of symbols]

 1 radiating fin 1'radiating fin on opposite side 2 holding spring 3 stay 4 mounting screw hole (for escape) 4'mounting screw hole (tap hole) 5 protrusion 6 shield case body 7 screw 8 claw 9 IC 10 printed wiring board 11 clamp spring 12 holes

Claims (3)

[Claims] 1. The front integrated circuit and the back integrated circuit do not overlap each other, and the upper integrated circuit is displaced so that the upper integrated circuit does not come directly above the lower mounted integrated circuit, and the upper integrated circuit is consumed. A heat dissipation device characterized by fixing the heat dissipation fins of a plurality of integrated circuits provided on a printed wiring board based on the rule of arranging an integrated circuit with large power and an integrated circuit with low power consumption in the lower stage. 2. A heat dissipation device comprising a pressing spring for fixing a heat dissipation fin of an integrated circuit and a stay capable of fixing a plurality of springs. 3. The hooks provided at both ends of the stay are hooked on the shield case body so as not to move, and the back stay and the front stay of the printed wiring board are fastened by screws passing through the through holes of the printed wiring board. The heat dissipation device according to claim 2, wherein the heat dissipation device is fixed integrally.