JPH0753302Y2 - Piezoelectric parts - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial application] The present invention relates to a piezoelectric component such as a piezoelectric resonator.

[Prior Art] An example of a conventional piezoelectric component of this type is shown in FIGS.
It is shown in FIG.

The above-mentioned piezoelectric component has electrodes 5 and 6 formed between two opposite sides 3 and 4 of one main surface 2 of a rectangular piezoelectric substrate 1 at intervals along the sides 3 and 4. On the other main surface 8 of the piezoelectric substrate 1, electrodes 11 and 12 facing the electrodes 5 and 6, respectively, and lead terminal mounting electrodes 13 outside the electrodes 11 and 12 are connected to each other by connection electrodes 7. , 14 are formed, and the element 15 is formed. The electrode 11 is connected to the lead terminal mounting electrode 13, and the electrode 12 is connected to the lead terminal mounting electrode 14.

The element 15 is a piezoelectric substrate 1 as shown in FIG.
The electrode 5 and the electrode 11 which are opposed to each other with the piezoelectric substrate 1 between them and the piezoelectric substrate 1 between the electrodes 5 form a two-terminal type resonator 16 having a vibration mode of energy trapping thickness slip or thickness vibration of the piezoelectric substrate 1. I am configuring. The electrode 6 and the electrode facing each other with the piezoelectric substrate 1 in between.
12 and the piezoelectric substrate 1 between them also constitute a two-terminal type resonator 17 having the same vibration mode as the resonator 16. Then, the element 15 is
These two resonators 16 and 17 have an equivalent circuit connected in series between the lead terminal mounting electrodes 13 and 14.

As shown in FIG. 6, on the lead terminal mounting electrodes 13 and 14 of the element 15, a lead terminal is drawn out to one side of a joint plate 18 having a constant width and solder 19 is attached to the surface in advance. 21,22 are placed. In addition, the piezoelectric substrate 1
As shown in FIG. 7, between the electrodes 5 and 6 on one main surface 2 of the main surface 2, a lead-shaped holding member is drawn out from the connecting plate 18 between the lead terminals 21 and 22. The tip portion 23a of the member 23 is arranged.

As a result, the element 15 is sandwiched and held between the lead terminals 21, 22 and the holding member 23. In this state, a soldering iron (not shown) is used or hot air is blown from the hot air tubes 24 and 25 to melt the solder 19 attached to the lead terminals 21 and 22, as shown in FIG. The lead terminals 21 and 22 are soldered to the lead terminal mounting electrodes 13 and 14, respectively. Then, the lead terminals 21 and 22 and the holding member 23 are separated from the coupling plate 18 at the position indicated by the chain double-dashed line m in FIG. When soldering the lead terminal mounting electrodes 13 and 14 of the element 15 and the lead terminals 21 and 22,
Since it is simply a member for holding the element 15, the holding member 23 is usually separated by the above-mentioned separation,
It is separated both from the element 15 and from the connecting plate 18. The element 15 is covered with resin or the like (not shown), leaving a space above the resonators 16 and 17 for allowing the vibration.

[Problems to be Solved by the Invention] In the piezoelectric component having the above-described configuration, the lead terminals 21 and 22 are coupled to the coupling plate 18 together with the holding member 23 and have a so-called hoop shape. When the solder 19 is attached to the lead terminals 21 and 22, the holding member 23 is also immersed in the molten solder together with the lead terminals 21 and 22, and the solder 19 is attached. Therefore, as shown in FIG. 6, the hot air tube 2
When hot air is blown to the lead terminals 21 and 22 from 4,25 to melt the solder 19 attached thereto, the hot air causes the holding member
It also hits 23, and the solder 19 attached to this holding member 23 also melts.

By the way, as shown in FIG. 7, the tip portion 23a of the holding member 23 is arranged between the electrodes 5 and 6 on one main surface 2 of the piezoelectric substrate 1 and connects these electrodes 5 and 6 to each other. It is located on the connection electrode 7 to be connected. Therefore, as described above, when the solder 19 attached to the holding member 23 is melted, the solder 19 is attached to the connection electrode 7 and the holding member 23 is soldered to the connection electrode 7, and thus the holding member 23 is held. Member 23
When separated from the connecting plate 18 (see FIG. 6), as shown in FIG. 8, there was a problem that the connection electrode 7 was separated at the contact position of the holding member 23.

Such a problem can be avoided by using a soldering iron when soldering the lead terminals 21 and 22. However, when a soldering iron is used, there is a problem that the efficiency of soldering the lead terminals 21 and 22 to the lead terminal mounting electrodes 13 and 14 is poor.

SUMMARY OF THE INVENTION An object of the present invention is to provide a piezoelectric component capable of efficiently soldering a lead terminal to a lead terminal mounting electrode of an element by a hot air method without peeling of a connection electrode due to soldering of a lead terminal.

[Means for Solving the Problems] Therefore, according to the present invention, an electrode formed between two opposite sides of one main surface of a piezoelectric substrate at intervals in a direction along these sides is formed by a connection electrode. While connected to each other,
The other main surface of the piezoelectric substrate is provided with an element in which electrodes facing the electrodes are formed and lead terminal mounting electrodes are formed outside the electrodes, respectively. Lead terminals to which solder is attached respectively are arranged in advance, tip ends of lead-shaped holding members are arranged between the electrodes on one main surface of the piezoelectric substrate, and the lead terminals are arranged between the lead terminals and the holding members. A piezoelectric component that holds an element between them and blows hot air to each of the lead terminals to melt the attached solder and solder it to a lead terminal mounting electrode, wherein the connection electrode is the tip of the holding member. It is characterized in that the electrodes on the one main surface side of the piezoelectric substrate are connected to each other while bypassing the portion.

[Operation] The tip of the holding member is arranged between the electrodes on one main surface of the piezoelectric substrate. However, the connection electrode connecting the electrodes to each other is formed so as to bypass the tip portion of the holding member. Therefore, the tip of the holding member and the connection electrode do not overlap.

According to the present invention, when a hot air is blown to each lead terminal to melt the solder attached to the lead terminal and solder it to the lead terminal mounting electrode, a holding member for holding the element together with the lead terminal is provided. Since the tip portion and the connecting electrode do not overlap, even if the solder adhered to the holding member is melted by hot air, the holding member is not soldered to the connecting electrode by the melted solder, and therefore the lead terminal by hot air is used. It is possible to completely prevent the connecting electrodes from peeling off during the soldering, and it is possible to solder the lead terminals efficiently by the hot air.

Embodiments Embodiments of the present invention will be described below with reference to the accompanying drawings.

1 and 2 are a plan view and a perspective view of an embodiment of a piezoelectric component according to the present invention viewed from two directions, respectively.

The element 31 of the piezoelectric component is the electrode 5, 6 formed on one main surface 2 of the piezoelectric substrate 1 in the piezoelectric component described in FIGS. 4 (a), 4 (b) and 6. The connecting electrode 7'for connecting the two is formed in a pattern shape that bypasses the tip portion 23a of the holding member 23 (see FIG. 3) arranged between the electrodes 5 and 6.

In FIGS. 1 and 2, parts corresponding to those in FIGS. 4 (a), 4 (b) and 6 are designated by corresponding reference numerals, and duplicate description will be omitted. .

With such a structure, as shown in FIG. 3, the holding member 23 has its tip portion 23a arranged between the electrodes 5 and 6 on the one main surface 2 side of the piezoelectric substrate 1. However, the connecting electrode 7'connecting the electrodes 5 and 6 to each other is
It is formed so as to bypass the tip end portion 23a of 3. Therefore, the tip portion 23a of the holding member 23 and the connecting electrode 7'do not overlap.

As a result, hot air is blown to the lead terminals 21 and 22 to melt the solder 19 adhering to the lead terminals 21 and 22 and the lead terminal mounting electrodes 13 and 1
When soldering to 4, the tip 23a of the holding member 23 that holds the element 15 together with the lead terminals 21 and 22 and the connecting electrode 7'do not overlap, so that the holding member 23 is heated by hot air.
Even if the solder 19 attached to the melts, the holding member 23 is not soldered to the connecting electrode 7'by the melted solder 19, and therefore, the connection is made when the lead terminals 21 and 22 are soldered by hot air. The electrode 7'is prevented from peeling off.

[Brief description of drawings]

1 is a plan view of an embodiment of the piezoelectric component according to the present invention, FIG. 2 is a perspective view of the piezoelectric component of FIG. 1, and FIG. 3 is a connecting electrode formed on an element of the piezoelectric component of FIG. And FIG. 4 (b) are plan views showing the electrode configuration of the elements used in the conventional piezoelectric component, and FIG. 5 (a) and FIG. 5 (b), respectively. Is an equivalent circuit diagram of an element having the electrode configuration shown in FIGS. 4 (a) and 4 (b), and FIG. 6 is a lead terminal soldered to the element of FIGS. 4 (a) and 4 (b). FIG. 7 is an explanatory view showing the relationship between the connection electrode formed on the elements of FIGS. 4 (a) and 4 (b) and the tip of the holding member, and FIG. 8 is a peeling diagram. It is explanatory drawing of the formed connection electrode. 1 ... Piezoelectric substrate, 2 ... Main surface, 3,4 ... Edge, 5,6 ... Electrode, 7,7 '... Connection electrode, 8 ... Main surface, 11, 12 ... Electrode, 13, 14 …… Lead terminal mounting electrode, 15 …… Element, 16,17 …… Resonator, 18 …… Coupling plate, 19 …… Solder, 21,
21 …… Lead terminal, 23 …… Holding member, 24,25 …… Hot air tube, 31 …… Element.

Claims (1)

[Scope of utility model registration request] 1. Electrodes formed between two opposing sides of one main surface of a piezoelectric substrate at intervals along a direction along these sides are connected to each other by a connection electrode, while the electrodes of the piezoelectric substrate are present. One main surface is provided with an element in which electrodes facing the above electrodes and lead terminal mounting electrodes are formed outside these electrodes, respectively, and solder is preliminarily attached onto the lead terminal mounting electrodes of this element. A lead-shaped holding member is arranged between the electrodes on one main surface of the piezoelectric substrate, and the element is sandwiched between the lead terminal and the holding member. Then, it is a piezoelectric component in which hot air is blown to each of the lead terminals to melt the attached solder and solder the lead terminals to the lead terminal mounting electrodes. A piezoelectric component, characterized in that the electrodes on the one main surface side of the piezoelectric substrate are detoured to be connected to each other.