JP2544169Y2 - Thermal fuse - Google Patents
Thermal fuseInfo
- Publication number
- JP2544169Y2 JP2544169Y2 JP1991068754U JP6875491U JP2544169Y2 JP 2544169 Y2 JP2544169 Y2 JP 2544169Y2 JP 1991068754 U JP1991068754 U JP 1991068754U JP 6875491 U JP6875491 U JP 6875491U JP 2544169 Y2 JP2544169 Y2 JP 2544169Y2
- Authority
- JP
- Japan
- Prior art keywords
- melting point
- thermoplastic resin
- low melting
- fusible alloy
- alloy piece
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Description
【０００１】[0001]
【産業上の利用分野】本考案は合金型の温度ヒューズに
関するものである。[Industrial application] The present invention is applied to an alloy type thermal fuse.
It is about .
【０００２】[0002]
【従来の技術】従来の合金型温度ヒューズは、金属製の
リード導体の先端部間に低融点可溶合金片を接続し、該
低融点可溶合金片にフラックスを塗布し、このフラック
ス塗布合金片を絶縁ケース等の絶縁体で包囲した構成で
あり、機器の過電流による発熱で低融点可溶合金片が溶
融され、この溶融金属がリード導体への濡れにより球状
化分断されて機器への通電が遮断され、かくして、機器
の異常発熱を未然に防止している。2. Description of the Related Art Conventional alloy type thermal fuses are made of metal.
A low melting point fusible alloy piece was connected between the tips of the lead conductors.
Apply flux to the low melting point fusible alloy piece
In a configuration in which the coated alloy piece is surrounded by an insulator such as an insulating case
Yes, the melting point of the low melting point fusible alloy
This molten metal is spherical due to wetting of the lead conductor
And the power to the equipment is cut off,
Abnormal heat generation is prevented .
【０００３】[0003]
【考案が解決しようとする課題】温度ヒューズは機器に
はんだ付け等により接続して使用されているが、その接
続部には上記機器の発熱による加熱のもとでも溶融され
ることのないように、温度ヒューズの低融点可溶合金片
よりも高い融点の耐熱性を付与する必要があり、はんだ
の融点、従って、はんだ付けの温度が低融点可溶合金片
の融点よりも高くなり、はんだ付け等の接続の際に低融
点可溶合金片が損傷を受け易い。 Temperature fuse The present invention is to solve the above to the instrument
Used for connection by soldering, etc.
The continuation section is melted even under the heating of the above equipment.
So that the low melting point fusible alloy piece of the thermal fuse
It is necessary to provide higher melting point heat resistance than solder
Melting point, and therefore the soldering temperature is low melting point
Higher than the melting point of
Point fusible alloy pieces are easily damaged.
【０００４】本考案の目的は、機器にリード導体端を接
続する際の加熱に対し、低融点可溶合金片を損傷させる
ことなく安全に保護できる温度ヒューズを提供すること
にある。 An object of the present invention is to connect a lead conductor end to a device.
Damage to the low melting point fusible alloy piece due to heating during continuation
To provide a thermal fuse that can be safely protected without
It is in.
【０００５】本考案に係る温度ヒューズは、リード導体
を金属部分と導電性樹脂部分との直列連結体とし、リー
ド導体の金属部分間に低融点可溶合金片を接続したこと
を特徴とする構成である。[0005] The thermal fuse according to the present invention has a lead conductor.
Is a series connection of a metal part and a conductive resin part,
A low-melting-point fusible alloy piece is connected between metal parts of the conductor .
【０００６】[0006]
【作用】リード導体の導電性樹脂部分の端部が機器の端
子等に溶着接続される。而るに、その溶着温度が低融点
可溶合金片の融点より高くても、導電性樹脂部分の低熱
伝導率のために（例えば、銅の熱伝導率６．０×１０
−３ ｃａｌ／ｃｍ・ｓｅｃ・℃に対し、導電性樹脂の熱
伝導率は０．９４ｃａｌ／ｃｍ・ｓｅｃ・℃である）、
その溶着熱の低融点可溶合金片への伝達をよく抑制で
き、低融点可溶合金片の加熱損傷を防止できる。また、
作動時、溶融した低融点可溶合金がリード導体の金属部
分によく濡れ、溶融金属の分断が迅速に行なわれ得、温
度ヒューズの迅速作動性を確保できる。 [Function] The end of the conductive resin portion of the lead conductor is the end of the device.
It is welded and connected to the child. However, its welding temperature is low
Even if the melting point of the fusible alloy piece is higher than
Due to the conductivity (eg, the thermal conductivity of copper 6.0 × 10
-3 cal / cm · sec · ° C, heat of conductive resin
The conductivity is 0.94 cal / cm · sec · ° C.),
Transfer of the welding heat to the low melting point fusible alloy piece can be suppressed well.
In this way, heat damage to the low melting point fusible alloy piece can be prevented. Also,
During operation, the molten low melting point fusible alloy is
Wet well, the molten metal can be separated quickly,
Quick operation of the fuse can be secured.
【０００７】[0007]
【実施例】図１の（イ）は本考案の合金型温度ヒュ−ズ
についての実施例を一部を断面で示す平面図、図１の
（ロ）は図１の（イ）におけるロ−ロ断面図である。1 (a) is a plan view partially showing an embodiment of the alloy type temperature fuse of the present invention in a sectional view, and FIG. 1 (b) is a sectional view of FIG. 1 (a). FIG.
【０００８】図１の（イ）並びに（ロ）において、１，
１は一対のリ−ド導体、２はこれらリ−ド導体１，１の
先端間に橋設した低融点可溶合金片であり、リ−ド導体
１のうち先端部１１は銅等の金属で構成し、他の部分１
２は導電性熱可塑性樹脂で構成してある。この導電性熱
可塑性樹脂としては、導電性金属粒体と熱可塑性樹脂と
の混合物、低融点金属（例えば、鉛）と熱可塑性樹脂と
の積層体に超音波振動を加えて低融点金属を溶融微細化
して熱可塑性樹脂に拡散させたもの等を使用できる。３
は低融点可溶合金片２上に塗布したフラックスである。In FIGS. 1A and 1B, 1,
1 is a pair of lead conductors, 2 is a low melting point fusible alloy piece bridged between the tips of these lead conductors 1 and 1, and the tip 11 of the lead conductor 1 is made of metal such as copper. The other part 1
Reference numeral 2 is made of a conductive thermoplastic resin. As the conductive thermoplastic resin, a mixture of a conductive metal particle and a thermoplastic resin, or a laminate of a low melting metal (for example, lead) and a thermoplastic resin, is subjected to ultrasonic vibration to melt the low melting metal. What has been made fine and diffused in a thermoplastic resin can be used. 3
Is a flux applied on the low melting point fusible alloy piece 2.
【０００９】４，４はフラックス塗布の低融点可溶合金
片２を気密に挾持して絶縁せる熱可塑性樹脂シ−トであ
り、リ−ド導体１の導電性熱可塑性樹脂部分１２にまで
達しており、熱可塑性樹脂シ−ト周辺部の相互間並びに
熱可塑性樹脂シ−ト周辺部とリ−ド導体の導電性熱可塑
性樹脂部分との間を熱溶着乃至は超音波溶着等により溶
着してある。Reference numerals 4 and 4 denote thermoplastic resin sheets for airtightly sandwiching and insulating the flux-applied low melting point fusible alloy piece 2 and reaching the conductive thermoplastic resin portion 12 of the lead conductor 1. The periphery of the thermoplastic resin sheet and the periphery of the thermoplastic resin sheet and the conductive thermoplastic resin portion of the lead conductor are welded by heat welding or ultrasonic welding. It is.
【００１０】図２の（イ）は本考案の合金型温度ヒュ−
ズについての別実施例を示す縦断面図、図２の（ロ）は
図２の（イ）におけるロ−ロ断面図である。FIG. 2A is an alloy-type temperature hue of the present invention.
FIG. 2B is a cross-sectional view taken along line B-B of FIG. 2A.
【００１１】図２の（イ）並びに（ロ）において、１，
１は銅等の金属製先端部１１と導電性熱可塑性樹脂製の
残部１２とを備えた一対のリ−ド導体、２はリ−ド導体
１，１の金属製先端部１１，１１間に橋設した低融点可
溶合金片、３は低融点可溶合金片２上に塗布したフラッ
クス、４は一端に開口４１を有する扁平なセラミックス
ケ−スであり、この開口４１より上記のフラックス塗布
低融点可溶合金片２を当該ケ−ス４内に収容してある。
５は接合剤であり、硬化性樹脂又は熱可塑性樹脂を使用
することができ、後者の場合、超音波溶着により接合剤
５とケ−ス口部４１との間、並びに接合剤５とリ−ド導
体１の導電性熱可塑性樹脂部分１２との間を溶着でき
る。In (a) and (b) of FIG.
1 is a pair of lead conductors having a metal tip 11 made of copper or the like and a remaining portion 12 made of a conductive thermoplastic resin, and 2 is between the metal tips 11 of the lead conductors 1 and 1. The bridged low-melting-point fusible alloy piece 3 is a flux applied on the low-melting-point fusible alloy piece 2, and 4 is a flat ceramic case having an opening 41 at one end. The low melting point fusible alloy piece 2 is housed in the case 4.
Numeral 5 is a bonding agent, which can be a curable resin or a thermoplastic resin. In the latter case, the bonding agent 5 and the case opening 41 and the bonding agent 5 and the lead are bonded by ultrasonic welding. Can be welded to the conductive thermoplastic resin portion 12 of the conductor 1.
【００１２】図３は本考案の合金型温度ヒュ−ズについ
ての他の別実施例を示す縦断面図である。FIG. 3 is a longitudinal sectional view showing another embodiment of the alloy type temperature fuse of the present invention.
【００１３】図３において、１，１は銅等の金属製先端
部１１と導電性熱可塑性樹脂製の残部１２とを備えた一
対のリ−ド導体、２はリ−ド導体１，１の金属製先端部
１１，１１間に橋設した低融点可溶合金片、３は低融点
可溶合金片２上に塗布したフラックス、４はセラミック
ス製の筒状ケ−スであり、前記フラックス塗布低融点可
溶合金片２上に挿通してある。５は筒状ケ−ス４の各端
と各リ−ド導体１の導電性熱可塑性樹脂部分１２との間
を封止せる接合剤であり、硬化性樹脂又は熱可塑性樹脂
を使用することができ、後者の場合、超音波溶着により
接合剤５とケ−ス各端４１との間、並びに接合剤５とリ
−ド導体１の導電性熱可塑性樹脂部分１２との間を溶着
できる。In FIG. 3, reference numerals 1 and 1 denote a pair of lead conductors having a metal tip 11 made of copper or the like and a remaining portion 12 made of a conductive thermoplastic resin. The low-melting-point fusible alloy piece bridged between the metal tip portions 11, 11, 3 is a flux applied on the low-melting-point fusible alloy piece 2, and 4 is a ceramic cylindrical case. It is inserted on the low melting point fusible alloy piece 2. Numeral 5 is a bonding agent for sealing between each end of the cylindrical case 4 and the conductive thermoplastic resin portion 12 of each lead conductor 1, and a curable resin or a thermoplastic resin may be used. In the latter case, it is possible to weld between the bonding agent 5 and each end 41 of the case and between the bonding agent 5 and the conductive thermoplastic resin portion 12 of the lead conductor 1 by ultrasonic welding.
【００１４】上記の合金型温度ヒユ−ズにおいて、リ−
ド導体１の導電性熱可塑性樹脂部分１２の熱可塑性樹脂
には低融点可溶合金片２の融点よりも高融点のものを使
用してある。従って、合金型温度ヒュ−ズの作動温度よ
りも低温の温度範囲で機器の通電ヒ−トサイクルに曝さ
れても、リ−ド導体１の導電性熱可塑性樹脂部分１２の
形状、電気導通性には何らの異常もきたさず、機器の異
常発熱に対する合金型温度ヒュ−ズの保護機能を良好に
保障できる。In the above alloy type temperature fuse,
The thermoplastic resin of the conductive thermoplastic resin portion 12 of the conductor 1 has a higher melting point than the melting point of the low melting point fusible alloy piece 2. Therefore, even if the device is exposed to the heat cycle of the device in a temperature range lower than the operating temperature of the alloy type temperature fuse, the shape and the electrical conductivity of the conductive thermoplastic resin portion 12 of the lead conductor 1 are maintained. Does not cause any abnormality, and the function of protecting the alloy-type temperature fuse against abnormal heat generation of the device can be well guaranteed.
【００１５】上記の電子部品の電気機器または電気回路
への接続には、電気機器または電気回路の端子或いは導
体ランドに同電子部品のリ−ド導体の導電性熱可塑性樹
脂部分を超音波溶着又は熱溶着によって溶着する方法を
使用できる。The connection of the electronic component to an electric device or an electric circuit is performed by ultrasonic welding or by ultrasonically welding a conductive thermoplastic resin portion of a lead conductor of the electronic component to a terminal or a conductor land of the electric device or the electric circuit. A method of welding by heat welding can be used.
【００１６】上記導電性樹脂には、例えば、塩化ビニル
樹脂１００部、銅粉末１００部の組成が使用され、その
熱伝導率は銅のほぼ１／１６０である。 The conductive resin may be, for example, vinyl chloride
The composition of 100 parts of resin and 100 parts of copper powder is used.
Thermal conductivity is approximately 1/160 that of copper.
【００１７】[0017]
【考案の効果】本考案に係る温度ヒューズにおいては、
リード導体の導電性樹脂部分の機器端子への溶着接続温
度が低融点可溶合金片の融点より高くても、導電性樹脂
部分の低熱伝導率のために、その溶着熱の低融点可溶合
金片への伝達を抑制でき、低融点可溶合金片の加熱損傷
をよく防止できる。また、作動時、溶融した低融点可溶
合金がリード導体の金属部分によく濡れるから、溶融金
属の分断を迅速に行なわせ得、温度ヒューズの迅速作動
性を確保できる。[Effect of the Invention] In the thermal fuse according to the present invention,
Temperature of welding connection of conductive resin part of lead conductor to equipment terminal
Even if the degree is higher than the melting point of the low melting
Due to the low thermal conductivity of the part, its melting heat has a low melting point melting
Heat damage to low melting point fusible alloy pieces can be suppressed by suppressing transmission to gold pieces.
Can be prevented well. In operation, it has a low melting point
Since the alloy wets the metal part of the lead conductor well,
Swift disconnection of metal and quick activation of thermal fuse
Nature can be secured .
【図１】図１の（イ）は本考案の実施例を一部を断面で
示す平面図、図１の（ロ）は図１の（イ）におけるロ−
ロ断面図である。1A is a plan view partially showing an embodiment of the present invention in cross section, and FIG. 1B is a cross-sectional view of FIG.
FIG.
【図２】図２の（イ）は本考案の上記とは別の実施例を
示す縦断面図、図２の（ロ）は図２の（イ）におけるロ
−ロ断面図である。Of (i) Figure 2 is a longitudinal sectional view showing another embodiment from the above of the present invention, in FIG. 2 (b) is b in the (b) 2 - a b cross section.
【図３】本考案の上記とは別の実施例を示す縦断面図で
ある。FIG. 3 is a longitudinal sectional view showing another embodiment of the present invention.
１ リード導体 １１ 金属製部分 １２ 導電性熱可塑性樹脂部分 DESCRIPTION OF SYMBOLS 1 Lead conductor 11 Metal part 12 Conductive thermoplastic resin part
Claims (1)
の直列連結体とし、リード導体の金属部分間に低融点可
溶合金片を接続したことを特徴とする温度ヒューズ。 1. A lead conductor comprising a metal part and a conductive resin part.
With a low melting point between the metal parts of the lead conductor.
A thermal fuse characterized by connecting a molten alloy piece.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1991068754U JP2544169Y2 (en) | 1991-08-02 | 1991-08-02 | Thermal fuse |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1991068754U JP2544169Y2 (en) | 1991-08-02 | 1991-08-02 | Thermal fuse |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0515278U JPH0515278U (en) | 1993-02-26 |
| JP2544169Y2 true JP2544169Y2 (en) | 1997-08-13 |
Family
ID=13382866
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1991068754U Expired - Lifetime JP2544169Y2 (en) | 1991-08-02 | 1991-08-02 | Thermal fuse |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2544169Y2 (en) |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5856449A (en) * | 1981-09-30 | 1983-04-04 | Nec Corp | Semiconductor device |
-
1991
- 1991-08-02 JP JP1991068754U patent/JP2544169Y2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0515278U (en) | 1993-02-26 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2624439B2 (en) | Circuit protection element | |
| US5982268A (en) | Thin type fuses | |
| US4533896A (en) | Fuse for thick film device | |
| JP3618635B2 (en) | Battery protector | |
| JP2544169Y2 (en) | Thermal fuse | |
| JPH0478104A (en) | Excess current protective component | |
| JPH031880Y2 (en) | ||
| JP2009070803A (en) | Temperature fuse with resistor and battery protection circuit board | |
| JPH0638351Y2 (en) | Temperature fuse | |
| JPS5937549B2 (en) | Wire - installation method | |
| JPS6297361A (en) | Reduced size apparatus for connecting two conducting lines | |
| JP3754770B2 (en) | Thin fuse | |
| JPS6314357Y2 (en) | ||
| JP3252025B2 (en) | Substrate type temperature fuse | |
| JPS6314356Y2 (en) | ||
| KR100459489B1 (en) | Lead wire and polymer fuse for blocking over-current using the same | |
| JPS6327410Y2 (en) | ||
| JP2872525B2 (en) | Circuit protection element | |
| JP2897430B2 (en) | Manufacturing method of fusible alloy type thermal fuse | |
| JPH042023A (en) | Resistance/thermal fuse and manufacture thereof | |
| JPS6013149Y2 (en) | temperature fuse | |
| JPH11339615A (en) | Substrate type resistor thermal fuse | |
| CA1191178A (en) | Fuse for thick film device | |
| JPH0638350Y2 (en) | Temperature fuse | |
| JP5981163B2 (en) | Current fuses and electronics |