JPH0766729B2 - Thermal fuse - Google Patents

Thermal fuse

Info

Publication number
JPH0766729B2
JPH0766729B2 JP1208791A JP20879189A JPH0766729B2 JP H0766729 B2 JPH0766729 B2 JP H0766729B2 JP 1208791 A JP1208791 A JP 1208791A JP 20879189 A JP20879189 A JP 20879189A JP H0766729 B2 JPH0766729 B2 JP H0766729B2
Authority
JP
Japan
Prior art keywords
low melting
melting point
insulating coating
coating layer
wire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP1208791A
Other languages
Japanese (ja)
Other versions
JPH0381921A (en
Inventor
孝志 石岡
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Uchihashi Estec Co Ltd
Original Assignee
Uchihashi Estec Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Uchihashi Estec Co Ltd filed Critical Uchihashi Estec Co Ltd
Publication of JPH0381921A publication Critical patent/JPH0381921A/en
Publication of JPH0766729B2 publication Critical patent/JPH0766729B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Description

【発明の詳細な説明】 〈産業上の利用分野〉 本発明は合金型温度ヒューズに関するものである。DETAILED DESCRIPTION OF THE INVENTION <Field of Industrial Application> The present invention relates to an alloy type thermal fuse.

〈従来の技術〉 合金型温度ヒューズは、ヒューズエレメントとしての低
融点合金片をリード導線間に橋設し、低融点合金片上に
フラックスを塗布し、これらに絶縁層を被覆した構成で
ある。而して、保護すべき電気機器が過電流によって発
熱すると、温度ヒューズがその発生熱によって加熱さ
れ、ヒューズエレメントが溶融し、溶融金属がリード導
線の材質に基づく漏れ性のために各リード導線に向けて
引張られて分断し、この分断と同時にアークが発生し、
分断溶融金属が表面張力により各リード導線を核として
球状化していき、分断間隔が増大し、たがてアークが消
滅して電気機器への通電が遮断される。
<Prior Art> An alloy type thermal fuse has a structure in which a low melting point alloy piece as a fuse element is bridged between lead wires, a flux is applied on the low melting point alloy piece, and an insulating layer is coated on these. Then, when the electrical equipment to be protected generates heat due to overcurrent, the thermal fuse is heated by the generated heat, the fuse element is melted, and the molten metal is leaked to each lead wire due to the leakage property based on the material of the lead wire. It is pulled toward and divided, and at the same time an arc is generated,
Due to the surface tension, the divided molten metal becomes spherical with each lead wire as a core, and the dividing interval increases, so that the arc disappears and the electric power to the electric device is cut off.

従って、リード導線の間隔は溶融ヒューズエレメントの
分断間隔と密接な関係があり、一定間隔以上とすること
が上記アークの消滅に不可欠である。しかし、その間隔
を余り広くすれば、温度ヒューズの寸法が増大し、小型
化に不利である。而して、リード導線間の間隔を厳密に
所定の一定値とすることが必要である。
Therefore, the interval between the lead wires is closely related to the interval at which the fused fuse element is divided, and it is essential that the interval be a certain interval or longer to extinguish the arc. However, if the interval is made too wide, the size of the thermal fuse increases, which is disadvantageous for downsizing. Therefore, it is necessary to strictly set the interval between the lead wires to a predetermined constant value.

而るに、第8図A並びに第8図B(第8図Aにおけるb
−b断面図)に示すように、互いに平行な二本の導線
1′・1′を有するフラット型絶縁被覆線の一端から導
線を口出し、これらの口出導線10′・10′間に低融点合
金線3′を橋設し、低融点合金線上にフラックス4′を
塗布し、口出導線並びに低融点合金線を内含せる絶縁層
5′を設けた合金型温度ヒューズにおいては、リード導
線間の間隔が一定であり、低融点合金線の橋設時(溶
接)、リード導体間隔を一定に保持するための特別の治
具等も不要であり、溶接を簡易に行い得る。
Therefore, FIG. 8A and FIG. 8B (b in FIG. 8A)
As shown in (b) cross-sectional view), a conductor is extended from one end of a flat type insulation covered wire having two parallel conductors 1'and 1 ', and a low melting point is provided between these conductors 10' and 10 '. In the alloy type thermal fuse in which the alloy wire 3'is bridged, the flux 4'is applied on the low melting point alloy wire, and the insulating layer 5'containing the lead conductor wire and the low melting point alloy wire is provided, between the lead conductor wires. The distance is constant and no special jig or the like is required to keep the distance between the lead conductors constant when the low melting alloy wire is bridged (welding), and welding can be performed easily.

かかる製造上の有利性に加え、絶縁層5′を浸漬塗装法
によって形成し得れば、製造法の著しい簡易化が可能と
なる。
In addition to such manufacturing advantages, if the insulating layer 5'can be formed by a dip coating method, the manufacturing method can be significantly simplified.

〈解決しようとする課題〉 しかしながら、絶縁塗装体のコーナ部においては、浸漬
塗装中での塗膜の未硬化時、表面張力f′によって塗膜
が顕著に薄肉化するから、このコーナが絶縁強度上並び
に機械強度上、ウィークポイントとなるのを避け難い。
従って、上記第8図A並びに第8図Bに示す合金型温度
ヒューズにおいては、浸漬塗装法による絶縁層の成形は
困難であり、例えば、モールド成形に頼らざるを得ず、
製造法の簡易化の達成は至難である。
<Problems to be Solved> However, in the corner portion of the insulating coated body, when the coating film is not cured during the dip coating, the surface tension f ′ significantly reduces the thickness of the coating film. It is hard to avoid becoming a weak point in terms of mechanical strength.
Therefore, in the alloy type thermal fuse shown in FIG. 8A and FIG. 8B, it is difficult to form the insulating layer by the dip coating method.
Achieving a simplified manufacturing method is extremely difficult.

本発明の目的は、上記合金型温度ヒューズにおいて、絶
縁層の成形に浸漬塗装法を使用できるようにして、同温
度ヒューズの製造の簡易化を可能ならしめることにあ
る。
An object of the present invention is to make it possible to use a dip coating method for forming an insulating layer in the alloy type thermal fuse, thereby facilitating the manufacture of the thermal fuse.

〈課題を解決するための手段〉 本発明に係る温度ヒューズは二本の導線を有するフラッ
ト型絶縁被覆線の一端から絶縁被覆層を切断除去して導
体を口出し、この絶縁被覆層の切断除去においては絶縁
被覆層切断端の両サイドに突出部を残存させ、口出導線
に低融点可溶金属片を橋設し、口出導線間、低融点可溶
金属片並びに絶縁被覆層端部にわたって絶縁被膜を施し
たことを特徴とする構成である。
<Means for Solving the Problems> In the thermal fuse according to the present invention, the insulating coating layer is cut and removed from one end of the flat type insulating coated wire having two conducting wires to expose the conductor, and the insulating coating layer is cut and removed. Leaves protruding parts on both sides of the cut end of the insulation coating layer, bridges the low melting point soluble metal piece to the lead wire, and insulates between the lead wires, the low melting point soluble metal piece, and the end of the insulation coating layer. This is a structure characterized by being coated.

〈実施例の説明〉 以下、本発明の実施例を図面により説明する。<Description of Embodiments> Hereinafter, embodiments of the present invention will be described with reference to the drawings.

第1図Aは本発明の一実施例を示す一部欠切上面図、第
1図Bは第1図Aにおけるb−b断面図である。
1A is a partially cutaway top view showing an embodiment of the present invention, and FIG. 1B is a sectional view taken along line bb in FIG. 1A.

第1図A並びに第1図Bにおいて、Wはフラット型絶縁
被覆線であり、互いに平行な二本の導線1・1(銅線、
アルミ線)を有し、絶縁被覆層2は両サイド部21・21、
導線包囲部22・22並びに中間部23から構成されている。
このフラット型絶縁被覆線には、二本の平行導線をプラ
スチックフイルムで挟み、フイルム間を熱融着または接
着剤によって接着したものを使用できる。10・10は絶縁
被覆層の一端を切断・除去することにより突出させた口
出導線である。20・20は絶縁被覆層切断端の両サイドに
残存させた突出部である。3は口出導線間に橋設した低
融点可溶金属片であり、例えば、Sn-Pb系合金線を使用
でき、低融点可溶金属片と口出導線との間は溶接等によ
り結合してある。4は低融点可溶金属線上に塗布せるフ
ラックスである。5は浸漬塗装法により被覆した絶縁層
である。
In FIG. 1A and FIG. 1B, W is a flat type insulation covered wire, and two parallel conductive wires 1.1 (copper wire,
Aluminum wire), and the insulating coating layer 2 has both side portions 21 and 21,
It is composed of the conductor wire surrounding portions 22 and 22 and the intermediate portion 23.
For this flat type insulation covered wire, two parallel conductive wires sandwiched between plastic films and the films are bonded by heat fusion or an adhesive can be used. Reference numeral 10 denotes a lead wire which is projected by cutting and removing one end of the insulating coating layer. 20 and 20 are protrusions left on both sides of the cut end of the insulating coating layer. 3 is a low melting point fusible metal piece bridged between the lead wires. For example, Sn-Pb based alloy wire can be used, and the low melting point fusible metal piece and the lead wire are joined by welding or the like. There is. 4 is a flux that can be applied on the low melting point soluble metal wire. Reference numeral 5 is an insulating layer coated by a dip coating method.

この浸漬塗装法には、例えばアミン系硬化剤を配合した
常温硬化性のエポキシ樹脂液(エポキシ100重量部に対
する硬化剤の配合量は10〜30重量部)であって、25℃に
おける粘度が30000〜70000CPSのものを使用できる。
For this dip coating method, for example, a room temperature curable epoxy resin liquid containing an amine-based curing agent (the content of the curing agent is 10 to 30 parts by weight with respect to 100 parts by weight of epoxy), and the viscosity at 25 ° C is 30000. You can use ~ 70000 CPS.

第2図はこの浸漬塗装時の成膜状態を示しており、絶縁
被覆層切断端の両サイドに突出部20・20が存在するた
め、リード導線と低融点可溶金属片との結合部aにおけ
る塗膜の表面張力f・fによるコーナ角を突出部のない
場合(点線で示す)に較べて鈍くでき、従って、表面張
力f・fの合力を小さくでき、それだけ塗膜の薄肉化を
軽減できる。
Fig. 2 shows the film formation state during this dip coating. Since there are protrusions 20 on both sides of the cut end of the insulating coating layer, the joint a between the lead wire and the low melting point fusible metal piece a The corner angle due to the surface tension f / f of the coating film can be made dull compared to the case where there is no protruding portion (shown by the dotted line), and therefore the resultant force of the surface tension f / f can be reduced, and the thickness of the coating film can be reduced accordingly it can.

上記において、低融点可溶金属片と絶縁被覆層切断端と
の間の間隔b、口出導線と突出部との間隔Cは可能な限
り小さくすることが望ましい。また、口出リード導線の
低融点可溶金属片に対する突出長さd並びに低融点可溶
金属片の口出リード導線に対する突出長さeは、溶接強
度を阻害しない範囲内で可能な限り小さくすることが望
ましい。
In the above, it is desirable that the distance b between the low melting point soluble metal piece and the cut end of the insulating coating layer and the distance C between the lead wire and the protrusion be as small as possible. Further, the protrusion length d of the lead wire for the low melting point soluble metal piece and the protrusion length e of the low melting point metal piece for the lead wire are made as small as possible within a range that does not impair the welding strength. Is desirable.

上記絶縁被覆層の突出部先端24は、低融点可溶金属片と
口出リード導線との結合箇所aに可能な限り近接させる
ことが望ましい。
It is desirable that the tip end 24 of the protruding portion of the insulating coating layer be as close as possible to the connection point a between the low melting point fusible metal piece and the lead wire.

上記突出部20は絶縁被覆層2よりも厚肉にすることもで
きる(例えば、折り返しにより二重にする)。
The protrusion 20 may be thicker than the insulating coating layer 2 (for example, folded back to be doubled).

第3図は本発明の別実施例を示す一部欠切上面面であ
る。この別実施例においては、絶縁被覆層切断端の両サ
イド突出部20・20を口出導線10・10よりも突出させてあ
る。而して、これらの突出部10・10間に充分な樹脂量の
塗膜を成膜できるから、リード導線と低融点可溶金属片
との結合部aを充分な樹脂量の塗膜で被覆できる。第3
図において、hは絶縁被覆体厚みの1〜5倍とすること
が望ましい。上記別実施例において、第4図に示すよう
に、突出部20・20を外側に湾曲させることもできる。ま
た、第5図に示すように両突出部20・20をかぎ形にし
て、絶縁塗装樹脂体の固着強度を増強することもでき
る。また、第6図あるいは第7図に示すようにフラット
型絶縁被覆線Wの一端部を除く他部におりて絶縁被覆層
中間部を除去することもできる。
FIG. 3 is a partially cutaway upper surface showing another embodiment of the present invention. In this other embodiment, both side projecting portions 20, 20 at the cut end of the insulating coating layer are projected more than the lead wire 10. Thus, since a coating film with a sufficient amount of resin can be formed between these protrusions 10 and 10, the connecting portion a between the lead wire and the low melting point soluble metal piece is covered with a coating film with a sufficient amount of resin. it can. Third
In the figure, h is preferably 1 to 5 times the thickness of the insulating coating. In the above-mentioned other embodiment, as shown in FIG. 4, the protrusions 20 may be curved outward. Further, as shown in FIG. 5, both protrusions 20 may be formed in a hook shape to enhance the fixing strength of the insulating coating resin body. Further, as shown in FIG. 6 or 7, it is also possible to remove the intermediate portion of the insulating coating layer at the other portion of the flat type insulating coating wire W excluding one end portion.

なお、上記第3図〜第7図において、第1図A並びに第
1図Bと同一符号の部分は、第1図A並びに第1図Bと
同一の構成部分を示している。
In FIGS. 3 to 7, the same reference numerals as those in FIGS. 1A and 1B indicate the same components as those in FIGS. 1A and 1B.

〈発明の効果〉 上述した通り、本発明に係る合金型温度ヒューズにおい
ては、リード線としてフラット型絶縁被覆線を使用し、
かつ口出導線並びに口出導線間に橋設した低融点可溶金
属片を浸漬塗装法による塗膜によって被覆する場合、口
出導線と低融点可溶金属片との結合部上塗膜のコーナ角
を鈍くするかまたはコーナ角を生じさせないように、同
上被覆線の被覆層切断端両サイドに突出部を残存させて
おり、上記結合上塗膜の薄肉化を軽減できる。而して、
本発明に係る温度ヒューズによれば、浸漬塗装法により
絶縁処理を簡単に行い得、また、リード導線間隔が安定
であり一定していて低融点可溶金属片の溶接を容易に行
い得、かつ口出リード導線間の間隔を温度ヒューズ作動
時の絶縁距離と温度ヒューズの小型化から規制される所
定値に厳密に保証し得るので、製造が容易で、耐電圧性
に優れた小型の合金型温度ヒューズを提供できる。
<Effects of the Invention> As described above, in the alloy type thermal fuse according to the present invention, the flat type insulation coated wire is used as the lead wire,
When the lead wire and the low melting point soluble metal piece bridged between the lead wires are covered with a coating film by the dip coating method, the corner of the coating film on the joint between the lead wire and the low melting point metal piece The protrusions are left on both sides of the cut end of the coating layer of the coated wire so as not to make the corners blunt or to make a corner angle, and it is possible to reduce the thinning of the above-mentioned bonding upper coating film. Therefore,
According to the thermal fuse of the present invention, the insulation treatment can be easily performed by the dip coating method, and the lead wire interval is stable and constant, and the low melting point fusible metal piece can be easily welded, and The spacing between the lead wires can be strictly guaranteed to the insulation distance when the thermal fuse is activated and the specified value that is regulated from the miniaturization of the thermal fuse, so it is easy to manufacture and is a small alloy type with excellent withstand voltage. A thermal fuse can be provided.

【図面の簡単な説明】 第1図Aは本発明の一実施例を示す説明図、第1図Bは
第1図Aにおけるb−b断面図、第2図は本発明に係る
温度ヒューズにおける浸漬塗装状態を示す説明図、第3
図、第4図、第5図、第6図並びに第7図はそれぞれ本
発明の別実施例を示す説明図、第8図Aは従来例を示す
説明図、第8図Bは第8図Aにおけるb−b断面図であ
る。 W……フラット型絶縁被覆層線、1……リード導線、10
……口出導線、2……絶縁被覆層、20……突出部、3…
…低融点可溶金属片、5……絶縁塗膜。
BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1A is an explanatory view showing an embodiment of the present invention, FIG. 1B is a sectional view taken along line bb in FIG. 1A, and FIG. 2 shows a thermal fuse according to the present invention. Explanatory drawing showing the state of dip coating, 3rd
FIG. 4, FIG. 5, FIG. 5, FIG. 6 and FIG. 7 are explanatory views showing another embodiment of the present invention, FIG. 8A is an explanatory view showing a conventional example, and FIG. 8B is FIG. It is bb sectional drawing in A. FIG. W: Flat type insulation layer wire, 1 ... Lead wire, 10
...... Lead wire, 2 ... Insulating coating layer, 20 ... Projection part, 3 ...
… Low melting point soluble metal pieces, 5… Insulating coating.

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】二本の導線を有するフラット型絶縁被覆線
の一端から絶縁被覆層を切断除去して導体を口出し、こ
の絶縁被覆層の切断除去においては絶縁被覆層切断端の
両サイドに突出部を残存させ、口出導線間に低融点可溶
金属片を橋設し、口出導線間、低融点可溶金属片並びに
絶縁被覆層端部にわたって絶縁被膜を施したことを特徴
とする温度ヒューズ。
1. A flat type insulating coated wire having two conducting wires, the insulating coating layer is cut and removed from one end to expose a conductor, and when the insulating coating layer is cut and removed, the conductor is projected on both sides of the cut end of the insulating coating layer. Part, the low melting point fusible metal piece is bridged between the lead wires, and the insulating coating is applied between the lead wires, the low melting point metal piece, and the end of the insulating coating layer. fuse.
【請求項2】請求項(1)において、突出部を口出導体
先端よりも突出させたことを特徴とする温度ヒューズ。
2. The thermal fuse according to claim 1, wherein the protruding portion is made to protrude beyond the tip of the lead conductor.
JP1208791A 1989-05-12 1989-08-11 Thermal fuse Expired - Fee Related JPH0766729B2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP1-119917 1989-05-12
JP11991789 1989-05-12

Publications (2)

Publication Number Publication Date
JPH0381921A JPH0381921A (en) 1991-04-08
JPH0766729B2 true JPH0766729B2 (en) 1995-07-19

Family

ID=14773381

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1208791A Expired - Fee Related JPH0766729B2 (en) 1989-05-12 1989-08-11 Thermal fuse

Country Status (1)

Country Link
JP (1) JPH0766729B2 (en)

Also Published As

Publication number Publication date
JPH0381921A (en) 1991-04-08

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