JPH0758600B2 - Semiconductor device - Google Patents

Semiconductor device

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Publication number
JPH0758600B2
JPH0758600B2 JP11947386A JP11947386A JPH0758600B2 JP H0758600 B2 JPH0758600 B2 JP H0758600B2 JP 11947386 A JP11947386 A JP 11947386A JP 11947386 A JP11947386 A JP 11947386A JP H0758600 B2 JPH0758600 B2 JP H0758600B2
Authority
JP
Japan
Prior art keywords
memory element
pseudo
semiconductor memory
memory device
gate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP11947386A
Other languages
Japanese (ja)
Other versions
JPS62275400A (en
Inventor
毅 渡辺
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP11947386A priority Critical patent/JPH0758600B2/en
Publication of JPS62275400A publication Critical patent/JPS62275400A/en
Publication of JPH0758600B2 publication Critical patent/JPH0758600B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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  • Techniques For Improving Reliability Of Storages (AREA)
  • Semiconductor Memories (AREA)
  • Non-Volatile Memory (AREA)
  • For Increasing The Reliability Of Semiconductor Memories (AREA)
  • Read Only Memory (AREA)

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は半導体装置に関し、特に浮遊ゲートを有する不
揮発性半導体メモリを備える半導体装置に関する。
The present invention relates to a semiconductor device, and more particularly to a semiconductor device including a nonvolatile semiconductor memory having a floating gate.

〔従来の技術〕[Conventional technology]

従来の浮遊ゲートを有する不揮発性半導体メモリ素子
(以下単にメモリ素子と称する)の情報を同一構造・同
一寸法の疑似メモリ素子との比較で読み出す方法は、メ
モリ素子の書込み後の電圧(以下VTM-Wとする)を測定
することが困難なため、幾分偏倚したあ値(VTM-W
α)であるおおまかな目安でしか測定できず、更に、こ
のαが一定の値ではなく、VTM-Wの値によってその大き
さが変動するという問題がある。このような理由で、実
際のメモリ素子のVTM-Wの正しい値が測定できず、書込
み特性を調査することが困難である。
A method of reading information of the nonvolatile semiconductor memory device having a conventional floating gate (hereinafter simply referred to as a memory device) in comparison with the pseudo memory device having the same structure and the same size, after writing of the memory device voltage (hereinafter V TM -W ) is difficult to measure, so the value is slightly biased (V TM-W +
It can be measured only as a rough guideline of α), and further, there is a problem that the α does not have a constant value, but its size varies depending on the value of V TM -W . For this reason, the correct value of VTM-W of the actual memory element cannot be measured, and it is difficult to investigate the write characteristics.

従来一般に用いられている読み出し回路を有する半導体
装置について図面を参照して説明する。
A semiconductor device having a read circuit which is generally used in the past will be described with reference to the drawings.

第2図に従来の半導体装置の読み出し回路の構成の一例
を示す。
FIG. 2 shows an example of the configuration of a read circuit of a conventional semiconductor device.

メモリ素子M1とセンスアンプ部S1と絶縁ゲート型電界効
果トランジスタ(以下IGFETと略称する)MP1・M2・MPd
・M3とによって構成される電流比較回路部2(ここでMP
1とMPdはP−チャンネル型IGFET、M2とM3はN−チャン
ネル型IGFETである)と疑似メモリ素子MDとセンスアン
プ部SDとにより読み出し回路は構成されている。ここで
センスアンプ部S1およびSDは、同一の特性を示すように
同一の回路で構成されている。IGFETM2およびM3のコン
ダクタンス抵抗比(gm比)により、比較するIGFETM1・M
Dの電流比を決定するが、ここでIGFETM3のgm(トランジ
スタのw/L)をIGFETM2に比較して3倍にすると、IGFETM
Dに流れる電流と比較して1/3以上の電流がIGFETM1に流
れたとき“on"として読み出す。
Memory element M1, sense amplifier S1, insulated gate field effect transistor (hereinafter abbreviated as IGFET) MP1, M2, MPd
・ Current comparison circuit 2 composed of M3 (here, MP
1 and MPd are P-channel type IGFETs, M2 and M3 are N-channel type IGFETs), the pseudo memory element MD and the sense amplifier section SD constitute a read circuit. Here, the sense amplifier sections S1 and SD are configured by the same circuit so as to exhibit the same characteristics. IGFET M1 ・ M to be compared by the conductance resistance ratio (gm ratio) of IGFET M2 and M3
The current ratio of D is determined, but if the gm of IGFET M3 (transistor w / L) is tripled compared to IGFET M2, IGFETM
Read as "on" when more than 1/3 of the current flowing in D flows in IGFET M1.

この動作を第3図を用いて説明する。This operation will be described with reference to FIG.

第3図の横軸はメモリ素子のゲート電圧、縦軸はメモリ
素子の電流を示す。曲線Aは書込み前のメモリ素子に流
れる電流曲線、曲線Bは書込み後(VTM-W)のメモリ素
子に流れる電流曲線、曲線Cは疑似メモリ素子に流れる
電流を1/3にした場合の電流曲線を示す。
The horizontal axis of FIG. 3 represents the gate voltage of the memory element, and the vertical axis represents the current of the memory element. A curve A is a current curve flowing through the memory element before writing, a curve B is a current curve flowing through the memory element after writing (V TM -W ), and a curve C is a current when the current flowing through the pseudo memory element is 1/3. A curve is shown.

この曲線Cよりもメモリ素子の電流Iが大きければ“o
n"(Vout“H")、小さければ“off"(Vout“L")とな
る。書込み後(VTM-W)のメモリセルは、“off"が期待
値であるが、これを満足するゲート電圧VGの最大値は
(VTM-W+α)になる。これよりもゲート電圧VGが小さ
いと、期待値通り“off"となり、(VTM-W+α)よりゲ
ート電圧VGが大きいと“on"となって誤動作する。つま
り実際の書込み後のメモリ素子のVTM-αに対して“α”
の上乗せされた値まで正常動作する。このようにメモリ
素子の閾値電圧がVTM-Wであるに拘らず、VCCを上昇させ
てモニターするとVCCmax=(VTM-W)+αでしか測定で
きず、実際のVTM-Wを測定する事が困難である。
If the current I of the memory element is larger than this curve C, "o
n "(Vout" H "), if smaller," off "(Vout" L "). After writing (V TM-W )," off "is the expected value, which satisfies this the maximum value of the gate voltage V G becomes (V TM-W + α) . If this gate voltage V G is less than, the expected values "off", and the gate voltage V G from (V TM-W + α) If it is larger, it becomes “on” and malfunctions, that is, “α” with respect to V TM- α of the memory element after actual writing
It operates normally up to the added value. Thus, even if the threshold voltage of the memory element is V TM-W , when V CC is raised and monitored, only V CC max = (V TM-W ) + α can be measured, and the actual V TM-W Is difficult to measure.

〔発明が解決しようとする問題点〕[Problems to be solved by the invention]

上述したように、従来の半導体装置の読み出し回路は、
メモリ素子の実際の閾値電圧を測定することができない
という欠点がある。
As described above, the read circuit of the conventional semiconductor device is
The drawback is that the actual threshold voltage of the memory device cannot be measured.

本発明が解決しようとする問題点、換言すれば本発明の
目的は、上述のような従来の半導体装置の読出し回路の
欠点を除去するため、疑似メモリ素子のゲート電圧を可
変にできる手段を設けることにより、メモリ素子の閾値
電圧を容易に測定できるようにした半導体装置を提供す
ることにある。
SUMMARY OF THE INVENTION Problems to be solved by the present invention, in other words, an object of the present invention is to provide means for changing the gate voltage of a pseudo memory element in order to eliminate the drawbacks of the read circuit of the conventional semiconductor device as described above. Accordingly, it is an object of the present invention to provide a semiconductor device capable of easily measuring the threshold voltage of a memory element.

〔問題点を解決するための手段〕[Means for solving problems]

本発明の半導体装置は、浮遊ゲートを有する不揮発性半
導体メモリ素子と、前記不揮発性半導体メモリ素子と同
一構造・同一寸法の比較用の疑似不揮発性半導体メモリ
素子とを備え、書込みまたは消去情報を蓄えた前記不揮
発性半導体メモリ素子と比較用の前記疑似不揮発性半導
体メモリ素子との電流を比較して前記不揮発性半導体メ
モリ素子の情報を読み出す回路を同一半導体基板上に備
える半導体装置において、ドレインを第一の電源に接続
した第一の絶縁ゲート型電解効果トランジスタと、ドレ
インを第二の電源に接続した第二の絶縁ゲート型電解効
果トランジスタとを備え、前記第一および第二の絶縁ゲ
ート型電解効果トランジスタのソースを前記疑似不揮発
性半導体メモリ素子のゲートに接続して構成される。
A semiconductor device of the present invention includes a nonvolatile semiconductor memory element having a floating gate, and a pseudo-nonvolatile semiconductor memory element for comparison having the same structure and size as the nonvolatile semiconductor memory element for storing write or erase information. In a semiconductor device including a circuit for reading information of the nonvolatile semiconductor memory element on the same semiconductor substrate by comparing the currents of the nonvolatile semiconductor memory element and the pseudo-nonvolatile semiconductor memory element for comparison, A first insulated gate field effect transistor connected to one power supply and a second insulated gate field effect transistor having a drain connected to a second power supply, wherein the first and second insulated gate field effect transistors The source of the effect transistor is connected to the gate of the pseudo non-volatile semiconductor memory device.

〔実施例〕〔Example〕

次に、本発明の実施例について図面を参照して詳細に説
明する。
Next, embodiments of the present invention will be described in detail with reference to the drawings.

第1図は本発明の一実施例の回路図である。FIG. 1 is a circuit diagram of an embodiment of the present invention.

第1図において、浮遊ゲートを有するメモリ素子M1と、
メモリ素子M1と同一構造・同一寸法の比較用の疑似メモ
リ素子MDおよび書込みまたは消去情報を蓄えたメモリ素
子M1をセンスアンプ部S1およびSDとIGFETMP1・MP2・MPd
・M3とによって電流比較してメモリ素子M1の情報を読み
出す回路とを同一半導体基板上に設け、疑似メモリ素子
MDのゲートに印加する電圧VG1をメモリ素子M1のゲート
印加電圧(ここではVCC)とは独立して可変にできる手
に設定し、IGEFETMR2を“on"させVG1≒VPPに設定し、V
PPを可変にすることによって疑似メモリ素子MDのゲート
に印加する電圧を可変にする)をもっている。疑似メモ
リ素子MDのゲートにはIGFETMR1・MR2を次のように接続
する。すなわち、Nチャンネルデプレーション型IGFETM
R1は、ドレインをVCCに、ゲートを▲▼に、ソー
スを疑似メモリ素子MDのゲートに接続し、N−チャンネ
ル型IGFETMR2はゲートをVReに、ドレインを第2の電源V
PPに、ソースを疑似メモリ素子MDのゲートに接続する。
In FIG. 1, a memory device M1 having a floating gate,
The pseudo-memory element M D having the same structure and size as the memory element M1 for comparison and the memory element M1 storing the write or erase information are connected to the sense amplifier sections S1 and S D and the IGFET MP1, MP2, and MPd.
・ A circuit for reading the information of the memory device M1 by comparing the current with M3 is provided on the same semiconductor substrate, and the pseudo memory device
Means for making the voltage V G1 applied to the gate of M D independent of the gate applied voltage (V CC in this case) of the memory device M1. , Set IGEFETMR2 to “on”, set V G1 ≈ V PP, and set V
By making PP variable, the voltage applied to the gate of the pseudo memory device M D can be made variable). IGFET MR1 and MR2 are connected to the gate of the pseudo memory element M D as follows. That is, N-channel depletion type IGFETM
R1 is a drain to V CC, the gate ▲ ▼ to, a source connected to the gate of the pseudo memory device M D, N-channel type IGFETMR2 is the gate to V Re, the drain second power supply V
At PP , the source is connected to the gate of the pseudo memory device M D.

次に上述の回路の動作について第4図を参照して説明す
る。
Next, the operation of the above circuit will be described with reference to FIG.

通常の読み出し時は、制御信号 に設定することによってMR1が“on"に、MR2が“off"に
なって疑似メモリ素子MDのゲート電圧VG1は第一の電源V
CCと同電位になり、メモリ素子M1と疑似メモリ素子MD
のゲート電圧が等しくなって従来の回路と同じ動作をす
る。次にメモリ素子M1の閾値電圧を読み出すテスト時
は、制御信号 に設定し、IGFETMR1とIGFETMR2とをともに“on"させ
る。ここでIGFETMR2のgmをIGFETMR1のgmより充分大きく
設定することにより、VG1≒VPPとなる。このVPPをメモ
リ素子M1の初期閾値電圧VTMO近傍に設定することによっ
て疑似メモリ素子MDは第4図における曲線Dに示す電流
特性を持つ。これによって書込み後のメモリ素子M1の閾
値電圧VTM-Wと電源電圧動作最大値VCCmaxとの差βが大
幅に小さくなる。従ってVCCmaxを測定することによって
VTM-Wを容易に測定できる。
Control signal during normal read Setting MR1 to “on” and MR2 to “off” to set the gate voltage V G1 of the pseudo memory device M D to the first power supply V
Becomes CC the same potential, the same operation as the conventional circuit is equal gate voltages of the memory device M1 and the pseudo memory device M D. Next, during the test to read the threshold voltage of the memory device M1, the control signal And turn on both IGFETMR1 and IGFETMR2. Here, by setting the gm of IGFETMR2 sufficiently larger than the gm of IGFETMR1, V G1 ≈V PP . By setting this V PP near the initial threshold voltage V TMO of the memory device M1, the pseudo memory device M D has the current characteristic shown by the curve D in FIG. As a result, the difference β between the threshold voltage V TM-W of the memory element M1 after writing and the power supply voltage operation maximum value V CC max is significantly reduced. So by measuring V CC max
V TM-W can be easily measured.

〔発明の効果〕〔The invention's effect〕

以上詳細に説明したように、本発明は疑似メモリ素子の
ゲート電圧を可変にできる手段を設けることによってメ
モリ素子の閾値電圧を容易に測定できるという効果があ
る。
As described above in detail, the present invention has an effect that the threshold voltage of the memory element can be easily measured by providing the means capable of varying the gate voltage of the pseudo memory element.

【図面の簡単な説明】[Brief description of drawings]

第1図は本発明の一実施例を示す回路図、第2図は従来
の半導体装置の一例を示す回路図、第3図は第2図の例
の動作を説明するための電流特性を示すグラフ、第4図
は第1図の実施例の動作を説明するための電流を示すグ
ラフである。 S1,SD……センスアンプ部、M2,M3,MR2……nチャンネル
IGFET、MR1……nチャンネルデプレーション形IGFET、M
P1,MPd……PチャンネルIGFET、M1……メモリ素子、MD
……疑似メモリ素子。
FIG. 1 is a circuit diagram showing an embodiment of the present invention, FIG. 2 is a circuit diagram showing an example of a conventional semiconductor device, and FIG. 3 is a current characteristic for explaining the operation of the example of FIG. FIG. 4 is a graph showing current for explaining the operation of the embodiment shown in FIG. S1, SD …… Sense amplifier section, M2, M3, MR2 …… n channel
IGFET, MR1 ... n-channel depletion type IGFET, M
P1, MPd ...... P-channel IGFET, M1 ...... memory element, M D
...... Pseudo memory device.

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】浮遊ゲートを有する不揮発性半導体メモリ
素子と、前記不揮発性半導体メモリ素子と同一構造・同
一寸法の比較用の疑似不揮発性半導体メモリ素子とを備
え、書込みまたは消去情報を蓄えた前記不揮発性半導体
メモリ素子と比較用の前記疑似不揮発性半導体メモリ素
子との電流を比較して前記不揮発性半導体メモリ素子の
情報を読み出す回路を同一半導体基板上に備える半導体
装置において、ドレインを第一の電源に接続した第一の
絶縁ゲート型電解効果トランジスタと、ドレインを第二
の電源に接続した第二の絶縁ゲート型電解効果トランジ
スタとを備え、前記第一および第二の絶縁ゲート型電解
効果トランジスタのソースを前記疑似不揮発性半導体メ
モリ素子のゲートに接続したことを特徴とする半導体装
置。
1. A non-volatile semiconductor memory device having a floating gate, and a pseudo-non-volatile semiconductor memory device for comparison having the same structure and size as the non-volatile semiconductor memory device for storing write or erase information. In a semiconductor device having a circuit for reading out information of the nonvolatile semiconductor memory element on the same semiconductor substrate by comparing the currents of the nonvolatile semiconductor memory element and the pseudo-nonvolatile semiconductor memory element for comparison, the first drain is provided. A first insulated gate field effect transistor having a power supply connected thereto and a second insulated gate field effect transistor having a drain connected to a second power supply, wherein the first and second insulated gate field effect transistors are provided. The semiconductor device is characterized in that the source is connected to the gate of the pseudo-nonvolatile semiconductor memory element.
JP11947386A 1986-05-23 1986-05-23 Semiconductor device Expired - Lifetime JPH0758600B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11947386A JPH0758600B2 (en) 1986-05-23 1986-05-23 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11947386A JPH0758600B2 (en) 1986-05-23 1986-05-23 Semiconductor device

Publications (2)

Publication Number Publication Date
JPS62275400A JPS62275400A (en) 1987-11-30
JPH0758600B2 true JPH0758600B2 (en) 1995-06-21

Family

ID=14762179

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11947386A Expired - Lifetime JPH0758600B2 (en) 1986-05-23 1986-05-23 Semiconductor device

Country Status (1)

Country Link
JP (1) JPH0758600B2 (en)

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62231500A (en) * 1986-03-31 1987-10-12 Toshiba Corp Semiconductor storage device

Also Published As

Publication number Publication date
JPS62275400A (en) 1987-11-30

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