JPH075971Y2 - Small polishing machine - Google Patents
Small polishing machineInfo
- Publication number
- JPH075971Y2 JPH075971Y2 JP1990019431U JP1943190U JPH075971Y2 JP H075971 Y2 JPH075971 Y2 JP H075971Y2 JP 1990019431 U JP1990019431 U JP 1990019431U JP 1943190 U JP1943190 U JP 1943190U JP H075971 Y2 JPH075971 Y2 JP H075971Y2
- Authority
- JP
- Japan
- Prior art keywords
- polishing
- quantitative
- sensing
- amount
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
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- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
Description
【考案の詳細な説明】 [産業の利用分野] 本案は、精密部品の端面を精密に研磨する小型研磨機に
関するものである。DETAILED DESCRIPTION OF THE INVENTION [Industrial field of application] The present invention relates to a small polishing machine for precisely polishing an end surface of a precision component.
[従来の技術] 従来の小型研磨機αは、第5図に示すよう研磨量を直接
設定し、任意の研磨に達したら研磨動作を停止する機構
を内蔵していないため、任意の研磨時間を設定して、そ
の時間を調整することで研磨量を決定している。[Prior Art] Since the conventional small-scale polishing machine α does not have a built-in mechanism for directly setting the polishing amount as shown in FIG. The amount of polishing is determined by setting and adjusting the time.
図中1は基体,2は研磨盤,3はモータ,4は試料,5は試料ホ
ルダ,6はアーム,7は止め金,8は押え板,9はバネ,10はホ
ック,11は支柱,12はスライド支持筒である。In the figure, 1 is a substrate, 2 is a polishing machine, 3 is a motor, 4 is a sample, 5 is a sample holder, 6 is an arm, 7 is a stopper, 8 is a holding plate, 9 is a spring, 10 is a hook, 11 is a column, 12 is a slide support cylinder.
従来の小型研磨機αにおいて、精密部品の研磨量を正確
に直接制御するためには、次に示すいくつかの条件を満
足することが必要である。In the conventional small polishing machine α, in order to accurately and directly control the polishing amount of precision parts, it is necessary to satisfy the following several conditions.
同一時間での研磨量は、研磨材質によって変化しな
いこと。The amount of polishing at the same time should not change depending on the polishing material.
同一時間での研磨量は、研磨面積によって変化しな
いこと。The amount of polishing at the same time should not change depending on the polishing area.
同一時間での研磨量は、研磨シートの摩耗による変
化がないこと。The amount of polishing at the same time should not change due to abrasion of the polishing sheet.
そこで、従来の研磨機で研磨量を一定にするためには、
予め材質及び研磨面積の同じものを研磨して、時間と研
磨量の関係を明らかにしてから研磨時間を決定してい
る。また、研磨シートの摩耗時間と研磨効率の関係を明
確にしてから、研磨量に余りバラツキが生じない使用量
を決めて研磨シートの交換を行っている。Therefore, in order to make the polishing amount constant with the conventional polishing machine,
The same material and same polishing area are polished in advance, and the relationship between the time and the polishing amount is clarified, and then the polishing time is determined. Further, after clarifying the relationship between the abrasion time of the polishing sheet and the polishing efficiency, the polishing sheet is exchanged by deciding the usage amount that does not cause a large variation in the polishing amount.
[考案が解決しようとする課題] 現在の時間調整に依る研磨量の決定を行う場合は、材質
及び研磨面積が異なれば研磨量も異なる。また、研磨シ
ートの摩耗スピードも変化するため、一定時間内での研
磨量も変化する。そのため、一定時間内の研磨量を一定
にすることは、不可能である。[Problems to be Solved by the Invention] When determining the polishing amount based on the present time adjustment, the polishing amount differs if the material and the polishing area are different. Further, since the abrasion speed of the polishing sheet also changes, the amount of polishing within a fixed time also changes. Therefore, it is impossible to make the polishing amount constant within a constant time.
作業性を考慮した光コネクタ端面は、研磨スピードが速
いため、僅かな時間的なずれが研磨量のバラツキを起こ
すことになる。Since the polishing speed of the optical connector end face in consideration of workability is high, a slight time deviation causes variations in the polishing amount.
また、研磨シートの摩耗程度により研磨量のバラツキが
大きくなる。Further, the variation in the polishing amount increases depending on the degree of wear of the polishing sheet.
そのため、研磨シートの交換時間を正確に把握しなけれ
ばならなくなる。Therefore, it is necessary to accurately grasp the replacement time of the polishing sheet.
ここにおいて、本案は、従来の研磨機の作業性、被研磨
物の研磨量の精度を大幅に改善した小型研磨機を提供せ
んとするものである。Here, the present invention intends to provide a small-sized polishing machine in which the workability of the conventional polishing machine and the accuracy of the polishing amount of the object to be polished are significantly improved.
[課題を解決するための手段] 前記課題の解決は、本案の小型研磨機が、研磨盤に接触
セットした試料を保持するアーム自体又はその可動支持
部に定量研磨感知電極を取付け、当該定量研磨感知電極
に対臨した定量研磨感知電極を取付けた位置調整器を設
け、前記試料が設定研磨量に達したら、前記両定量研磨
感知電極の接触で発生する電気信号で自動的に前記研磨
盤による研磨動作を停止させる機構を備えた、以上の構
成手段を採用することにより達成される。[Means for Solving the Problems] To solve the above problems, a small-sized polishing machine of the present invention attaches a quantitative polishing sensing electrode to an arm itself or a movable support part thereof that holds a sample that is set in contact with a polishing table, and the quantitative polishing is performed. A position adjuster equipped with a quantitative polishing sensing electrode facing the sensing electrode is provided, and when the sample reaches a set polishing amount, an electric signal generated by contact between the two quantitative polishing sensing electrodes automatically causes the polishing plate to move. This is achieved by adopting the above-mentioned constituent means having a mechanism for stopping the polishing operation.
[作用] 本案は前記手段を講じ、研磨機に、研磨量を判定して、
自動的に研磨動作を停止させる機構を内蔵または付加し
たものであるから、次に示す作用と多くの利点を有す
る。[Operation] The present measure takes the above-mentioned means, judges the polishing amount in the polishing machine,
Since the mechanism for automatically stopping the polishing operation is incorporated or added, it has the following operation and many advantages.
研磨面積及び材質が異なっても研磨量が一定にな
る。Even if the polishing area and material are different, the polishing amount becomes constant.
研磨スピードが速くても研磨量が一定になる。 Even if the polishing speed is high, the amount of polishing is constant.
研磨シートが摩耗しても研磨量が一定になる。 Even if the polishing sheet wears, the polishing amount becomes constant.
研磨シートの摩耗にバラツキが生じても研磨量が一
定になる。Even if the abrasion of the polishing sheet varies, the polishing amount becomes constant.
研磨シートの研磨使用量を把握して、その都度研磨
シートの交換を行う必要がなく、任意に決めた作業時間
を越える様になってから交換すれば良い。It is not necessary to know the polishing amount of the polishing sheet and to replace the polishing sheet each time, and it is sufficient to replace the polishing sheet after the working time exceeds an arbitrarily determined working time.
研磨シートの研磨効率の程度にバラツキが生じても
研磨量を一定にすることが可能であり、研磨シートの有
効利用を実現する。Even if the polishing efficiency of the polishing sheet varies, the polishing amount can be kept constant, and the polishing sheet can be effectively used.
以上説明した様な作用と多くの利点がある。There are many advantages as described above.
また、この様な構造の研磨機は、従来の研磨機と電源,
配線,大きさ及び重量が殆んど変わらないため、使用場
所は従来同様に制限されない。In addition, the polishing machine with such a structure is a conventional polishing machine and power source,
Since the wiring, size and weight are almost the same, the place of use is not restricted as before.
[実施例] 本案の実施例を図面について説明する。[Embodiment] An embodiment of the present invention will be described with reference to the drawings.
第1図乃至第4図は、本実施例を示すもので、第1図は
研磨を実施している時の研磨機側面図、第2図は研磨機
平面図、第3図は定量研磨の動作原理を示した研磨量感
知回路、第4図は定量研磨の仕組みを説明した研磨手順
である。FIGS. 1 to 4 show the present embodiment. FIG. 1 is a side view of a polishing machine when polishing is being carried out, FIG. 2 is a plan view of the polishing machine, and FIG. A polishing amount sensing circuit showing the operating principle, and FIG. 4 is a polishing procedure explaining the mechanism of quantitative polishing.
本案の小型研磨機βは、第5図に示す従来の小型研磨機
αに設定研磨量自動検出機構γを装備するにあたり、支
柱11に外挿したスライド支持筒12に基端部を片持支持さ
れたアーム6の中間部下側に絶縁控板13を介して垂設す
る定量研磨感知上電極14の下面に定量研磨感知盤15を取
付ける一方、基体1の上面定位置に載設する位置調整器
16の上端に装設した定量研磨感知下電極17の上面に定量
研磨感知盤15に対向臨ませて定量研磨基準盤18を取付け
てなる。The small polishing machine β of the present invention is a conventional small polishing machine α shown in FIG. 5 equipped with a set polishing amount automatic detection mechanism γ. A position adjuster for mounting the quantitative polishing sensing board 15 on the lower surface of the quantitative polishing sensing upper electrode 14 which is hung vertically below the middle portion of the fixed arm 6 via an insulating backing plate 13 while being mounted at a fixed position on the upper surface of the substrate 1.
A quantitative polishing reference plate 18 is attached to the upper surface of the quantitative polishing sensing lower electrode 17 mounted on the upper end of the 16 so as to face the quantitative polishing sensing plate 15.
なお、第5図と同一部分には同一符号を付した。次に本
実施例に備わる研磨量感知回路εについて第3図につき
説明する。The same parts as those in FIG. 5 are designated by the same reference numerals. Next, the polishing amount detection circuit ε provided in this embodiment will be described with reference to FIG.
研磨量感知回路εは直流電源とモータ駆動回路間に挿入
され、一対の連動型マグネットリレイMSと、手動スイッ
チSWと、当該手動スイッチSWのONにより作動導通するサ
イリスタ等の固体スイッチSSW1と、定量研磨感知上電極
14と定量研磨感知下電極17との接触閉回路形成により作
動導通しマグネットリレイMSをOFFし直流電源とモータ
駆動回路を遮断してモータ3を停止するサイリスタ等の
固体スイッチSSW2とからなる。The polishing amount detection circuit ε is inserted between the DC power supply and the motor drive circuit, and has a pair of interlocking magnetic relays MS, a manual switch SW, a solid switch SSW1 such as a thyristor which is activated by turning on the manual switch SW, and a fixed amount. Polishing sensing upper electrode
The solid state switch SSW2 such as a thyristor stops the magnet relay MS by turning off the magnet relay MS to shut off the motor 3 by forming a contact closed circuit between the contact electrode 14 and the fixed polishing sensing lower electrode 17 to turn off the magnetic relay MS.
即ちまずマグネットリレイMSは常時ONであるため手動ス
イッチSWをONすると固体スイッチSSW1が導通して、モー
タ駆動回路に電力を供給しモータ3を回転することによ
り研磨作業が開始する。That is, first, since the magnet relay MS is always on, when the manual switch SW is turned on, the solid state switch SSW1 is turned on, power is supplied to the motor drive circuit, and the motor 3 is rotated to start the polishing operation.
次いで試料4が規定の研磨量に達すると定量研磨感知盤
15と定量研磨基準盤18が接して“い”と“ろ”がショー
トすると固体スイッチSSW2が導通して、マグネットリレ
イMSに電流が流れ、閉接点が開成される。Next, when the sample 4 reaches the specified polishing amount, the quantitative polishing sensing plate
When the 15 and the quantitative polishing reference plate 18 are in contact with each other and the “I” and the “R” are short-circuited, the solid switch SSW2 becomes conductive, a current flows through the magnet relay MS, and the closed contact is opened.
そして、マグネットリレイMSの閉接点が開成されたため
固体スイッチSSW1の導通が停止し、その後モータ駆動回
路への電力供給が止まり研磨盤2の回転が停止して研磨
作業が終了する。Then, since the closed contact of the magnet relay MS is opened, the conduction of the solid switch SSW1 is stopped, after that the power supply to the motor drive circuit is stopped, the rotation of the polishing platen 2 is stopped, and the polishing operation is completed.
なお第3図の回路εから判るように固体スイッチSSW1の
導通が停止すると固体スイッチSSW2の導通も止まり、マ
グネットリレイMSの閉接点がOFF開成から常時ON閉成の
原状に戻る。As can be seen from the circuit ε in FIG. 3, when the conduction of the solid switch SSW1 is stopped, the conduction of the solid switch SSW2 is also stopped, and the closed contact of the magnetic relay MS returns from the OFF open state to the normal ON closed state.
しかして、本実施例の動作を説明する。The operation of this embodiment will be described.
試料4の端面を荒研磨50μm、中研磨10μm、仕上げ研
磨2μmに精密研磨する場合の手順は次の各段階を踏ん
で実行される。The procedure for precision polishing the end face of the sample 4 to 50 μm for rough polishing, 10 μm for medium polishing, and 2 μm for final polishing is performed in the following steps.
i)試料4を試料ホルダー5に取付て第1図の状態にセ
ットする。i) The sample 4 is attached to the sample holder 5 and set in the state shown in FIG.
ii)位置調整器16を操作して定量研磨基準盤18が定量研
磨感知盤15に接する位置X値をよむ。(リセット機能付
きは、0にセットする) iii)位置調整器16を操作して、定量研磨基準盤18が定
量研磨感知盤15よりX-50μmになるY値に設定する。
(リセット機能付きは、50μmにセットする) iv)荒研磨を開始する。試料4が50μm研磨されると定
量研磨感知盤15と定量研磨基準盤18が接して、停止す
る。(リセット機能付きは、0にセットする) v)位置調整器16を操作して、定量研磨基準盤18が定量
研磨感知盤15よりY-10μmになるZ値に設定する。(リ
セット機能付きは、10μmにセットする) vi)中研磨を開始する。試料4が10μm研磨されると定
量研磨感知盤15と定量研磨基準盤18が接して、停止す
る。(リセット機能付きは、0にセットする) vii)位置調整器16を操作して、定量研磨基準盤18が定
量研磨感知盤15によりZ−2μmになる値に設定する。
(リセット機能付きは、2μmにセットする) viii)仕上げ研磨を開始する。試料4が2μm研磨され
ると定量研磨感知盤15と定量研磨基準盤18が接して、停
止する。ii) The position adjuster 16 is operated to read the position X value at which the quantitative polishing reference plate 18 contacts the quantitative polishing sensing plate 15. (Set the reset function to 0.) iii) Operate the position adjuster 16 to set the Y value at which the quantitative polishing reference plate 18 becomes X-50 μm from the quantitative polishing sensing plate 15.
(Set to 50 μm for those with reset function) iv) Start rough polishing. When the sample 4 is polished by 50 μm, the quantitative polishing sensing plate 15 and the quantitative polishing reference plate 18 come into contact with each other and stop. (Set to 0 for the reset function) v) Operate the position adjuster 16 to set the Z value so that the quantitative polishing reference plate 18 becomes Y-10 μm from the quantitative polishing sensing plate 15. (Set to 10 μm for models with reset function) vi) Start medium polishing. When the sample 4 is polished by 10 μm, the quantitative polishing sensing plate 15 and the quantitative polishing reference plate 18 come into contact with each other and stop. (Set the reset function to 0.) vii) Operate the position adjuster 16 to set the quantitative polishing reference plate 18 to a value of Z-2 μm by the quantitative polishing sensing plate 15.
(Set to 2 μm for the reset function) viii) Start the final polishing. When the sample 4 is polished by 2 μm, the quantitative polishing sensing plate 15 and the quantitative polishing reference plate 18 come into contact with each other and stop.
以上で目的の研磨が終了する。( )内で示す様にリセ
ット機能付きマイクロメータを位置調整器16として、使
用すれば研磨量の設定が簡単にできる。This completes the intended polishing. If a micrometer with a reset function is used as the position adjuster 16 as shown in (), the polishing amount can be set easily.
一般には、ほぼ同一形状のものを同一手順に従って同じ
長さのものに研磨されている。In general, the same shape is ground to the same length according to the same procedure.
さらに本案の他の実施例における手順は、次の各段階を
踏んで実行される。Furthermore, the procedure in the other embodiment of the present invention is executed in the following steps.
i)マイクロメータ機能を有しない位置調整器16′は、
固定されているため定量研磨感知下電極17は上下の動作
が停止する。i) The position adjuster 16 ′ having no micrometer function is
Since it is fixed, the vertical polishing sensing lower electrode 17 stops moving up and down.
ii)(A)図は、試料ホルダ5に試料4を取り付けた状
態を示した。定量研磨感知盤15と定量研磨基準盤18′の
間隔Lは、試料4によってバラツキが生ずる。ii) (A) diagram shows a state in which the sample 4 is attached to the sample holder 5. The distance L between the quantitative polishing sensing plate 15 and the quantitative polishing reference plate 18 'varies depending on the sample 4.
iii)(B)図は、試料4がLだけ研磨されて定量研磨
基準盤18′に接して停止する。iii) In FIG. 7B, the sample 4 is polished by L and stops in contact with the quantitative polishing reference plate 18 '.
iv)(C)図は、定量研磨基準盤18′を−1少ないもの
に替えた後、試料4が−1だけ研磨されて定量研磨基準
盤18′に接して停止する。iv) In the figure (C), after the quantitative polishing reference plate 18 'is replaced by -1 less, the sample 4 is polished by -1 and stops in contact with the quantitative polishing reference plate 18'.
v)(D)図は、定量研磨基準盤18′を更に−1少ない
ものに替えた後、試料4が更に−1だけ研磨されて定量
研磨基準盤18′に接して停止する。v) (D) shows that after the quantitative polishing reference plate 18 'is replaced by one less by -1, the sample 4 is further polished by -1 and stops in contact with the quantitative polishing reference plate 18'.
以上で研磨が終了する。この様にすれば、位置調整器1
6′の操作が省けて、研磨作業が短縮される。また、研
磨作業が規格化されれば、位置調整器16′は規定の寸法
を持った台座で十分である。With the above, polishing is completed. By doing this, the position adjuster 1
The 6'operation can be omitted and the polishing work can be shortened. If the polishing operation is standardized, the position adjuster 16 'may be a pedestal having a specified size.
本案は、設定研磨量自動検出機構γと同様な働きをする
機構を支柱11及び下部周辺に設定しても同様の効果があ
る。According to the present invention, the same effect can be obtained even if a mechanism having the same function as the set polishing amount automatic detection mechanism γ is set around the column 11 and the lower portion.
また、従来の時間制御形研磨機に設定研磨量自動検出機
構γを付加すれば、両方の利点を容易に使い分けること
もできる。Further, by adding a set polishing amount automatic detection mechanism γ to the conventional time control type polishing machine, both advantages can be easily used properly.
[考案の効果] かくして本案は、研磨機に設定研磨量を自動的に判定で
きる機構を付加したため、研磨速度の異なる被研磨物で
も研磨量のバラツキが非常に少なくなった。そのため、
精密な研磨精度を必要とする部品の研磨作業の効率が大
幅に向上した。[Advantage of the Invention] Thus, in the present invention, since the polishing machine is provided with a mechanism capable of automatically determining the set polishing amount, variations in the polishing amount are significantly reduced even for objects to be polished having different polishing rates. for that reason,
The efficiency of polishing work for parts that require precise polishing accuracy has been greatly improved.
また、従来の研磨機の機能,重量,大きさが備わってい
るため、作業できる場所は変わらず、高機能化されて使
用範囲が拡大された。In addition, since it has the functions, weight and size of a conventional polishing machine, the work place remains the same and the functionality is enhanced and the range of use is expanded.
第1図乃至第2図は本案の実施例を示す側面図,および
平面図、第3図は同上に装備する研磨量感知回路図、第
4図(A)(B)(C)(D)は本案の他の実施例の作
業進捗手順の各段階をそれぞれ示す説明図、第5図は従
来機を示す側面図である。 α,β……小型研磨機、γ……設定研磨量自動検出機構 ε……研磨量感知回路、1……基体 2……研磨盤、3……モータ 4……試料、5……試料ホルダ 6……アーム、7……止め金 8……押え板、9……バネ 10……ホック、11……支柱 12……スライド支持筒、13……絶縁控板 14……定量研磨感知上電極 15……定量研磨感知盤、16,16′……位置調整器 17……定量研磨感知下電極 18,18′……定量研磨基準盤 MS……マグネットリレイ SW……手動スイッチ SSW1,SSW2……固体スイッチ1 and 2 are a side view and a plan view showing an embodiment of the present invention, FIG. 3 is a circuit diagram of a polishing amount sensing circuit mounted on the same, and FIGS. 4 (A) (B) (C) (D). Is an explanatory view showing each stage of the work progress procedure of another embodiment of the present invention, and FIG. 5 is a side view showing a conventional machine. α, β …… Small polishing machine, γ …… Set polishing amount automatic detection mechanism ε …… S polishing amount sensing circuit, 1… Substrate 2 …… Grinding board, 3 …… Motor 4 …… Sample, 5 …… Sample holder 6 ... Arm, 7 ... Clasp 8 ... Presser plate, 9 ... Spring 10 ... Hook, 11 ... Strut 12 ... Slide support cylinder, 13 ... Insulating plate 14 ... Quantitative polishing sensing upper electrode 15 …… Quantitative polishing sensing panel, 16,16 ′ …… Position adjuster 17 …… Quantitative polishing sensing lower electrode 18,18 ′ …… Quantitative polishing reference panel MS …… Magnet relay SW …… Manual switch SSW1, SSW2 …… Solid switch
Claims (1)
側に保持するとともに基端部を旋回不能かつ上下可動変
位自在に支柱に取付けた片持梁型アーム自体の適宜下面
に定量研磨盤を重合した定量研磨感知上電極を下向に取
付け、当該定量研磨感知上電極に対臨しかつ上面に定量
研磨基準盤を重合した定量研磨感知下電極を上向に取付
けた位置調節器を設け、前記試料が設定研磨量に達した
ら、前記定量研磨盤と前記定量基準盤を介する前記両定
量研磨感知上下電極の接触で発生する電気信号で自動的
に前記研磨盤による研磨動作を停止させる機構を備えた
小型研磨機。1. Quantitative polishing on an appropriate lower surface of a cantilever type arm itself, which holds a sample set in contact with an upward polishing machine on the lower end of the tip and has a base end which is non-rotatable and vertically movable and displaceable. A position controller with a fixed quantitative polishing sensing lower electrode that is mounted on the upper surface of the quantitative polishing sensing upper electrode that overlaps the plate and that faces the quantitative polishing sensing upper electrode and that has a quantitative polishing reference plate that is polymerized on the upper surface is installed. When the sample reaches the set polishing amount, the polishing operation by the polishing platen is automatically stopped by the electric signal generated by the contact between the quantitative polishing platen and the both quantitative polishing sensing upper and lower electrodes via the quantitative reference platen. A small polisher equipped with a mechanism.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1990019431U JPH075971Y2 (en) | 1990-03-01 | 1990-03-01 | Small polishing machine |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1990019431U JPH075971Y2 (en) | 1990-03-01 | 1990-03-01 | Small polishing machine |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH03113747U JPH03113747U (en) | 1991-11-21 |
JPH075971Y2 true JPH075971Y2 (en) | 1995-02-15 |
Family
ID=31522552
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1990019431U Expired - Lifetime JPH075971Y2 (en) | 1990-03-01 | 1990-03-01 | Small polishing machine |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH075971Y2 (en) |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61100355A (en) * | 1984-10-23 | 1986-05-19 | Seiko Instr & Electronics Ltd | Optical connector end-face polisher |
JPS63221973A (en) * | 1987-01-28 | 1988-09-14 | Matsushita Electric Ind Co Ltd | Polishing machine |
-
1990
- 1990-03-01 JP JP1990019431U patent/JPH075971Y2/en not_active Expired - Lifetime
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61100355A (en) * | 1984-10-23 | 1986-05-19 | Seiko Instr & Electronics Ltd | Optical connector end-face polisher |
JPS63221973A (en) * | 1987-01-28 | 1988-09-14 | Matsushita Electric Ind Co Ltd | Polishing machine |
Also Published As
Publication number | Publication date |
---|---|
JPH03113747U (en) | 1991-11-21 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
EXPY | Cancellation because of completion of term |