JPH075971Y2 - Small polishing machine - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial field of application] The present invention relates to a small polishing machine for precisely polishing an end surface of a precision component.

[Prior Art] Since the conventional small-scale polishing machine α does not have a built-in mechanism for directly setting the polishing amount as shown in FIG. The amount of polishing is determined by setting and adjusting the time.

In the figure, 1 is a substrate, 2 is a polishing machine, 3 is a motor, 4 is a sample, 5 is a sample holder, 6 is an arm, 7 is a stopper, 8 is a holding plate, 9 is a spring, 10 is a hook, 11 is a column, 12 is a slide support cylinder.

In the conventional small polishing machine α, in order to accurately and directly control the polishing amount of precision parts, it is necessary to satisfy the following several conditions.

The amount of polishing at the same time should not change depending on the polishing material.

The amount of polishing at the same time should not change depending on the polishing area.

The amount of polishing at the same time should not change due to abrasion of the polishing sheet.

Therefore, in order to make the polishing amount constant with the conventional polishing machine,
The same material and same polishing area are polished in advance, and the relationship between the time and the polishing amount is clarified, and then the polishing time is determined. Further, after clarifying the relationship between the abrasion time of the polishing sheet and the polishing efficiency, the polishing sheet is exchanged by deciding the usage amount that does not cause a large variation in the polishing amount.

[Problems to be Solved by the Invention] When determining the polishing amount based on the present time adjustment, the polishing amount differs if the material and the polishing area are different. Further, since the abrasion speed of the polishing sheet also changes, the amount of polishing within a fixed time also changes. Therefore, it is impossible to make the polishing amount constant within a constant time.

Since the polishing speed of the optical connector end face in consideration of workability is high, a slight time deviation causes variations in the polishing amount.

Further, the variation in the polishing amount increases depending on the degree of wear of the polishing sheet.

Therefore, it is necessary to accurately grasp the replacement time of the polishing sheet.

Here, the present invention intends to provide a small-sized polishing machine in which the workability of the conventional polishing machine and the accuracy of the polishing amount of the object to be polished are significantly improved.

[Means for Solving the Problems] To solve the above problems, a small-sized polishing machine of the present invention attaches a quantitative polishing sensing electrode to an arm itself or a movable support part thereof that holds a sample that is set in contact with a polishing table, and the quantitative polishing is performed. A position adjuster equipped with a quantitative polishing sensing electrode facing the sensing electrode is provided, and when the sample reaches a set polishing amount, an electric signal generated by contact between the two quantitative polishing sensing electrodes automatically causes the polishing plate to move. This is achieved by adopting the above-mentioned constituent means having a mechanism for stopping the polishing operation.

[Operation] The present measure takes the above-mentioned means, judges the polishing amount in the polishing machine,
Since the mechanism for automatically stopping the polishing operation is incorporated or added, it has the following operation and many advantages.

Even if the polishing area and material are different, the polishing amount becomes constant.

 Even if the polishing speed is high, the amount of polishing is constant.

 Even if the polishing sheet wears, the polishing amount becomes constant.

Even if the abrasion of the polishing sheet varies, the polishing amount becomes constant.

It is not necessary to know the polishing amount of the polishing sheet and to replace the polishing sheet each time, and it is sufficient to replace the polishing sheet after the working time exceeds an arbitrarily determined working time.

Even if the polishing efficiency of the polishing sheet varies, the polishing amount can be kept constant, and the polishing sheet can be effectively used.

There are many advantages as described above.

In addition, the polishing machine with such a structure is a conventional polishing machine and power source,
Since the wiring, size and weight are almost the same, the place of use is not restricted as before.

[Embodiment] An embodiment of the present invention will be described with reference to the drawings.

FIGS. 1 to 4 show the present embodiment. FIG. 1 is a side view of a polishing machine when polishing is being carried out, FIG. 2 is a plan view of the polishing machine, and FIG. A polishing amount sensing circuit showing the operating principle, and FIG. 4 is a polishing procedure explaining the mechanism of quantitative polishing.

The small polishing machine β of the present invention is a conventional small polishing machine α shown in FIG. 5 equipped with a set polishing amount automatic detection mechanism γ. A position adjuster for mounting the quantitative polishing sensing board 15 on the lower surface of the quantitative polishing sensing upper electrode 14 which is hung vertically below the middle portion of the fixed arm 6 via an insulating backing plate 13 while being mounted at a fixed position on the upper surface of the substrate 1.
A quantitative polishing reference plate 18 is attached to the upper surface of the quantitative polishing sensing lower electrode 17 mounted on the upper end of the 16 so as to face the quantitative polishing sensing plate 15.

The same parts as those in FIG. 5 are designated by the same reference numerals. Next, the polishing amount detection circuit ε provided in this embodiment will be described with reference to FIG.

The polishing amount detection circuit ε is inserted between the DC power supply and the motor drive circuit, and has a pair of interlocking magnetic relays MS, a manual switch SW, a solid switch SSW1 such as a thyristor which is activated by turning on the manual switch SW, and a fixed amount. Polishing sensing upper electrode
The solid state switch SSW2 such as a thyristor stops the magnet relay MS by turning off the magnet relay MS to shut off the motor 3 by forming a contact closed circuit between the contact electrode 14 and the fixed polishing sensing lower electrode 17 to turn off the magnetic relay MS.

That is, first, since the magnet relay MS is always on, when the manual switch SW is turned on, the solid state switch SSW1 is turned on, power is supplied to the motor drive circuit, and the motor 3 is rotated to start the polishing operation.

Next, when the sample 4 reaches the specified polishing amount, the quantitative polishing sensing plate
When the 15 and the quantitative polishing reference plate 18 are in contact with each other and the “I” and the “R” are short-circuited, the solid switch SSW2 becomes conductive, a current flows through the magnet relay MS, and the closed contact is opened.

Then, since the closed contact of the magnet relay MS is opened, the conduction of the solid switch SSW1 is stopped, after that the power supply to the motor drive circuit is stopped, the rotation of the polishing platen 2 is stopped, and the polishing operation is completed.

As can be seen from the circuit ε in FIG. 3, when the conduction of the solid switch SSW1 is stopped, the conduction of the solid switch SSW2 is also stopped, and the closed contact of the magnetic relay MS returns from the OFF open state to the normal ON closed state.

The operation of this embodiment will be described.

The procedure for precision polishing the end face of the sample 4 to 50 μm for rough polishing, 10 μm for medium polishing, and 2 μm for final polishing is performed in the following steps.

i) The sample 4 is attached to the sample holder 5 and set in the state shown in FIG.

ii) The position adjuster 16 is operated to read the position X value at which the quantitative polishing reference plate 18 contacts the quantitative polishing sensing plate 15. (Set the reset function to 0.) iii) Operate the position adjuster 16 to set the Y value at which the quantitative polishing reference plate 18 becomes X-50 μm from the quantitative polishing sensing plate 15.
(Set to 50 μm for those with reset function) iv) Start rough polishing. When the sample 4 is polished by 50 μm, the quantitative polishing sensing plate 15 and the quantitative polishing reference plate 18 come into contact with each other and stop. (Set to 0 for the reset function) v) Operate the position adjuster 16 to set the Z value so that the quantitative polishing reference plate 18 becomes Y-10 μm from the quantitative polishing sensing plate 15. (Set to 10 μm for models with reset function) vi) Start medium polishing. When the sample 4 is polished by 10 μm, the quantitative polishing sensing plate 15 and the quantitative polishing reference plate 18 come into contact with each other and stop. (Set the reset function to 0.) vii) Operate the position adjuster 16 to set the quantitative polishing reference plate 18 to a value of Z-2 μm by the quantitative polishing sensing plate 15.
(Set to 2 μm for the reset function) viii) Start the final polishing. When the sample 4 is polished by 2 μm, the quantitative polishing sensing plate 15 and the quantitative polishing reference plate 18 come into contact with each other and stop.

This completes the intended polishing. If a micrometer with a reset function is used as the position adjuster 16 as shown in (), the polishing amount can be set easily.

In general, the same shape is ground to the same length according to the same procedure.

Furthermore, the procedure in the other embodiment of the present invention is executed in the following steps.

i) The position adjuster 16 ′ having no micrometer function is
Since it is fixed, the vertical polishing sensing lower electrode 17 stops moving up and down.

ii) (A) diagram shows a state in which the sample 4 is attached to the sample holder 5. The distance L between the quantitative polishing sensing plate 15 and the quantitative polishing reference plate 18 'varies depending on the sample 4.

iii) In FIG. 7B, the sample 4 is polished by L and stops in contact with the quantitative polishing reference plate 18 '.

iv) In the figure (C), after the quantitative polishing reference plate 18 'is replaced by -1 less, the sample 4 is polished by -1 and stops in contact with the quantitative polishing reference plate 18'.

v) (D) shows that after the quantitative polishing reference plate 18 'is replaced by one less by -1, the sample 4 is further polished by -1 and stops in contact with the quantitative polishing reference plate 18'.

With the above, polishing is completed. By doing this, the position adjuster 1
The 6'operation can be omitted and the polishing work can be shortened. If the polishing operation is standardized, the position adjuster 16 'may be a pedestal having a specified size.

According to the present invention, the same effect can be obtained even if a mechanism having the same function as the set polishing amount automatic detection mechanism γ is set around the column 11 and the lower portion.

Further, by adding a set polishing amount automatic detection mechanism γ to the conventional time control type polishing machine, both advantages can be easily used properly.

[Advantage of the Invention] Thus, in the present invention, since the polishing machine is provided with a mechanism capable of automatically determining the set polishing amount, variations in the polishing amount are significantly reduced even for objects to be polished having different polishing rates. for that reason,
The efficiency of polishing work for parts that require precise polishing accuracy has been greatly improved.

In addition, since it has the functions, weight and size of a conventional polishing machine, the work place remains the same and the functionality is enhanced and the range of use is expanded.

[Brief description of drawings]

1 and 2 are a side view and a plan view showing an embodiment of the present invention, FIG. 3 is a circuit diagram of a polishing amount sensing circuit mounted on the same, and FIGS. 4 (A) (B) (C) (D). Is an explanatory view showing each stage of the work progress procedure of another embodiment of the present invention, and FIG. 5 is a side view showing a conventional machine. α, β …… Small polishing machine, γ …… Set polishing amount automatic detection mechanism ε …… S polishing amount sensing circuit, 1… Substrate 2 …… Grinding board, 3 …… Motor 4 …… Sample, 5 …… Sample holder 6 ... Arm, 7 ... Clasp 8 ... Presser plate, 9 ... Spring 10 ... Hook, 11 ... Strut 12 ... Slide support cylinder, 13 ... Insulating plate 14 ... Quantitative polishing sensing upper electrode 15 …… Quantitative polishing sensing panel, 16,16 ′ …… Position adjuster 17 …… Quantitative polishing sensing lower electrode 18,18 ′ …… Quantitative polishing reference panel MS …… Magnet relay SW …… Manual switch SSW1, SSW2 …… Solid switch

Claims (1)

[Scope of utility model registration request] 1. Quantitative polishing on an appropriate lower surface of a cantilever type arm itself, which holds a sample set in contact with an upward polishing machine on the lower end of the tip and has a base end which is non-rotatable and vertically movable and displaceable. A position controller with a fixed quantitative polishing sensing lower electrode that is mounted on the upper surface of the quantitative polishing sensing upper electrode that overlaps the plate and that faces the quantitative polishing sensing upper electrode and that has a quantitative polishing reference plate that is polymerized on the upper surface is installed. When the sample reaches the set polishing amount, the polishing operation by the polishing platen is automatically stopped by the electric signal generated by the contact between the quantitative polishing platen and the both quantitative polishing sensing upper and lower electrodes via the quantitative reference platen. A small polisher equipped with a mechanism.