JPH0760844A - Manufacture of three-dimensional structure - Google Patents

Abstract

PURPOSE:To obtain a three-dimensional structure containing a relatively movable resin material and a ceramic material and having high accuracy by providing the steps of molding an optically curable fluidized resin, curing a sacrificial layer of optically curable resin containing a sacrificial layer component or made of the component, and removing the layer. CONSTITUTION:A optically curable fluidized resin 24 is contained in an optically curable fluidized resin tank 21, and formed with an ultraviolet beam 23 from below a glass plate 22. Then, a table 31 is moved by a vertical actuator 32 and a horizontal actuator 33, filled in a cleaning tank 26 filled with cleanser 25, and cleaned by an ultrasonic generator 40. Thereafter, after an ultraviolet ray source 28 is disposed, the table 31 is introduced into an exposure tank 27, and the cured optically curable fluidized resin 34 is completely cured by the ultraviolet beam. Further, an optically curable fluidized resin 30 of a sacrificial layer component is contained in an optically curable fluidized resin tank 29, the table 31 is moved thereto, and a sacrificial layer is optically formed at a resin molded form. Then, after it is cleaned with the tank 26, it is applied by an ultrasonic vibration and only the sacrificial layer component is dissolved.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION The present invention relates to a three-dimensional structure having relatively movable parts, particularly a fine three-dimensional structure, by means of a stereolithography technique using a photocurable fluid resin, a polymer resin or a setamix. The present invention relates to a method of manufacturing a three-dimensional structure with a material.

[0002]

2. Description of the Related Art In recent years, research on micromachines has been actively conducted, and in particular, there is a great need for three-dimensional component processing and assembling technology, and various fine processing technologies are being researched. As one of these fine processing techniques, a metal injection molding method, that is, MI
There is M (Metal Injection Molding), which is being actively researched and developed. For example (Hiroyuki Okumura, Metal Powder Injection Molding Process, Press School, No. 291, 1992, p.
1-14) (Ritsu Miura, metal powder injection molding method, industrial materials,
No. 39 No. 12, September 1991, P18-23).

FIG. 1 shows this machining process diagram. First, in the heating and kneading step, fine powder of metal, for example, a particle size of 1 μm to 1 is generally used.
An organic material (hereinafter referred to as a binder) is added to a metal powder manufactured by a fine powder manufacturing technique such as water atomization or gas atomization such as Fe or Ni having an average diameter of 0 μm and a thickness of 5 μm.
For example, polyethylene, polystyrene, polypropylene and EVA (copolymer of ethylene and vinyl acetate) are mixed at a constant ratio and heated to knead to form a clay-like soft mixture. The granulation step pelletizes the mixture so that it can be fed to an injection molding machine. In the injection molding process, the pelletized material is completely filled by the injection molding machine into the closed mold, and the material is taken out as it is and the material is melted and poured by the method of obtaining the final target shape. Molded by repeating the process of hardening.
In the degreasing step, heating is performed to decompose and remove the binder in the molded body. Generally, the degreasing time is 15 to 100 hours, and the maximum temperature is 300 to 500 depending on the binder component.
It is about ℃. In the sintering step, a compact made of only metal powder is sintered at high temperature. For example, in the case of Fe and Ni, it is a method of sintering at 1100 to 1200 ° C. in a hydrogen atmosphere to obtain a metal body having an original density. Through such a process, a certain degree of three-dimensional microstructure can be manufactured without cutting.

However, in this case, since a highly viscous fluid material is used, it is difficult to completely pour the fluid material into the fine mold, and there are drawbacks listed below. (1) It is difficult to obtain a highly accurate molded body. (2) Since a highly viscous fluid material is used, the mold wear is large and the mold life is short. (3) Since the parts are molded by injection molding, it is difficult to make the powder density uniform, and uneven dimension shrinkage occurs in the binder degreasing process. (4) Since the mold has to be designed in consideration of the non-uniform dimensional shrinkage, the manufacturing cost of the mold is high. (5) Particularly in the case of manufacturing a minute structure, it is extremely difficult to process the mold required for it. (6) It is extremely difficult to manufacture a fine structure with a mechanism that is relatively movable.

Conventionally, no other cutting process is required. 3
There is a stereolithography technology that has been attracting attention in recent years as a manufacturing technology for three-dimensional structures (Points for producing three-dimensional models from CAD data, labor saving and automation, September 1992 issue, P38-63) (Shigeru Nagamori, UV curable resin Micromachine design / fabrication by the processing method used, mechanical design, 1992, P50-55) (Koji Ikuta, Optical wound 3D microfabrication,
Material of the 5th Micromachine Symposium, P79, P7
8).

A specific method of forming a three-dimensional structure by the optical forming method is shown in the process flow chart of FIG. (1) First, input the drawing of the three-dimensional structure into the three-dimensional CAD. (2) Next, a horizontal slice graphic data group is created for each fixed stack thickness from the three-dimensional structure. (3) Next, a photocurable fluid resin, for example, an oligomer (epoxy acrylate, urethane acrylate, etc.) reactive diluent (monomer), a photopolymerization initiator (benzoin-based,
An elevator that moves in the vertical direction is installed in a photocurable fluid resin consisting of three elements (acetophenone-based, etc.), and the photocurable fluid resin is positioned so as to have a constant laminated thickness.

(4) Further, a laser beam, for example, an excimer laser (308 nm) having a wavelength range of ultraviolet rays, a HeCd laser (325 nm), an Ar laser (351 to 346 nm) is traced on the horizontal cross section of the target shape to scan light. The curable fluid resin is cured. (5) After that, the elevator is again positioned so as to have a constant laminated thickness, and the uncured photocurable fluid resin is flowed in. (6) Next, the above (4) and (5) are repeated until the three-dimensional structure having the target shape is completed. (7) Subsequently, the three-dimensional structure is taken out and the uncured photocurable fluid resin adhering to the surface is washed. (8) Finally, post exposure is performed.

The details of these stereolithography steps are shown in FIG.
~ (D). FIG. 3 is a modeling state diagram of optical molding by a regulated liquid surface method in which light is irradiated from the lower surface of the photocurable fluidized resin to perform modeling. First, each member in FIG. 3A will be described. Reference numeral 1 in the figure denotes a photocurable fluid resin tank. A part of the bottom of the tank 1 is opened, and a glass plate 2 that transmits light is provided in this opening. A table 3 is arranged on the glass plate 2. The ultraviolet laser beam 4 focused on the glass plate 2 is directed from the bottom to the top as shown by the arrow. The ultraviolet laser beam 4 is, for example, A having a wavelength of 330 to 364 nm.
An r laser or a HeCd laser with a wavelength of 325 nm is used.
Reference numeral 5 in the figure denotes a photocurable fluid resin, specifically, a photocurable fluid resin that is cured by, for example, X-rays, ultraviolet rays, or visible light, such as an oligomer (epoxy acrylate, urethane acrylate, etc.) reactive It consists of three elements: a diluent (monomer) and a photopolymerization initiator (benzoin-based, acetophenone-based, etc.). Further, 6 is a cured photocurable fluid resin.

That is, the table 3 is raised so that the table 3 and the glass plate 2 are spaced at a constant distance, and an ultraviolet laser beam 4 is irradiated to allow the glass plate 2 to pass therethrough to produce a cured photocurable fluid resin 6. (See FIG. 3A). Figure 3
FIG. 3B is a diagram in which the curing of the first layer of the photocurable fluid resin has been completed, and FIG. 3C is a diagram in which the irradiation of the laser beam is stopped in order to cure the photocurable fluid resin of the second layer, and the table 3 is used. FIG. 3D is a view in which the second layer of photocurable fluid resin is cured by the laser beam 4.
These procedures of FIGS. 3 (A) to 3 (D) are repeated to mold the structure while curing the photocurable fluid resin and stacking it.

The details of the stereolithography process by another method are shown in FIG. FIG. 4 is a figure of a stereolithography shaped body by the free liquid surface method in which light is irradiated from the upper surface of the photocurable fluidized resin, and is a method of curing by ultraviolet rays or the like from the upper surface direction. In this method, the table 3 descends at a constant interval to cure the photocurable fluid resin, and the structure is formed while being laminated. A three-dimensional structure is manufactured by the above process. By such a method, a three-dimensional structure can be manufactured without cutting.

However, regarding the stereolithography method, although a three-dimensional structure having a complicated shape can be manufactured at once in a continuous process, only a molding body made of a single resin material can be molded, so that it is relatively movable. When manufacturing a structure, it is necessary to form and assemble a plurality of parts. In particular, it has not reached the level of assembling parts of 1 mm or less as parts of micromachines. Furthermore, the stereolithography body is made only of resin material, and it cannot be processed with a material having excellent mechanical strength such as metal. . Further, a proposal regarding molding of a metal or ceramic structure to which an optical molding method is applied is disclosed in Japanese Laid-Open Patent Publication No.
Illustrated at 99203. This is the content described below.

In this step, as shown in the flow chart of FIG. 5, first, an inorganic powder material is mixed into a liquid photocurable liquid resin, and the mixture is kneaded, and then the resin is cured by irradiating light to cure the resin. Make it shaped. Next, the resin component in the resin molding is burned and removed. Further, the powder mixture molded body from which the resin component has been burned and removed is sintered at a high temperature to mold a structure made of metal or ceramic material, or a structure made of a mixed material of both. Further, a resin molded body having a predetermined shape is formed of a laminated body of powder mixed resin layers in which the composition ratio of metal and ceramic components is changed for each coating layer, and the resin molded body is heated in a high temperature atmosphere to form a resin component. Is burned away and the powder contained is sintered to form a functionally graded material in the desired shape. However, in this method, a structure formed of a resin material is simply changed to a ceramic material, and there is no proposal for a structure including a sacrificial layer or a temporary fixing portion that can relatively move a three-dimensional structure. It has not been.

As another processing method, there is semiconductor sacrifice layer etching as a method for processing a microstructure having a relatively movable portion (Masaki Esashi, Micromachine, Applied Physics, Vol. 60, No. 3 (1991). ), P. 230). This processing method is shown in FIG. First, on the Si substrate 11, SiO ₂
The film 12 and the polycrystalline Si layer 13 are sequentially formed (FIG. 6).
(A)). Next, heat treatment is performed to form a SiO ₂ film 14 around the polycrystalline Si layer 13, and then a part of the SiO ₂ film 12 is selectively removed by etching (FIG. 6B). Subsequently, after the polycrystalline Si layer 15 is formed on the entire surface, the polycrystalline Si layer 15 located on the polycrystalline Si layer 13 is selectively removed by etching (FIG. 6C). Further, the SiO ₂ film
12 and 14 are removed by etching, leaving only the polycrystalline Si layers 13 and 15 (FIG. 6D). Through such a series of steps, the polycrystalline Si layer 13 can rotate because it is not in direct contact with the Si substrate 11 and the polycrystalline Si layer 15. With such a technique, it has become possible to manufacture gears, electrostatic micromotors, etc. on a Si substrate.

However, regarding the above-mentioned semiconductor sacrifice layer etching method, (1) there is a physical limit such as strength because the material that can be processed is limited to the semiconductor material, and (2) because the aspect ratio is small, Since only a two-dimensional planar structure can be made, it is not suitable for a three-dimensional structure required for a micromachine.

That is, in the above-described conventional method for manufacturing a three-dimensional structure by stereolithography, there is a problem that it is not possible to manufacture a fine three-dimensional structure having a mechanism portion that can be relatively moved. It was

The present invention has been made in view of the above circumstances, solves the above problems, uses at least one of a stereolithography method and a sintering technique, and reduces removal of a sacrificial layer and removal of a temporary fixing portion. By using either one of the above, with polymer material, ceramic material, metal material,
It is an object of the present invention to provide a method for manufacturing a fine three-dimensional structure having a mechanism that can be moved relatively.

[0017]

SUMMARY OF THE INVENTION The present invention is a method of manufacturing a three-dimensional structure having a relatively movable portion, wherein a photocurable fluid resin that is cured by light is irradiated with light and a resin molding having a predetermined shape is formed. And a sacrificial layer curing step of irradiating a photocurable resin containing a sacrificial layer component or serving as a sacrificial layer component with light to cure the sacrificial layer into a predetermined shape, and a sacrifice for removing the sacrificial layer. A method for manufacturing a three-dimensional structure, comprising: a layer removing step.

[0018]

In the present invention, the following means are used to manufacture a three-dimensional structure having a mechanism that can be moved relative to a dense three-dimensional structure. 1) In a manufacturing method of forming a structure using a stereolithography method,
The structure is formed by molding the sacrificial layer with a photocurable liquid resin having a property different from that of the photocurable liquid resin which is the structure, or by forming a temporary fixing part with the photocurable liquid resin which is the structure. Either the step of shaping the object, and then removing the sacrificial layer or removing the temporary fixing portion, or both are used. It is to provide a method for manufacturing a fine three-dimensional structure having a mechanical section that can be moved manually.

[0019]

Embodiments of the present invention will now be described in detail with reference to the drawings. (Embodiment 1) An embodiment of a stereolithography apparatus that sculpts several kinds of photocurable fluid resins at arbitrary places to fabricate parts will be described with reference to FIGS. 7 and 8.

FIG. 7 shows an optical molding apparatus configuration in which different types of photocurable fluid resins are laminated at arbitrary positions while the photocurable fluid resins are dropped and laminated. Reference numeral 21 in the figure denotes a photocurable fluid resin tank (hereinafter referred to as a first tank) having an open bottom. A glass plate 22 that transmits light is provided at the bottom of the first tank 21, and an ultraviolet beam 23 is transmitted from the lower side to the upper side of the glass plate 22. In the first tank 21, a photocurable liquid resin 24
(Product name: photocurable resin 3042, made by ThreeBond) is stored. Near the first tank 21, a cleaning solution is provided inside.
A cleaning tank 26 containing 25 (for example, acetone or alcohol) is arranged. An ultrasonic generator 40 is arranged outside the bottom of the cleaning tank 26. A post-exposure tank 27 is arranged near the cleaning tank 26,
Further, a large number of ultraviolet light sources 28 for post-exposure are arranged on the inner wall of the post-exposure tank 27. A photocurable fluidized resin tank (hereinafter referred to as a second tank) 29 having an open bottom is arranged near the post-exposure tank 27. A glass plate 22 that transmits light is provided at the bottom of the second tank 29 as with the first tank 21, and an ultraviolet beam 23 is transmitted through the glass plate 22 from below to above. . In the second tank 29, a photocurable liquid resin
30 (trade name: photo-curing resin 3046, made by ThreeBond) is stored.

Above the first tank 21, a table 31 which is movable in the vertical and horizontal directions (XYZ directions) is arranged. A vertical actuator 32 for vertically moving the table 31 is connected to the table 31, and a horizontal actuator 33 for horizontally moving the table 31 is connected to the actuator 32. 34 in the figure
Is a cured photocurable fluid resin (Product name: photocurable resin 30
42, made by ThreeBond.

Next, a case will be described in which a three-dimensional structure having different material parts is manufactured by forming structures of different materials by using the optical modeling apparatus having the above structure. First, the photocurable resin 24 is cured by the photocurable resin 24 in the step of the regulated liquid level method shown in FIG. Then table 31
Is moved by the vertical actuator 32 and the horizontal actuator 33, and is put in the cleaning tank 26 for ultrasonic cleaning.
Subsequently, the table 31 is placed in the post-exposure tank 27, and the cured photocurable fluid resin 34 is completely cured by ultraviolet rays.
Depending on the type of resin, it may be heated by a heater to be cured. Next, the table 31 is put in the photo-curable flow resin 30, and the photo-curable flow resin is changed depending on the ultraviolet beam 23.
At 30, further additive manufacturing is performed. Here, when the size of the optical system for irradiating light is increased as the configuration of the device, not only the table 31 movable in the XYZ directions but also the first tank 2
1, cleaning tank 26, post-exposure tank 27 and second tank 2
By moving 9 in the XYZ directions, position control is performed to form a structure. By repeating these steps, it is possible to obtain an optical modeling apparatus that molds the photocurable fluid resins 24 and 30 at arbitrary places to manufacture a structure. Further, by installing a plurality of photocurable fluid resin tanks, it is possible to obtain an apparatus capable of molding several kinds of photocurable fluid resins at arbitrary locations.

The apparatus of FIG. 8 will be described as another apparatus configuration. Here, the same members as those in FIG. 7 are designated by the same reference numerals and the description thereof will be omitted. Reference numeral 41 in the figure denotes a beam irradiation device that is movable like the table 31 and that irradiates an ultraviolet beam on an arbitrary plane (or a beam irradiation device that is installed at a certain position and irradiates an ultraviolet beam on an arbitrary plane). Is.

The operation of the apparatus shown in FIG. 5 is performed as follows. That is, the photocurable liquid resin 24 is cured in the step of the free liquid surface method shown in FIG. Other steps are the same as those described with reference to FIG.
This is an optical modeling device that manufactures structures by molding 4 and 30 at any location. Further, by installing a plurality of photocurable fluid resin tanks, several kinds of photocurable fluid resins can be molded at arbitrary places.

Further, by combining FIG. 7 and FIG. 8, one apparatus is used to irradiate ultraviolet rays from the upper surface of the photocurable resin to form a model, and the free liquid surface method is used to irradiate ultraviolet rays from the lower surface of the photocurable resin. It is also possible to use a device that can perform the regulated liquid level method for modeling.

Examples in which a sacrificial layer is manufactured by using these devices will be described in Examples 2 to 4. (Embodiment 2) FIG. 9 shows a flow chart in the case of manufacturing a three-dimensional structure with a sacrificial layer, which is mainly composed of a polymer resin and has a mechanism part that can be relatively moved.

First, a photocurable fluid resin that is cured by light, for example, an oligomer (epoxy acrylate, urethane acrylate, etc.) reactive diluent (monomer), and a photopolymerization initiator (benzoin-based, acetone-based, etc.) are used. , A non-water-soluble trade name: photocurable resin 3042 manufactured by ThreeBond is used.

Next, in the stereolithography process to be carried out, a resin modeling process for curing the photocurable fluid resin as the material of the structure and an uncured resin adhering to the surface of the cured photocurable fluid resin are conducted. There is a cleaning step for cleaning. Next, a sacrifice layer forming step of forming a sacrifice layer, and a washing step of washing a photocurable fluid resin containing an uncured sacrifice layer component adhering to the surface of the cured sacrifice layer or becoming a sacrifice layer component. It consists of This process is repeated until the sacrifice layer is formed at a desired position. This resin modeling process is a three-dimensional curing process while the cured photocurable liquid resin is laminated by the free liquid level method described in FIG. The photocurable fluid resin is molded.

In the next cleaning step, the table is moved to the cleaning tank 21 of 31 as shown in FIG. 8 and ultrasonically cleaned together with the cured photocurable fluid resin 34 adhered and molded on the table 31. The photocurable fluid resin in the uncured portion is washed.
Depending on the resin conditions, the post-exposure tank 27 is then irradiated with ultraviolet rays to completely cure the resin. In the sacrifice layer forming step to be performed next, the table 31 is moved to the photocurable fluid resin tank 29 including the sacrifice layer components. The sacrifice layer components are three bond photocurable resins 3046, 3046B, 3046C, 3046.
Using a water-soluble type such as D or 3046E, a photocurable fluid resin composed of a sacrificial layer component is stereolithographically formed on the resin molded body by the process shown in FIG. Then, the cleaning tank 26 is moved to the cleaning tank 26 for cleaning. By repeating these resin molding and sacrifice layer molding steps, a resin molded body in which a sacrifice layer is molded at an arbitrary position of the cured photocurable fluid resin is molded.

In the next sacrifice layer removing step, a resin molding having a sacrifice layer formed at an arbitrary position is placed in water and ultrasonic vibration is applied to dissolve only the sacrifice layer component. Although the dissolution time depends on the shape, the sacrificial layer components were completely dissolved in 46 hours in the structure shown in FIG. 12 in which the rotating shaft having a diameter of 5 mm and the thickness of the sacrificial layer was 1 mm. In the next inspection step, the dimensions and movable parts are inspected to manufacture a relatively movable three-dimensional structure.

FIG. 11 is a sectional view of a structural example in which a relatively movable three-dimensional structure is manufactured by the sacrificial layer, and FIG.
The manufacturing process in the stereolithography process is shown in FIGS.
Is shown in. 10A to 10E show the manufacturing process sequence of the stereolithography process. In FIG. 10, 41 indicates a cured photocurable fluid resin, and 42 indicates a sacrifice layer. By such a process,
By processing the photocurable fluid resin that has been cured with the sacrificial layer component and removing the sacrificial layer in the sacrificial layer removal step,
1, it is possible to manufacture a rotating shaft mechanism that can be moved relatively as shown in FIG. In the next inspection step, the dimensions and movable parts are inspected to manufacture a relatively movable three-dimensional structure.

(Embodiment 3) In the case where a three-dimensional structure having a mechanism that can be relatively moved is manufactured from a sacrificial layer by using an inorganic powder material containing ceramic as a sintered structure. The flowchart is shown in FIG.

First, a photocurable fluid resin material and an inorganic powder material are prepared. The photocurable fluid resin is a photocurable fluid resin that is cured by light such as X-rays, ultraviolet rays, or visible light. For example, an oligomer (epoxy acrylate, urethane acrylate, etc.) reactive diluent (monomer), photopolymerization initiator ( A resin consisting of three elements (benzoin-based, acetophenone-based, etc.) is prepared. Further, powder processing was performed by a water atomizing method, a gas atomizing method, or the like as a means for converting the inorganic powder material into powder. In addition, as another method of processing powders and fibers, sol-gel in which metal alkoxides are hydrolyzed at room temperature to form a sol, and this reaction is allowed to proceed to gel and then fired at low temperature to obtain fibers or powders. There is a law. The material made into powder by these processing methods is SU
S316L, SUS304, FeCoV type (Fe49% .Co49
%. V2%), Cu-Sn alloy, Cu-Ni alloy, Si
O ₂ , TiO ₂ , ZrO ₂ , Al ₂ O ₃ , BaTiO ₃
Etc. In addition, soda glass, lead glass, Pyrex glass, epoxy type, polyethylene type, polypropylene type, alumina (Al ₂ O ₃ ), potassium titanate (K ₂
O.nTiO ₂ ), graphite, pyroxymethylene, etc. are used.

In the next kneading step, the photocurable fluid resin material is kneaded with one or several kinds of single or mixed inorganic powder materials by a pressure kneader, and then defoamed by a vacuum pump or the like to obtain a powder pair. A photocurable fluid resin is mixed to make a powder-mixed photocurable fluid resin. In the next stereolithography step, the powder-mixed resin molded product obtained by curing the powder-mixed photocurable fluid resin is produced in the same manner as the step described in Example 2. Next, the powder pair serving as the component of the sacrificial layer is formed by adding the photocurable fluid resin to the tungsten powder, which is not sintered even at a high temperature of 1200 ° C to 1400 ° C in the subsequent sintering process. After mixing, a sacrificial layer is formed by irradiating an ultraviolet beam with the photocurable fluidized resin in which the powder pair serving as the sacrificial layer component is mixed. After that, a washing step, a resin modeling step, and a washing step are performed to make a resin molded body including a sacrificial layer. In the next resin removing step, the resin component contained in the resin molded body is removed by heating at 300 to 500 ° C. for 10 to 100 hours. In the next sintering step, if the material of the powder pair to be sintered is Fe or Ni, 1
Sintering is performed at 100 to 1200 ° C. In the next sacrifice layer removing step, the unsintered tungsten powder is removed by an ultrasonic cleaner. In the next inspection step, the dimensions and movable parts are inspected to manufacture a relatively movable three-dimensional structure.

(Embodiment 4) In the case where a three-dimensional structure having a mechanism part which can be relatively moved is manufactured from a sacrificial layer by using an inorganic powder material containing ceramic as a sintered structure. The flowchart is shown in FIG.

This processing is carried out by using a material from which the photocurable fluid resin as the sacrificial layer component in the stereolithography process described in Example 3 is removed in the resin removal process, for example, a product name of ThreeBond: photocurable resin 3042. The sacrificial layer is processed and the stereolithography process is performed. The sacrificial layer is removed in the subsequent resin removing step and sintering step. In this case, FIG. 15 shows a method of fixing the resin molded body including the sacrificial layer in advance before heating at a high temperature so that the parts are not integrated with each other in the sintering step.

Reference numeral 51 in the figure denotes a positioning base mounted on the flat plate 52 and made of, for example, tungsten. On the flat plate 52 between the positioning bases 51, the powder-mixed resin molded body 53 is partially located on the positioning bases 51.
Is provided. A sacrificial layer 54 is embedded in a part of the powder mixed resin molded body 53. In addition, 55 in the figure is
A gap between the resin molded body 53 including the sacrificial layer 54 and the positioning base 51 is shown. After fixing in this way, high temperature heating is performed, and a resin removing step and a sintering step are performed to manufacture a relatively movable three-dimensional structure containing ceramic as a component.

(Embodiment 5) A flow chart in the case of manufacturing a three-dimensional structure having a mechanism part that can be relatively moved by a resin component by molding a temporary fixing part
Shown in 16.

First, the photocurable fluid resin is irradiated with ultraviolet light to form a three-dimensional structure having a temporary fixing portion in a stereolithography process for forming a fine three-dimensional structure. In the next washing step, the uncured portion of the photocurable fluid resin is washed. In the next temporary fixing portion removing step, stress is applied to the temporary fixing portion to remove it. In the next inspection process, we will inspect the dimensions and moving parts,
A relatively movable three-dimensional structure is manufactured.

Here, sectional views of the shape of the structure having the temporary fixing portion are shown in FIGS. 17 (A) and 17 (B). However, Figure 17
17A is a cross-sectional view of the entire structure, and FIG. 17B is FIG. 17A.
A partially enlarged view of FIG. In the figure, 61 is a structure having a temporary fixing portion 62, and 63 is a hinge portion. The temporary fixing portion 62 is
As shown in FIG. 17 (B), it has a "cut shape" so that it can be easily removed in a later step.

By removing the temporary fixing portion 62, a structural pair is formed which is relatively movable around the hinge portion 63. Further, a perspective view in which the temporary fixing portion 62 is removed is as shown in FIG. As shown in FIG. 18, a three-dimensional structure that is relatively movable can be manufactured by removing the temporary fixing portion of one component manufactured by stereolithography.

(Embodiment 6) A three-dimensional structure having an inorganic powder material containing ceramics, for example, SUS316L, having a mechanism portion that can be relatively moved is manufactured by forming a temporary fixing portion, FIG. 19 shows a flowchart for the case of using a sintered structure pair.

First, an inorganic powder material containing ceramic as a component and a photocurable fluid resin are mixed in a kneading step, stirred and defoamed to prepare a powder-mixed photocurable fluid resin. Next, the powder-mixed photo-curable resin is irradiated with ultraviolet light, and a three-dimensional structure having a temporary fixing portion is formed in a stereolithography process for forming a fine three-dimensional structure. This structure is similar to the structure of FIGS. 17 and 18 described in the sixth embodiment. In the next washing step, the uncured portion of the powder-mixed photocurable fluid resin is washed to obtain a powder-mixed resin molded body.

In the next resin removing step, the resin components contained in the powder-mixed resin molded product are burned and removed at 300 ° C to 500 ° C. Further, in the next sintering step, an inorganic powder material containing ceramic as a component is sintered at a temperature of 1300 ° C to 1440 ° C. In the next temporary fixing portion removing step, stress is applied to the temporary fixing portion to cut and remove the temporary fixing portion. For example, as a method of cutting and removing, by holding the upper portion and the lower portion of FIG. 17 respectively, and applying bending stress centering around the elbow portion 63, the temporary fixing portion 62 is cut from a portion having a cut shape. . Therefore, the upper part and the lower part are movable around the hinge portion 63. Since the cut portion has unevenness, the movement is not smooth, so as a method of reducing unevenness, the uneven portion is shaved and smoothed by repeating the fin portion many times.

As another method for reducing the unevenness of the cut portion, the temporary fixing portion of the three-dimensional structure is cut and then put into a solution to dissolve the uneven portion, thereby smoothing. For example, in the case where the material of the three-dimensional structure is SUS316L, dilute hydrochloric acid is used and immersed for 38 minutes to melt 35% of the uneven portion, so that the hinge portion can be moved smoothly. In the next inspection step, the dimensions and movable parts are inspected to manufacture a relatively movable pair of three-dimensional structures.

Further, as shown in FIGS. 20 (A) and 20 (B), two cut portions are formed in the temporary fixing portion 62, and the removing portion of FIG. Unevenness can be reduced.

[0047]

As described above, by forming the sacrificial layer or the temporary fixing portion in the structure by the stereolithography method of the present invention, the resin material or the ceramic which is relatively movable without assembling and joining the parts. Depending on the material, three-dimensional structure pairs can be manufactured. In particular, in the assembly of fine parts that require high positioning accuracy, it is possible to obtain an excellent structure with high accuracy.

[Brief description of drawings]

FIG. 1 is a flowchart showing a manufacturing process by MIM which is a conventional technique.

FIG. 2 is a flowchart of a specific method for forming a three-dimensional structure by a stereolithography method.

FIG. 3 is a stereolithography process chart by a regulated liquid level method.

FIG. 4 is a stereolithography process diagram by a free liquid surface method.

FIG. 5 is a proposed processing flowchart for manufacturing a ceramic structure by applying a stereolithography method.

FIG. 6 is a process cross-sectional view when a semiconductor sacrificial layer is processed by etching.

FIG. 7 is an explanatory view of a manufacturing apparatus for laminating different kinds of photocurable fluid resins by a regulated liquid level method at arbitrary places.

FIG. 8 is an explanatory view of a manufacturing apparatus for laminating different kinds of photocurable fluid resins by a free liquid surface method at arbitrary places.

FIG. 9 is a flowchart for manufacturing a relatively movable three-dimensional structure using a sacrificial layer.

FIG. 10 is a process cross-sectional view of forming a sacrificial layer.

11A and 11B show a rotating shaft mechanism that can be relatively moved, FIG. 11A being a sectional view, and FIG. 11B being a perspective view.

FIG. 12 is a flowchart for manufacturing a relatively movable three-dimensional structure using a sacrificial layer.

FIG. 13 is a flowchart for manufacturing a relatively movable three-dimensional structure using a sacrificial layer.

FIG. 14 is an explanatory diagram of a method for fixing a resin molded body in a resin removing step and a sintering step.

FIG. 15 is a flowchart for manufacturing a relatively movable three-dimensional structure by a temporary fixing unit.

16A and 16B are explanatory views of the shape of a structure having a temporary fixing portion, FIG. 16A is an overall view, and FIG. 16B is a partially enlarged view of FIG.

FIG. 17 is a perspective view of a structure from which a temporary fixing portion is removed.

FIG. 18 is a flowchart for manufacturing a relatively movable three-dimensional structure by the temporary fixing unit.

19A and 19B are explanatory views of a shape of a structure having a temporary fixing portion, FIG. 19A is an overall view, and FIG. 19B is a partially enlarged view of FIG.

FIG. 20 is a perspective view of the structure from which the temporary fixing portion is removed.

[Explanation of symbols]

21 ... First tank, 22 ... Glass plate,
23 ... UV beam, 24, 30 ... Photocurable fluid resin, 25 ...
Cleaning solution, 26 ... Cleaning tank, 27 ... Post-exposure tank, 28 ... Ultraviolet light source, 31 ... Table, 3
2, 33 ... Actuator, 34 ... Cured photocurable fluid resin, 40 ... Ultrasonic generator, 41 ... Beam irradiation device.

Claims (1)

[Claims] 1. A method for manufacturing a three-dimensional structure having a relatively movable portion, a resin molding step of irradiating a photocurable liquid resin that is cured by light with light to obtain a resin molded body having a predetermined shape, and a sacrifice. A sacrificial layer curing step of irradiating a photocurable resin containing a layer component or a sacrificial layer component with light to cure the sacrificial layer into a predetermined shape, and a sacrificial layer removing step of removing the sacrificial layer. And a method for manufacturing a three-dimensional structure characterized by the above.