JPH0770457B2 - X-ray exposure method and X-ray generation source used therefor - Google Patents

X-ray exposure method and X-ray generation source used therefor

Info

Publication number
JPH0770457B2
JPH0770457B2 JP61245267A JP24526786A JPH0770457B2 JP H0770457 B2 JPH0770457 B2 JP H0770457B2 JP 61245267 A JP61245267 A JP 61245267A JP 24526786 A JP24526786 A JP 24526786A JP H0770457 B2 JPH0770457 B2 JP H0770457B2
Authority
JP
Japan
Prior art keywords
ray
pair
electrodes
rays
generation source
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP61245267A
Other languages
Japanese (ja)
Other versions
JPS63100728A (en
Inventor
浩 有田
宏之 菅原
光二 鈴木
幸夫 黒沢
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP61245267A priority Critical patent/JPH0770457B2/en
Publication of JPS63100728A publication Critical patent/JPS63100728A/en
Publication of JPH0770457B2 publication Critical patent/JPH0770457B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B82NANOTECHNOLOGY
    • B82YSPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70008Production of exposure light, i.e. light sources
    • G03F7/70033Production of exposure light, i.e. light sources by plasma extreme ultraviolet [EUV] sources

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明はX線露光方法、及びそれに用いられるX線発生
源に係り、特に、LSI製造用X線リソグラフィ装置のよ
うに、X線を利用して半導体基板上に微細パターンを形
成するものに好適なX線露光方法、及びそれに用いられ
るX線発生源に関する。
Description: TECHNICAL FIELD The present invention relates to an X-ray exposure method and an X-ray generation source used for the same, and particularly to the use of X-rays as in an X-ray lithography apparatus for manufacturing LSI. The present invention relates to an X-ray exposure method suitable for forming a fine pattern on a semiconductor substrate and an X-ray generation source used therefor.

〔従来の技術〕[Conventional technology]

近年、より高性能な半導体集積回路を製造するために、
0.5μm以下の寸法を有する微細パターンを、半導体基
板上に形成する要求が高まつている。X線(主に4〜13
Åの軟X線)を使用したパターン転写技術であるX線露
光法は、転写されたパターンの精度が極めて高く、特に
サブミクロンパターン形成において有力な技術とされて
いる。
In recent years, in order to manufacture higher performance semiconductor integrated circuits,
There is an increasing demand for forming a fine pattern having a dimension of 0.5 μm or less on a semiconductor substrate. X-ray (mainly 4-13
The X-ray exposure method, which is a pattern transfer technology using (Å soft X-rays), has extremely high accuracy of the transferred pattern, and is considered to be a powerful technology particularly in submicron pattern formation.

ところで、X線露光法を実施するには高出力で安定なX
線発生装置を必要とする。そこで最近、放電プラズマを
X線源とするX線発生装置が研究されている。この装置
は第4図に示す如く高電圧電源1により充電されたコン
デンサ2の電荷を一対の電極3・4間で放電させ、電極
3・4間に放電プラズマを生成し、プラズマ中で起こる
エネルギ遷移によつて放射されるX線を利用するもので
ある。なお、第4図中5はトリガー電極を示す。
By the way, in order to carry out the X-ray exposure method, a high output and stable X
Requires a line generator. Therefore, recently, an X-ray generator using discharge plasma as an X-ray source has been studied. As shown in FIG. 4, this device discharges the electric charge of the capacitor 2 charged by the high-voltage power supply 1 between the pair of electrodes 3 and 4 to generate discharge plasma between the electrodes 3 and 4, and the energy generated in the plasma. The X-ray emitted by the transition is used. In addition, 5 in FIG. 4 shows a trigger electrode.

このような従来技術としては、例えば、特開昭58−1880
40号公報に示される。
As such a conventional technique, for example, JP-A-58-1880
No. 40 publication.

〔発明が解決しようとする問題点〕[Problems to be solved by the invention]

上記従来技術は、プラズマ中のエネルギー遷移の制御の
点について配慮がなされておらず、弱いX線出力しか得
られないことに問題があつた。すなわちX線発生メカニ
ズムを説明すると、原子は、原子核とその回りを一定の
エネルギーレベルを持つた軌導を回る電子とから成る。
入射電子の運動エネルギーが電子の結合エネルギーより
大きくなれば、その殻から電子をたたき出す(光電効
果)。その空席に外殻軌道の電子が入りこむ特、電子の
保有するエネルギー差分をX線として放出する。第5図
にその様子を示す。高エネルギーの電子は自然放出さ
れ、遷移が偶発的に起こるもので、X線は不規則に放出
される。以上の様に、自然放出のエネルギー遷移を利用
しているため、制御が困難であつた。
The above-mentioned conventional technology has a problem that no consideration is given to control of energy transition in plasma, and only weak X-ray output is obtained. That is, to explain the X-ray generation mechanism, an atom consists of an atomic nucleus and electrons that orbit around it with a certain energy level.
When the kinetic energy of the incident electron becomes larger than the binding energy of the electron, the electron is knocked out of its shell (photoelectric effect). The electron in the outer orbit enters the vacant seat, and the energy difference held by the electron is emitted as X-ray. The situation is shown in FIG. High-energy electrons are spontaneously emitted, the transitions are accidental, and X-rays are emitted irregularly. As described above, since the energy transfer of spontaneous emission is used, it is difficult to control.

本発明は上述の点に鑑みなされたもので、その目的とす
るところは、高輝度のX線出力が得られ、X線露光での
スループットが向上するX線露光方法、及びそれに用い
られるXS線発生源を提供するにある。
The present invention has been made in view of the above points, and an object of the present invention is to provide an X-ray exposure method capable of obtaining high-intensity X-ray output and improving throughput in X-ray exposure, and an XS-ray used therefor. To provide the source.

〔問題点を解決するための手段〕[Means for solving problems]

本発明では上記目的を達成するために、X線発生源より
のX線を利用して、微細パターンを半導体基板上に形成
する際に、 相対向する一対の電極間で発生する放電プラズマ中から
発生したX線を励起状態にある隣接する一対の電極間に
発生するプラズマに入射し、これにより誘発されるX線
を順次隣接する一対の電極間のプラズマに導いて誘導放
出させて形成されるX線レーザーを前記半導体基板上に
導いて露光するX線露光方法、 又、微細パターンを半導体基板上に形成するX線を発生
するX線発生源であって、 前記X線発生源は、真空容器と、該真空容器内に複数対
一直線上に設けられ、一方が絶縁物を介して該真空容器
に支持されている相対向する一対の電極と、該一対の電
極を覆うと共に、一対の電極の他方の電極と電気的に接
続され、かつ、一対の電極間で発生するX線を隣接する
一対の電極間に導く開孔部を有し、電気真空容器に絶縁
物を介して支持されている導電路と、前記一対の電極間
に放電を発生させるための高電圧印加手段を備えている
X線露光のためのX線発生源としたことを特徴とする。
In the present invention, in order to achieve the above object, when a fine pattern is formed on a semiconductor substrate by utilizing X-rays from an X-ray generation source, the discharge plasma generated between a pair of electrodes facing each other The generated X-rays are incident on the plasma generated between the pair of electrodes in the excited state, and the X-rays induced by the X-rays are sequentially guided to the plasma between the pair of electrodes adjacent to each other to be induced and emitted. An X-ray exposure method of exposing an X-ray laser on the semiconductor substrate, and an X-ray generation source for generating X-rays for forming a fine pattern on the semiconductor substrate, wherein the X-ray generation source is a vacuum. A container, a pair of electrodes provided on the vacuum container in a plurality of one-to-one straight lines, one of which is supported by the vacuum container through an insulator, and a pair of electrodes which covers the pair of electrodes and a pair of electrodes. Electrically connected to the other electrode of A conductive path supported by an electric vacuum container via an insulator and having an opening portion for guiding X-rays generated between the pair of electrodes between the pair of adjacent electrodes; and the pair of electrodes. It is characterized in that it is an X-ray generation source for X-ray exposure, which is provided with a high voltage applying means for generating a discharge therebetween.

〔作用〕[Action]

第6図に原理を示す。励起状態にある原子に入射X線が
作用すると、入射X線と同じ方向に、同じ周波数位相、
さらに同じ偏光持性のX線が誘導放出され、入射X線の
強さに比例して放出される現象を利用するものである。
この現象を作り出すX線レーザは、複数のX線発生部を
一直線上の配設し、高速大電流放電により上記励起状態
を形成する。この時、X線が入射されると誘導放出によ
り高輝度のX線出力を得ることができる。
The principle is shown in FIG. When an incident X-ray acts on an atom in an excited state, the same frequency phase in the same direction as the incident X-ray,
Further, it utilizes a phenomenon in which X-rays having the same polarizability are stimulated and emitted, and emitted in proportion to the intensity of incident X-rays.
In an X-ray laser that produces this phenomenon, a plurality of X-ray generation units are arranged in a straight line, and the excited state is formed by high-speed large-current discharge. At this time, when X-rays enter, high-intensity X-ray output can be obtained by stimulated emission.

〔実施例〕〔Example〕

以下、本発明の一実施例を第1図により説明する。ここ
で第4図の従来例と同一構成要素には同一番号を付けて
ある。真空容器6内に絶縁物15を介して、対向する電極
対31・41,32・42,…36・46を設け、電極41,42…46は各
々円筒状の導電路81,82…,86に接合されている。(第2
図にひとつの電極対の構成外観を示す。16はX線の通る
開孔部)電極31,32,…36の一方とトリガー電極5を介し
てコンデンサ2に、また導電路81,82,…86の一方もコン
デンサ2に接合されている。トリガー電極5の放電時間
制御はトリガー時間制御器7によつて調整する。真空容
器6の図面下部にはX線取出し窓10を設置してある。
An embodiment of the present invention will be described below with reference to FIG. Here, the same numbers are attached to the same components as those in the conventional example of FIG. Opposing electrode pairs 31, 41, 32, 42, ... 36, 46 are provided in the vacuum vessel 6 via an insulator 15, and the electrodes 41, 42, ... 46 are cylindrical conductive paths 81, 82 ,. Is joined to. (Second
The figure shows the external appearance of one electrode pair. 36 are connected to the capacitor 2 via one of the electrodes 31, 32, ... 36 passing through X-rays and the trigger electrode 5, and one of the conductive paths 81, 82 ,. The discharge time control of the trigger electrode 5 is adjusted by the trigger time controller 7. An X-ray extraction window 10 is installed below the vacuum container 6 in the drawing.

X線発生にあたつては、高電圧電源1によつて充電され
たコンデンサ2の電荷をトリガー電極5を作動させるこ
とによつて、電極対31・41間、32・42間,…36・46間で
放電させる。これにより各電極間で放電プラズマを形成
し、プラズマ中の原子は励起状態となる。電極31・41間
でのスポツトプラズマ中から発生したX線の一部は電極
32・42間への入射X線となり、誘導放出現象を誘発し、
入射X線と同一方向にX線を発生する。順次電極対33・
43間,34・44間,…36・46間で誘導放出し、X線9を発
生する。微細パターンを転写するため、上記発生X線9
をX線取出し窓10を通して露光部に取り出す。支持体11
に支持されたマスク12のパターンを、アライナ14上のシ
リコンウエハ13上に転写する。以上説明した様にX線露
光用の光源に誘導放出現象を利用したX線レーザーを使
用しているため、高輝度のX線出力を得ることができ
る。誘導放出のための入射X線発生部は第1図のどの電
極対から発生しても、同様に高輝度のX線出力が得られ
る。
In the generation of X-rays, the trigger electrode 5 is actuated by the electric charge of the capacitor 2 charged by the high voltage power source 1, whereby the electrode pair 31 and 41, 32 and 42, ... 36. Discharge between 46. As a result, discharge plasma is formed between the electrodes, and the atoms in the plasma are excited. Some of the X-rays generated from the spot plasma between electrodes 31 and 41 are electrodes.
It becomes an incident X-ray between 32 and 42 and induces the stimulated emission phenomenon,
X-rays are generated in the same direction as the incident X-rays. Sequential electrode pair 33 ・
Stimulated emission occurs between 43, between 34 and 44, ... and between 36 and 46, and X-ray 9 is generated. In order to transfer a fine pattern, the generated X-ray 9
Is taken out through the X-ray extraction window 10 to the exposure section. Support 11
The pattern of the mask 12 supported by the is transferred onto the silicon wafer 13 on the aligner 14. As described above, since the X-ray laser utilizing the stimulated emission phenomenon is used as the light source for X-ray exposure, high-intensity X-ray output can be obtained. Even if the incident X-ray generator for stimulated emission is generated from any of the electrode pairs shown in FIG. 1, a high-intensity X-ray output can be similarly obtained.

第3図は別の発明であり、電極対にガスパフ式を適用し
た場合である。各電極対31・41,32・42,33・43,34・44
を一直線上に配置し、各電極の中心部にはX線の通路で
ある開孔部が設けてある。各電極31,32,33,34の内部に
はガス吹き出し孔18を設けている。X線発生にあたって
は、最初にガス導入パイプ17より、ガス19を電極間に吹
き出す。一定の遅延時間後にトリガー電極5を作動させ
放電を開始する。電極間のガスは電流の磁気ピンチ効果
により、高温・高密度のプラズマとなり、励起状態を形
成する。この時、各プラズマ中にX線が入射すると、誘
導放出したX線は増幅され、X線9を発生する。本発明
も第1図と同様に、高輝度X線を発生させる効果があ
る。
FIG. 3 shows another invention, in which a gas puff type is applied to the electrode pair. Each electrode pair 31,41,32,42,33,43,34,44
Are arranged in a straight line, and an opening which is a passage for X-rays is provided at the center of each electrode. A gas blowing hole 18 is provided inside each of the electrodes 31, 32, 33, 34. When generating X-rays, the gas 19 is first blown out between the electrodes from the gas introduction pipe 17. After a certain delay time, the trigger electrode 5 is activated to start discharging. The gas between the electrodes becomes a high-temperature, high-density plasma due to the magnetic pinch effect of the current and forms an excited state. At this time, when X-rays enter each plasma, the X-rays that have been stimulated and emitted are amplified and generate X-rays 9. The present invention also has the effect of generating high-intensity X-rays, as in FIG.

〔発明の効果〕〔The invention's effect〕

以上説明した本発明のX線露光方法、及びそれに用いら
れるX線発生源によれば、X線発生源よりのX線を利用
して、微細パターンを半導体基板上に形成する際に、 相対向する一対の電極間で発生する放電プラズマ中から
発生したX線を励起状態にある隣接する一対の電極間に
発生するプラズマに入射し、これにより誘発されるX線
を順次隣接する一対の電極間のプラズマに導いて誘導放
出させて形成されるX線レーザーを前記半導体基板上に
導いて露光するX線露光方法、及び、微細パターンを半
導体基板上に形成するX線を発生するX線発生源であっ
て、 前記X線発生源は、真空容器と、該真空容器内に複数対
一直線上に設けられ、一方が絶縁物を介して該真空容器
に支持されている相対向する一対の電極と、該一対の電
極を覆うと共に、一対の電極の他方の電極と電気的に接
続され、かつ、一対の電極間で発生するX線を隣接する
一対の電極間に導く開孔部を有し、前記真空容器に絶縁
物を介して支持されている導電路と、前記一対の電極間
に放電を発生させるための高電圧印加手段を備えている
X線露光のためのX線発生源としたものであるから、高
輝度のX線出力が得られ、X線露光でのスループットが
向上する効果がある。
According to the X-ray exposure method of the present invention described above and the X-ray generation source used for the method, the X-rays generated from the X-ray generation source are used to face each other when the fine pattern is formed on the semiconductor substrate. The X-rays generated from the discharge plasma generated between the pair of electrodes are incident on the plasma generated between the pair of adjacent electrodes in the excited state, and the X-rays induced thereby are sequentially generated between the pair of adjacent electrodes. X-ray exposure method for exposing and exposing an X-ray laser formed on the semiconductor substrate by inducing and inducing the above plasma to stimulate emission, and an X-ray generation source for generating X-rays for forming a fine pattern on the semiconductor substrate. The X-ray generation source includes a vacuum container, and a pair of electrodes which are provided in a plurality of one-to-one straight lines in the vacuum container and one of which is supported by the vacuum container via an insulator and which face each other. , Covering the pair of electrodes A vacuum chamber electrically connected to the other electrode of the pair of electrodes and having an opening for guiding X-rays generated between the pair of electrodes between the pair of adjacent electrodes. The X-ray generation source for X-ray exposure is provided with a high-voltage applying unit for generating a discharge between the pair of electrodes and a conductive path supported by the X-ray of high brightness. There is an effect that a line output is obtained and the throughput in X-ray exposure is improved.

【図面の簡単な説明】[Brief description of drawings]

第1図は本発明のX線露光のためのX線発生源の一実施
例を示す断面図、第2図は第1図の実施例に採用される
電極部分の斜視図、第3図は本発明の他の実施例を示す
断面図、第4図は従来のX線発生源を示す概略構成図、
第5図は従来の構成における原理を説明するための図、
第6図は本発明の構成における原理を説明するための図
である。 1……高電圧電源、2……コンデンサ、3、4、31、3
2、33、34、35、36、41、42、43、44、45、46……電
極、5……トリガー電極、6……真空容器、7……トリ
ガー時間制御器、9……X線、10……X線取出し窓、11
……支持体、12……マスク、13……ウエハ、14……アラ
イナ、15……絶縁物、16……開孔部、17……ガス導入パ
イプ、18……ガス吹き出し孔、19……ガス、81、82、8
3、84、85、86……導電路。
FIG. 1 is a sectional view showing an embodiment of an X-ray generation source for X-ray exposure of the present invention, FIG. 2 is a perspective view of an electrode portion adopted in the embodiment of FIG. 1, and FIG. FIG. 4 is a sectional view showing another embodiment of the present invention, FIG. 4 is a schematic configuration diagram showing a conventional X-ray generation source,
FIG. 5 is a diagram for explaining the principle of the conventional configuration,
FIG. 6 is a diagram for explaining the principle of the configuration of the present invention. 1 ... High-voltage power supply, 2 ... Capacitors 3,4,31,3
2, 33, 34, 35, 36, 41, 42, 43, 44, 45, 46 ... Electrode, 5 ... Trigger electrode, 6 ... Vacuum container, 7 ... Trigger time controller, 9 ... X-ray , 10 …… X-ray extraction window, 11
…… Support, 12 …… Mask, 13 …… Wafer, 14 …… Aligner, 15 …… Insulator, 16 …… Opening part, 17 …… Gas introduction pipe, 18 …… Gas blowing hole, 19 …… Gas, 81, 82, 8
3, 84, 85, 86 ... Conductive path.

───────────────────────────────────────────────────── フロントページの続き (72)発明者 黒沢 幸夫 茨城県日立市久慈町4026番地 株式会社日 立製作所日立研究所内 (56)参考文献 特開 昭56−111223(JP,A) 特開 昭60−7130(JP,A) 特開 昭62−273728(JP,A) 特開 昭62−273727(JP,A) ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Yukio Kurosawa 4026 Kuji Town, Hitachi City, Hitachi, Ibaraki Prefecture Hitachi Research Laboratory, Hiritsu Manufacturing Co., Ltd. (56) Reference JP-A-56-111223 (JP, A) JP-A-60 -7130 (JP, A) JP 62-273728 (JP, A) JP 62-273727 (JP, A)

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】X線発生源よりのX線を利用して、微細パ
ターンを半導体基板上に形成するX線露光方法におい
て、 相対向する一対の電極間で発生する放電プラズマ中から
発生したX線を励起状態にある隣接する一対の電極間に
発生するプラズマに入射し、これにより誘発されるX線
を順次隣接する一対の電極間のプラズマに導いて誘導放
出させて形成されるX線レーザーを前記半導体基板上に
導いて露光することを特徴とするX線露光方法。
1. An X-ray exposure method for forming a fine pattern on a semiconductor substrate using X-rays from an X-ray generation source, wherein X generated from discharge plasma generated between a pair of electrodes facing each other. X-ray laser formed by injecting X-rays into plasma generated between a pair of adjacent electrodes in an excited state and sequentially guiding the X-rays induced thereby to plasma between the pair of adjacent electrodes to induce emission. An X-ray exposure method, which comprises exposing the substrate to the semiconductor substrate to perform exposure.
【請求項2】微細パターンを半導体基板上に形成するX
線を発生するX線発生源であって、 前記X線発生源は、真空容器と、該真空容器内に複数対
一直線上に設けられ、一方が絶縁物を介して該真空容器
に支持されている相対向する一対の電極と、該一対の電
極とを覆うと共に、一対の電極の他方の電極と電気的に
接続され、かつ、一対の電極間で発生するX線を隣接す
る一対の電極間に導く開孔部を有し、前記真空容器に絶
縁物を介して支持されている導電路と、前記一対の電極
間に放電を発生させるための高電圧印加手段を備えてい
ることを特徴とするX線露光のためのX線発生源。
2. An X for forming a fine pattern on a semiconductor substrate.
An X-ray generation source for generating a line, wherein the X-ray generation source is provided on a vacuum container and a plurality of one-to-one lines in the vacuum container, and one of the X-ray generation source is supported by the vacuum container via an insulator. A pair of electrodes facing each other, and a pair of electrodes that cover the pair of electrodes and are electrically connected to the other electrode of the pair of electrodes and that generate X-rays between the pair of electrodes. And a high-voltage applying means for generating a discharge between the pair of electrodes, and a conductive path having an opening portion that leads to the electric path supported by the vacuum container via an insulator. X-ray generation source for X-ray exposure.
JP61245267A 1986-10-17 1986-10-17 X-ray exposure method and X-ray generation source used therefor Expired - Lifetime JPH0770457B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61245267A JPH0770457B2 (en) 1986-10-17 1986-10-17 X-ray exposure method and X-ray generation source used therefor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61245267A JPH0770457B2 (en) 1986-10-17 1986-10-17 X-ray exposure method and X-ray generation source used therefor

Publications (2)

Publication Number Publication Date
JPS63100728A JPS63100728A (en) 1988-05-02
JPH0770457B2 true JPH0770457B2 (en) 1995-07-31

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5177784B2 (en) * 2005-08-25 2013-04-10 孝晏 望月 Method for manufacturing semiconductor crystal film

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56111223A (en) * 1980-02-01 1981-09-02 Chiyou Lsi Gijutsu Kenkyu Kumiai X-ray exposuring device
CA1224839A (en) * 1983-06-06 1987-07-28 Barukh Yaakobi X-ray lithography
KR940000696B1 (en) * 1986-04-15 1994-01-27 햄프셔 인스트루 먼트스 인코포레이티드 X-ray lithography system

Also Published As

Publication number Publication date
JPS63100728A (en) 1988-05-02

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