JP3754770B2

JP3754770B2 - Thin fuse

Info

Publication number: JP3754770B2
Application number: JP28150796A
Authority: JP
Inventors: 俊朗川西
Original assignee: Uchihashi Estec Co Ltd
Current assignee: Uchihashi Estec Co Ltd
Priority date: 1996-10-01
Filing date: 1996-10-01
Publication date: 2006-03-15
Anticipated expiration: 2016-10-01
Also published as: JPH10106425A

Description

【０００１】
【発明の属する技術分野】
本発明は薄型ヒュ−ズに関するものである。
【０００２】
【従来の技術】
電気機器を保護するための部材として、電流ヒュ−ズや温度ヒュ−ズが汎用されているが、取付けスペ−ス上、薄型化が要請されている。
そこで、本出願人においては、図４の（イ）及び図４の（ロ）〔図４の（イ）におけるロ−ロ断面図〕並びに図４の（ハ）〔底面図〕に示すように、一対の帯状リ−ド導体２’，２’の各先端部に膨出部２１’，２１’を形成し、各膨出部２１’をプラスチック製絶縁支持フィルム１’の片面より他面に水密に表出させ、該絶縁支持フィルム１’の他面側での上記リ−ド導体の先端部間にヒュ−ズエレメント３’を接続し、このヒュ−ズエレメント３’を覆ってフラックス層５’を被覆し、該フラックス層５’を覆って上記絶縁支持フィルム１’の他面に絶縁カバ−フィルム４’を被着した薄型ヒュ−ズを既に提案した（特公平７−９５４１９号公報）。
【０００３】
この薄型ヒュ−ズによれば、製造工数が少なく製造を簡易化でき、また、絶縁支持フィルムと絶縁カバ−フィルムとの接触面が他部材の介在のない平坦接触面であり、ヒュ−ズ作動時フラックスの膨張で発生する内圧に対し、その接触面を熱融着または接着剤で容易に、かつ優れたシ−ル性で封止できてミストの飛散を防止できる、等の利点が得られる。
【０００４】
【発明が解決しようとする課題】
電流ヒュ−ズや温度ヒュ−ズにおいては、過電流によるジュ−ル熱や外部からの過熱でヒュ−ズエレメントが融点に達して溶断されることにより作動され、スイッチオン・オフ時での過度的なパルス電流で作動されないことが必要である。
しかしながら、上記薄型ヒュ−ズでは、本発明者の試験結果によれば、過度的なパルス電流が多回数流れると、ヒュ−ズエレメントの変歪による溶断特性の変動や断線が発生して使用条件の制約を受けることがある。
【０００５】
本発明の目的は、上記薄型ヒュ−ズを対象とし、パルス状過電流の通電が繰り返されても、当初の溶断特性を充分に維持できる薄型ヒュ−ズを提供することにある。
【０００６】
【課題を解決するための手段】
本発明に係る薄型ヒューズは、一対のリ−ド導体の各先端部を絶縁支持フィルムの片面より他面に水密に表出させ、該絶縁支持フィルムの他面側での上記リ−ド導体先端部間にヒュ−ズエレメントを接続し、上記絶縁支持フィルムの他面に絶縁カバ−フィルムを上記ヒュ−ズエレメントに面接触させて被覆したことを特徴とし、ヒュ−ズエレメントと絶縁カバ−フィルムとの接触面を囲んで絶縁支持フィルムと絶縁カバ−フィルムとの間にフラックスを充填することができる。
【０００７】
【発明の実施の形態】
以下、図面を参照しつつ本発明の実施の形態について説明する。
図１の（イ）は本発明に係る薄型ヒュ−ズの一例を一部を切開して示す平面図、図１の（ロ）は同薄型ヒュ−ズの一例を示す図１の（イ）におけるロ−ロ断面図、図１の（ハ）は同じく図１の（イ）におけるハ−ハ断面図、図１の（ニ）は同上薄型ヒュ−ズの一例を示す底面図である。
図１の（イ）乃至図１の（ニ）において、１はプラスチック製の絶縁支持フィルムである。２，２は一対の帯状リ−ド導体であり、各導体２の先端部に膨出部２１を形成し、各導体先端部を絶縁支持フィルム１の裏面に当接し、膨出部２１を絶縁支持フィルム１の表面に表出させると共に絶縁支持フィルム１と帯状リ−ド導体２との接触面を接着してある。３は帯状リ−ド導体の表出部２１０，２１０間に溶接またはろう接により接続したヒュ−ズエレメントであり、所定融点の低融点可溶金属片を使用できる。４は絶縁支持フィルム１の表面側に被覆したプラスチック製の絶縁カバ−フィルムであり、周囲が上記絶縁支持フィルム１に融着または接着剤により接着され、該カバ−フィルム４の裏面を上記ヒュ−ズエレメント３に面接触させてある。この面接触を確保するために、ヒュ−ズエレメント３の断面は四角形としてある。５は絶縁支持フィルム１と絶縁カバ−フィルム４との間にヒュ−ズエレメント３を囲んで充填したフラックスである。
【０００８】
上記の絶縁支持フィルム１及び絶縁カバ−フィルム４には、高剛性のプラスチック、特に、熱可塑性プラスチック、例えば、ポリエチレンテレフタレ−ト、ポリアセタ−ル、ポリアミド、ポリブチレンテレフタレ−ト、ポリフェニレンオキシド、ポリフェニレンサルファイド、ポリサルホン等を使用できる。これらの絶縁支持フィルム１及び絶縁カバ−フィルム４に同材質のものを使用することが好ましいが、異種材質のものの使用も可能である。
【０００９】
上記の帯状リ−ド導体２には、銅の単一体、または、絶縁支持フィルム１の裏面に当接される面を銅とし、他の部分を異種の金属、例えば、ニッケルとした複合体を使用することもできる。
【００１０】
上記帯状リ−ド導体先端部の絶縁支持フィルムへの接着には、帯状リ−ド導体の先端部に膨出部をプレス加工し、絶縁支持フィルムにこの膨出部よりもやや小さい孔を穿設し、帯状リ−ド導体先端部を絶縁支持フィルム裏面に当接し、膨出部を絶縁支持フィルムの孔に嵌めると共に両者の接触面を加圧熱融着する方法、帯状リ−ド導体の先端部に膨出部をプレス加工し、帯状リ−ド導体先端部を絶縁支持フィルム裏面に当接し、加熱下でプレス加圧して膨出部を絶縁支持フィルムの表面に向け食い込ませると共に絶縁支持フィルムと帯状リ−ド導体とを熱融着し、研削で膨出部上のフィルム部分を除去して膨出部を表出させる方法等を使用できる。
【００１１】
上記絶縁カバ−フィルムの被覆には、帯状リ−ド導体の表出部間にヒュ−ズエレメントを接続したのち、図２に示すように、絶縁カバ−フィルム４を絶縁支持フィルム１の上側に配置し、この絶縁カバ−フィルム４の上面中央部に冷却シリンダ−６１を当接し、このシリンダ−６１への寒剤６２の循環によってヒュ−ズエレメント（低融点可溶金属片）を冷却しつつ絶縁カバ−フィルム４の周囲を加熱リング６３によって絶縁支持フィルム１の周囲に熱融着する方法を使用できる。
【００１２】
本発明に係る薄型ヒュ−ズは、電気機器の平坦面部分に帯状リ−ド導体を接触させるようにして当該機器に取り付け、温度ヒュ−ズまたは電流ヒュ−ズとして使用される。すなわち、ヒュ−ズエレメントに流れる過電流で発生するジュ−ル熱または過電流に基づく機器発生熱でヒュ−ズエレメントが溶融され、この溶融エレメントが既に溶融しているフラックスの活性作用を受けつつ球状化進行で分断されて機器への通電が遮断される。
この場合、過電流をｉ、ヒュ−ズエレメントの抵抗をＲ、ヒュ−ズエレメントの単位時間・単位温度差当たりの放熱量をＰ、ヒュ−ズエレメントの熱容量をＣ、常温をθ、ｔ時間後でのヒュ−ズエレメントの温度をＴとすると、
ｉ²Ｒ△ｔ−Ｐ（Ｔ−θ）△ｔ＝Ｃ△Ｔ、すなわち
【００１３】
【数１】

が成立し、過電流ｉをｔ時間以内に遮断させるには、ヒュ−ズエレメントの融点Ｔxが式▲２▼を満たすように設定される。
【００１４】
【数２】

本発明に係る薄型ヒュ−ズを電流ヒュ−ズとして使用する場合、図３の斜線部分で示すような要求溶断範囲を満たすように、ヒュ−ズエレメントの融点Ｔｘや上記したＰやＲが設定される。
本発明に係る薄型ヒュ−ズを電流ヒュ−ズ、温度ヒュ−ズの何れで使用するときでも、スイッチのオン・オフ時に生じる過度的電圧や電流で作動されてはならず、図３のｐで示すようなパルス状過電流ではヒュ−ズエレメントの温度を融点に達しさせないように、ヒュ−ズエレメントの融点や上記したＰやＲが設定される。
【００１５】
この場合、本発明に係る薄型ヒュ−ズでは、外面が空気に接触される絶縁カバ−フィルム４の裏面にヒュ−ズエレメント３を面接触させ、かかる面接触状態を保持してフラックス５を充填してあり、ヒュ−ズエレメントをフラックス層を介して絶縁カバ−フィルムに接触させている従来の薄型ヒュ−ズに較べてヒュ−ズエレメントの単位時間・単位温度差当たりの放熱量Ｐを大にできるから、上記パルス状過電流に対するヒュ−ズエレメントの温度上昇を抑制できる。従って、上記パルス状過電流に基づくヒュ−ズエレメントの加熱（融点以下での加熱）を軽度にとどめ得、それだけパルス状過電流の繰返し通電によるヒュ−ズエレメントの疲労乃至は破断をよく抑制でき、当初の溶断特性を充分に維持させ得る。
【００１６】
なお、本発明に係る薄型ヒュ−ズの上記の例では、一対の帯状リ−ド導体を一直線状に対向させているが、一対の帯状リ−ド導体を並行に配設し、ヒュ−ズエレメントをリ−ド導体先端部間にリ−ド導体の長手方向に直交させて接続することもできる。
【００１７】
【実施例】
〔実施例〕
絶縁支持フィルムには長さ１０．５ｍｍ、巾：６ｍｍ、厚み：０．１９ｍｍのポリエチレンテレフタレ−トフィルムを、絶縁カバ−フィルムには厚みが０．１９ｍｍで外郭が絶縁支持フィルムよりもやや大きなポリエチレンテレフタレ−トフィルムをそれぞれ使用した。
帯状リ−ド導体には、巾：３．５ｍｍ、厚み：０．１ｍｍの銅−ニツケル複合体を使用し、各帯状リ−ド導体の絶縁支持フィルム裏面への接触長さは４．８５ｍｍとした。
ヒュ−ズエレメントには、融点が９３℃、断面積が０．０７ｍｍ²の断面正方形の低融点可溶金属線（共晶合金）を使用し、フラックスにはロジンを主成分とするものを使用した。
絶縁支持フィルムに帯状リ−ド導体の先端部を固着するには、帯状リ−ド導体の端部の中央部に膨出部をプレス成形し、絶縁支持フィルムにこの膨出部よりもやや小さい孔を穿設し、帯状リ−ド導体先端部を絶縁支持フィルム裏面に当接し、帯状リ−ド導体先端部の膨出部を絶縁支持フィルムの孔に嵌めると共に両者の接触面を加圧加熱により融着する方法を使用した。また、絶縁支持フィルムと絶縁カバ−フィルムとの接着は熱融着により行った。
実施例における、その他の各部の寸法は、図１の（イ）に示すように、ａ並びにｂを帯状リ−ド導体表出部の長さ並びに巾とし、Ｌを帯状リ−ド導体表出部間の間隔とし、ｈをヒュ−ズエレメントの長さとして、ａ：１．６２ｍｍ、ｂ：０．８ｍｍ、Ｌ：２．５ｍｍ、ｈ：６．０ｍｍとした。
上記ヒュ−ズエレメントと絶縁カバ−フィルムとの接触面積は、ほぼ１．３０ｍｍ²であった。
【００１６】
〔比較例〕
実施例に対し、ヒュ−ズエレメントとして断面積同一の断面円形線を使用し、絶縁カバ−フィルムとヒュ−ズエレメントとを接触させず、この間にフラックスを介在させた以外、実施例に同じとした。
【００１７】
これらの実施例及び比較例について、絶縁樹脂板に帯状リ−ド導体の裏面を密接させ、５アンペヤ１秒通電−５９秒遮断を１サイクルとして５００サイクルのパルス状過電流通電試験を行ったところ（試料数は各１０箇）、実施例品では何らの異常も観られなかったが、比較例品では、１０箇中６箇にヒュ−ズエレメントの断線が認められた。
【００１８】
【発明の効果】
本発明に係る薄型ヒュ−ズは、本出願人が既に提案した薄型ヒュ−ズ（（特公平７−９５４１９号公報）を対象として、スイッチオン・オフ時での過度的電流等のパルス状過電流に対する安定性を向上させ得るものであり、機器、特に電子機器の小型化に伴いますます薄型化が要求される電流ヒュ−ズまたは温度ヒュ−ズとして極めて有用である。
【図面の簡単な説明】
【図１】図１の（イ）は本発明に係る薄型ヒュ−ズの一例を一部を切開して示す平面図、図１の（ロ）は同薄型ヒュ−ズの一例を示す図１の（イ）におけるロ−ロ断面図、図１の（ハ）は同じく図１の（イ）におけるハ−ハ断面図、図１の（ニ）は同上薄型ヒュ−ズの一例を示す底面図である。
【図２】本発明に係る薄型ヒュ−ズの製造方法を示す説明図である。
【図３】本発明に係る薄型ヒュ−ズの作動特性を示す説明図である。
【図４】図４の（イ）は従来の薄型ヒュ−ズを一部を切開して示す平面図、図４の（ロ）は同薄型ヒュ−ズを示す図４の（イ）におけるロ−ロ断面図、図４の（ハ）は同上薄型ヒュ−ズを示す底面図である。
【符号の説明】
１絶縁支持フィルム
２リ−ド導体
２１膨出部
３ヒュ−ズエレメント
４絶縁カバ−フィルム
５フラックス[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a thin fuse.
[0002]
[Prior art]
Current fuses and temperature fuses are widely used as members for protecting electrical equipment, but they are required to be thin in terms of mounting space.
Therefore, in the present applicant, as shown in FIGS. 4 (a) and 4 (b) [a cross-sectional view of FIG. 4 (a)] and FIG. 4 (c) [bottom view]. The bulging portions 21 ′ and 21 ′ are formed at the tip ends of the pair of strip-shaped lead conductors 2 ′ and 2 ′, and the bulging portions 21 ′ are arranged on the other side from one side of the plastic insulating support film 1 ′. The fuse element 3 'is connected between the leading ends of the lead conductors on the other surface side of the insulating support film 1', and the flux element is covered with the fuse element 3 '. A thin fuse has already been proposed in which 5 'is covered and an insulating cover film 4' is covered on the other surface of the insulating support film 1 'so as to cover the flux layer 5' (Japanese Patent Publication No. 7-95419). ).
[0003]
According to this thin fuse, the number of manufacturing steps can be reduced and the manufacturing can be simplified, and the contact surface between the insulating support film and the insulating cover film is a flat contact surface without any other member, so that the fuse operates. With respect to the internal pressure generated by the expansion of the flux at the time, the contact surface can be easily sealed with heat sealing or an adhesive and can be sealed with excellent sealing properties to prevent the mist from scattering. .
[0004]
[Problems to be solved by the invention]
Current fuses and temperature fuses are activated when the fuse element reaches the melting point due to overheating due to overcurrent or overheating from the outside, and it is activated excessively when the switch is turned on / off. It is necessary not to be operated with a typical pulse current.
However, in the above thin fuse, according to the test results of the present inventor, if excessive pulse current flows many times, fusing characteristics fluctuate or disconnection occurs due to distortion of the fuse element. May be subject to restrictions.
[0005]
SUMMARY OF THE INVENTION An object of the present invention is to provide a thin fuse that can maintain the original fusing characteristics sufficiently even when pulsed overcurrent is repeatedly applied to the thin fuse.
[0006]
[Means for Solving the Problems]
In the thin fuse according to the present invention, the tip ends of the pair of lead conductors are watertightly exposed from one side of the insulating support film to the other side, and the leading ends of the lead conductors on the other side of the insulating support film are provided. A fuse element and an insulating cover film are characterized in that a fuse element is connected between the portions, and an insulating cover film is coated on the other surface of the insulating support film so as to be in surface contact with the fuse element. Flux can be filled between the insulating support film and the insulating cover film so as to surround the contact surface.
[0007]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the drawings.
1A is a plan view showing an example of a thin fuse according to the present invention with a part cut away, and FIG. 1B is a plan view showing an example of the thin fuse shown in FIG. FIG. 1C is a cross-sectional view of the same in FIG. 1A, and FIG. 1D is a bottom view of an example of the thin fuse.
In FIGS. 1A to 1D, 1 is a plastic insulating support film.

Reference numerals

2 and 2 denote a pair of strip-shaped lead conductors. A bulge portion 21 is formed at the tip of each conductor 2, and each conductor tip is in contact with the back surface of the insulating support film 1 to insulate the bulge 21 The surface of the support film 1 is exposed and the contact surface between the insulating support film 1 and the strip-shaped lead conductor 2 is bonded. Reference numeral 3 denotes a fuse element connected between the exposed

portions

210 and 210 of the strip-shaped lead conductor by welding or brazing, and a low melting point soluble metal piece having a predetermined melting point can be used. Reference numeral 4 denotes an insulating cover film made of plastic coated on the surface side of the insulating support film 1, the periphery of which is adhered to the insulating support film 1 by fusion or adhesive, and the back surface of the cover film 4 is attached to the above-mentioned fusible body. The surface element 3 is in surface contact. In order to ensure this surface contact, the fuse element 3 has a rectangular cross section. Reference numeral 5 denotes a flux filled with the fuse element 3 between the insulating support film 1 and the insulating cover film 4.
[0008]
The insulating support film 1 and the insulating cover film 4 include a high-rigidity plastic, in particular, a thermoplastic plastic such as polyethylene terephthalate, polyacetal, polyamide, polybutylene terephthalate, polyphenylene oxide, Polyphenylene sulfide, polysulfone, etc. can be used. The insulating support film 1 and the insulating cover film 4 are preferably made of the same material, but different materials can also be used.
[0009]
The strip-shaped lead conductor 2 is made of a single body of copper or a composite in which the surface abutting against the back surface of the insulating support film 1 is copper and the other portion is a different metal, for example, nickel. It can also be used.
[0010]
To bond the leading end of the strip-shaped lead conductor to the insulating support film, a bulging portion is pressed at the leading end of the strip-shaped lead conductor, and a hole slightly smaller than the bulging portion is formed in the insulating supporting film. A belt-shaped lead conductor tip is brought into contact with the back surface of the insulating support film, the bulging portion is fitted into the hole of the insulating support film, and the contact surfaces of both are pressurized and heat-sealed. The bulging part is pressed at the leading end, the leading end of the strip-shaped lead conductor is brought into contact with the back surface of the insulating support film, and pressurizing is applied under heat to bite the bulging part toward the surface of the insulating supporting film and support the insulation. A method may be used in which the film and the strip-shaped lead conductor are heat-sealed, and the film portion on the bulging portion is removed by grinding to expose the bulging portion.
[0011]
For covering the insulating cover film, a fuse element is connected between the exposed portions of the strip-shaped lead conductor, and then the insulating cover film 4 is placed on the upper side of the insulating support film 1 as shown in FIG. The cooling cylinder 61 is brought into contact with the center of the upper surface of the insulating cover film 4 and the fuse element (low melting point metal piece) is cooled and insulated by circulation of the cryogen 62 to the cylinder 61. A method in which the periphery of the cover film 4 is heat-sealed to the periphery of the insulating support film 1 by the heating ring 63 can be used.
[0012]
The thin fuse according to the present invention is attached to a device in such a manner that a strip-shaped lead conductor is brought into contact with a flat surface portion of the electric device, and is used as a temperature fuse or a current fuse. In other words, the fuse element is melted by the heat generated by the overcurrent flowing through the fuse element or the heat generated by the equipment based on the overcurrent, and the molten element is subjected to the active action of the already melted flux. It is divided by the progress of spheroidization, and the power supply to the equipment is cut off.
In this case, the overcurrent is i, the resistance of the fuse element is R, the heat dissipation amount per unit time / unit temperature of the fuse element is P, the heat capacity of the fuse element is C, the normal temperature is θ, and t time If the temperature of the fuse element later is T,
i ² RΔt−P (T−θ) Δt = CΔT, ie,
[Expression 1]

In order to cut off the overcurrent i within t time, the melting point Tx of the fuse element is set so as to satisfy the formula (2).
[0014]
[Expression 2]

When the thin fuse according to the present invention is used as a current fuse, the melting point Tx of the fuse element and the above-described P and R are set so as to satisfy the required fusing range as shown by the hatched portion in FIG. Is done.
When the thin fuse according to the present invention is used as a current fuse or a temperature fuse, it must not be operated by an excessive voltage or current generated when the switch is turned on / off. The melting point of the fuse element and the above-described P and R are set so that the temperature of the fuse element does not reach the melting point with the pulsed overcurrent as shown in FIG.
[0015]
In this case, in the thin fuse according to the present invention, the fuse element 3 is brought into surface contact with the back surface of the insulating cover film 4 whose outer surface is in contact with air, and the surface contact state is maintained and the flux 5 is filled. Compared to the conventional thin fuse in which the fuse element is brought into contact with the insulating cover film through the flux layer, the heat dissipation amount P per unit time / unit temperature difference of the fuse element is larger. Therefore, the temperature rise of the fuse element with respect to the pulse-like overcurrent can be suppressed. Therefore, the heating of the fuse element based on the above pulsed overcurrent (heating below the melting point) can be kept light, and the fatigue or breakage of the fuse element due to repeated energization of the pulsed overcurrent can be well suppressed. The initial fusing characteristics can be sufficiently maintained.
[0016]
In the above-described example of the thin fuse according to the present invention, the pair of strip-shaped lead conductors are opposed to each other in a straight line, but the pair of strip-shaped lead conductors are arranged in parallel to form the fuse. It is also possible to connect the elements between the leading ends of the lead conductors so as to be orthogonal to the longitudinal direction of the lead conductors.
[0017]
【Example】
〔Example〕
The insulation support film is a polyethylene terephthalate film with a length of 10.5 mm, width: 6 mm, and thickness: 0.19 mm. The insulation cover film is polyethylene with a thickness of 0.19 mm and a slightly larger outer shell than the insulation support film. Each terephthalate film was used.
For the strip-shaped lead conductor, a copper-nickel composite having a width of 3.5 mm and a thickness of 0.1 mm is used, and the contact length of each strip-shaped lead conductor to the back surface of the insulating support film is 4.85 mm. did.
The fuse element uses a low-melting-point soluble metal wire (eutectic alloy) with a melting point of 93 ° C and a cross-sectional area of 0.07 mm ² , and the flux is mainly composed of rosin. did.
To fix the leading end of the strip-shaped lead conductor to the insulating support film, a bulging portion is press-molded at the center of the end of the strip-shaped lead conductor, and the insulating supporting film is slightly smaller than the bulging portion. A hole is formed, the leading end of the strip-shaped lead conductor is brought into contact with the back surface of the insulating support film, the bulging portion of the leading end of the strip-shaped lead conductor is fitted into the hole of the insulating support film, and both contact surfaces are pressurized and heated. The method of fusing was used. Adhesion between the insulating support film and the insulating cover film was performed by heat sealing.
In the embodiment, as shown in FIG. 1A, the dimensions of the other parts are as follows. A and b are the length and width of the strip-shaped lead conductor exposed portion, and L is the strip-shaped lead conductor expression. The interval between the parts was set to h, and the length of the fuse element was set to a: 1.62 mm, b: 0.8 mm, L: 2.5 mm, and h: 6.0 mm.
The contact area between the fuse element and the insulating cover film was approximately 1.30 mm ² .
[0016]
[Comparative Example]
In contrast to the embodiment, the same as in the embodiment, except that a circular line having the same cross-sectional area is used as the fuse element, the insulating cover film and the fuse element are not brought into contact with each other, and a flux is interposed therebetween. did.
[0017]
About these examples and comparative examples, when the back surface of the strip-shaped lead conductor was brought into close contact with the insulating resin plate, a 500-cycle pulse overcurrent energization test was performed with 5 amperes 1 second energization-59 seconds interruption as one cycle. (No. of samples: 10) No abnormality was observed in the example products, but in the comparative product, 6 out of 10 fuse elements were disconnected.
[0018]
【The invention's effect】
The thin fuse according to the present invention is intended for the thin fuse already proposed by the present applicant (Japanese Patent Publication No. 7-95419). It can improve the stability against electric current, and is extremely useful as a current fuse or a temperature fuse that is required to be thinner as equipment, particularly electronic equipment, becomes smaller.
[Brief description of the drawings]
1A is a plan view showing an example of a thin fuse according to the present invention, and FIG. 1B is a plan view showing an example of the thin fuse. FIG. (A) in FIG. 1, (c) in FIG. 1 is a cross-sectional view in (c) in FIG. 1, and (d) in FIG. 1 is a bottom view showing an example of the thin fuse. It is.
FIG. 2 is an explanatory view showing a method of manufacturing a thin fuse according to the present invention.
FIG. 3 is an explanatory diagram showing operating characteristics of a thin fuse according to the present invention.
4 (a) is a plan view showing a conventional thin fuse partially cut away, and FIG. 4 (b) is a plan view showing the same thin fuse in FIG. 4 (b). -A cross-sectional view, (c) of FIG. 4 is a bottom view showing the thin fuse.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Insulation support film 2 Lead conductor 21 Bulge part 3 Fuse element 4 Insulation cover film 5 Flux

Claims

Each tip of the pair of lead conductors is watertightly exposed from one side of the insulating support film to the other side, and a fuse element is interposed between the leading ends of the lead conductors on the other side of the insulating support film. A thin fuse which is connected and covered on the other surface of the insulating support film with an insulating cover film brought into surface contact with the fuse element.

2. The thin fuse according to claim 1, wherein a flux is filled between the insulating support film and the insulating cover film so as to surround a contact surface between the fuse element and the insulating cover film.