JPH0752358A - Holding equipment of board of screen printer - Google Patents

Holding equipment of board of screen printer

Info

Publication number
JPH0752358A
JPH0752358A JP22285293A JP22285293A JPH0752358A JP H0752358 A JPH0752358 A JP H0752358A JP 22285293 A JP22285293 A JP 22285293A JP 22285293 A JP22285293 A JP 22285293A JP H0752358 A JPH0752358 A JP H0752358A
Authority
JP
Japan
Prior art keywords
backup
circuit board
printed circuit
block
elastic body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP22285293A
Other languages
Japanese (ja)
Inventor
Tomoyuki Hatakeyama
智之 畠山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Olympus Corp
Original Assignee
Olympus Optical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Olympus Optical Co Ltd filed Critical Olympus Optical Co Ltd
Priority to JP22285293A priority Critical patent/JPH0752358A/en
Publication of JPH0752358A publication Critical patent/JPH0752358A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing

Landscapes

  • Manufacturing Of Printed Wiring (AREA)
  • Screen Printers (AREA)
  • Coating Apparatus (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

PURPOSE:To enable execution of screen printing of excellent printing precision by providing a backup holding a printed circuit board, a recessed type backup block closing up the backup, and an elastic body being fitted fast on the top surface of the block and brought into close contact with the printed circuit board. CONSTITUTION:The lateral side and the upper side of a printed circuit board 1 are clamped by a support block 2 provided on a printing table 3. Besides, the lower side thereof is held by a backup 4a being an inactive liquid. This backup 4a is filled up in a backup block 5 formed in a recessed type by a liquid supply device 6. A through hole for supplying the backup 4a is provided in the support block 2 and, besides, an elastic body 7a to be brought into close contact with the printed circuit board 1 is fitted fast to the upper end of the backup block 5. When the printed circuit board 1 is carried onto the printing table 3, the backup block 5 rises, and when the elastic body 7a is brought into close contact with the lower side of the printed circuit board 1, the backup 4a is filled up so that the board be supported with an equal pressure.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、プリント基板に接着
剤、クリームハンダ等を印刷するプリント基板スクリー
ン印刷機の基板保持装置に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate holding device for a printed substrate screen printing machine that prints an adhesive, cream solder or the like on a printed substrate.

【0002】[0002]

【従来の技術】一般に、プリント基板スクリーン印刷機
の基板保持装置は、例えば実開昭63−138968号
公報に開示されているような構成となっている。すなわ
ち、同装置は、図4に示すように、プリント基板1の側
面及び上面をクランプするサポートブロック2を有する
印刷テーブル3と、印刷テーブル3上に位置し基板を下
面から支持するバックアップブロック4とから構成さ
れ、スクリーン印刷時にプリント基板を少なくとも2方
向から支持する構成が採られている。
2. Description of the Related Art Generally, a substrate holding device for a printed circuit board screen printing machine is constructed as disclosed in, for example, Japanese Utility Model Laid-Open No. 63-138968. That is, as shown in FIG. 4, the apparatus includes a printing table 3 having a support block 2 for clamping the side surface and the upper surface of the printed circuit board 1, and a backup block 4 positioned on the printing table 3 and supporting the substrate from the lower surface. And supports the printed circuit board from at least two directions during screen printing.

【0003】[0003]

【発明が解決しようとする課題】このような従来装置
は、プリント基板下面を複数のピンで押上げる方法と比
べると、プリント基板下面に部品等が存在し凹凸がある
場合に、その凹凸に応じてピン配置を変更する必要がな
いため工程が簡易になるという利点がある。しかし、プ
リント基板の縁部のみを圧接することとなり、基板の下
面全体を均一な圧力で支持することができないために、
基板の反りを完全に矯正することができず、印刷精度が
劣るという問題があった。
Compared with the method of pushing up the lower surface of the printed circuit board with a plurality of pins, such a conventional device responds to the unevenness when there are parts or the like on the lower surface of the printed circuit board. Since there is no need to change the pin arrangement by using the method, there is an advantage that the process is simplified. However, since only the edge of the printed circuit board is pressed, it is not possible to support the entire lower surface of the circuit board with uniform pressure.
There is a problem that the warp of the substrate cannot be completely corrected and the printing accuracy is poor.

【0004】本発明は、かかる従来の問題点に鑑みてな
されたもので、プリント基板下面に凹凸がある場合で
も、基板下面全体を均一な圧力で支持でき、印刷精度の
良いスクリーン印刷を可能とするプリント基板保持装置
を提供することを目的とする。
The present invention has been made in view of the above-mentioned conventional problems, and even when the lower surface of the printed board is uneven, the entire lower surface of the board can be supported by a uniform pressure, and screen printing with high printing accuracy can be performed. It is an object of the present invention to provide a printed circuit board holding device.

【0005】[0005]

【課題を解決するための手段】上記課題を解決するため
に、本発明は、プリント基板を保持するバックアップ
と、このバックアップを密閉する凹型のバックアップブ
ロックと、このバックアップブロック上面に固着されプ
リント基板と密着する弾性体とを設ける構成とした。ま
た、本発明は、バックアップブロックとプリント基板等
とで密閉された空間にバックアップを充填する供給装置
を設ける構成とした。
In order to solve the above problems, the present invention provides a backup for holding a printed circuit board, a concave backup block for sealing the backup, and a printed circuit board fixed to the upper surface of the backup block. An elastic body that is in close contact is provided. Further, the present invention is configured such that a supply device for filling the backup in a space sealed by the backup block and the printed circuit board is provided.

【0006】[0006]

【作用】上記構成により、プリント基板が印刷テーブル
上に搬入されると、バックアップブロックが上昇し、弾
性体とプリント基板下面が密着し、更に、プリント基板
とバックアップブロックとで密閉された空間にバックア
ップが充填されることにより、プリント基板下面全体が
均一の圧力で支持される。また、バックアップをバック
アップブロック内に充填するに際して供給装置を用いる
ことにより圧の設定を容易に行い得る。
With the above structure, when the printed circuit board is carried onto the printing table, the backup block rises to bring the elastic body and the lower surface of the printed circuit board into close contact with each other, and further back up to the space enclosed by the printed circuit board and the backup block. Is filled, the entire lower surface of the printed board is supported with a uniform pressure. Further, the pressure can be easily set by using the supply device when the backup is filled in the backup block.

【0007】[0007]

【第1実施例】図1は、本発明の第1実施例の概略構成
図である。図4に示した上記従来例と同一の部材は同一
番号を用いて説明する。プリント基板1は、印刷テーブ
ル3上に設けられたサポートブロック2により、その側
面及び上面がクランプされている。また、その下面はパ
ーフルオロトリアルキルアミン系の不活性液体であるバ
ックアップ4aにより保持されている。このバックアッ
プ4aは、凹型に形成されたバックアップブロック5内
に、液体供給装置である薬液定量ポンプ6によって充填
される。尚、サポートブロック2には、バックアップ4
a供給のための貫通口が設けられており、また、バック
アップブロック5上端にはシリコンゴム等で形成されプ
リント基板1に密着する弾性体7aが固着されている。
[First Embodiment] FIG. 1 is a schematic configuration diagram of a first embodiment of the present invention. The same members as those in the conventional example shown in FIG. 4 will be described using the same reference numerals. The side surface and the upper surface of the printed circuit board 1 are clamped by a support block 2 provided on a printing table 3. The lower surface thereof is held by a backup 4a which is a perfluorotrialkylamine-based inert liquid. The backup 4a is filled in the concave backup block 5 by a chemical solution metering pump 6 which is a liquid supply device. In addition, a backup 4 is included in the support block 2.
A through hole for supplying a is provided, and an elastic body 7a made of silicon rubber or the like and adhered to the printed circuit board 1 is fixed to the upper end of the backup block 5.

【0008】プリント基板1が印刷テーブル3上に搬入
されると、バックアップブロック5が上昇し、弾性体7
aとプリント基板1の下面とが密着する。次に、薬液定
量ポンプ6がプリント基板1とバックアップブロック5
とにより密閉された空間にバックアップ4aが充填さ
れ、プリント基板1下面全体を均等の圧力で支持するよ
うに働く。
When the printed circuit board 1 is carried onto the printing table 3, the backup block 5 rises and the elastic body 7
a and the lower surface of the printed circuit board 1 are in close contact with each other. Next, the chemical metering pump 6 is connected to the printed circuit board 1 and the backup block 5.
The backup space 4a is filled in the space sealed by and works so as to support the entire lower surface of the printed board 1 with a uniform pressure.

【0009】従って、プリント基板1の反りが矯正され
精度の良いスクリーン印刷が可能となる。本実施例で
は、特に、収縮しにくい不活性液体をバックアップとし
て用いているため、他の実施例に比べて基板支持力が強
いという効果がある。
Therefore, the warp of the printed circuit board 1 is corrected and the screen printing can be performed with high accuracy. In this embodiment, in particular, an inert liquid that does not easily shrink is used as a backup, and therefore, there is an effect that the substrate supporting force is stronger than in other embodiments.

【0010】[0010]

【第2実施例】図2は、本発明の第2実施例の概略構成
図である。プリント基板1の側面及び上面は、印刷テー
ブル3上に設けられたサポートブロック2によりクラン
プされている。また、プリント基板1の下面にはバック
アップブロック5内に予め充填されたバックアップ4b
が圧着しており、下面縁部にはバックアップブロック5
上端に個着された弾性体7aが密着している。上記第1
実施例との相違は、バックアップ4bがテフロン等の微
小な粒状体・粉粒体である点、及び、予め薬液定量ポン
プ6等のバックアップの供給装置を用いない点にある。
[Second Embodiment] FIG. 2 is a schematic configuration diagram of a second embodiment of the present invention. The side surface and the upper surface of the printed circuit board 1 are clamped by the support block 2 provided on the printing table 3. Further, on the lower surface of the printed circuit board 1, a backup 4b filled in advance in the backup block 5 is provided.
Is crimped, and backup block 5 is attached to the bottom edge.
The elastic body 7a individually attached to the upper end is in close contact. First above
The difference from the embodiment is that the backup 4b is a fine granular material or powdery material such as Teflon, and that the backup supply device such as the chemical solution metering pump 6 is not used in advance.

【0011】プリント基板1が印刷テーブル3上に搬入
されると、バックアップブロック5が上昇し、バックア
ップ4bと弾性体7aとがプリント基板1の下面全体に
密着する。よって、バックアップ4bはプリント基板1
下面全体を均等の圧力で支持するように働く。
When the printed board 1 is carried onto the printing table 3, the backup block 5 rises, and the backup 4b and the elastic body 7a come into close contact with the entire lower surface of the printed board 1. Therefore, the backup 4b is the printed circuit board 1
It works to support the entire lower surface with uniform pressure.

【0012】本実施例では、バックアップ4bとして固
体である微小な粒状体・粉粒体を用いているため、一定
の印刷回数毎にバックアップを補充する必要がない。従
って、他の実施例に比べて印刷工程におけるタクトを短
縮できるという効果がある。
In the present embodiment, since solid fine particles or powder are used as the backup 4b, it is not necessary to supplement the backup every fixed number of times of printing. Therefore, the tact in the printing process can be shortened as compared with the other embodiments.

【0013】[0013]

【第3実施例】図3は、本発明の第3実施例の概略構成
図である。プリント基板1の側面及び上面は、印刷テー
ブル3上に設けられたサポートブロック2によりクラン
プされている。一方、プリント基板1の下面には、バッ
クアップブロック5上端に固着された弾性体7bが密着
している。弾性体7bは、薬液定量ポンプ6によりバッ
クアップブロック5内に充填されたバックアップ4aに
より、一定の圧を受けている。弾性体7bの形状・構成
において、他の実施例と相違する。
[Third Embodiment] FIG. 3 is a schematic diagram of the third embodiment of the present invention. The side surface and the upper surface of the printed circuit board 1 are clamped by the support block 2 provided on the printing table 3. On the other hand, the elastic body 7b fixed to the upper end of the backup block 5 is in close contact with the lower surface of the printed circuit board 1. The elastic body 7b receives a certain pressure by the backup 4a filled in the backup block 5 by the chemical solution metering pump 6. The shape and configuration of the elastic body 7b differ from those of the other embodiments.

【0014】プリント基板1が印刷テーブル3上に搬入
されると、バックアップブロック5が上昇し、弾性体7
bがプリント基板1の下面全体に密着する。次に、弾性
体7bとバックアップブロック5とで密閉された空間に
薬液定量ポンプ6によりバックアップ4aが充填される
ことにより、弾性体7bが、部品が実装されているプリ
ント基板下面全体を均等の圧力で支持するように働く。
When the printed circuit board 1 is carried onto the printing table 3, the backup block 5 rises and the elastic body 7
b adheres to the entire lower surface of the printed circuit board 1. Then, the space sealed by the elastic body 7b and the backup block 5 is filled with the backup 4a by the chemical solution metering pump 6, so that the elastic body 7b uniformly presses the entire lower surface of the printed board on which the components are mounted. Work to support in.

【0015】本実施例によれば、弾性体7bがバックア
ップブロック5の上部開口全体を覆うため、スルーホー
ルを有する多層のプリント基板においても、バックアッ
プ4aがスルーホールから漏れることなく一定圧力でプ
リント基板を支持できるという効果がある。
According to this embodiment, since the elastic body 7b covers the entire upper opening of the backup block 5, even in a multilayer printed circuit board having a through hole, the backup 4a does not leak from the through hole and the printed circuit board is kept at a constant pressure. There is an effect that can support.

【0016】[0016]

【発明の効果】本発明によれば、凹型のバックアップブ
ロック内に充填されたバックアップによりプリント基板
下面を押圧することにより、基板下面全体を均一な圧力
で支持することができるため、プリント基板下面に凹凸
や反りがある場合でも、印刷精度の良いスクリーン印刷
を可能となる効果が得られる。
According to the present invention, by pressing the lower surface of the printed circuit board by the backup filled in the concave type backup block, the entire lower surface of the printed circuit board can be supported with a uniform pressure. Even if there is unevenness or warpage, it is possible to obtain the effect of enabling screen printing with good printing accuracy.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の従来例によるスクリーン印刷機の基板
保持装置の概略断面図である。
FIG. 1 is a schematic sectional view of a substrate holding device of a screen printing machine according to a conventional example of the present invention.

【図2】本発明の第1実施例によるスクリーン印刷機の
基板保持装置の概略断面図である。
FIG. 2 is a schematic sectional view of a substrate holding device of a screen printing machine according to a first embodiment of the present invention.

【図3】本発明の第2実施例によるスクリーン印刷機の
基板保持装置の概略断面図である。
FIG. 3 is a schematic sectional view of a substrate holding device of a screen printing machine according to a second embodiment of the present invention.

【図4】本発明の第3実施例によるスクリーン印刷機の
基板保持装置の概略断面図である。
FIG. 4 is a schematic sectional view of a substrate holding device of a screen printing machine according to a third embodiment of the present invention.

【符号の説明】[Explanation of symbols]

1 プリント基板 2 サポートブロック 3 印刷テーブル 4a,4b バックアップ 5 バックアップブロック 6 薬液定量ポンプ 7a,7b 弾性体 1 Printed circuit board 2 Support block 3 Printing table 4a, 4b Backup 5 Backup block 6 Chemical solution metering pump 7a, 7b Elastic body

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】 プリント基板に接着剤、クリームハンダ
等を印刷するプリント基板スクリーン印刷機において、
プリント基板を保持するバックアップと、このバックア
ップを密閉する凹型のバックアップブロックと、このバ
ックアップブロック上面に固着されプリント基板と密着
する弾性体とを有することを特徴とするスクリーン印刷
機の基板保持装置。
1. A printed circuit board screen printing machine for printing an adhesive, cream solder, etc. on a printed circuit board,
A substrate holding device for a screen printing machine, comprising: a backup that holds a printed circuit board; a concave backup block that seals the backup circuit; and an elastic body that is fixed to the upper surface of the backup block and is in close contact with the printed circuit board.
【請求項2】 バックアップブロック内に形成された空
間にバックアップを充填する供給装置を有する請求項1
記載のスクリーン印刷機の基板保持装置。
2. A supply device for filling the backup formed in the space formed in the backup block.
A substrate holding device for the screen printing machine described.
JP22285293A 1993-08-16 1993-08-16 Holding equipment of board of screen printer Withdrawn JPH0752358A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP22285293A JPH0752358A (en) 1993-08-16 1993-08-16 Holding equipment of board of screen printer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP22285293A JPH0752358A (en) 1993-08-16 1993-08-16 Holding equipment of board of screen printer

Publications (1)

Publication Number Publication Date
JPH0752358A true JPH0752358A (en) 1995-02-28

Family

ID=16788913

Family Applications (1)

Application Number Title Priority Date Filing Date
JP22285293A Withdrawn JPH0752358A (en) 1993-08-16 1993-08-16 Holding equipment of board of screen printer

Country Status (1)

Country Link
JP (1) JPH0752358A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012164855A (en) * 2011-02-08 2012-08-30 Denso Corp Method of manufacturing electronic device
AT510358B1 (en) * 2010-09-10 2015-07-15 Traktionssysteme Austria Gmbh PERMANENT MAGNETIC RUDDER ELECTRIC MACHINE
WO2022059178A1 (en) * 2020-09-18 2022-03-24 株式会社Fuji Substrate holding device and solder printing machine

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AT510358B1 (en) * 2010-09-10 2015-07-15 Traktionssysteme Austria Gmbh PERMANENT MAGNETIC RUDDER ELECTRIC MACHINE
JP2012164855A (en) * 2011-02-08 2012-08-30 Denso Corp Method of manufacturing electronic device
WO2022059178A1 (en) * 2020-09-18 2022-03-24 株式会社Fuji Substrate holding device and solder printing machine

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