JPH0758839B2 - Electronic component insertion head - Google Patents

Description

Description: TECHNICAL FIELD The present invention relates to an electronic component insertion head for automatically inserting an electronic component into a substrate.

(Prior Art) Conventionally, the lead of an electronic component is clamped by an insertion guide and the lead is guided to the printed circuit board side and the mounting hole while the push rod pushes down the electronic component from above to insert the electronic component into the mounting hole. The electronic component insertion mechanism to be implemented is known from Japanese Patent Publication No. 55-51358.

(Problems to be Solved by the Invention) By the way, in the electronic component insertion head used in the conventional electronic component insertion mechanism, the return operation of the insertion guide to the raised position after inserting the electronic component into the printed circuit board is The lower end always draws a fixed trajectory and returns to the ascending position. Therefore, with an insertion guide suitable for inserting electronic components such as ceramic capacitors that are relatively thin, even if an electronic component with a large diameter such as an electrolytic capacitor is to be inserted, the insertion guide may not be able to return when the insertion guide is restored. Electronic components with a large diameter get in the way, and the return operation cannot be performed.

On the other hand, if a relatively thin electronic component such as a ceramic capacitor is inserted with an insertion guide that is suitable for inserting an electronic component with a large diameter such as an electrolytic capacitor, it may cause a clearance when the insertion guide returns after insertion. Becomes unnecessarily large, and it becomes impossible to increase the mounting density for inserting electronic components on the substrate.

(Means for Solving Problems) In view of the above points, the present invention changes the trajectory of the return movement of the insertion guide to the raised position according to the thickness (diameter) of the electronic component by selection by a preset program. It is an object of the present invention to provide an electronic component insertion head capable of automatically inserting electronic components having a small diameter to a large diameter into a substrate without changing an insertion guide or the like.

The present invention provides a support block, a fulcrum shaft positioned at a first position or a second position with respect to the support block, and one end attached to the fulcrum shaft with the fulcrum shaft as a rotation center. 1 arm, a second arm whose one end is pivotally supported by the support block, and an insertion guide in which the other ends of the first and second arms are pivotally mounted respectively, and the position of the fulcrum shaft with respect to the support block Is changed from the first position to the second position so that the ascending locus of the insertion guide tip can be changed, and the problem of the conventional technique is solved by such a configuration.

(Operation) In the electronic component insertion head of the present invention, the position of the fulcrum shaft of the first arm of the first and second arms constituting the link for attaching the insertion guide to the support block is set to the small diameter electronic component. Or small-diameter electronic parts.For small-diameter electronic parts, reduce the clearance when returning to the raised position of the insertion guide after inserting the electronic parts into the printed circuit board. , The clearance of the insertion guide is enlarged to restore it. Therefore, it is possible to automatically insert electronic components from a small diameter to a large diameter without replacing the electronic component insertion head, and at the same time, it is possible to increase the mounting density of the electronic components on the printed board.

(Embodiment) An embodiment of the electronic component insertion head according to the present invention will be described below with reference to the drawings.

1 to 4, 1 is a support block, 2 is an insertion guide, and the insertion guide 2 is connected to the support block 1 via a link mechanism of the first arm 3 and the second arm 4.

Here, the rotation center of the first arm 3 on the support block side is the fulcrum shaft 11, and the rotation center of the second arm 4 on the support block side is the pivot shaft 21. The rotation center of the first arm 3 on the insertion guide side is the pivot 23, and the rotation center of the second arm 4 on the insertion guide side is the pivot 24. The fulcrum shaft 11 and the pivot 23
And the axes 21 and 24 are kept at a constant distance.

A cylinder chamber 5 is formed in the support block 1 as shown in FIG. 1, and a piston 6 is slidably provided in the cylinder chamber 5. An upper portion of the cylinder chamber 5 communicates with the air passage 7, and a lower portion is closed by a closing body 8. The piston 6 is constantly urged upward by a compression spring 9 arranged between the piston 6 and the closing body 8. The support block 1 is formed with a large diameter lateral hole 10 for shaft insertion.
The fulcrum shaft 11 to which the first arm 3 is fixedly passes through. Then, the fulcrum shaft 11 moves to the first position when the piston 6 is raised.
The position is the solid line position P in the figure, and when air is supplied to the air passage 7 and the piston 6 is lowered, the recess 12 on the side of the piston 6 is located to the side of the lateral hole 10, and the fulcrum shaft 11 is indicated by the imaginary line Q in FIG. It becomes possible to move to the position.

Positioning hemispherical recesses 15 and 16 are formed on the front surface and the rear surface of the support block 1, and the hemispherical recesses 15 communicate with the upper portion of the cylinder chamber 5 via an air passage 17.

In addition, as shown in FIGS. 3 and 4, the support block 1
A lower end portion of a third arm 20 is pivotally attached to a pivot shaft 21 to which the second arm 4 is fixed, and the fulcrum shaft 11 is a third pivot shaft.
It projects through the arm 20 and is fixed to one end of the first arm 3 outside the third arm 20. Further, the third arm 20 has an engaging hole of the same diameter as the hemispherical recess 15.
22 are formed.

The fulcrum shaft 11 penetrates the third arm 20 without rattling, and the third arm 20 functions to keep the distance between the pivot shaft 21 and the fulcrum shaft 11 constant.

The other end of the first arm 3 is fixed to a pivot 23 penetrating the insertion guide 2, and the tip of the second arm 4 is fixed to a pivot 24 penetrating the insertion guide 2. An elongated hole 25 is formed in the second arm 4, and the elongated hole 25 is formed in the third arm.
It is possible to engage with the protruding pin 26 provided on the 20.
Further, as shown in FIG. 2, the second arm 4 is formed with a positioning hemispherical recess 27 having the same diameter as the hemispherical recess 15. A steel ball 28 is arranged so as to engage with the engaging hole 22 of the third arm 20 and any one of the hemispherical recesses 15, 16, 27 to form a ball click.

The arms that connect the insertion guide 2 to the support block 1 are shown on the front surface of the support block 1, but a similar mechanism is provided on the back surface side of the support block 1.

Next, the operation of the embodiment of the present invention will be described.

First, the movement of the insertion guide 2 when inserting the electronic component S having a small thickness (small diameter) into the printed circuit board 30 will be described. In this case, air is not supplied to the air passage 7, and the piston 6 is stopped at the raised position shown in FIG. Therefore, the fulcrum shaft 11 is pushed by the side portion of the piston 6 and is in the solid line position P. At this time, as shown in FIG. 2, the position of the positioning hemispherical recess 15 on the support block side and the position of the engagement hole 22 on the third arm side are aligned, and the steel ball 28 can be at the solid line position R in FIG. That is, when the steel ball 28 is fitted in the hemispherical recess 15 (the fulcrum shaft 11 is in the position P), the second
The arm 4 can freely rotate, and the third arm 20 has a steel ball 28.
By engaging with the hemispherical recess 15, the fixed state is established on the support block 1. The positional relationship of each arm in this state is shown in FIG.

Therefore, when the support block 1 is in the raised position, the insertion guide 2 is in the position indicated by the solid line in FIG. 1, and the insertion guide 2 that has received the electronic component S having a small thickness (small diameter) from the transfer chuck 31 moves as the support block 1 descends. As shown in FIG. 5 (A), the leads of the electronic component S are clamped and guided into the mounting holes 32 on the printed circuit board 30 side. The component S is pushed down from above to insert the electronic component S into the mounting hole 32.

The operation of returning the insertion guide 2 to the raised position is performed by the air passage 7
Since no air is continuously supplied to the arms, the positional relationship between the arms shown in FIG. 3 is maintained (the fulcrum shaft 11 is maintained at the position P), and in this positional relationship, the insertion guide 2 leads the electronic component S. Release the retention of the
35 is pushed up in the direction of the arrow Y by a component on the electronic component inserting machine side, and a force is applied in a direction of pulling up the second arm 4 to move the arm 3,
This is done by rotating 4 from the solid line position to the virtual line position. As a result, the locus at the lower end of the insertion guide 2 becomes a locus with little escape as shown by the curve X in FIG. 5 (B).
Therefore, an electronic component S having a small thickness (small diameter) can be mounted on the printed circuit board 30 at a high density.

After the support block 1 returns to the raised position, the convex portion 35 of the insertion guide 2 is pushed down in the direction of arrow Z to return to the state where the next electronic component can be received from the transfer chuck 31 as shown in FIG.

When the large-diameter electronic component L is inserted into the printed circuit board 30, the electronic component L is transferred from the transfer chuck 31 as shown in FIG. The air is not supplied to the air passage 7 until the component L is inserted into the printed circuit board 30, but the air is supplied to the air passage 7 when the insertion guide 2 is returned to the raised position. The piston 6 is in the lowered position, and the fulcrum shaft 11 can be moved to the imaginary line position Q by the concave portion 12 on the side of the piston 6. Further, the steel ball 28 becomes the imaginary line position T in FIG. 2, and the third arm 20 is brought into the disengaged state with respect to the support block 1 by the steel ball 28 being pushed into the hemispherical recess 27 and entering. Then, in the escape operation after the electronic component is inserted, the fulcrum shaft 11 is first moved from the position P to the position Q by the force in the direction of pushing up the insertion guide 2, and then the steel ball 28 is engaged with the hemispherical recess. Done in. The positional relationship of each arm in this state is shown in FIG.

First, when the electronic component L having a large diameter is received from the transfer chuck 31 of FIG. 1 at the raised position of the support block 1,
The lower end position of the insertion guide 2 must be at the same position as the electronic component S having a small thickness described above. Therefore, during the downward pivoting operation of the second arm 4, the elongated hole 25 of the second arm 4 is moved to the third arm.
The protrusion pin 26 on the 20 side is caught and the third arm 20 is rotated to the right to return to the same position as in the case of FIG. 3 (the fulcrum shaft is in the position P). The insertion guide 2 which has received the large-diameter electronic component L in this state holds the lead of the electronic component L in the mounting hole 32 on the printed circuit board 30 side as shown in FIG. A push rod that is in a state of guiding the reed and moves up and down with respect to the support block 1 in this state.
Push down the electronic component L from above with 33 to attach the electronic component L
Insert into 32.

The returning operation of the insertion guide 2 to the raised position is performed by the second arm 4
Is rotated upward from the solid line position to the virtual line position. In this case, the second arm 4 and the third arm
As a result of the 20 and 20 being connected by a steel ball 28, the third arm 20 becomes a steel ball 28.
Rotates counterclockwise from the solid line position in FIG. 3 to the solid line position in FIG. 4 until it engages with the radial recess 16 to move the fulcrum shaft 11 of the first arm 3 to the left side, as shown in FIG. Each arm has a positional relationship (the fulcrum shaft 11 is at the position Q). The steel ball 28 does not hinder the movement of the second arm 4 after it is fitted into the positioning hemispherical recess 16. As a result, when the second arm 4 rotates further upward, the locus of the lower end of the insertion guide 2 becomes a locus with a large relief as shown by the curve Y in FIG. 6 (B). Therefore, for the large-diameter electronic component L as well, the same insertion guide 2 is used for the printed circuit board 30.
Can be inserted into.

(Effects of the Invention) As described above, according to the electronic component insertion head of the present invention, the first arm having one end pivotally supported by the fulcrum shaft with respect to the support block, and one end of the support block. It is configured to include a second arm pivotally supported, an insertion guide in which the other ends of the first and second arms are pivotally mounted, and means for changing the position of the fulcrum shaft with respect to the support block. Therefore, it is possible to change the return trajectory of the insertion guide to the raised position according to the thickness (diameter) of the electronic parts, and select from a small diameter to a large diameter by selecting a preset program without replacing the insertion guide. There is an advantage that it is possible to automatically insert the electronic components of the above into the substrate.

[Brief description of drawings]

FIG. 1 is an embodiment of an electronic component insertion head according to the present invention, and is a front view in which a support block portion is shown in section, and FIG. 2 is a plan view in which a portion showing a support block and an arm connected thereto is shown in section 3 and 4 are front views showing the positional relationship between each arm and the support block when inserting an electronic component having a small thickness, and FIG. 4 is a view showing each arm and the support block when inserting a large-diameter electronic component. FIG. 5 is a front view showing the positional relationship, FIG. 5 is an explanatory view showing an inserting operation of an electronic component having a small thickness, and FIG. 6 is an explanatory view showing an inserting operation of an electronic component having a large diameter. 1 ... Support block, 2 ... Insertion guide, 3 ... First arm, 4 ... Second arm, 6 ... Piston, 11 ... Support shaft, 15,16,27 ... Hemispherical recess for positioning, 20 ...... Third arm, 28 ... Steel ball.

Claims (1)

[Claims] 1. A support block (1), a fulcrum shaft (11) positioned at a first position (P) or a second position (Q) with respect to the support block, and one end of the fulcrum shaft. A first arm (3) attached and having the fulcrum shaft as a rotation center, and a second arm (4) having one end pivotally supported by the support block.
And an insertion guide (2) having the other ends of the first and second arms (3, 4) pivotally attached to each other, and the position of the fulcrum shaft with respect to the support block is the first.
The electronic component insertion head, wherein the ascending locus of the tip of the insertion guide (2) can be freely changed by changing the position (P) to the second position (Q).