JPH0755877A - Environment testing device - Google Patents

Abstract

PURPOSE:To prevent deformation of the device board of burn-in testing device and to reduce cost. CONSTITUTION:A plurality of sockets 3 are installed on the surface of a device board 1 (board 1) consisting of a wiring board. A terminal 5 of the sockets 3 is connected to a conductor layer 6 on the back side of the board 1 via solder. The board 1 is fitted to a socket 37 of a driver board 36 of a burn-in testing device. A busbar 20 for supplying power (a busbar 45 which also serves as a reinforcing body) which also plays a role of a reinforcing body consisting of copper plate is laid out on the back side of the board 1. The busbar 45 which also serves as a reinforcing body is fixed to the board 1 by a set screw 40 and is connected to the terminal 5 by soldering, thus preventing the deformation of the board 1. The busbar 45 which also serves as a reinforcing body has a flexed strain absorption part 35 which can absorb thermal stress so that it is not deformed. The device board 1 does no require any independent reinforcing bodies, thus reducing the number of parts.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an environmental testing device, such as a burn-in testing device, for testing electrical characteristics of electronic components such as semiconductor devices at a high environmental temperature, and more particularly to sockets for mounting electronic components. The present invention relates to a device board to be arranged.

[0002]

2. Description of the Related Art Semiconductor devices (semiconductor devices) are subjected to various tests (measurement and measurement) in order to guarantee the reliability of their products.
Inspected) and select non-defective products. As one of such non-defective product selection methods (screening), there is a so-called burn-in test in which a semiconductor device is subjected to an electrical stress under a high temperature environment to perform an accelerated life test. For example, “Electronic Materials Special Issue” published by the Industrial Research Society, November 20, 1985, P227
~ P231 describes a burn-in system.
This document discloses the basic structure of a burn-in device. The burn-in system consists of a test chamber (oven), power supply, program board, driver board, device board and pattern generator. In the device board,
Dozens to hundreds of sockets are mounted on one board depending on the package. Also, depending on the model, it is possible to burn in 4 types simultaneously in 4 zones. Further, the document describes that burn-in devices include a monitored burn-in device, a burn-in device with a Felbit monitor, a test burn-in device, and a moisture-resistant burn-in device.

On the other hand, "Electronic Materials Separate Volume" issued by the Industrial Research Committee
P177 to P185, issued December 10, 1988, regarding burn-in, "For burn-in that is most often used in the VLSI manufacturing process, the DUT board can be inserted and removed as well as the door.
It was a big bottleneck for making A. In the case of burn-in, since the operating temperature exceeds 100 ° C, the internal structure undergoes a temperature cycle from room temperature to hundreds of degrees every time it starts and ends,
Distortion of mm unit occurs, and the core of the manual insertion and removal of the board in the DUT board mounting rack and connector of the burn-in part shifts with each use. Is stated. "

[0004]

In the burn-in test apparatus (accelerated life test apparatus), as described in the above-mentioned document, the test chamber is subjected to a temperature cycle of from room temperature to hundreds of degrees, Some things cause distortion. Since the wiring board (device board) to which the socket for mounting the semiconductor device is attached has a relatively large vertical and horizontal dimensions of about 20 to 60 mm, respectively,
Distortion due to thermal expansion occurs, and for example, it is twisted or warped. Therefore, the electrical connection between the device board and the terminals of the socket is damaged, and the semiconductor device is not subject to electrical stress. Further, when the device board is twisted or warped, the rail for guiding the device board to the driver board is not well meshed with the device board, which makes it difficult to insert and remove the device board.

On the other hand, although this is not a known technique, the present applicant has developed a device board 1 as shown in FIGS. 11 to 13 in order to prevent deformation of the device board. This device board 1 is composed of a rectangular wiring board, and has a shape having a narrow insertion portion 2 at one end as shown in FIG. As shown in FIGS. 11 and 12, the device board 1 has a socket 3 attached to its main surface. In this example, two sockets 3 are arranged in parallel. The socket 3 has a housing 4 made of an insulator, and the housing 4
The terminal 5 is projected from the bottom of the. The terminal 5 is inserted into an insertion hole provided in the device board 1 and is provided in a conductor layer 6 provided on the back surface of the device board 1 (the conductor layer 6 is hatched in FIG. 13). It is connected through the solder 7. Further, as shown in FIG. 11, a contact portion (spring contact portion) 10 connected to the terminal 5 is exposed on the upper surface side of the housing 4 of the socket 3, and the semiconductor device 11 is connected to the contact portion 10.
The tips of the leads 13 protruding from the package 12 are inserted. In addition, the device board 1
The conductor layer 6 on the back surface is formed in a desired pattern, and a part of each electrically independent conductor layer 6 extends to the end of the insertion portion 2 to form a contact terminal 14. The contact terminal 14 electrically contacts the contact portion of the socket when the insertion portion 2 of the device board 1 is inserted into a socket (not shown) attached to the driver board of the burn-in test apparatus. Also, each socket 3
In order to pass a large current to the power supply terminal of, the predetermined terminal 5 protruding on the back surface of the device board 1 is electrically connected to the power supply bus bar 20 made of a copper plate. Further, when the power supply bus bar 20 is connected to the device board 1 in a long state, thermal stress is generated between the device board 1 and the device board 1 due to a difference in thermal expansion coefficient between the device board 1 and the device board 1, so that the device board 1 is distorted. As shown in FIGS. 11 and 12, a plurality of short ones are arranged in series and used, and adjacent power supply bus bars 20 are electrically connected by a bus bar connection line 21. Busbar connection line 2
Plugs 22 are provided at both ends of 1, and the plugs 22 are connected to the power supply busbars 20 by screws 23, so that the adjacent power supply busbars 20 are electrically connected. In addition, a reinforcing body (warp prevention plate) 24 made of metal having an L-shaped cross section is fixed by screws 25 along both side edges of the back surface of the device board 1. The reinforcement 24 prevents the device board 1 from being deformed by heat. In addition, a part of the power supply bus bar 20 is provided.
Are arranged in parallel with the surface of the device board 1, and a part of them are also arranged vertically so that they also serve as a reinforcing member.

[0006] In such a device board developed by the present applicant, since reinforcing members are provided on both sides of the device board, it has an effect of being hard to be deformed by heat, but has a large number of parts and a screw. Since the reinforcing body is attached in, the number of assembling steps increases and the cost of the device board increases.

An object of the present invention is to provide a burn-in test apparatus having a device board with a small number of parts and a low manufacturing cost. The above and other objects and novel features of the present invention will be apparent from the description of the present specification and the accompanying drawings.

[0008]

The outline of the representative ones of the inventions disclosed in the present application will be briefly described as follows. That is, the burn-in test apparatus has a built-in device board to which a plurality of sockets for mounting electronic components are attached, and the device board is provided with a reinforcing body for suppressing deformation of the device board. The reinforcing body is provided with a strain absorbing portion for absorbing deformation due to thermal expansion, and is arranged over substantially the entire length of the device board. The reinforcing body is formed by a power supply bus bar made of a copper plate that electrically connects predetermined terminals of each socket.

[0009]

In the burn-in test apparatus incorporating the device board according to the present invention, since the device board is provided with the reinforcing member, the device board is less likely to be deformed by heat such as twisting and warping.

In the burn-in test apparatus of the present invention,
The reinforcement provided on the device board is used in a long state by bending the copper bus bar used for increasing the power supply amount in the middle to form a thermal stress absorbing portion, so the reinforcement is provided independently. Unlike the structure, the number of parts can be reduced, and the material cost and the assembly cost can be reduced.

[0011]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a schematic view showing a device board attached to a driver board in a burn-in test apparatus according to an embodiment of the present invention, FIG. 2 is a sectional view taken along the longitudinal direction of the device board of the present invention, and FIG. 3 is the width of the device board. A sectional view taken along the direction, and FIG. 4 are bottom views of the device board.

In the burn-in test apparatus of the present invention,
The device board 1 has a structure in which the strain absorbing portion 35 is provided in the middle of the power supply bus bar 20 in the device board 1 having the structure shown in FIGS. 11 to 13 to continuously lengthen the power supply bus bar 20. Is used as a reinforcement. Further, the device board 1 does not use an independent reinforcing body, and has a structure with a small number of parts.

As shown in FIG. 1, the burn-in test apparatus of the present invention has a structure in which the insert portion 2 of the device board 1 is inserted into the socket 37 attached to the driver board 36 to perform the burn-in test. Further, when the device board 1 is mounted in the socket 37 of the driver board 36, both sides of the device board 1 are guided by rails 39 to carry in and carry out. Although not shown, both sides of the device board 1 are guided in the grooves of the rail 39, respectively.

As shown in FIGS. 1 and 4, the device board 1 is composed of a rectangular wiring board and has a narrow insertion portion 2 at one end (insertion end), and has a main surface. The socket 3 is attached to the
Is provided. In reality, a large number of sockets 3 are arranged in parallel, but the figure shows a state in which two sockets 3 are arranged in parallel. The socket 3 is a housing 4 made of an insulator.
The terminal 5 is projected from the bottom of the. The terminals 5 are inserted into the insertion holes provided in the device board 1 and soldered to the conductor layer 6 (the conductor layer 6 is hatched in FIG. 4) provided on the back surface of the device board 1. It is connected via 7. Also, the housing 4
As shown in FIG. 2, a contact portion (spring contact portion) 10 connected to the terminal 5 is exposed on the upper surface side of the. The contact portion 10 has a package 1 of the semiconductor device 11
The tip of the lead 13 protruding from 2 is inserted, and the burn-in test can be performed. Further, the conductor layer 6 on the back surface of the device board 1 is formed in a desired pattern, and a part of each electrically independent conductor layer 6 extends to the end of the insertion portion 2. It becomes the contact terminal 14. The contact terminal 14 electrically contacts the contact portion of the socket 37 when the insertion portion 2 of the device board 1 is inserted into the socket 37 attached to the driver board 36 of the burn-in test apparatus.

Since the burn-in test is an accelerated life test, the current passed through the semiconductor device is, for example, 1 to 2 A.
The conductor layer 6 provided on the surface of the device board 1 has a large resistance and a large amount of heat generation. Therefore, in order to increase the current amount, the power supply bus bar 20 made of a copper plate having a small electric resistance is prepared. The power supply bus bar 20 has, for example, a thickness of about 1.5 to 2 mm, a width of about 15 to 22 mm, and a length of about 20 to 50 mm.
One is arranged. Further, each power supply bus bar 20 is electrically connected to a predetermined terminal 5 of each socket 3 via solder 7. At this time, the power supply bus bar 20 is connected to the side surface of the terminal 5 so as to be perpendicular to the surface of the device board 1 as shown in FIGS. Further, the power supply bus bar 20 is firmly fixed to the device board 1 by the set screw 40. This fixation is
It is fixed by tightening a set screw 40 that penetrates the center of the support portion 41 formed by bending the lower surface of the power supply bus bar 20 to the side and the device board 1. The supporting portion 41 is provided in the vicinity of the terminal 5 and is not provided between the sockets 3 and 3. Further, the bus bar 45 also serving as the reinforcing body is connected to the terminal 5 by the solder 7.

The power supply bus bar 20 between the sockets 3 and 3 is, as shown in FIGS. 4 and 1,
The strain distortion absorbing portion 35 is formed by bending it to the left and right in a V shape. Since the strain absorbing portion 35 is repeatedly bent left and right, the power supply bus bar 2
Even if 0 expands due to heat and tries to expand as a whole, the strain absorbing portion 35 is deformed, so that no large force is applied to both ends of the power supply bus bar 20 to which the terminals 5 of the socket 3 are fixed. Therefore, the device board 1 will not be deformed by being twisted or warped by heat. As described above, the power supply busbar 20 has the structure in which the strain absorbing portion 35 is provided on the way, so that the power supply busbar 20 can be used as a long unit in the longitudinal direction of the device board 1.

As described above, in the device board 1 of the present invention, unlike the device board 1 developed by the present applicant, the reinforcing member provided so as to extend along the longitudinal direction of the device board 1 is eliminated, and By providing the strain absorbing portion 35, the short power supply bus bar 20 is provided.
And the bus bar 20 for power supply is vertically connected to the surface of the device board 1 to be used as a warp-preventing reinforcement body (reinforcement body / bus bar 45) of the device board 1. The screw 25 (screw hole) used for the fixing can be eliminated, and the number of parts and processing points can be reduced.

[0018]

【The invention's effect】

(1) Since the burn-in test apparatus incorporating the device board of the present invention is provided with the reinforcing body on the device board, it is possible to obtain an effect that the device board is less likely to be deformed by twisting or warping due to heat. To be

(2) Due to the above (1), in the burn-in test apparatus of the present invention, the deformation of the device board such as twisting or warping due to heat is less likely to occur.
It is possible to prevent the connection failure between the socket terminal and the conductor layer (wiring layer) of the device board and achieve a stable burn-in test.

(3) Due to the above (1), in the burn-in test apparatus of the present invention, the deformation of the device board such as twisting and warping due to heat is less likely to occur.
The effect that the engagement with the rail for guiding the device board does not deteriorate and the device board can be inserted into and removed from the rail satisfactorily.

(4) In the device board of the burn-in test apparatus of the present invention, the reinforcing member provided on the device board is distorted by bending the copper power supply bus bar used for increasing the power supply amount in the middle. Since it can be used in a long state by using the absorbing portion, it can be used as a reinforcing body. Therefore, unlike the structure in which the reinforcing body is provided independently, the number of parts can be reduced.

(5) According to the above (4), in the device board of the burn-in test apparatus of the present invention, the power supply bus bar used for increasing the power supply amount is used as the reinforcing body, so the reinforcing body is independent. Since the number of parts can be reduced as compared with the structure in which it is made, the effect of reducing the material cost can be obtained.

(6) According to the above (4), in the device board of the burn-in test apparatus of the present invention, the power supply bus bar used for increasing the power supply amount is used as the reinforcing body, so that the reinforcing body is independent. Since the number of parts can be reduced as compared with the structure prepared in advance, there is an effect that the assembly cost can be reduced.

(7) From the above (1) to (6), according to the present invention, a stable burn-in test can be performed by preventing the deformation of the device board, and the attachment / detachment work of the device board can be stabilized, and the device board There is a synergistic effect that a reduction in burn-in test cost can be achieved from a reduction in manufacturing cost.

Although the invention made by the present inventor has been specifically described based on the embodiments, the present invention is not limited to the above embodiments, and various modifications can be made without departing from the scope of the invention. Needless to say. The strain absorbing portion 35 of the reinforcing / cumulative busbar 45 (power supply busbar 20) may have another shape. For example, as shown in FIG. That is, the deformation of the device board 1 can be prevented.

6 to 8 are views showing another embodiment of the present invention. FIG. 6 is a plan view showing a reinforcing body which also serves as a power supply bus bar in a device board, and FIG. 7 is also a power supply bus bar. FIG. 8 is a front view showing a part of the reinforcing body that also serves as a device, the device board, and the like, and FIG. 8 is a sectional view taken along the line AA of FIG. In this example, the reinforcing / cumulative busbar 45 (power supply busbar 20) is connected to the terminal 5 of the socket 3 via the solder 7 at its central portion, and both end sides of the reinforcing / cumulative busbar 45 extend in the longitudinal direction. The structure is such that it can move freely, and it is possible to use the linear reinforcing body / bus bar 45. That is, the bus bar 45 that also serves as the reinforcing body
As shown in FIG. 8, a groove 46 is provided at the center of both sides of each end of the groove 46 over a certain length from the end.
It has a letter shape. Further, a receiving body 47 is provided which fits this I-shaped portion from below to the groove portions 46 on both sides in a close contact state and is slidable relatively to the bus bar 45 also serving as a reinforcing body. The receiving body 47 is made of copper, and a fitting hole 49 into which one terminal 5 can be inserted is provided on the upper portion thereof. Then, in the fitting hole 49,
A terminal 5 penetrating the device board 1 is inserted.
Since the terminal 5 of the socket 3 does not move along the surface of the device board 1, the receptacle 47 into which the terminal 5 is inserted also does not move. However, both end portions of the bus bar 45 also serving as the reinforcing body can slide with respect to the receiving body 47. In this example, the reinforcing / cumulative busbar 45 is fixed to the device board 1 by using the terminals 5 at the central portion, but both end portions of the reinforcing / cumulative busbar 45 are located between the receiving body 47 and the reinforcing / cumulative busbar 45. Since the stress is canceled by the shift between the receiving body 47 and the reinforcing / cumulative busbar 45, the longitudinal bending of the reinforcing / cumulative busbar 45 of the device board 1 does not occur. In addition, the warp in the width direction of the reinforcing / cumulative bus bar 45 of the device board 1 is such that both ends of the reinforcing / cumulative bus bar 45 are supported by the receiving bodies 47, so that the device board 1 passes through the terminals 5 and the receiving bodies 47. Since it is supported by both end portions of the bus bar 45 that also serves as the reinforcing body, warping is less likely to occur. As described above, according to this embodiment, the presence of the reinforcing member / bus bar 45 makes it difficult for the device board 1 to be deformed by heat.

9 and 10 are views showing another embodiment of the present invention. FIG. 9 is a plan view showing a reinforcing body which also serves as a power supply bus bar in a device board, and FIG. 10 is a line B- of FIG. It is sectional drawing which follows the B line. In this embodiment, similar to the previous embodiment, both ends of the reinforcing / cumulative bus bar 45 are supported by the receiving bodies 47, but in this example, grooves 46 are formed at both ends of the reinforcing / cumulative bus bar 45. Instead, a through hole 50 is provided. Then, in the receiving body 47, a contact portion 51 that comes into contact with the through hole 50 is provided. The contact portion 51 protrudes in a conical shape, and the conical portion 52 contacts the through hole 50 so as to enter the through hole 50. As a result, the expansion and contraction in the longitudinal direction of the bus bar 45 also serving as the reinforcing member shifts at the contact portion between the through hole 50 and the conical portion 52, and the stress between the device board 1 and the bus bar 45 serving also as the reinforcing member can be eliminated. It is possible to prevent the deformation due to the heat of 1.

In the above description, the case where the invention made by the present inventor is mainly applied to the burn-in test apparatus which is the field of application which is the background of the invention has been described. However, the invention is not limited thereto and, for example, a wide range of environmental tests. It can be applied to devices. INDUSTRIAL APPLICABILITY The present invention can be applied to at least an apparatus for testing electronic components under high temperature.

[Brief description of drawings]

FIG. 1 is a schematic cross-sectional view showing a device board attached to a driver board in a burn-in test apparatus according to an embodiment of the present invention.

FIG. 2 is a cross-sectional view taken along the longitudinal direction of a device board according to an embodiment of the present invention.

FIG. 3 is a sectional view taken along the width direction of a device board according to an embodiment of the present invention.

FIG. 4 is a bottom view of a device board according to an embodiment of the present invention.

FIG. 5 is a plan view showing a reinforcing body which also serves as a power supply bus bar in a device board according to another embodiment of the present invention.

FIG. 6 is a plan view showing a reinforcing body which also serves as a power supply bus bar in a device board according to another embodiment of the present invention.

FIG. 7 is a front view showing a part of a reinforcing body which also serves as a power supply bus bar and a device board and the like in a device board according to another embodiment of the present invention.

8 is a sectional view taken along the line AA of FIG.

FIG. 9 is a plan view showing a reinforcing body that also serves as a power supply bus bar in a device board according to another embodiment of the present invention.

10 is a sectional view taken along the line BB of FIG.

FIG. 11 is a sectional view taken along the longitudinal direction of the device board in the burn-in test apparatus developed by the present applicant.

FIG. 12 is a sectional view taken along the width direction of a device board developed by the present applicant.

FIG. 13 is a bottom view of the device board developed by the present applicant.

[Explanation of symbols]

1 ... Device board, 2 ... Insertion part, 3 ... Socket, 4 ...
Housing, 5 ... Terminal, 6 ... Conductor layer, 7 ... Solder, 10 ...
Contact part (spring contact part), 11 ... Semiconductor device, 12 ... Package, 13 ... Lead, 14 ... Contact terminal, 20 ... Power supply busbar, 21 ... Busbar connecting wire, 22 ... Plug, 23 ... Screw, 24 ... Reinforcement Body, 25 ...
Screw, 35 ... Strain absorbing part, 36 ... Driver board, 3
7 ... Socket, 39 ... Rail, 40 ... Set screw, 41 ...
Support part, 45 ... Reinforcement-use bus bar, 46 ... Groove, 47 ...
Receiver, 49 ... Fitting hole, 50 ... Through hole, 51 ... Contact portion, 5
2 ... Conical part.

Claims (3)

[Claims] 1. An environmental test apparatus having a built-in device board having a plurality of sockets for mounting electronic components, wherein the device board is provided with a reinforcing member for suppressing deformation of the device board. Environmental testing equipment characterized by. 2. The environmental test device according to claim 1, wherein the reinforcing body is provided with a strain absorbing portion that absorbs deformation due to thermal expansion. 3. The environmental test apparatus according to claim 1, wherein the reinforcing body is composed of a power supply bus bar for connecting a specific terminal of each socket.