JPH0751870A - Laser beam machine - Google Patents

Laser beam machine

Info

Publication number
JPH0751870A
JPH0751870A JP5203934A JP20393493A JPH0751870A JP H0751870 A JPH0751870 A JP H0751870A JP 5203934 A JP5203934 A JP 5203934A JP 20393493 A JP20393493 A JP 20393493A JP H0751870 A JPH0751870 A JP H0751870A
Authority
JP
Japan
Prior art keywords
laser
condenser lens
processing apparatus
temperature
detected
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP5203934A
Other languages
Japanese (ja)
Other versions
JP2812157B2 (en
Inventor
Haruhide Tamura
東英 田村
Hirosuke Katayama
裕亮 形山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP5203934A priority Critical patent/JP2812157B2/en
Publication of JPH0751870A publication Critical patent/JPH0751870A/en
Application granted granted Critical
Publication of JP2812157B2 publication Critical patent/JP2812157B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Landscapes

  • Laser Beam Processing (AREA)
  • Lasers (AREA)

Abstract

PURPOSE:To provide a device capable of surely making check, maintenance, display and control at the time of a failure of optical parts such as condenser lens of a processing head an resonator mirrors of a laser oscillator. CONSTITUTION:An electric conductivity is detected at all times through an electric conductivity detector 15 from a conductive material 14 stuck to the condenser lens 4 held in an insulating holder 25 and the PR mirror 11 and TR mirror 12 of the resonator of the laser oscillator 1 and, therefore, the electric conductivity degrades and the fault of the condenser lens 4 is detected in case of the deterioration and failure of the condenser lens 4. Since the electric conductivity detector 15 and a controller 6 are wired, the irradiation with lens light 2 is stopped when the detected signal is processed by the controller 6 and then, the fault is detected from the condenser lens 4. As a result, the failure of the optical parts, such as condenser lens 4 of the processing head and resonator mirrors of the laser oscillator, is monitored at all times and there is an effect of safely executing the processing.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】この発明は、レーザ加工装置の加
工ヘッドの集光レンズやレーザ発振器の共振器ミラー等
の光学部品の破損時における対策に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to countermeasures against damage to optical components such as a condenser lens of a processing head of a laser processing apparatus and a resonator mirror of a laser oscillator.

【0002】[0002]

【従来の技術】図10は例えば特開昭60−66226
号公報に示された従来のレーザ加工装置の構成図であ
り、2はレーザ光、4は集光レンズ、20は汚れ検出用
レーザ光、21は汚れ検出用レーザ光20の発振器、2
2は集光レンズ4による汚れ検出用レーザ光20の反射
光を検出する光量検出装置、23は汚れ検出用レーザ光
20の電源、24は汚れ検出用レーザ光20の光量比較
回路を示す。
2. Description of the Related Art FIG. 10 shows, for example, JP-A-60-66226.
FIG. 1 is a configuration diagram of a conventional laser processing apparatus disclosed in Japanese Patent Publication No. 2 (1994), 2 is laser light, 4 is a condenser lens, 20 is dirt detection laser light, 21 is dirt detection laser light 20 oscillator, and 2 is
Reference numeral 2 is a light amount detecting device for detecting the reflected light of the dirt detecting laser light 20 by the condenser lens 4, 23 is a power source of the dirt detecting laser light 20, and 24 is a light quantity comparing circuit of the dirt detecting laser light 20.

【0003】次に動作について説明する。汚れ検出用レ
ーザ光20を集光レンズ4に照射し、集光レンズ4の表
面に当たり反射する光を光検出器で検出する。検出され
た反射光の比較によりレンズ表面の汚れを検出する。こ
こでは検出用レーザ光20の反射成分を検出したが、加
工用レーザ光の反射成分を検出する方法も成立する。
Next, the operation will be described. The dirt detection laser beam 20 is applied to the condenser lens 4, and the light that hits the surface of the condenser lens 4 and is reflected is detected by the photodetector. The dirt on the lens surface is detected by comparing the detected reflected light. Although the reflection component of the detection laser light 20 is detected here, a method of detecting the reflection component of the processing laser light is also valid.

【0004】[0004]

【発明が解決しようとする課題】従来のレーザ加工装置
は以上のように構成されているので、検出手段が光であ
るが故に、検出空間(加工ヘッド)内の諸変化(雰囲気
温度あるいはアシストガスの圧力変化、乱流、渦などの
アシストガスの流れの変化)に対して光が屈折、発散す
るので反射光検出が正確に出来ない。また、加工ヘッド
内に検出装置(光源、受光素子)を配設するための余分
な空間が必要になり加工ヘッド自体が大きくなる。さら
に、検出値で演算し、制御装置へ指令するための演算回
路が必要であり、検出装置及び制御演算回路のコストが
高価となる。また、光源が切れてしまったり、光源にス
パッタ、塵埃等が付着し、光源としての機能が損なうな
どの問題点があった。
Since the conventional laser processing apparatus is constructed as described above, various changes (atmosphere temperature or assist gas) in the detection space (processing head) are caused because the detection means is light. The reflected light cannot be accurately detected because the light is refracted and diverged in response to pressure changes, changes in the flow of assist gas such as turbulence, and vortices. Further, an extra space for disposing the detection device (light source, light receiving element) is required in the processing head, and the processing head itself becomes large. Further, an arithmetic circuit for performing an arithmetic operation with the detected value and instructing the control device is required, which increases the cost of the detection device and the control arithmetic circuit. In addition, there are problems that the light source is cut off, spatter, dust and the like adhere to the light source, and the function as the light source is impaired.

【0005】この発明は上記のような問題点を解決する
ためになされたもので、加工ヘッドの集光レンズやレー
ザ発振器の共振器ミラー等の光学部品の破損時における
確認、保全、制御等ができるレーザ加工装置を得ること
を目的とする。
The present invention has been made in order to solve the above-mentioned problems, and it is possible to perform confirmation, maintenance, control and the like when an optical component such as a condenser lens of a processing head or a resonator mirror of a laser oscillator is damaged. The purpose is to obtain a laser processing device that can perform.

【0006】[0006]

【課題を解決するための手段】この発明に係るレーザ加
工装置は、レーザ発振器により出力されたレーザ光を集
光して被加工物に照射し、所望の加工を行うレーザ加工
装置であって、上記レーザ加工装置は、レーザ光を発振
させる光学部材として共振器ミラーを有するとともに、
レーザ光を高エネルギ密度に集光する光学部材として集
光レンズを有し、上記光学部材に、導電性材料を付与
し、上記導電性材料の導電度を検出する導電性材料を含
めて構成される導電度検出手段を具備するものである。
A laser processing apparatus according to the present invention is a laser processing apparatus for converging a laser beam output from a laser oscillator and irradiating the object to be processed to perform desired processing. The laser processing device has a resonator mirror as an optical member for oscillating laser light,
It has a condensing lens as an optical member for condensing laser light at a high energy density, and is configured to include a conductive material for applying a conductive material to the optical member and detecting the conductivity of the conductive material. It is provided with a conductivity detecting means.

【0007】また、レーザ発振器により出力されたレー
ザ光を集光して被加工物に照射し、所望の加工を行うレ
ーザ加工装置であって、上記レーザ加工装置を構成する
レーザ光を高エネルギ密度に集光する集光レンズと被加
工物との間に温度検出手段を設け、上記温度検出手段に
より検出された温度が所定の温度に達すると動作を停止
するものである。
A laser processing apparatus for converging laser light output from a laser oscillator and irradiating the object to be processed to perform desired processing, wherein the laser light forming the laser processing apparatus has a high energy density. The temperature detecting means is provided between the condensing lens for condensing the light and the workpiece, and the operation is stopped when the temperature detected by the temperature detecting means reaches a predetermined temperature.

【0008】また、上記集光レンズに異常がないとき
に、上記温度検出手段が検出する温度範囲を記憶してお
き、上記記憶された温度と検出された温度とを比較演算
することにより、レーザ発振器の出力を制御する制御手
段を備えたものである。
Further, when there is no abnormality in the condenser lens, the temperature range detected by the temperature detecting means is stored, and the stored temperature is compared with the detected temperature to calculate the laser. A control means for controlling the output of the oscillator is provided.

【0009】また、レーザ発振器により出力されたレー
ザ光を集光して被加工物に照射し、所望の加工を行うレ
ーザ加工装置であって、上記レーザ加工装置を構成する
レーザ光を高エネルギ密度に集光する集光レンズと被加
工物との間に複数の温度検出手段を上記集光レンズの周
辺に対称に配置し、集光レンズの熱分布状況を検出する
ものである。
Further, the laser processing apparatus is a laser processing apparatus for converging a laser beam output from a laser oscillator and irradiating the object to be processed to perform desired processing, wherein the laser beam constituting the laser processing apparatus has a high energy density. A plurality of temperature detecting means are symmetrically arranged around the condensing lens between the condensing lens for condensing the light and the object to be processed, and the heat distribution state of the condensing lens is detected.

【0010】[0010]

【作用】この発明におけるレーザ加工装置は、集光レン
ズの外周に導電性材料を付着させ、導電体の導電度を検
出できる加工ヘッドを備えたことにより集光レンズに劣
化、破損、亀裂が生じた場合、上記導電度の程度により
集光レンズの異常を感知することができる。また、同様
にレーザ発振器の共振器ミラーについて導電体を付着さ
せ、導電度検出装置により常時導電度を検出することに
より劣化・破損した場合、導電度が低下し、異常を感知
することができる。
In the laser processing apparatus according to the present invention, the condensing lens is deteriorated, damaged, or cracked by attaching a conductive material to the outer periphery of the condensing lens and providing a processing head capable of detecting the conductivity of the conductor. In this case, the abnormality of the condenser lens can be detected by the degree of conductivity. Similarly, when a conductor is attached to the resonator mirror of the laser oscillator, and the conductivity is constantly detected by the conductivity detector, if the conductor is deteriorated or damaged, the conductivity is lowered and an abnormality can be sensed.

【0011】また、レーザ光の集光レンズと被加工物の
間に温度センサを装備した加工ヘッドを備えたことによ
り集光レンズが支障を来たしその作用をせずレーザ光が
集光されない場合、温度センサがレーザ光を検出して正
常検出値に対して上昇し、所定の温度に達すると動作
し、集光レンズの異常を感知することができる。また、
レーザ光が加工ヘッドに正常に入射されず、加工ヘッド
の一部に当った場合、レーザ光により熱が伝導し温度が
上昇すると、センサが上記と同様に異常を感知すること
ができる。
Further, when a processing head equipped with a temperature sensor is provided between the condensing lens for laser light and the workpiece, the condensing lens interferes with its operation and the laser light is not condensed. The temperature sensor detects the laser light, rises above the normal detection value, operates when reaching a predetermined temperature, and can detect an abnormality of the condenser lens. Also,
When the laser light is not normally incident on the processing head and hits a part of the processing head, heat is conducted by the laser light and the temperature rises, so that the sensor can detect an abnormality in the same manner as described above.

【0012】また、レーザ加工装置において、たとえ集
光レンズが破損にまで到らない状態であっても加工ヘッ
ド内の環境の変化などにより集光レンズ自体の熱吸収率
が高くなり温度上昇が生じた場合でもあらかじめ正常に
加工可能な集光レンズでの温度領域を制御装置に記憶さ
せ、現検出温度との比較を行なう事により加工を継続し
たり、又上記温度領域からはずれた時にレーザ光を停止
したり、あるいはレーザ光の出力を制御する機能を備え
たことにより集光レンズの状態に応じた制御を可能とし
た。
Further, in the laser processing apparatus, even if the condenser lens is not damaged, the heat absorption rate of the condenser lens itself increases and the temperature rises due to changes in the environment inside the machining head. Even if the temperature is too high, the temperature range of the condenser lens that can be processed normally is stored in the control device in advance and the processing is continued by comparing it with the current detected temperature. By providing a function of stopping or controlling the output of the laser light, it is possible to perform control according to the state of the condenser lens.

【0013】また、集光レンズの周囲に複数の温度セン
サを対称に取付けたことで、各々の温度センサが各点で
の温度を検出し、その温度を比較、演算することで集光
レンズの温度分布を検出することができる。
Further, by mounting a plurality of temperature sensors symmetrically around the condenser lens, each temperature sensor detects the temperature at each point, and the temperatures are compared and calculated to calculate the temperature of the condenser lens. The temperature distribution can be detected.

【0014】[0014]

【実施例】【Example】

実施例1.以下、この発明の実施例1について説明す
る。図1はレーザ加工装置の構成図を示し1はレーザ発
振器、2はレーザ光、3は加工ヘッド、4は集光レン
ズ、5は加工テーブル、6は制御装置、7は反射鏡、8
は被加工物、9は加工ヘッド3の先端のノズル、10は
加工アシストガス、11はレーザ発振器1に装備され外
部と接しレーザ光2の取出部となるPRミラー、12は
PRミラー11の反射鏡7となるTRミラー、残りの符
号は後述の図で説明する。図2はレーザ発振器1内ミラ
ー構成図を示し、13はレーザ光2を発生するための発
振器1の共振器、14は集光レンズ4、PRミラー1
1、TRミラー12等の光学部材の外周に塗布された金
属粒子等の導電性塗布材あるいは外周にコーティングさ
れた導電性樹脂材等の導電性材料、15は導電度検出装
置。図3は集光レンズ4、PRミラー11、TRミラー
12等の光学部品16のレーザ光の光軸方向から見た図
である。図4は加工ヘッド3の断面図を示す。25は集
光レンズ4を保持し、金属製ボディである加工ヘッド3
から絶縁するための絶縁ホルダであり、図2においてP
Rミラー11、TRミラー12を保持しるものである。
図7はこの実施例の回路概略図であり、26は導電性材
料14の抵抗を測るための電流源となる出力ユニット、
27は導電性材料14負荷後の電流値を検出する電流検
出器、28が電源電流(設定電流)と導電性材料14負
荷後の電流値を比較する比較器、30は比較後異常があ
る場合レーザ加工装置を停止する遮断器である。
Example 1. The first embodiment of the present invention will be described below. FIG. 1 is a block diagram of a laser processing apparatus. 1 is a laser oscillator, 2 is laser light, 3 is a processing head, 4 is a condenser lens, 5 is a processing table, 6 is a controller, 7 is a reflecting mirror, and 8 is a reflecting mirror.
Is a workpiece, 9 is a nozzle at the tip of the processing head 3, 10 is a processing assist gas, 11 is a PR mirror which is provided in the laser oscillator 1 and is in contact with the outside and serves as an extraction part of the laser beam 2, and 12 is a reflection of the PR mirror 11. The TR mirror serving as the mirror 7 and the remaining symbols will be described later with reference to the drawings. FIG. 2 shows a mirror configuration diagram inside the laser oscillator 1, 13 is a resonator of the oscillator 1 for generating the laser beam 2, 14 is a condenser lens 4, and PR mirror 1
1, a conductive material such as a metal particle coated on the outer circumference of an optical member such as the TR mirror 12 or a conductive material such as a conductive resin material coated on the outer circumference, and 15 a conductivity detecting device. FIG. 3 is a view seen from the optical axis direction of the laser light of the optical component 16 such as the condenser lens 4, the PR mirror 11, and the TR mirror 12. FIG. 4 shows a sectional view of the processing head 3. 25 is a processing head 3 that holds the condenser lens 4 and is a metal body.
It is an insulating holder for insulating from
It holds the R mirror 11 and the TR mirror 12.
FIG. 7 is a schematic circuit diagram of this embodiment, in which an output unit 26 serves as a current source for measuring the resistance of the conductive material 14,
Reference numeral 27 is a current detector that detects the current value after the conductive material 14 is loaded, 28 is a comparator that compares the power supply current (set current) with the current value after the conductive material 14 is loaded, and 30 is an abnormality after the comparison. It is a circuit breaker that stops the laser processing device.

【0015】絶縁ホルダ25に保持された集光レンズ4
に図3の様に付着させた導電性材料14から導電度検出
装置15を通し、常時導電度を検出しているため、集光
レンズ4が劣化し破損した場合、導電度が低下し、集光
レンズ4の異常を感知する。また、同様にレーザ発振器
1の共振器13についても図3の様に付着させた導電性
材料14から導電度検出装置15を通し図7の回路によ
り、常時導電度を検出しているため、PRミラー11・
TRミラー12が劣化破損した場合、導電度が低下し、
PRミラー11・TRミラー12の異常を感知する。
Condensing lens 4 held by insulating holder 25
As shown in FIG. 3, the conductivity is constantly detected from the conductive material 14 attached as shown in FIG. 3, so that when the condenser lens 4 is deteriorated and damaged, the conductivity is reduced and The abnormality of the optical lens 4 is detected. Similarly, for the resonator 13 of the laser oscillator 1, the conductivity is constantly detected by the circuit of FIG. 7 from the conductive material 14 attached as shown in FIG. Mirror 11
When the TR mirror 12 is deteriorated and damaged, the conductivity decreases,
The abnormality of the PR mirror 11 and the TR mirror 12 is detected.

【0016】また、導電度検出装置15で検出された検
出信号を制御装置6に入力し、検出信号を制御装置6で
処理し、集光レンズ4より異常が感知された場合、レー
ザ光2の照射を停止する。
Further, when a detection signal detected by the conductivity detecting device 15 is input to the control device 6 and the detection signal is processed by the control device 6 and an abnormality is sensed by the condenser lens 4, the laser beam 2 is detected. Stop irradiation.

【0017】図1の内18は他の装置である。検出信号
を制御装置6を介して他の装置18例えばレーザ加工装
置の周辺機器(支援機器)であるワーク搬出・搬入装置
に送ることにより加工異常に対する安全対策を起動させ
ることができる。また、前記周辺機器だけではなくレー
ザ加工装置とシステム化された装置においては、システ
ム全体の停止ができる。
Reference numeral 18 in FIG. 1 denotes another device. By sending the detection signal to another device 18 such as a peripheral device (supporting device) of the laser processing apparatus, that is, a work unloading / carrying-in device via the control device 6, it is possible to activate a safety measure against a processing abnormality. Further, not only the peripheral equipment but also the apparatus systematized with the laser processing apparatus can stop the entire system.

【0018】図1の内17は制御装置6のディスプレイ
画面である。導電度検出装置15と制御装置6が配線さ
れているため、検出信号を制御装置6で処理し、集光レ
ンズ4の異常を制御装置6のディスプレイ画面17に表
示することができる。
Reference numeral 17 in FIG. 1 denotes a display screen of the control device 6. Since the conductivity detecting device 15 and the control device 6 are wired, the detection signal can be processed by the control device 6 and the abnormality of the condenser lens 4 can be displayed on the display screen 17 of the control device 6.

【0019】実施例2.この発明の実施例2について説
明する。図5は集光レンズ4の破損時の状態を示す。1
9は集光レンズ4とノズル9の間に設置された温度セン
サ。
Example 2. A second embodiment of the present invention will be described. FIG. 5 shows a state when the condenser lens 4 is broken. 1
9 is a temperature sensor installed between the condenser lens 4 and the nozzle 9.

【0020】レーザ加工で使用され、一定の加工時間が
経過すると集光レンズ4が劣化し破損した場合、レーザ
光2は集光されず、加工ヘッド3に入射したままの大き
さで加工ヘッド3の先端部のノズル9まで到達すること
になり、図5に示す様に集光レンズ4とノズル9の間に
設置された温度センサ19に熱が伝わり感知する。ま
た、レーザ光2が加工ヘッド3に正常に入射されず、加
工ヘッド3の一部に当った場合、レーザ光2の熱が伝導
し、温度が上昇し、温度センサ19が動作する。いずれ
にしても温度センサ19は設定温度に達すると動作し導
通がオフする。この信号により制御装置が異常を表示・
伝達する。
When the condenser lens 4 is used for laser processing and is deteriorated and damaged after a lapse of a certain processing time, the laser beam 2 is not condensed, and the processing head 3 has the same size as it is incident on the processing head 3. As a result, heat reaches the nozzle 9 at the tip of the nozzle, and heat is transmitted to and sensed by the temperature sensor 19 installed between the condenser lens 4 and the nozzle 9, as shown in FIG. When the laser light 2 is not normally incident on the processing head 3 and hits a part of the processing head 3, the heat of the laser light 2 is conducted, the temperature rises, and the temperature sensor 19 operates. In any case, the temperature sensor 19 operates when the set temperature is reached and the conduction is turned off. This signal causes the controller to display an error.
introduce.

【0021】実施例3.この発明の実施例3について説
明する。図8は実施例3の回路概略図である。26は導
電性材料14の抵抗を測るための電流源となる出力ユニ
ット、27は導電性材料14負荷後の電流値を検出する
電流検出器、28が電源電流(設定電流)と導電性材料
14負荷後の電流値を比較する比較器、32は比較器か
らの数値により発振器の出力値を制御する発振器制御装
置である。
Example 3. A third embodiment of the present invention will be described. FIG. 8 is a schematic circuit diagram of the third embodiment. 26 is an output unit that serves as a current source for measuring the resistance of the conductive material 14, 27 is a current detector that detects a current value after the conductive material 14 is loaded, and 28 is a power supply current (set current) and the conductive material 14 A comparator for comparing the current value after loading, and 32 is an oscillator control device for controlling the output value of the oscillator by the numerical value from the comparator.

【0022】レーザ加工装置において集光レンズ4が破
損にまで到らない状態であっても加工ヘッド3内の環境
の変化などにより集光レンズ4自体の熱吸収率が高くな
り温度上昇が生じた場合でも、図8の回路によりあらか
じめ正常に加工可能な集光レンズ4での温度領域を制御
装置6に記憶させ、現検出温度との比較を行なう事によ
り加工を継続したり、又上記温度領域からはずれた時に
レーザ光2を停止したり、あるいはレーザ光2の出力を
制御する制御装置6により集光レンズ4の状態に応じた
より適切な制御をする。
In the laser processing apparatus, even if the condenser lens 4 is not damaged, the heat absorption rate of the condenser lens 4 itself is increased due to a change in the environment inside the processing head 3 and the temperature is increased. Even in such a case, the temperature region in the condenser lens 4 which can be normally processed by the circuit of FIG. 8 is stored in the control device 6 in advance, and the processing is continued by comparing it with the current detected temperature, or the temperature region is changed. When the laser beam 2 deviates from the above, the laser beam 2 is stopped, or a control device 6 for controlling the output of the laser beam 2 performs more appropriate control according to the state of the condenser lens 4.

【0023】実施例4.この発明の実施例4について説
明する。図6は実施例1におけるレーザ加工装置に温度
センサ19を兼ね備えた加工ヘッド3を示す。図9は、
実施例4の回路概略図である。26は導電性材料14の
抵抗を測るための電流源となる出力ユニット、27は導
電性材料14負荷後の電流値を検出する電流検出器、2
8が電源電流(設定電流)と導電性材料14負荷後の電
流値を比較する比較器、29は比較器からの数値を演算
し高温度点を算出する演算器、31は演算器からのデー
タを表示するための画面を制御する画面制御系である。
Example 4. A fourth embodiment of the present invention will be described. FIG. 6 shows the processing head 3 in which the temperature sensor 19 is combined with the laser processing apparatus in the first embodiment. Figure 9
9 is a circuit schematic diagram of Embodiment 4. FIG. 26 is an output unit which serves as a current source for measuring the resistance of the conductive material 14, 27 is a current detector for detecting the current value after the conductive material 14 is loaded, 2
8 is a comparator for comparing the power supply current (set current) with the current value after the conductive material 14 is loaded, 29 is a calculator for calculating the high temperature point by calculating the numerical value from the comparator, 31 is data from the calculator Is a screen control system for controlling the screen for displaying.

【0024】集光レンズ4の周囲に複数の温度センサ1
9を対称となる様に取付たことで各々の温度センサ19
が図9に示す様な回路により各点での温度を検出し、そ
の温度を比較・演算することで最も高温度とされる点を
算出することで集光レンズ4の温度状態及び熱分布状況
を観測する。又導電性材料14にも近接しているため温
度センサ19に異常温度(導電性材料の正常導通動作範
囲内)を設定し導電性材料14の危険温度に対する検出
も合わせて行なうことができる。
A plurality of temperature sensors 1 are arranged around the condenser lens 4.
By mounting 9 in a symmetrical manner, each temperature sensor 19
Detects the temperature at each point by a circuit as shown in FIG. 9 and compares / calculates the temperatures to calculate the highest temperature point, thereby obtaining the temperature state and heat distribution state of the condenser lens 4. To observe. Further, since it is also close to the conductive material 14, it is possible to set an abnormal temperature (within the normal conduction operation range of the conductive material) in the temperature sensor 19 and also detect the dangerous temperature of the conductive material 14.

【0025】[0025]

【発明の効果】以上のように、この発明によれば、加工
ヘッドの集光レンズやレーザ発振器の共振器ミラー等の
光学部材に導電度を検出する素子が密着しているためガ
ス等の媒体による影響がなく光学部材のレーザ光の集光
性能を明確に監視することができ、また加工ヘッド自体
に過大な装置を付随しなくてもよい効果がある。
As described above, according to the present invention, since the element for detecting the conductivity is in close contact with the optical member such as the condenser lens of the processing head and the resonator mirror of the laser oscillator, the medium such as gas. There is an effect that the converging performance of the laser light of the optical member can be clearly monitored without being affected by the above, and that the processing head itself does not need to have an excessive device.

【0026】また、レーザ光の集光レンズと被加工物と
の間に温度センサを設けることにより、集光レンズに、
支障がある場合直ちに対応し温度センサが異常を検知
し、安全に加工できる効果がある。
Further, by providing a temperature sensor between the laser light condenser lens and the workpiece, the condenser lens can be
If there is a problem, the temperature sensor responds immediately and the temperature sensor detects the abnormality, which has the effect of enabling safe processing.

【0027】また、加工条件と共に集光レンズの温度に
も対応して発振器の出力を制御し良好なレーザ加工が行
える効果がある。
Further, the output of the oscillator is controlled in accordance with the temperature of the condenser lens as well as the processing conditions, so that an excellent laser processing can be performed.

【0028】また、集光レンズの周囲に複数の温度セン
サを対称となるように配置することにより、集光レンズ
の熱分布状況を検出する効果がある。
Further, by disposing a plurality of temperature sensors symmetrically around the condenser lens, there is an effect of detecting the heat distribution state of the condenser lens.

【図面の簡単な説明】[Brief description of drawings]

【図1】この発明の実施例によるレーザ加工装置の構成
図である。
FIG. 1 is a configuration diagram of a laser processing apparatus according to an embodiment of the present invention.

【図2】この発明の実施例1によるレーザ発振器のミラ
ー構成図である。
FIG. 2 is a mirror configuration diagram of the laser oscillator according to the first embodiment of the present invention.

【図3】この発明の実施例1による光学部材詳細図であ
る。
FIG. 3 is a detailed view of an optical member according to Embodiment 1 of the present invention.

【図4】この発明の実施例1によるレーザ加工装置の加
工ヘッドの断面図である。
FIG. 4 is a sectional view of a processing head of the laser processing apparatus according to the first embodiment of the present invention.

【図5】この発明の実施例2による加工ヘッドの構成図
である。
FIG. 5 is a configuration diagram of a processing head according to a second embodiment of the present invention.

【図6】この発明の実施例4による加工ヘッドの構成図
である。
FIG. 6 is a configuration diagram of a processing head according to a fourth embodiment of the present invention.

【図7】この発明の実施例1による回路概略図である。FIG. 7 is a schematic diagram of a circuit according to the first embodiment of the present invention.

【図8】この発明の実施例3による回路概略図である。FIG. 8 is a circuit schematic diagram according to a third embodiment of the present invention.

【図9】この発明の実施例4による回路概略図である。FIG. 9 is a circuit schematic diagram according to a fourth embodiment of the present invention.

【図10】従来のレーザ加工装置の構成図である。FIG. 10 is a configuration diagram of a conventional laser processing apparatus.

【符号の説明】[Explanation of symbols]

1 レーザ発振器 2 レーザ光 3 加工ヘッド 4 集光レンズ 5 加工テーブル 6 制御装置 7 反射鏡 8 被加工物 9 ノズル 10 加工アシストガス 11 PRミラー 12 TRミラー 13 共振器 14 導電性材料 15 導電度検出装置 16 光学部材 17 ディスプレイ画面 18 他の装置 19 温度センサ 20 汚れ検出用レーザ光 21 汚れ検出用レーザ光の発振器 22 光量検出装置 23 汚れ検出用レーザ光の電源 24 光量比較回路 25 絶縁ホルダ 26 出力ユニット 27 電流検出器 28 比較器 29 演算器 30 遮断器 31 画面制御系 32 発振器制御装置 1 Laser Oscillator 2 Laser Light 3 Processing Head 4 Condensing Lens 5 Processing Table 6 Controller 7 Reflector 8 Workpiece 9 Nozzle 10 Processing Assist Gas 11 PR Mirror 12 TR Mirror 13 Resonator 14 Conductive Material 15 Conductivity Detector Reference Signs List 16 optical member 17 display screen 18 other device 19 temperature sensor 20 contamination detection laser light 21 contamination detection laser light oscillator 22 light intensity detection device 23 contamination detection laser light power supply 24 light intensity comparison circuit 25 insulation holder 26 output unit 27 Current detector 28 Comparator 29 Computing device 30 Circuit breaker 31 Screen control system 32 Oscillator control device

───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.6 識別記号 庁内整理番号 FI 技術表示箇所 H01S 3/08 ─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. 6 Identification code Internal reference number FI technical display location H01S 3/08

Claims (4)

【特許請求の範囲】[Claims] 【請求項1】 レーザ発振器により出力されたレーザ光
を集光して被加工物に照射し、所望の加工を行うレーザ
加工装置であって、上記レーザ加工装置は、レーザ光を
発振させる光学部材として共振器ミラーを有するととも
に、レーザ光を高エネルギ密度に集光する光学部材とし
て集光レンズを有し、上記光学部材に、導電性材料を付
与し、上記導電性材料の導電度を検出する導電性材料を
含めて構成される導電度検出手段を具備することを特徴
とするレーザ加工装置。
1. A laser processing apparatus for condensing laser light output from a laser oscillator and irradiating a workpiece to perform desired processing, wherein the laser processing apparatus is an optical member for oscillating laser light. And a condenser lens as an optical member for condensing laser light at a high energy density, and a conductive material is applied to the optical member to detect the conductivity of the conductive material. A laser processing apparatus comprising: a conductivity detecting unit configured to include a conductive material.
【請求項2】 レーザ発振器により出力されたレーザ光
を集光して被加工物に照射し、所望の加工を行うレーザ
加工装置であって、上記レーザ加工装置を構成するレー
ザ光を高エネルギ密度に集光する集光レンズと被加工物
との間に温度検出手段を設け、上記温度検出手段により
検出された温度が所定の温度に達すると動作を停止する
ことを特徴とするレーザ加工装置。
2. A laser processing apparatus for converging laser light output from a laser oscillator and irradiating a workpiece to perform desired processing, wherein the laser light constituting the laser processing apparatus has high energy density. A laser processing apparatus, characterized in that temperature detecting means is provided between a condensing lens for condensing light onto a workpiece and a workpiece, and the operation is stopped when the temperature detected by the temperature detecting means reaches a predetermined temperature.
【請求項3】 上記集光レンズに異常がないときに、上
記温度検出手段が検出する温度範囲を記憶しておき、上
記記憶された温度と検出された温度とを比較演算するこ
とにより、レーザ発振器の出力を制御する制御手段を備
えたことを特徴とする特許請求の範囲第2項記載のレー
ザ加工装置。
3. When the condenser lens has no abnormality, the temperature range detected by the temperature detecting means is stored, and the stored temperature and the detected temperature are compared and calculated to obtain a laser beam. The laser processing apparatus according to claim 2, further comprising control means for controlling the output of the oscillator.
【請求項4】 レーザ発振器により出力されたレーザ光
を集光して被加工物に照射し、所望の加工を行うレーザ
加工装置であって、上記レーザ加工装置を構成するレー
ザ光を高エネルギ密度に集光する集光レンズと被加工物
との間に複数の温度検出手段を上記集光レンズの周辺に
対称に配置し、集光レンズの熱分布状況を検出すること
を特徴とするレーザ加工装置。
4. A laser processing apparatus for converging laser light output from a laser oscillator and irradiating a workpiece to perform desired processing, wherein the laser light constituting the laser processing apparatus has high energy density. Laser processing characterized in that a plurality of temperature detecting means are symmetrically arranged around the condensing lens between the condensing lens for condensing the light onto the workpiece and the workpiece, and the heat distribution state of the condensing lens is detected. apparatus.
JP5203934A 1993-08-18 1993-08-18 Laser processing equipment Expired - Fee Related JP2812157B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5203934A JP2812157B2 (en) 1993-08-18 1993-08-18 Laser processing equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5203934A JP2812157B2 (en) 1993-08-18 1993-08-18 Laser processing equipment

Publications (2)

Publication Number Publication Date
JPH0751870A true JPH0751870A (en) 1995-02-28
JP2812157B2 JP2812157B2 (en) 1998-10-22

Family

ID=16482113

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5203934A Expired - Fee Related JP2812157B2 (en) 1993-08-18 1993-08-18 Laser processing equipment

Country Status (1)

Country Link
JP (1) JP2812157B2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012024808A (en) * 2010-07-23 2012-02-09 Miyachi Technos Corp Scanning type laser beam machining apparatus
KR101422932B1 (en) * 2011-11-24 2014-07-24 미쓰비시덴키 가부시키가이샤 Lens unit and laser processing apparatus
US9393643B2 (en) 2011-06-29 2016-07-19 Trumpf Werkzeugmaschinen Gmbh + Co. Kg Optical element of a laser material-processing machine

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55114488A (en) * 1979-02-26 1980-09-03 Sumitomo Electric Ind Ltd Laser working apparatus with lens failure detector
JPS60247489A (en) * 1984-05-24 1985-12-07 Mitsubishi Electric Corp Laser beam machining equipment
JPS62142484U (en) * 1986-02-28 1987-09-08
JPS6316889A (en) * 1986-07-07 1988-01-23 Mitsubishi Electric Corp Laser light abnormality monitoring device
JPS6393492A (en) * 1986-10-06 1988-04-23 Mitsubishi Electric Corp Condenser lens controller for laser beam processing

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55114488A (en) * 1979-02-26 1980-09-03 Sumitomo Electric Ind Ltd Laser working apparatus with lens failure detector
JPS60247489A (en) * 1984-05-24 1985-12-07 Mitsubishi Electric Corp Laser beam machining equipment
JPS62142484U (en) * 1986-02-28 1987-09-08
JPS6316889A (en) * 1986-07-07 1988-01-23 Mitsubishi Electric Corp Laser light abnormality monitoring device
JPS6393492A (en) * 1986-10-06 1988-04-23 Mitsubishi Electric Corp Condenser lens controller for laser beam processing

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012024808A (en) * 2010-07-23 2012-02-09 Miyachi Technos Corp Scanning type laser beam machining apparatus
US9393643B2 (en) 2011-06-29 2016-07-19 Trumpf Werkzeugmaschinen Gmbh + Co. Kg Optical element of a laser material-processing machine
KR101422932B1 (en) * 2011-11-24 2014-07-24 미쓰비시덴키 가부시키가이샤 Lens unit and laser processing apparatus

Also Published As

Publication number Publication date
JP2812157B2 (en) 1998-10-22

Similar Documents

Publication Publication Date Title
JP5043316B2 (en) Laser processing monitoring device
JP2002361452A (en) Method for measuring extent of staining of protective glass of laser beam machining head, and laser beam machining system for performing the method
JP2006247681A (en) Monitoring device for laser beam machining
US5991319A (en) Mirror failure detector for high power lasers
AU2003293268A1 (en) Method and system for weld process monitoring
KR20140022821A (en) Machine and method for the material processing of workpieces by way of a laser beam
JP2771569B2 (en) Laser processing equipment
JPH0751870A (en) Laser beam machine
CN112098046B (en) Detection system and detection method of semiconductor laser
US6934017B2 (en) Method and device for detection of information on optical elements, particularly for monitoring a laser arrangement
CN110091052B (en) Evaluation device, evaluation method, and display device
JP2002361451A (en) Method for measuring deterioration of lens array of laser beam machining head and extent of deterioration of laser beam machining head
JPH04167990A (en) Device for adjusting focal distance
JP3385218B2 (en) Laser beam optical axis deviation detector
JP4204384B2 (en) Laser equipment
JP2820939B2 (en) NC laser device
JP2947641B2 (en) Laser oscillator output monitoring method and apparatus
JPS6330192A (en) Laser beam machine with laser output detector
JPH01291477A (en) Nc laser equipment
Corder et al. High power laser beam delivery monitoring for laser safety
JPH04115582A (en) Laser
CN115389166A (en) Fault monitoring method for reflector of laser galvanometer
JP2000042771A (en) Method of detecting disconnection of optical fiber, for laser beam and laser beam machine
JP2001183256A (en) Coating film inspection apparatus and inspection method
JPH02263583A (en) Laser beam machine

Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees