JP3189811B2 - Method of supplying solder to CSP external terminal - Google Patents
Method of supplying solder to CSP external terminalInfo
- Publication number
- JP3189811B2 JP3189811B2 JP33626598A JP33626598A JP3189811B2 JP 3189811 B2 JP3189811 B2 JP 3189811B2 JP 33626598 A JP33626598 A JP 33626598A JP 33626598 A JP33626598 A JP 33626598A JP 3189811 B2 JP3189811 B2 JP 3189811B2
- Authority
- JP
- Japan
- Prior art keywords
- csp
- solder
- cream solder
- head
- external terminal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
Landscapes
- Wire Bonding (AREA)
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、ＣＳＰ（Ｃｈｉｐ
Ｓｉｚｅ Ｐａｃｋａｇｅ）外部端子への半田供給方
法に関する。The present invention relates to a CSP (Chip)
The present invention relates to a method for supplying solder to external terminals.
【０００２】[0002]
【従来の技術】従来、ＣＳＰのリペアの際には、取り替
えるＣＳＰを外した後、新たにＣＳＰを搭載する場合、
半田の供給は以下の３つの方法のいずれかが採られてい
る。その１は、リペア専用の個別のメタルマスクにより
直接、基板側へ印刷する。その２は、リペア専用の個別
のメタルマスクにより直接、ＣＳＰ外部端子へ印刷す
る。その３は、ディスペンスにより個々の基板パッドへ
供給する。2. Description of the Related Art Conventionally, when a CSP is repaired, a CSP to be replaced is removed, and then a new CSP is mounted.
The solder is supplied by any one of the following three methods. In the first method, printing is performed directly on the substrate using a separate metal mask dedicated to repair. In the second method, printing is performed directly on the CSP external terminal using a separate metal mask dedicated to repair. The third is dispensed to individual substrate pads.
【０００３】[0003]
【発明が解決しようとする課題】しかしながら、ＣＳＰ
外部端子の配列は、年々狭ピッチ化が進んできており、
０．５ｍｍピッチ程度の狭いピッチの場合は、上述の１
または２の従来方法では、高い位置合わせ精度が必要に
なるため作業が困難である。また、上述の３の従来方法
では、個々の端子１つ１つに半田を供給するため、長い
作業時間を要するという問題がある。したがって、本発
明の目的は、狭いピッチの外部端子への半田供給を簡易
に、かつ、短時間に行なえるＣＳＰ外部端子への半田供
給方法を提供することにある。However, the CSP
The pitch of the external terminals has been narrowing year by year,
In the case of a narrow pitch of about 0.5 mm,
In the second conventional method, high alignment accuracy is required, so that the operation is difficult. Further, in the above-mentioned three conventional methods, there is a problem that a long working time is required because the solder is supplied to each of the individual terminals. Accordingly, an object of the present invention is to provide a method for supplying solder to CSP external terminals that can easily and quickly supply solder to external terminals having a narrow pitch.
【０００４】[0004]
【課題を解決するための手段】そこで、本発明のＣＳＰ
外部端子への半田供給方法は、水平なステージに設置さ
れた半田膜プレート上にクリーム半田膜を形成する手順
と、ＣＳＰ裏面をヘッド表面へ全面接触させ、該へッド
の中央部を前記ヘッド表面と垂直に貫通する吸着穴から
真空引きすることによりＣＳＰを前記へッドへ吸着固定
させる手順と、この状態で、前記接触面を前記ステージ
の表面との水平を維持しつつ前記ヘッドを垂直に降下さ
せ、前記クリーム半田膜へＣＳＰ外部端子を押し込む手
順と、ＣＳＰ外部端子ヘクリーム半田が付着するとへッ
ドを上昇させて、ＣＳＰ外部端子をクリーム半田膜から
引き離す手順とを有することを特徴とする。Accordingly, a CSP of the present invention is provided.
The method of supplying the solder to the external terminals includes the steps of forming a cream solder film on a solder film plate placed on a horizontal stage, bringing the CSP back surface into full contact with the head surface, and connecting the center of the head to the head. A procedure in which the CSP is suction-fixed to the head by evacuating from a suction hole penetrating perpendicular to the surface, and in this state, the head is vertically moved while maintaining the contact surface horizontal with the surface of the stage. And pressing the CSP external terminal into the cream solder film, and lifting the head when the cream solder adheres to the CSP external terminal, and separating the CSP external terminal from the cream solder film. I do.
【０００５】[0005]
【発明の実施の形態】次に、本発明の実施の形態につい
て説明する。ＣＳＰのリペアは、通常、次のように行な
う。すなわち、ＣＳＰを実装後に導通試験を行ない、導
通不良となったＣＳＰを個別に加熱し接続部半田を溶か
して基板から取り外す。取り外した後、基板パッド表面
をクリーニングする。その後、パッド表面または新たに
搭載するＣＳＰ外部端子表面にクリーム半田を供給す
る。そして、再び基板とＣＳＰを位置合わせし、個別加
熱を行ない、新しいＣＳＰを基板へ搭載し、リペアが完
成する。Next, an embodiment of the present invention will be described. CSP repair is usually performed as follows. That is, a continuity test is performed after the CSP is mounted, and the CSPs having the continuity failure are individually heated to melt the connection portion solder, and then removed from the board. After removal, the surface of the substrate pad is cleaned. Thereafter, cream solder is supplied to the pad surface or the surface of the newly mounted CSP external terminal. Then, the substrate and the CSP are again positioned, individually heated, a new CSP is mounted on the substrate, and the repair is completed.
【０００６】本発明は、上述のリペア工程において、新
たに搭載するＣＳＰ外部端子表面にクリーム半田を供給
する新規な方法を提供するものである。The present invention provides a new method of supplying cream solder to the surface of a newly mounted CSP external terminal in the above-described repair process.
【０００７】図１は、本発明のＣＳＰ外部端子への半田
供給方法の工程と、それに使用する工具を説明するため
の図を示す。図１において、ヘッドの中央部には、その
表面と垂直にヘッドを貫通する吸着穴１が設けられてお
り、この吸着穴１から真空引きすることによって、ヘッ
ド表面に裏面を全面接触させたＣＳＰ３をへッドに吸着
固定するようになっている。また、ヘッド２は、ステー
ジ７の表面と平行を保ったまま、鉛直に上下できるよう
になっている。FIG. 1 is a view for explaining steps of a method for supplying solder to CSP external terminals according to the present invention and a tool used for the method. In FIG. 1, a suction hole 1 is provided at the center of the head and penetrates the head perpendicularly to the front surface of the head. Is fixed to the head by suction. Also, the head 2 can be moved up and down vertically while keeping the surface parallel to the surface of the stage 7.
【０００８】次に、本発明のＣＳＰ外部端子４への半田
供給方法の手順について説明する。先ず、水平なステー
ジ上の半田膜プレート６上に、通常のクリーム印刷と同
様に、メタルマスクとスキージを用いて、クリーム半田
膜５を形成する。形成するクリーム半田膜５の厚さは、
メタルマスクの厚さにより調整することができる。次
に、ＣＳＰ３の裏面をヘッド２の表面へ接触させ、吸着
穴１から真空引きすることによりＣＳＰ３をヘッド２に
吸着固定させる。そして、この状態でＣＳＰ３とヘッド
２の接触面をステージ７の表面との水平を維持しつつ、
へッド２を鉛直に降下させ（図１（ａ））、ＣＳＰ外部
端子４をクリーム半田膜５へ押し込む（図１（ｂ））。
最後に、ＣＳＰ外部端子４にクリーム半田８が付着する
と、ヘッド２を上昇させて、ＣＳＰ外部端子４をクリー
ム半田膜５から引き離す（図１（ｃ））。Next, a procedure of a method for supplying solder to the CSP external terminal 4 according to the present invention will be described. First, a cream solder film 5 is formed on a solder film plate 6 on a horizontal stage using a metal mask and a squeegee as in the case of ordinary cream printing. The thickness of the cream solder film 5 to be formed is
It can be adjusted by the thickness of the metal mask. Next, the back surface of the CSP 3 is brought into contact with the front surface of the head 2, and the CSP 3 is suction-fixed to the head 2 by evacuating from the suction hole 1. In this state, while keeping the contact surface between the CSP 3 and the head 2 horizontal with the surface of the stage 7,
The head 2 is lowered vertically (FIG. 1A), and the CSP external terminals 4 are pushed into the cream solder film 5 (FIG. 1B).
Finally, when the cream solder 8 adheres to the CSP external terminal 4, the head 2 is raised to separate the CSP external terminal 4 from the cream solder film 5 (FIG. 1 (c)).
【０００９】以上のような手順により、ＣＳＰ外部端子
４に半田が粘着し、クリーム半田８が供給されることに
なる。ＣＳＰ外部端子４へ付着するクリーム半田８の付
着量は、クリーム半田８に含まれる半田粒径またはフラ
ックス粘度を変えることにより調整できる。また、使用
するメタルマスクの厚さを変えてクリーム半田膜５の厚
さを変えてもよい。According to the above procedure, the solder adheres to the CSP external terminal 4 and the cream solder 8 is supplied. The amount of the cream solder 8 attached to the CSP external terminal 4 can be adjusted by changing the particle size or the flux viscosity of the solder contained in the cream solder 8. Further, the thickness of the cream solder film 5 may be changed by changing the thickness of the metal mask used.
【００１０】ところで、一般に、ＣＳＰ外部端子４の取
り付け高さは、一定ではなく、ある範囲で、高さばらつ
き（コプラナリテー）がある。たとえば、図２（ａ）に
示すように、高さばらつきがあると、ＣＳＰ外部端子４
をクリーム半田膜５へ押し込んだときに、ＣＳＰ外部端
子４ごとにクリーム半田膜５に埋まる深さが異なり、供
給される半田量も異なってくる。In general, the mounting height of the CSP external terminal 4 is not constant, and there is a variation in height (coplanarity) within a certain range. For example, as shown in FIG.
Is pushed into the cream solder film 5, the depth of burying in the cream solder film 5 differs for each CSP external terminal 4, and the amount of supplied solder also differs.
【００１１】このような不具合の対策としては、半田膜
プレート６にエラストマ、ゴム等の弾性体を用いるとよ
い。このようにすると、図２（ｂ）に示すように、高さ
ばらつきの影響を無くし、どのＣＳＰ外部端子４もクリ
ーム半田膜５に埋まる深さが一定となり、供給される半
田量のばらつきをなくすことができる。As a countermeasure against such a problem, it is preferable to use an elastic material such as an elastomer or rubber for the solder film plate 6. In this way, as shown in FIG. 2B, the influence of the height variation is eliminated, and the depth at which any CSP external terminal 4 is buried in the cream solder film 5 becomes constant, and the variation in the supplied amount of solder is eliminated. be able to.
【００１２】[0012]
【発明の効果】以上に説明したとおり、本発明によれ
ば、高精度の位置決めを行なうことなく、簡易に狭ピッ
チのＣＳＰ外部端子への半田供給が可能となる。また、
一回の動作で一括して全てのＣＳＰ外部端子への半田供
給が可能であり、タクト時間の短縮効果が得られる。As described above, according to the present invention, it is possible to easily supply solder to narrow-pitch CSP external terminals without performing high-precision positioning. Also,
Solder can be supplied to all CSP external terminals all at once by one operation, and the effect of shortening the tact time can be obtained.
【図１】 本発明のＣＳＰ外部端子への半田供給方法の
一実施例を説明するための図である。FIG. 1 is a diagram for explaining an embodiment of a method for supplying solder to CSP external terminals according to the present invention.
【図２】 本発明のＣＳＰ外部端子への半田供給方法の
他の実施例を説明するための図である。FIG. 2 is a diagram for explaining another embodiment of the method of supplying solder to CSP external terminals according to the present invention.
【符号の説明】 １ 吸着穴 ２ へッド ３ ＣＳＰ ４ ＣＳＰ外部端子 ５ クリーム半田膜 ６ 半田膜プレート ７ ステージ ８ クリーム半田[Description of Signs] 1 Suction hole 2 Head 3 CSP 4 CSP external terminal 5 Cream solder film 6 Solder film plate 7 Stage 8 Cream solder
Claims (3)
マ、ゴム等の弾性体からなる半田膜プレート上にクリー
ム半田膜を形成する手順と、 ＣＳＰ裏面をヘッド表面へ全面接触させ、該ヘッドの中
央部を吸着穴から真空引きすることによりＣＳＰを前記
ヘッドへ吸着固定させる手順と、 この状態で、前記接触面を前記ステージの裏面との水平
を維持しつつ前記ヘッドを垂直に降下させ、前記クリー
ム半田膜へＣＳＰ外部端子を押し込む手順と、 ＣＳＰ外部端子へクリーム半田が付着するとヘッドを上
昇させて、ＣＳＰ外部端子をクリーム半田膜から引き離
す手順とを有することを特徴とするＣＳＰ外部端子への
半田供給方法。1. An elastometer which is set on a horizontal stage.
On a solder film plate made of an elastic material such as
A procedure for forming a solder paste film , and bringing the CSP back surface into full contact with the front surface of the head.
The CSP is extracted by vacuuming the center from the suction hole.
A step of adsorbing and fixing to the head, a step of lowering the head vertically while keeping the contact surface horizontal with the back surface of the stage, and pushing a CSP external terminal into the cream solder film; A method of raising the head when the cream solder adheres to the terminal and separating the CSP external terminal from the cream solder film.
マスクの厚さにより調整する請求項１記載のＣＳＰ外部
端子への半田供給方法。2. The method according to claim 2, wherein the thickness of said cream solder film is
2. The method for supplying solder to external terminals of a CSP according to claim 1, wherein the method is adjusted by the thickness of the mask .
当該クリーム半田に含まれる半田粒径またはフラックス
粘度を変え、あるいは前記メタルマスクの厚さを変え、
クリーム半田膜の厚さを変えることにより調整する請求
項１記載のＣＳＰ外部端子への半田供給方法。3. The amount of the attached cream solder is:
Solder particle size or flux contained in the cream solder
Change the viscosity, or change the thickness of the metal mask,
2. The method according to claim 1, wherein the adjustment is performed by changing the thickness of the cream solder film .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP33626598A JP3189811B2 (en) | 1998-11-26 | 1998-11-26 | Method of supplying solder to CSP external terminal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP33626598A JP3189811B2 (en) | 1998-11-26 | 1998-11-26 | Method of supplying solder to CSP external terminal |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2000164641A JP2000164641A (en) | 2000-06-16 |
| JP3189811B2 true JP3189811B2 (en) | 2001-07-16 |
Family
ID=18297335
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP33626598A Expired - Fee Related JP3189811B2 (en) | 1998-11-26 | 1998-11-26 | Method of supplying solder to CSP external terminal |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3189811B2 (en) |
-
1998
- 1998-11-26 JP JP33626598A patent/JP3189811B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2000164641A (en) | 2000-06-16 |
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