JPH04167990A - Device for adjusting focal distance - Google Patents
Device for adjusting focal distanceInfo
- Publication number
- JPH04167990A JPH04167990A JP2291101A JP29110190A JPH04167990A JP H04167990 A JPH04167990 A JP H04167990A JP 2291101 A JP2291101 A JP 2291101A JP 29110190 A JP29110190 A JP 29110190A JP H04167990 A JPH04167990 A JP H04167990A
- Authority
- JP
- Japan
- Prior art keywords
- lens
- temp
- focal distance
- focal length
- temperature
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001514 detection method Methods 0.000 claims abstract description 22
- 238000000034 method Methods 0.000 abstract description 4
- 239000000463 material Substances 0.000 abstract description 2
- 230000000694 effects Effects 0.000 description 11
- 238000010586 diagram Methods 0.000 description 6
- 238000010521 absorption reaction Methods 0.000 description 3
- 238000000605 extraction Methods 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 239000000779 smoke Substances 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Abstract
Description
【発明の詳細な説明】
［産業上の利用分野］
この発明は、レーザ光を集光し、集光されたレーザ光の
エネルギーにより被加工物を加工する焦点距離調整装置
に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a focal length adjustment device that focuses laser light and processes a workpiece using the energy of the focused laser light.
［従来の技術］
レーザ加工機において、レーザ光が加工レンズを通過す
ると表面の汚れ、レンズの吸収率の差等によりレンズの
温度が上昇する。その結果、レンズに熱膨張及び材質の
屈折率の変化が生じ焦点距離が変化するいわゆる熱レン
ズ作用が生じる。この焦点距離の変化を修正するものと
して、焦点距離調整装置がある。[Prior Art] In a laser processing machine, when a laser beam passes through a processing lens, the temperature of the lens increases due to dirt on the surface, a difference in absorption rate of the lens, and the like. As a result, the lens undergoes thermal expansion and changes in the refractive index of its material, resulting in a so-called thermal lens effect in which the focal length changes. There is a focal length adjustment device that corrects this change in focal length.
第６図は特開平２−６０９３号公報に示された従来の焦
点距離調整装置を示す構成図である。FIG. 6 is a block diagram showing a conventional focal length adjustment device disclosed in Japanese Patent Application Laid-Open No. 2-6093.
図中、（１）は平行光線のレーザ光、（２）はレーザ光
ｆｉ＋を集光するための熱レンズ作用を生じる加工レン
ズ、（３）はレーザ光（１）によって加工される被加工
物、（１４）は加工レンズ（２）を取付けるレンズマウ
ント、 ＋１５１は加工レンズ（２）等の保護と加工さ
れる点の雰囲気を清浄にし、被加工物（３）の酸化を防
ぐためのアシストガス、（１６）はアシストガス（１５
）をガイドするためのヘッド、（１７）はレンズマウン
ト（１４）とヘッド（１６）を介する伸縮自在の金属ジ
ャバラ、（１８）は遠赤外線を検出する第１の開封温度
センサ、（１９）は同様の第２の開封温度センサ、（２
０）は第１及び第２の開封温度センサ（１８１，＋１９
１ を移動可能とした移動ステージ、（２１）はレンズ
マウント（１４）を上下に移動させる上下装置、（２２
）は上下装置（２１）を駆動するパルスモータ、（２月
は第１及び第２の開封温度センサｆ１８＋、 ＋１９１
の出力電圧をマイクロコンピュータ（図示せず）に入力
する入力配線、（２９）はマイクロコンピュータの演算
結果によって上下装置（２１）を上下する指令をパルス
モータに与える出力配線、（３３）はレーザ光（１１が
被加工物（３）によって反射された反射光である。In the figure, (1) is a parallel laser beam, (2) is a processing lens that produces a thermal lens effect to focus the laser beam fi+, and (3) is the workpiece to be processed by the laser beam (1). , (14) is a lens mount for attaching the processing lens (2), and +151 is an assist gas for protecting the processing lens (2), etc., cleaning the atmosphere at the point being processed, and preventing oxidation of the workpiece (3). , (16) is the assist gas (15
), (17) is a telescopic metal bellows that passes through the lens mount (14) and the head (16), (18) is the first unsealed temperature sensor that detects far infrared rays, and (19) is the A similar second unsealed temperature sensor, (2
0) are the first and second unsealed temperature sensors (181, +19
1 is a movable stage, (21) is a vertical device that moves the lens mount (14) up and down, (22)
) is a pulse motor that drives the vertical device (21), (in February, the first and second unsealed temperature sensors f18+, +191
(29) is an output wire that gives commands to the pulse motor to raise and lower the vertical device (21) according to the calculation results of the microcomputer, (33) is a laser beam. (11 is the reflected light reflected by the workpiece (3).
次に動作について説明する。Next, the operation will be explained.
今、作業者が被加工物（３）をヘッド（１６）の前に設
置する。レーザ加工機のスイッチを投入すると、加工レ
ンズ（２）の焦点距離が最適となるようパルスモーク（
２２）が駆動し上下装置（２１）を動作させる。Now, the operator places the workpiece (3) in front of the head (16). When the laser processing machine is turned on, the pulse smoke (
22) is driven to operate the up and down device (21).
次に、被加工物（３）の加工を開始させると、レーザ光
（１１は、加工レンズ（２）を通過して集光し被加工物
（３）を加工する。ここで、レーザ光（１１が、加工レ
ンズ（２）を通過することによって加工レンズ（２）の
光の吸収率が増加する。このため加工レンズ（２）自体
の温度が上昇する。従って、加工レンズ（２）が熱を生
じるため赤外線を周囲に放射する。放射した赤外線のう
ち、遠赤外線を第１及び第２の開封温度センサ（１８）
、（１９）によって加工レンズ（２）の全面をスキャン
ニングして各ポイントの温度を測定する。各ポイントの
測定データは配線（２月を通して熱解析ソフトを有する
マイクロコンピュータへ入力され、その結果、マイクロ
コンビニーりは、レンズの熱変形量を演算し該熱変形量
から焦点距離変化量を演算し、その結果を制御指令とし
配線（２９）を通してパルスモーク（２２）を駆動する
。パルスモータ（２２）により上下装置（２１）は、レ
ンズマウント（１４）を上下してレンズの位置をレーザ
光（１１の焦点が常に被加工物上に結ぶよう制御する。Next, when processing of the workpiece (3) is started, the laser beam (11) passes through the processing lens (2) and is focused to process the workpiece (3). 11 passes through the processing lens (2), the absorption rate of light of the processing lens (2) increases. Therefore, the temperature of the processing lens (2) itself increases. Therefore, the processing lens (2) Infrared rays are emitted to the surroundings to generate a
, (19) to scan the entire surface of the processed lens (2) and measure the temperature at each point. The measurement data at each point is input to a microcomputer with thermal analysis software through the wiring (February), and as a result, the microcomputer calculates the amount of thermal deformation of the lens and calculates the amount of change in focal length from the amount of thermal deformation. The result is used as a control command to drive the pulse smoke (22) through the wiring (29).The pulse motor (22) causes the up and down device (21) to move the lens mount (14) up and down to adjust the position of the lens using the laser beam. (Control is performed so that the focal point of No. 11 is always focused on the workpiece.
［発明が解決しようとする課題］
従来のレーザ加工機における焦点距離調整装置は加工レ
ンズ（２）の温度を第１及び第２の開封温度センサ（１
８）、（１９）によって検出していたため、被加工物（
３）がレーザ光（１１を反射し易い金属等の場合、被加
工物（３）からの反射光（３３）が加工レンズ（２）を
通過し、第１及び第２の開封温度センサｆ１８１． ＋
１９＋を誤動作させたり該センサー自身を破損させると
いう問題点があった。[Problems to be Solved by the Invention] A focal length adjustment device in a conventional laser processing machine measures the temperature of a processing lens (2) using first and second unsealing temperature sensors (1).
8) and (19), the workpiece (
3) is a metal or the like that easily reflects the laser beam (11), the reflected light (33) from the workpiece (3) passes through the processing lens (2), and the first and second unsealing temperature sensors f181. +
There was a problem that the 19+ could malfunction or the sensor itself could be damaged.
本発明は、かかる問題点を解決するためになされたもの
で、被加工物がレーザ光を反射しやすい金属等であって
も加工レンズの温度をより正確に検出することによって
、自動的に被加工物と加工レンズとの最適な焦点距離を
得るレーザ加工機の焦点距離調整装置を提供しようとす
るものである。The present invention was made to solve this problem, and even if the workpiece is a metal or the like that easily reflects laser light, the temperature of the processing lens can be detected more accurately to automatically prevent the workpiece from being exposed. It is an object of the present invention to provide a focal length adjustment device for a laser processing machine that obtains an optimal focal length between a workpiece and a processing lens.
この発明に係る焦点距離調整装置は、レーザ光を通過さ
せるレンズと、上記レンズに接触式の温度検出素子を取
付けた温度検出手段と、上記温度検出手段の情報によっ
て熱変形量を演算し、焦点距離変化量を演算する演算回
路と、上記演算回路の指令によって焦点距離を調整する
上下移動装置とを有するようにしたものである。A focal length adjustment device according to the present invention includes a lens that allows laser light to pass through, a temperature detection means in which a contact type temperature detection element is attached to the lens, and an amount of thermal deformation calculated based on information from the temperature detection means, and a focus This apparatus includes an arithmetic circuit that calculates the amount of change in distance, and a vertical movement device that adjusts the focal length according to a command from the arithmetic circuit.
上記のように構成された焦点距離調整装置は熱レンズ作
用を有するレンズを接触式の温度検出手段によって該レ
ンズの温度を検出し、演算回路によって該レンズの熱変
形量を演算させ、その演算結果の指令に基づき上下装置
を移動させるようにしたので、より正確な焦点距離の自
動調整をすることができる。The focal length adjustment device configured as described above detects the temperature of a lens having a thermal lens effect using a contact temperature detection means, calculates the amount of thermal deformation of the lens using a calculation circuit, and calculates the result of the calculation. Since the vertical device is moved based on the command, it is possible to automatically adjust the focal length more accurately.
［発明の実施例］
この発明の第１の一実施例を第１図、第２図により説明
する。図中、従来例と同じ符号で示されたものは、従来
例のそれと同一もしくは同等なものを示す、第１図は、
焦点距離調整装置の構成図である。[Embodiment of the Invention] A first embodiment of the invention will be described with reference to FIGS. 1 and 2. In the figure, the same reference numerals as in the conventional example indicate the same or equivalent elements as in the conventional example.
FIG. 2 is a configuration diagram of a focal length adjustment device.
（６）はレーザ光（１）を発生させるレーザ発振器、（
４）はレーザ光（１）を取り出す部分反射鏡、（５）は
レーザ光＋１１ を反射し方向を変化させる反射鏡、（
７）は加工レンズ（２）の温度を検出する温度検出手段
であり加工レンズ（２）の温度を直接検出しレーザ光ｆ
ｉｌが通過しない箇所に取付けている。−般に、レーザ
光ｆｉｌが通過しない部分は加工レンズ（２）の端とな
る。従って本実施例においてもレンズ端に温度検出素子
を取付けている。一般に温度検出素子（７）は接触式の
熱電対、あるいは温度によって抵抗が変化する白金抵抗
線、サーミスク等を用いる。(6) is a laser oscillator that generates laser light (1), (
4) is a partial reflecting mirror that takes out the laser beam (1), (5) is a reflecting mirror that reflects the laser beam +11 and changes its direction, (
7) is a temperature detection means for detecting the temperature of the processing lens (2), which directly detects the temperature of the processing lens (2) and emits the laser beam f.
It is installed in a place where il does not pass through. - Generally, the portion through which the laser beam fil does not pass is the end of the processing lens (2). Therefore, in this embodiment as well, a temperature detection element is attached to the end of the lens. Generally, the temperature detection element (7) uses a contact thermocouple, a platinum resistance wire whose resistance changes depending on the temperature, a thermistorc, or the like.
（８）は温度検出素子（７）の検出値を基に加工レンズ
（２）の端と中央の温度差を推定し、その温度差より加
工レンズ（４）のレーザ光（１）の吸収率、屈折率等を
考慮していわゆる熱レンズ作用による最適焦点距離を演
算する演算回路である。（９）は加工レンズ（２） と
被加工物（３）との相対距離を制御する上下移動装置で
ある。(8) estimates the temperature difference between the edge and center of the processing lens (2) based on the detected value of the temperature detection element (7), and uses the temperature difference to estimate the absorption rate of the laser beam (1) of the processing lens (4). This is an arithmetic circuit that calculates the optimum focal length by a so-called thermal lens effect, taking into account the refractive index and the like. (9) is a vertical movement device that controls the relative distance between the processing lens (2) and the workpiece (3).
第２図はレーザ光＋１１が通過している場合の加工レン
ズ（２）の温度分布を示す曲線である０図中Ｘ軸は加工
レンズ（２）の中心からの半径方向の距離を示す、従っ
て、中心からの距離が長くなる程レンズの端部となる。Figure 2 is a curve showing the temperature distribution of the processing lens (2) when the laser beam +11 is passing through it. , the longer the distance from the center, the closer it becomes to the edge of the lens.
又、Ｙ軸は加工しノンズ（２）の温度であり中心部はど
温度が高く又、端部はと低くなっている。これは加工レ
ンズ（２）の端部が水等によって冷却されるためであり
更に、加工レンズ（２）の端部はレーザ光（１）が通過
しないことにもよる。Moreover, the Y-axis is the temperature of the processed nons (2), and the temperature is high at the center and very low at the ends. This is because the end of the processing lens (2) is cooled by water or the like, and also because the laser beam (1) does not pass through the end of the processing lens (2).
以上のように構成されたレーザ加工機の焦点距離調整装
置の動作につき説明する。今、レーザ加工機が動作前の
状態において、最適な焦点距離を上下装置（９）によっ
て設定する。同時に加工レンズ（２）の温度Ｔｌを温度
検出素子（７）にて測定し、演算回路（８）へ入力し記
憶する。次に、被加工物（３）を加工するためレーザ光
（１１をレーザ発振器（６）を通じて発生させる。この
ためレーザ光（１）が加工レンズ（２）を通過すること
によって焦光し被加工物（３）を熱して加工する。これ
と同時に加工レンズ（２）はレーザ光（１）を吸収し温
度が上昇する。このときの温度Ｔ２を温度検出素子（７
）にて測定し演算回路（８）へ入力する。The operation of the focal length adjusting device for a laser processing machine configured as above will be explained. Now, while the laser processing machine is in a pre-operation state, the optimum focal length is set by the up/down device (9). At the same time, the temperature Tl of the processing lens (2) is measured by the temperature detection element (7), and is input to the arithmetic circuit (8) and stored. Next, in order to process the workpiece (3), a laser beam (11) is generated through a laser oscillator (6). For this purpose, the laser beam (1) passes through the processing lens (2) and is focused to the workpiece. The object (3) is heated and processed. At the same time, the processing lens (2) absorbs the laser beam (1) and its temperature rises. The temperature T2 at this time is detected by the temperature detection element (7).
) and input it to the calculation circuit (8).
演算回路（８）では初期の温度Ｔ１と上昇後の温度Ｔ２
の差ＴＩ−Ｔ２・八Ｔを演算し、次に、第２図の如き加
工レンズ（２）の温度分布から熱変形量を演算し該熱変
形量から焦点距離変化量を演算する。その演算結果を指
令として上下移動装置（９）に伝え加工レンズ（２）を
上下装置（９）によって上下してレンズの位置をレーザ
光（１）の焦点が常に被加工物（３）上に結ぶよう制御
する。The arithmetic circuit (8) calculates the initial temperature T1 and the temperature T2 after the rise.
Then, the amount of thermal deformation is calculated from the temperature distribution of the processed lens (2) as shown in FIG. 2, and the amount of change in focal length is calculated from the amount of thermal deformation. The calculation result is sent as a command to the vertical movement device (9), and the processing lens (2) is moved up and down by the vertical movement device (9) to adjust the lens position so that the focus of the laser beam (1) is always on the workpiece (3). Control to tie.
尚、温度検出の時期は加工レンズ（２）が定常状態に達
した後の温度であることは必ずしも必要でない。例えば
、レーザ光ｆｌ）が発生する前の加工レンズ温度ＴＩを
検出した後、レーザ光ｉｌ＋が発生して加工レンズ（２
）を通過した短い時間（加工レンズの熱時定数に比べ充
分短い時間）経過後、加工レンズ（２）の温度Ｔ２を測
定し演算回路（８）へ入力する。演算回路（８）では、
加工レンズ（２）の定常状態の温度を演算し、その後加
工レンズ（２）の熱変形量を演算し該熱変形量から焦点
距離変化量を演算し上記と同様に焦点距離を調整しても
よい。Note that the timing of temperature detection does not necessarily have to be after the processing lens (2) has reached a steady state. For example, after detecting the processing lens temperature TI before the laser beam fl) is generated, the laser beam il+ is generated and the processing lens (2
) After a short time (sufficiently short time compared to the thermal time constant of the processed lens) has passed, the temperature T2 of the processed lens (2) is measured and input to the arithmetic circuit (8). In the arithmetic circuit (8),
The steady state temperature of the processed lens (2) is calculated, then the amount of thermal deformation of the processed lens (2) is calculated, the amount of change in focal length is calculated from the amount of thermal deformation, and the focal length is adjusted in the same way as above. good.
第３図〜第５図はこの発明の他の実施例を示す。3 to 5 show other embodiments of the invention.
第１の実施例と同一符号は同一または相当部分を示す。The same reference numerals as in the first embodiment indicate the same or corresponding parts.
第３図はこの発明の第２の一実施例であり。FIG. 3 shows a second embodiment of the invention.
温度検出素子（７）を部分反射鏡（４）に取付けたもの
である０部分反射鏡（４）も加工レンズ（２）と同様に
熱レンズ作用を生じるからである。This is because the zero partial reflector (4), which is a partial reflector (4) with a temperature detection element (7) attached thereto, also produces a thermal lens effect in the same way as the processed lens (2).
第４図はこの発明の第３の一実施例であり温度検出素子
（７）を部分反射鏡（４）及び加工レンズ（２）に取付
けたものである。夫々のレンズによって生じる熱レンズ
作用による焦点距離のズレを修正することか可能となる
。FIG. 4 shows a third embodiment of the present invention, in which a temperature detecting element (7) is attached to a partially reflecting mirror (4) and a processing lens (2). It becomes possible to correct focal length deviations caused by thermal lens effects caused by each lens.
第５図はこの発明の第４の一実施例であり不安定形共振
器方式のレーザ発振器のレーザビーム取り出し窓（ｌＯ
）に温度検出素子（７）を取付けたものである。レーザ
ビーム取り出し窓（１０）も加工レンズ（２）と同様に
熱レンズ作用を生じるからである。FIG. 5 shows a fourth embodiment of the present invention, which is a laser beam extraction window (lO
) with a temperature detection element (7) attached. This is because the laser beam extraction window (10) also produces a thermal lens effect like the processing lens (2).
［発明の効果１
この発明の焦点距離調整装置は、熱レンズ作用が生じる
レンズ自体に接触式の温度検出手段を設けることよりレ
ンズの温度を検出し、この検出温度から焦点距離を最適
となるよう７Ｖ４算回路にて演算し、該演算結果によっ
て上下装置を駆動し焦点距離を自動調整するようにした
ので、被加工物からの赤外線の反射による温度の誤検出
あるいは温度検出素子の破壊がない偲顛性の高いレーザ
加工機の焦点距離調整装置を得る効果がある。[Effect of the Invention 1] The focal length adjustment device of the present invention detects the temperature of the lens by providing a contact temperature detection means on the lens itself where a thermal lens effect occurs, and optimizes the focal length based on the detected temperature. The calculation is performed using a 7V4 arithmetic circuit, and the vertical device is driven based on the calculation result to automatically adjust the focal length, so there is no possibility of false temperature detection or destruction of the temperature detection element due to reflection of infrared rays from the workpiece. This has the effect of providing a highly flexible focal length adjustment device for a laser processing machine.
第１図から第５図はこの発明の一実施例に係る構成図、
曲線であり、第１図はこの発明の一実施例を示す焦点距
離調整装置の構成図、ｉＪ！２図は同様に一実施例を示
す焦点距離調整装置の構成図、第６区は従来の焦点距離
調整装置を示す構成図である。
図において、ｆ１＋はレーザ光、（２）は加工レンズ、
（４）は部分反射鏡、（７）は温度検出手段（温度検出
素子）、（９１は上下移動装置、（１０）はレーザビー
ム取り出し窓である。
なお、各図中、同一符号は同一、又は相当部分を示す。1 to 5 are configuration diagrams according to an embodiment of the present invention,
FIG. 1 is a block diagram of a focal length adjustment device showing an embodiment of the present invention, iJ! Similarly, FIG. 2 is a configuration diagram of a focal length adjustment device showing one embodiment, and Section 6 is a configuration diagram showing a conventional focal length adjustment device. In the figure, f1+ is a laser beam, (2) is a processing lens,
(4) is a partial reflecting mirror, (7) is a temperature detection means (temperature detection element), (91 is a vertical moving device, and (10) is a laser beam extraction window. In each figure, the same reference numerals are the same, or a corresponding portion.
Claims (1)
温度検出素子を取付けた温度検出手段と、上記温度検出
手段の情報によって熱変形量を演算し焦点距離変化量を
演算する演算回路と、上記演算回路の指令によって焦点
距離を調整する上下移動装置とを有する焦点距離調整装
置。a lens that allows laser light to pass through; a temperature detection means having a contact type temperature detection element attached to the lens; an arithmetic circuit that calculates an amount of thermal deformation based on information from the temperature detection means and calculates an amount of change in focal length; A focal length adjustment device that includes a vertical movement device that adjusts the focal length according to a command from an arithmetic circuit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2291101A JPH04167990A (en) | 1990-10-29 | 1990-10-29 | Device for adjusting focal distance |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2291101A JPH04167990A (en) | 1990-10-29 | 1990-10-29 | Device for adjusting focal distance |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04167990A true JPH04167990A (en) | 1992-06-16 |
Family
ID=17764467
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2291101A Pending JPH04167990A (en) | 1990-10-29 | 1990-10-29 | Device for adjusting focal distance |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04167990A (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0899678A2 (en) * | 1997-08-25 | 1999-03-03 | Nec Corporation | Autofocus bar code reader |
| GB2354845A (en) * | 1999-09-15 | 2001-04-04 | Whitney Co W | Real time control of laser beam characteristics in a laser equipped machine tool |
| WO2006134785A1 (en) * | 2005-06-13 | 2006-12-21 | The Japan Steel Works, Ltd. | Laser irradiation method and device thereof |
| JP2008114228A (en) * | 2006-10-31 | 2008-05-22 | Mitsubishi Electric Corp | Laser beam machine |
| JP2012157893A (en) * | 2011-02-01 | 2012-08-23 | Amada Co Ltd | Laser beam machining method and laser beam machine |
| WO2012137579A1 (en) * | 2011-04-08 | 2012-10-11 | 三菱電機株式会社 | Laser machining device |
| JP2013173176A (en) * | 2012-02-27 | 2013-09-05 | Mitsubishi Electric Corp | Laser machining apparatus |
| JP2017047455A (en) * | 2015-09-02 | 2017-03-09 | トヨタ自動車株式会社 | Laser welding method |
| CN110238393A (en) * | 2019-06-20 | 2019-09-17 | 江西科欧科技有限公司 | A kind of Three-Dimensional Dynamic focusing printing equipment and method based on laser 3d printing technique |
-
1990
- 1990-10-29 JP JP2291101A patent/JPH04167990A/en active Pending
Cited By (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0899678A2 (en) * | 1997-08-25 | 1999-03-03 | Nec Corporation | Autofocus bar code reader |
| EP0899678A3 (en) * | 1997-08-25 | 2000-05-17 | Nec Corporation | Autofocus bar code reader |
| US6315203B1 (en) | 1997-08-25 | 2001-11-13 | Nec Corporation | Autofocus bar code reader |
| US6420674B1 (en) * | 1999-04-30 | 2002-07-16 | W. A. Whitney Co. | Heavy-duty laser plate cutting machine |
| GB2354845A (en) * | 1999-09-15 | 2001-04-04 | Whitney Co W | Real time control of laser beam characteristics in a laser equipped machine tool |
| US6392192B1 (en) * | 1999-09-15 | 2002-05-21 | W. A. Whitney Co. | Real time control of laser beam characteristics in a laser-equipped machine tool |
| US6462301B1 (en) * | 1999-09-15 | 2002-10-08 | W. A. Whitney Co. | Heavy-duty plate laser with linear motors for X and Y position control |
| GB2354845B (en) * | 1999-09-15 | 2004-03-24 | Whitney Co W | Real time control of laser beam characteristics in a laser equipped tool |
| WO2006134785A1 (en) * | 2005-06-13 | 2006-12-21 | The Japan Steel Works, Ltd. | Laser irradiation method and device thereof |
| US7471712B2 (en) | 2005-06-13 | 2008-12-30 | The Japan Steel Works, Ltd. | Laser irradiating method and device for same |
| US7680163B2 (en) | 2005-06-13 | 2010-03-16 | The Japan Steel Works, Ltd. | Laser irradiating method including maintaining temperature of a lens |
| JP2008114228A (en) * | 2006-10-31 | 2008-05-22 | Mitsubishi Electric Corp | Laser beam machine |
| JP2012157893A (en) * | 2011-02-01 | 2012-08-23 | Amada Co Ltd | Laser beam machining method and laser beam machine |
| WO2012137579A1 (en) * | 2011-04-08 | 2012-10-11 | 三菱電機株式会社 | Laser machining device |
| JP5558629B2 (en) * | 2011-04-08 | 2014-07-23 | 三菱電機株式会社 | Laser processing equipment |
| US9289850B2 (en) | 2011-04-08 | 2016-03-22 | Mitsubishi Electric Corporation | Laser machining device |
| JP2013173176A (en) * | 2012-02-27 | 2013-09-05 | Mitsubishi Electric Corp | Laser machining apparatus |
| JP2017047455A (en) * | 2015-09-02 | 2017-03-09 | トヨタ自動車株式会社 | Laser welding method |
| CN110238393A (en) * | 2019-06-20 | 2019-09-17 | 江西科欧科技有限公司 | A kind of Three-Dimensional Dynamic focusing printing equipment and method based on laser 3d printing technique |
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