JPH077032Y2 - Bend mirror device in laser processing machine - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Field of Industrial Application) The present invention relates to a bend mirror device in a laser beam machine.

(Prior Art) Conventionally, a laser processing machine bends a laser beam oscillated by a laser oscillator with a bend mirror, collects it with a condenser lens, and further collects the laser beam with a condenser lens from the tip of a nozzle. The workpiece W is irradiated with the laser beam to perform the laser processing on the workpiece W.

Then, when the sharpness of the laser becomes poor during laser processing, it is necessary to clean the bend mirror etc. provided in the bend mirror device, but at that time, the laser processing machine is stopped and the bend mirror is removed from the bend mirror device. Removed and cleaned.

(Problems to be solved by the invention) By the way, when dirt or dust adheres to the bend mirror to clean the bend mirror, the laser beam machine is stopped and the bend mirror is removed from the bend mirror device.
Further, when a new bend mirror or a cleaned bend mirror is attached, alignment adjustment is required, so that the laser processing machine is stopped for a long time. Therefore, there is a problem that the operation rate of laser processing is lowered and that it takes a lot of time to remove and attach the bend mirror.

The purpose of this invention is to improve the above-mentioned problems by removing the bend mirror from the bend mirror device when dirt, dust or the like adheres to the bend mirror, saving the labor of mounting and improving the operation rate of laser processing. An object of the present invention is to provide a bend mirror device in such a laser processing machine.

[Means for Solving the Problem] (Means for Solving the Problems) In order to achieve the above object, the present invention condenses a laser beam oscillated by a laser oscillator with a condenser lens and irradiates a workpiece with a nozzle. In a laser processing machine that performs laser processing, a plurality of bend mirror devices including a detection sensor for detecting at least dirt and dust and a bend mirror are provided in the optical path between the laser oscillator and the condenser lens.
When the bend mirror of the bend mirror device currently in use detects dirt, dust, etc. by the detection sensor, the bend mirror device currently in use can be replaced with a new bend mirror device which is not in use, so that a laser processing machine can be used. Configured a bend mirror device.

(Operation) By adopting the bend mirror device in the laser processing machine of the present invention, the laser beam oscillated by the laser oscillator is bent by the bend mirror of the bend mirror device, condensed by the condenser lens, and further Irradiate from the tip toward the work. Then, the work is subjected to desired laser processing by the laser beam emitted from the tip of the nozzle.

When the bend mirror of the bend mirror device is soiled or contaminated with dust during laser processing, it is detected by a detection sensor provided in the bend mirror device. When the detection sensor detects dirt or dust on the bend mirror, the bend mirror currently in use and the bend mirror not in use are automatically replaced on the spot.

Therefore, it is easy to replace the bend mirror and it is not necessary to stop the laser processing machine, so that the operation rate of laser processing is improved.

(Embodiment) Hereinafter, an embodiment of the present invention will be described in detail with reference to the drawings.

Referring to FIG. 4, for example, a CO ₂ laser oscillator 3 is mounted on the rear side (right side in FIG. 4) of the laser processing machine 1 so that the laser beam LB oscillates toward the laser processing machine 1. Is configured.

The laser processing machine 1 includes a base 5, a post 7 standing vertically on the base 5, and a part of a processing machine main body horizontally supported in a cantilevered manner above the base 5 via the post 7. It is composed of a certain beam member 9 and the like. A work table 11 on which a work W is placed is provided above the base 5.

A work positioning device 13 for clamping and positioning the work W is provided on the right side of the work table 11. The work positioning device 13 is moved in the X-axis direction (direction orthogonal to the paper surface in FIG. 4) and the Y-axis direction (horizontal direction in FIG. 4) to position the desired position of the work W at the machining position. .

A bend mirror device 17 having a bend mirror 15 for bending the laser beam LB is built in the tip of the beam member 9, and a laser having a condenser lens 19 at the lower end of the beam member 9 at the tip. A processing head 21 is provided.

The laser beam LB condensed by the condenser lens 19 is supplied from the nozzle 23 mounted at the tip of the laser processing head 21 to the workpiece W.
And laser processing is performed.

With the above configuration, the laser beam LB oscillated by the laser oscillator 3 is provided in the bend mirror device 17 as a bend mirror.
It is bent at 15 and condensed by the condenser lens 19. The laser beam LB condensed by the condenser lens 19 is applied to the work W from the tip of the nozzle 23, and the work W positioned by the work positioning device 13 is laser-processed to a desired position.

An NC device 25 for NC controlling the laser processing machine is provided on the right frame of the guide post 7.

The bend mirror device 17 includes, for example, two bend mirror devices 17A and 17A as shown in FIGS.
The bend mirror device 17A is formed integrally with the fluid pressure cylinder 29 through the piston rod 27.
Is attached to the frame of the laser processing head 21. With the above configuration, when the fluid pressure cylinder 29 is actuated, the piston rod 27 moves upward in FIG. 2 so that the bend mirror devices 17A and 17B move as shown by the chain double-dashed line. Therefore, the surface of the bend mirror 15 of the bend mirror device 17A that is currently used becomes dirty,
When dust or the like is attached, it is replaced with a new unused bend mirror device 17B.

Since the bend mirror devices 17A and 17B have the same structure, the structure of the bend mirror device 17A will be described, and the description of the structure of the bend mirror device 17B will be omitted. In the bend mirror device 17A, as shown in FIG. 1, a mirror holder 33 is held by a hollow replacement block 31, and a mirror support plate 35 having the bend mirror 15 is attached to the mirror holder 33. Has been done. The mirror support plate 35 is provided with, for example, a temperature sensor 37 as a detection sensor that detects dirt, dust, and the like attached to the surface of the bend mirror 15.

Therefore, when dirt or dust adheres to the surface of the bend mirror 15, the temperature of the bend mirror 15 itself becomes higher than usual because the dirt or dust absorbs the laser beam. Therefore, when the temperature sensor 37 detects a temperature higher than a preset temperature, dirt or dust adheres to the surface of the bend mirror 15 and is replaced. The temperature sensor 37 is connected to the NC device 25.

The operation when the bend mirror 15 is replaced by dirt, dust or the like during laser processing will be described with reference to the flowchart shown in FIG.

In FIG. 3, first, in step S1, the operation panel of the NC device 25 is operated to turn on the switch of the temperature sensor 37 and set the automatic mode. Next, in step S2, it is determined whether or not the automatic driving is performed. If the automatic driving is not performed, the process returns to the step before step S2 and the automatic driving is performed. If it is in the automatic operation, the process proceeds to step S3 to start the laser processing and continuously operate the laser processing.

And the mirror support plate 35 with the bend mirror 15
The actual temperature detected by the temperature sensor 37 provided in the computer and the preset temperature are compared by the comparison calculation processing section of the NC device 25. As a result, if the actual temperature T detected by the temperature sensor 37 exceeds the preset set temperature To (T> To), after the end of the program currently being machined in step S4, for example, As shown in Fig. 2, the bend mirror device 17A currently in use to the fluid pressure cylinder 29 is used.
The unused bend bender device 17A is replaced by the operation of.

After replacement, the above operation is repeated until the bend mirror device 17B
To prepare for the next replacement of the bend mirror 15 at the earliest replacement time or the next regular maintenance inspection day, whichever comes first. Further, while the new bend mirror device 17B is in use, the dirty bend mirror device 17A can be removed, cleaned and reset.

In this way, when dirt, dust, etc. adhere to the surface of the bend mirror 15, for example, a temperature sensor as a detection sensor is used.
Detected by 37, it can be automatically replaced with a new bend mirror 15 without the need for an operator. Moreover, since the bend mirror 15 can be replaced without stopping the laser processing machine 1, the operation rate of laser processing can be improved as compared with the conventional case.

The present invention is not limited to the above-described embodiments, but can be implemented in other modes by making appropriate changes. In this embodiment, a single machine of the laser processing machine has been described, but a composite processing machine such as a punch press can also be used.

[Effects of the Invention] As can be understood from the above description of the embodiments, according to the present invention, the laser beam oscillated by the laser oscillator is bent by the bend mirror of the bend mirror device, and
The light is condensed by a condenser lens, and the work is irradiated from the tip of the nozzle. Then, the work is subjected to desired laser processing by the laser beam emitted from the tip of the nozzle.

When the bend mirror of the bend mirror device is soiled or contaminated with dust during laser processing, it is detected by a detection sensor provided in the bend mirror device. When the detection sensor detects dirt, dust, or the like on the bend mirror, the bend mirror currently in use can be automatically replaced on the spot with an unused bend mirror.

Therefore, it is not necessary to replace the bend mirror and it is not necessary to stop the laser processing machine, so that the operation rate of the laser processing can be improved.

[Brief description of drawings]

FIG. 1 shows a main part of the present invention, an enlarged detailed view of an I arrow portion in FIG. 4, FIG. 2 is a plan view in FIG. 1, and FIG. 3 shows an operation when a bend mirror is automatically replaced. The flowchart shown in FIG. 4 is a front view of a laser processing machine according to an embodiment for carrying out the invention. 1 ... Laser processing machine, 3 ... Laser oscillator 15 ... Bend mirror 17,17A, 17B ... Bend mirror device 19 ... Focusing lens, 23 ... Nozzle 25 ... NC device, 29 ... Fluid pressure cylinder 37 …… Temperature sensor (detection sensor)

Claims (1)

[Scope of utility model registration request] 1. A laser beam machine for concentrating a laser beam oscillated by a laser oscillator with a condenser lens and irradiating a workpiece from a nozzle for laser processing, in the optical path between the laser oscillator and the condenser lens. , A plurality of bend mirror devices equipped with a detection sensor and a bend mirror for detecting at least dirt, dust, etc. are used when the bend mirror of the bend mirror device currently in use detects dirt, dust, etc. with the detection sensor. A bend mirror device in a laser beam machine, wherein the bend mirror device in the middle is replaced with a new bend mirror device which is not used.