JPH0754878B2 - Cooling structure - Google Patents

Description

The present invention relates to a cooling structure for cooling a surface of an electronic component mounted on a printed circuit board by a cooling plate in which a cooling medium is circulated, and particularly to the cooling plate. Relates to a cooling structure formed so that a heating element such as a power supply bar is brought into contact with the cooling structure.

As a cooling device that cools electronic components mounted on a printed circuit board, it is economical and has a high cooling effect, so that heat generated by electronic components is absorbed by a cooling plate in which a coolant such as cold water is circulated. A cooling device formed in the above is generally known.

Although such a cooling device is formed to cool electronic components mounted on a printed circuit board, there are components other than the electronic components mounted on the printed circuit board in the configuration of electronic equipment, and these components are If is a heating element, the surrounding temperature is raised and the cooling efficiency is lowered.

Therefore, in order to improve the cooling efficiency of the electronic components mounted on the printed circuit board, it is important to efficiently cool the heating element arranged near the printed circuit board.

[Prior Art] Conventionally, the structure was as shown in the perspective view of FIG.

For a printed circuit board on which a plurality of electronic components 2 are mounted,
Cooling plate 3 having substantially the same size as the outer shape of the printed circuit board 1
And the electronic component 2 via a flexible heat transfer member 5 fixed to a predetermined position of the cooling plate 3.
It is configured to be pressed against the surface of.

The cooling plate 3 is made of a good heat conductive material such as copper, aluminum, stainless steel, etc., and has a circulation passage internally provided for circulating the refrigerant.

Therefore, cold water is supplied from one port 4 of the cooling plate 3 in the direction of arrow A and is drained from the other port 4 in the direction of arrow B so that the cold water flows through the circulation path and cooling is performed.

In addition, a power supply bar 6 for supplying power is stretched from the power supply unit on the printed circuit board 1 so that power is supplied to each electronic component.

[Problems to be solved by the invention]

In such a configuration, the heat generated from the power supply bar 6 is cooled by natural convection, so that the temperature of the fixed printed circuit board 1 is increased.

Therefore, there is a problem that the printed circuit board 1 expands and contracts to lower the reliability of the pressure contact between the electronic component 2 and the heat transfer member 5, and further lowers the cooling capacity due to an increase in ambient temperature.

[Means for solving problems]

The above-mentioned problem is that the surface of the electronic component is brought into contact with one surface of the cooling plate, and is brought into contact with the predetermined surface of the heating element on the other surface of the cooling plate via an insulating coating made of a good heat conductive material. This is solved by the cooling structure according to the present invention.

[Action]

That is, an insulating coating having good thermal conductivity is formed on the outer peripheral surface of the cooling plate, and a heating element is brought into contact with the insulating coating through the insulating coating to cool the heating element.

According to this structure, the heating element such as the power supply bar arranged near the printed circuit board can be forcibly cooled by the cooling plate, and the above-mentioned decrease in the cooling capacity due to the heating element can be prevented.

〔Example〕

Hereinafter, the present invention will be described in detail with reference to one embodiment of FIGS. 1 and 2. FIG. 1 is a perspective view, and FIG. 2 is a sectional view of a main part. Note that the same reference numerals denote the same objects throughout the drawings.

As shown in FIG. 1, an insulating coating 8 is provided on a predetermined side surface of the cooling plate 3 so that a predetermined portion of the power source bar 7 as a heating element is brought into contact with the side surface of the cooling plate 3 provided with the insulating coating 8. The other parts have the same configuration as described above.

The insulating coating 8 is formed, for example, by firing a ceramic material, or by vapor-depositing a metal material and a rigid resin material, or by adhering a sheet-shaped member such as thin silicon rubber. It may be formed by, for example, and it is desirable that it has good thermal conductivity and is thin.

Therefore, as shown in the D-D cross-sectional view of FIG. 2, an abutting surface 7A that abuts the side surface of the cooling plate 3 is provided at a predetermined position of the power supply bar 7, and one end of the abutment surface 7A is fixed to the printed circuit board 1 with a screw 9. By being fixed, the contact surface 7A of the power supply bar 7 can be formed so as to contact the side surface of the cooling plate 3 on which the insulating coating 8 is provided.

With this configuration, the heat generated by the power supply bar 7 is transferred to the cooling plate 3 as indicated by an arrow C, and cooling is performed.

Further, it may be configured as shown in another embodiment of FIG. 4 (a), (b) and (c) are cross-sectional views of the main part.

FIG. 4 (a) shows a metal fitting for the power supply bar 7 and the cooling plate 3.
It is connected by 10. With this configuration, the contact via the insulating coating 8 can be more closely attached.

However, it is necessary to form the mounting hole of the metal fitting 10 in an oval shape in consideration of adjusting the positional deviation between the power supply bar 7 and the cooling plate 3 in connecting the metal fitting 10.

Further, in (b), a leaf spring 12 formed of a good heat conducting material is fixed to the power supply bar 7, and the metal fitting 11 is so attached that the tip end portion of the leaf spring 12 is pressed against the cooling plate 3 through the insulating coating 8. And the power supply bar 7 is shown in (c).
Is provided with a flexible bellows-shaped member 13 in which a heat conductive paste 14 is injected, and the member 13 is connected by a metal fitting 11 so that the member 13 is pressed against the cooling plate 3 via the insulating coating 8 as described above. It is a thing.

When connected like this (b) and (c), the above (a)
The power supply bar 7 and the cooling plate 3 are more flexible than the other, and they can be brought into contact with each other so as to absorb the positional deviation between them and ensure heat transfer.

If such an insulating coating 8 is provided on the entire outer circumference of the cooling plate 3, it is possible to cool the heating elements other than the power source bar 7 described above, and the same effect can be obtained.

Although the power supply bar is fixed on the printed board 1 in the above example, it may be fixed on a member different from the printed board 1.

〔The invention's effect〕

INDUSTRIAL APPLICABILITY As described above, the present invention provides an element other than a semiconductor element mounted on a printed board through an insulating coating on the side surface of a cooling plate, or another heating element not mounted on the printed board. Is formed so as to be cooled.

As a result, the cooling performance does not deteriorate due to the influence of the heating element arranged in the vicinity of the printed circuit board as in the prior art, and therefore stable cooling can be performed and the practical effect is great.

[Brief description of drawings]

1 and 2 show an embodiment of the present invention. FIG. 1 is a perspective view, FIG. 2 is a sectional view of an essential part, FIG. 3 is a conventional perspective view, and FIG. 4A, FIG. 4A, FIG. 4B, and FIG. 4C are cross-sectional views of essential parts. In the figure, 1 is a printed circuit board, 2 is an electronic component, 3 is a cooling plate, 4 is a port, 5 is a heat transfer member, 6 and 7 are power supply bars, 8 is an insulating film, 9 is a screw, 1
Reference numerals 0 and 11 are metal fittings, 12 is a leaf spring, 13 is a member, and 14 is a good heat conductive paste.

Claims (1)

[Claims] 1. A cooling structure for cooling an electronic component mounted on a printed circuit board by a cooling plate in which a cooling medium is circulated and a heating element arranged in the vicinity of the printed circuit board, wherein one surface of the cooling plate. The cooling structure is characterized in that the surface of the electronic component is brought into contact with the surface of the heating element, and the other surface of the cooling plate is brought into contact with a predetermined surface of the heating element via an insulating coating made of a good heat conductive material.