JPH0758836B2 - Ceramic substrate mounting device - Google Patents
Ceramic substrate mounting deviceInfo
- Publication number
- JPH0758836B2 JPH0758836B2 JP60075620A JP7562085A JPH0758836B2 JP H0758836 B2 JPH0758836 B2 JP H0758836B2 JP 60075620 A JP60075620 A JP 60075620A JP 7562085 A JP7562085 A JP 7562085A JP H0758836 B2 JPH0758836 B2 JP H0758836B2
- Authority
- JP
- Japan
- Prior art keywords
- mounting
- mounting portion
- hole
- ceramic substrate
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Mounting Of Printed Circuit Boards And The Like (AREA)
Description
【発明の詳細な説明】 産業上の利用分野 本発明は、配線回路基板用のセラミック基板を、機器筐
体に取付保持する際のセラミック基板の取付装置に関す
るものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a ceramic substrate attachment device for attaching and holding a ceramic substrate for a printed circuit board to a device housing.
従来の技術 セラミック基板の両面もしくは片面に導体パターン回路
を形成するとともに、電気部品を実装した配線回路基板
を、電子機器のシャーシ等の筐体へ取付ける時には、第
３図に示すような取付金具６を用いていた。2. Description of the Related Art When a conductor pattern circuit is formed on both sides or one side of a ceramic board and a printed circuit board on which electric parts are mounted is mounted on a chassis such as a chassis of electronic equipment, a mounting bracket 6 as shown in FIG. Was used.
すなわち、セラミック基板の導体パターに電気部品を半
田付実装した配線回路基板１を、取付金具６の基板実装
部に実装し、基板１上のアースパターン２と半田付部３
を接続して固定し、その状態で金具取付部５の孔６にネ
ジを挿入して電子機器のシャーシ等の筐体に取付保持し
ていた。That is, the wiring circuit board 1 in which electric parts are soldered and mounted on the conductor pattern of the ceramic board is mounted on the board mounting portion of the mounting bracket 6, and the ground pattern 2 and the soldering portion 3 on the board 1 are mounted.
Was connected and fixed, and in that state, a screw was inserted into the hole 6 of the metal fitting mounting portion 5 to be attached and held in a housing such as a chassis of the electronic device.
発明が解決しようとする課題 しかしながらこのような従来の取付構造では、上記ネジ
締め固定時に取付金具６にソリ、ネジレが生ずると、前
もって、取付金具６の基板実装部に半田付して固定され
た基板１に曲げストレスが加わり、クラック、割れを発
生させる問題がある。DISCLOSURE OF THE INVENTION Problems to be Solved by the Invention However, in such a conventional mounting structure, when the mounting bracket 6 is warped or twisted when the screw is fastened, the mounting bracket 6 is fixed to the mounting part 6 by soldering in advance. There is a problem that bending stress is applied to the substrate 1 and cracks are generated.
本発明は取付金具にソリ等が生じても、基板に曲げ、ネ
ジレのストレスを与えないセラミック基板の取付装置を
提供するものである。The present invention provides a ceramic substrate mounting device that does not apply stress to the substrate by bending it even if the mounting bracket is warped.
課題を解決するための手段 この目的を達成するために本発明のセラミック基板の取
付装置は、セラミック基板が装着される基板実装部を有
する取付金具と、この取付金具の側辺に設けられた複数
個の金具取付部と、この金具取付部に設けられた孔とを
備え、前記基板実装部と前記金具取付部の前記孔との間
から孔の両側に延長されてこの孔の前記基板実装部側外
周を取り囲む貫通溝を設けたものである。Means for Solving the Problems In order to achieve this object, a ceramic substrate mounting apparatus of the present invention is a mounting bracket having a substrate mounting portion on which the ceramic substrate is mounted, and a plurality of mounting members provided on the sides of the mounting bracket. Each metal fitting mounting portion and a hole provided in the metal fitting mounting portion are provided, and the board mounting portion of the hole is extended from between the board mounting portion and the hole of the metal fitting mounting portion to both sides of the hole. A through groove surrounding the outer circumference is provided.
作用 この構成により、基板実装部と金具取付部の孔との間
に、前記孔の基板実装部側を取り囲むように貫通溝を設
けているので、たとえ段差等を有する筐体の取付部にネ
ジ等で装着したとしても、前記貫通溝が、孔の基板実装
部側を取り囲むものであることから、貫通溝の内側の孔
に挿入したネジを締め付ける時に、貫通溝の内側部分が
変形することとなり、この結果取付金具に実装したセラ
ミック基板に曲げ、ネジレ等のストレスを加える力は生
じにくく、また若干その部分において前記ストレスを加
える力が生じたとしてもその力は孔の基板実装部とは反
対側の外周から貫通溝の外方を介してセラミック基板に
伝達、つまり長い距離を介して伝達されることとなるの
で、このセラミック基板に対する影響力は小さくなり、
この結果としてセラミック基板のクラック発生や割れの
生じにくいものとなる。また貫通溝で孔の基板実装部側
を取り囲むことにより、長い距離を形成することが出来
るので、金具取付部を長くする必要がなく、小型化でき
る。With this configuration, since the through groove is provided between the board mounting portion and the hole of the metal fitting mounting portion so as to surround the board mounting portion side of the hole, even if a screw is attached to the mounting portion of the housing having a step or the like. Even if it is mounted with, etc., since the through groove surrounds the board mounting portion side of the hole, when the screw inserted into the hole inside the through groove is tightened, the inner part of the through groove is deformed. As a result, it is difficult to generate a stress such as bending or twisting on the ceramic substrate mounted on the mounting bracket, and even if the stress is slightly applied to that portion, the force is opposite to that of the board mounting portion of the hole. From the outer periphery on the side to the ceramic substrate through the outside of the through groove, that is, it is transmitted over a long distance, so the influence on this ceramic substrate is small,
As a result, cracking and cracking of the ceramic substrate are less likely to occur. Further, by enclosing the hole on the substrate mounting portion side with the through groove, a long distance can be formed, so that it is not necessary to lengthen the metal fitting mounting portion, and the size can be reduced.
実施例 以下、本発明の実施例を図面に基づいて説明する。第１
図は本発明の実施例の分解斜視図である。Embodiment An embodiment of the present invention will be described below with reference to the drawings. First
The drawing is an exploded perspective view of an embodiment of the present invention.
第１図において、セラミック基板１の表面７上に、導体
パターン回路（図示せず）並びに電気部品半田付用パタ
ーン（図示せず）が印刷され、コンデンサ、抵抗、トラ
ンジスタ等のチップ部品（図示せず）が電気部品半田付
用パターンに半田付されている。またこの基板１には、
アースパターン２が形成されている。この基板１は半田
付が可能な材料もしくは、表面処理が施された取付金具
６のセラミック基板実装部８上に実装され、取付金具６
に形成された半田付部３と基板１上に印刷されたアース
パターン２とが半田付される。In FIG. 1, a conductor pattern circuit (not shown) and a pattern for soldering electric parts (not shown) are printed on the surface 7 of the ceramic substrate 1, and chip parts (not shown) such as capacitors, resistors and transistors are shown. No.) is soldered to the electric component soldering pattern. In addition, this substrate 1
The ground pattern 2 is formed. The board 1 is mounted on a ceramic board mounting portion 8 of a mounting material 6 which is a solderable material or surface-treated,
The soldering portion 3 formed on the substrate 1 and the ground pattern 2 printed on the substrate 1 are soldered.
取付金具６の側辺には、電子機器の筐体９に形成された
取付部10にネジ等で固定する為の孔４を有した金具取付
部５が形成されており、基板実装部８と金具取付部５の
孔４との間において、凹状の貫通溝11が設けられてい
る。つまりこの貫通溝11は孔４のセラミック基板実装部
８との間から、この孔４の両側に延長されて、この孔４
のセラミック基板実装部８側外周を取り囲むように設け
られたものである。On the side of the mounting bracket 6, a mounting bracket 5 having a hole 4 for fixing with a screw or the like is formed on a mounting part 10 formed in a housing 9 of an electronic device. A concave through groove 11 is provided between the metal fitting mounting portion 5 and the hole 4. That is, the through groove 11 is extended from the space between the hole 4 and the ceramic substrate mounting portion 8 to both sides of the hole 4,
It is provided so as to surround the outer periphery of the ceramic substrate mounting portion 8 side.
第２図は筐体の取付部10に取付金具６がネジで締付け固
定された断面図を示し、筐体９の取付部10の４ヶ所にお
いて、端面に段差があった場合３ヶ所で、取付部10の取
付平面が決まる中で、最も低い取付部端面との間で段差
Ａが生じた場合の取付金具６の取付状態を示す。FIG. 2 shows a cross-sectional view of the mounting bracket 6 fixed to the mounting portion 10 of the housing with screws, and the mounting portion 10 of the housing 9 is mounted at three locations when there is a step on the end face at four locations. The mounting state of the mounting bracket 6 when a step A is formed between the mounting surface of the portion 10 and the lowest end surface of the mounting portion is shown.
第２図において、筐体９の取付部端面に段差Ａが生じた
場合、その上に装着された取付金具６の金具取付部５は
凹状の貫通溝11の材料継ぎ部を支点にして取付部側に折
り曲がった状態でネジ12により固定されている。In FIG. 2, when there is a step A on the end surface of the mounting portion of the housing 9, the metal fitting mounting portion 5 of the mounting metal fitting 6 mounted thereon has the material joining portion of the concave through groove 11 as a fulcrum. It is fixed by a screw 12 while being bent to the side.
発明の効果 以上のように本発明は、基板実装部と金具取付部の孔と
の間に、前記孔の基板実装部側を取り囲むように貫通溝
を設けているので、たとえ段差等を有する筐体の取付部
にネジ等で装着したとしても、前記貫通溝が、孔の基板
実装部側を取り囲むものであることから、貫通溝の内側
の孔に挿入したネジを締め付ける時に、貫通溝の内側部
分が変形することとなり、この結果取付金具に実装した
セラミック基板に曲げ、ネジレ等のストレスを加える力
は生じにくく、また若干その部分において前記ストレス
を加える力が生じたとしてもその力は孔の基板実装部と
は反対側の外周から貫通溝の外方を介してセラミック基
板に伝達、つまり長い距離を介して伝達されることとな
るので、このセラミック基板に対する影響力は小さくな
り、この結果としてセラミック基板のクラック発生や割
れの生じにくいものとなる。また貫通溝で孔の基板実装
部側を取り囲むことにより、長い距離を形成することが
出来るので、金具取付部を長くする必要がなく、小型化
できる。EFFECTS OF THE INVENTION As described above, according to the present invention, since the through groove is provided between the board mounting portion and the hole of the metal fitting mounting portion so as to surround the board mounting portion side of the hole, even if the housing has a step or the like. Even if it is attached to the attachment part of the body with a screw or the like, since the through groove surrounds the board mounting part side of the hole, when tightening the screw inserted in the hole inside the through groove, the inside of the through groove is tightened. As a result, the portion is deformed, and as a result, a force that applies stress such as bending and twisting to the ceramic substrate mounted on the mounting bracket is unlikely to occur, and even if the stress applying force slightly occurs at that portion, the force is not generated by the hole. Since it is transmitted from the outer periphery on the side opposite to the board mounting portion to the ceramic substrate via the outside of the through groove, that is, it is transmitted over a long distance, the influence on this ceramic substrate is reduced, and As a result, cracking and cracking of the ceramic substrate are less likely to occur. Further, by enclosing the hole on the substrate mounting portion side with the through groove, a long distance can be formed, so that it is not necessary to lengthen the metal fitting mounting portion, and the size can be reduced.
第１図は本発明の一実施例に基づく分解斜視図、第２図
は第１図の要部断面図、第３図は取付金具の従来例を示
す斜視図である。 １……セラミック基板、４……孔、５……金具取付部、
６……取付金具、８……セラミック基板実装部、11……
貫通溝。FIG. 1 is an exploded perspective view based on an embodiment of the present invention, FIG. 2 is a sectional view of an essential part of FIG. 1, and FIG. 3 is a perspective view showing a conventional example of a mounting bracket. 1 ... Ceramic substrate, 4 ... Hole, 5 ... Metal fitting mounting part,
6 ... Mounting bracket, 8 ... Ceramic board mounting part, 11 ...
Through groove.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 河本 登 大阪府門真市大字門真1006番地 松下電器 産業株式会社内 (56)参考文献 実開 昭51−120944（ＪＰ，Ｕ) 実開 昭57−97991（ＪＰ，Ｕ) ─────────────────────────────────────────────────── ─── Continuation of front page (72) Inventor Noboru Kawamoto 1006 Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. (56) References 51-120944 (JP, U) (JP, U)
Claims (1)
有する取付金具と、この取付金具の側辺に設けられた複
数個の金具取付部と、この金具取付部に設けられた孔と
を備え、前記基板実装部と前記金具取付部の前記孔との
間から孔の両側に延長されてこの孔の前記基板実装部側
外周を取り囲む貫通溝を設けたセラミック基板の取付装
置。1. A mounting bracket having a board mounting part on which a ceramic substrate is mounted, a plurality of mounting brackets provided on a side of the mounting bracket, and holes provided in the mounting bracket. A ceramic substrate mounting device provided with a through groove extending from the space between the substrate mounting portion and the hole of the metal fitting mounting portion to both sides of the hole and surrounding the outer periphery of the hole on the substrate mounting portion side.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60075620A JPH0758836B2 (en) | 1985-04-10 | 1985-04-10 | Ceramic substrate mounting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60075620A JPH0758836B2 (en) | 1985-04-10 | 1985-04-10 | Ceramic substrate mounting device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61234098A JPS61234098A (en) | 1986-10-18 |
| JPH0758836B2 true JPH0758836B2 (en) | 1995-06-21 |
Family
ID=13581434
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60075620A Expired - Lifetime JPH0758836B2 (en) | 1985-04-10 | 1985-04-10 | Ceramic substrate mounting device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0758836B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011128708A (en) * | 2009-12-15 | 2011-06-30 | Toshiba Corp | Electronic apparatus |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5522788Y2 (en) * | 1975-03-28 | 1980-05-30 | ||
| JPS5551046U (en) * | 1978-09-25 | 1980-04-03 | ||
| JPS5797991U (en) * | 1980-12-05 | 1982-06-16 |
-
1985
- 1985-04-10 JP JP60075620A patent/JPH0758836B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61234098A (en) | 1986-10-18 |
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