JPH0746715B2 - Method for manufacturing lead frame - Google Patents
Method for manufacturing lead frameInfo
- Publication number
- JPH0746715B2 JPH0746715B2 JP28306985A JP28306985A JPH0746715B2 JP H0746715 B2 JPH0746715 B2 JP H0746715B2 JP 28306985 A JP28306985 A JP 28306985A JP 28306985 A JP28306985 A JP 28306985A JP H0746715 B2 JPH0746715 B2 JP H0746715B2
- Authority
- JP
- Japan
- Prior art keywords
- lead
- bonding
- molding
- lead frame
- width
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000000034 method Methods 0.000 title claims description 17
- 238000004519 manufacturing process Methods 0.000 title description 3
- 239000002184 metal Substances 0.000 claims description 11
- 229910052751 metal Inorganic materials 0.000 claims description 11
- 239000008188 pellet Substances 0.000 claims description 3
- 238000000465 moulding Methods 0.000 description 33
- 239000000463 material Substances 0.000 description 10
- 238000004080 punching Methods 0.000 description 8
- 238000003825 pressing Methods 0.000 description 6
- 239000004065 semiconductor Substances 0.000 description 3
- 229910000881 Cu alloy Inorganic materials 0.000 description 2
- 229910000640 Fe alloy Inorganic materials 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000000750 progressive effect Effects 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000007665 sagging Methods 0.000 description 1
- 238000010008 shearing Methods 0.000 description 1
- 238000005482 strain hardening Methods 0.000 description 1
- 230000008961 swelling Effects 0.000 description 1
- 230000002195 synergetic effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
- H01L21/4842—Mechanical treatment, e.g. punching, cutting, deforming, cold welding
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
【発明の詳細な説明】 〔発明の技術分野〕 本発明は個別半導体素子、とりわけLED用リードフレー
ムのプレス加工法に係り、特にそのボンディングリード
の製造方法の改良に関する。Description: TECHNICAL FIELD OF THE INVENTION The present invention relates to a method for pressing an individual semiconductor element, particularly an LED lead frame, and more particularly to an improvement in a method for manufacturing a bonding lead thereof.
半導体ペレットを組立てるのにリードフレームを利用す
ることは従来から一般に行われており、LED等の個別半
導体素子ではいわゆるSIPタイプのリードフレームが使
用されているが、このLED用のリードフレームではLED素
子をマウントするリードと、このLED素子電極に接続す
るリードは別のものを使用している。It has been common practice to use a lead frame to assemble semiconductor pellets, and so-called SIP type lead frames are used in individual semiconductor elements such as LEDs, but in this LED lead frame, LED elements are used. Another lead is used for mounting the LED and a lead for connecting to the LED element electrode.
このSIPタイプのリードフレームは金属支持板の厚さ方
向から互いに平行なリードを林立させ、その２本もしく
は３本を１単位として使用し、この単位体を10個程度金
属支持板に設置する。又このリードにはいわゆるタイバ
を金属支持板と平行に設置して、その機械的強度を補強
するのが通常である。In this SIP type lead frame, leads parallel to each other in the thickness direction of the metal supporting plate are forested, and two or three of them are used as one unit, and about 10 of these units are installed on the metal supporting plate. In addition, a so-called tie bar is usually installed on the lead in parallel with the metal supporting plate to reinforce its mechanical strength.
ところで、このリードフレームを順送型によるプレス加
工法で製造する工程を第３図ａ〜ｄによって説明する。
第３図ａに示すように先ずマウント部（21）ならびにボ
ンディング部（22）に必要なブランク形状を金属板を打
抜きによって形成するが、ボンディング部（22）のブラ
ンク幅w1は第３図ｃに示したボンディングリード幅w2よ
り大きく成形する。この金属板材質としてはFeもしくは
Fe合金の外にAlクラッド材更にはCuもしくはCu合金など
が使用される。次に第３図ｂのようにマウント部（21）
ならびにボンディング部（22）を成形する。By the way, a process of manufacturing this lead frame by a press working method by a progressive die will be described with reference to FIGS.
As shown in FIG. 3a, first, a blank shape required for the mount portion (21) and the bonding portion (22) is formed by punching a metal plate. The blank width w 1 of the bonding portion (22) is shown in FIG. 3c. Mold larger than the bonding lead width w 2 shown in. The material of this metal plate is Fe or
In addition to the Fe alloy, Al clad material, Cu or Cu alloy is used. Next, as shown in Fig. 3b, mount part (21)
Also, the bonding part (22) is molded.
前述のブランク加工によって得られるボンディング部
（22）端面には第４図に示すようにダレT1破断面T3が形
成される。すなわち切刃が材料を削る際T1の上のコーナ
部分にＲが形成されるようにダレT1ができ、更に切刃が
剪断面23を削ってカスと製品に分かれて破断する。この
面が破断面T3である。これらを１種の据込加工によって
平坦に加工する。この工程は第５図に示すように第３図
ａによって成形したブランク（23）を下型（26）とスト
リッパ（25）間に挟み第４図に示したダレなどが形成さ
れたボンディング部端面（22）をポンチ（27）で押圧成
形して第３図ｂに示した平坦な面（22）を形成し、ここ
をボンディング面とする。As shown in FIG. 4, a sag T 1 fracture surface T 3 is formed on the end face of the bonding portion (22) obtained by the blanking process. That is, when the cutting blade scrapes the material, sagging T 1 is formed so that R is formed in the corner portion above T 1 , and the cutting blade further scrapes the shearing surface 23 and breaks into scraps and products. This surface is the fracture surface T 3 . These are flattened by one type of upsetting. In this step, as shown in FIG. 5, the blank (23) formed according to FIG. 3a is sandwiched between the lower mold (26) and the stripper (25), and the end surface of the bonding portion on which the sag shown in FIG. 4 is formed. (22) is press-molded with a punch (27) to form a flat surface (22) shown in FIG. 3b, which is used as a bonding surface.
これまでの工程を第１成形と今後記載するが、これによ
ってボンディング面として使用する平坦な端面（22）は
材料の厚さＴ（第４図に明示）と等しい径に成形され
る。The process up to this point will be hereinafter referred to as the first molding, whereby the flat end face (22) used as the bonding surface is molded to have a diameter equal to the thickness T of the material (shown in FIG. 4).
この第１成形後、順次打抜加工して第３図（ｃ）に示す
ほぼ所定の形状を得るが、ボンディング部リード（28）
は幅がW2となるように細く打抜いたので、端面のボンデ
ィング部にはかえり（29）が発生する。このために第６
図に示すように、第１成形と同様にリード（28）をスト
リッパ（25）と下型（26）間に挟み、ポンチ（27）によ
ってリードの長手方向に押圧して平担なボンディング面
（22）を成形する。このリード（28）を挟むに当っては
ストリッパ（25）及び下型（26）にそれぞれ突起（30）
ならびに（31）を設け、ポンチの押圧力がボンディング
平担面（22）を持つリード（28）全体に及ぶのを防止し
ているが、ストリッパ（25）にはスプリング（32）を付
設する。この一連の工程を第２成形と今後記載する。After the first molding, punching is sequentially performed to obtain a substantially predetermined shape shown in FIG. 3 (c).
Since it was thinly punched so that the width was W 2 , burr (29) was generated at the bonding part of the end face. Because of this, the sixth
As shown in the figure, like the first molding, the lead (28) is sandwiched between the stripper (25) and the lower mold (26), and the punch (27) presses the lead (28) in the longitudinal direction of the lead to form a flat bonding surface ( 22) is molded. When sandwiching the lead (28), the stripper (25) and the lower mold (26) are each provided with a protrusion (30).
Further, (31) is provided to prevent the pressing force of the punch from reaching the entire lead (28) having the flat bonding surface (22), but the stripper (25) is provided with a spring (32). This series of steps will be hereinafter referred to as the second molding.
このように、ボンディングリードは第１成形、打抜き及
び第２成形を経て得られているが、先ずボンディング部
の精度が安定化し難い欠点がある。即ち、第１成形によ
って加工したボンディング部周辺は加工硬化しているの
で、第２成形での押圧力が弱いと打抜きによって生じた
かえりを完全につぶせず平担面が得られないし、逆に押
圧力が強いと第３図ｄに示すようにボンディングリード
に座屈が起って変形をもたらす。As described above, the bonding lead is obtained through the first molding, the punching, and the second molding, but first, there is a drawback that the accuracy of the bonding portion is difficult to stabilize. That is, since the periphery of the bonding portion processed by the first molding is work-hardened, if the pressing force in the second molding is weak, the burr generated by punching cannot be completely crushed and the flat surface cannot be obtained. When the pressure is strong, the bonding leads are buckled and deformed as shown in FIG. 3d.
第３図ｃに示すように、ボンディング端面の位置はマウ
ント部の中心からリードの中心までの距離L1と、金属支
持板（33）に形成する治具穴からの距離L2とによってそ
れぞれ±0.05mmの精度が要求される。従ってボンディン
グリードが変形すると要求精度が得られず、第６図に示
したストリッパならびに下型に形成した突起の摩耗も激
しくボンディングリードの変形防止策としては完全なも
のではなかった。As shown in FIG. 3c, the position of the bonding end surface is ± ± depending on the distance L 1 from the center of the mount portion to the center of the lead and the distance L 2 from the jig hole formed in the metal supporting plate (33). Accuracy of 0.05 mm is required. Therefore, if the bonding leads are deformed, the required accuracy cannot be obtained, and the stripper shown in FIG. 6 and the projections formed on the lower mold are also worn out significantly, and it is not a perfect measure for preventing the deformation of the bonding leads.
このようにボンディング部の精度が不安定な欠点は、多
数個取りの順送型で数個のボンディング部を同時に加工
する場合に特に顕著となる。第２成形によってボンディ
ング部を成形する押圧力は、その成形量すなわち成形が
完了するポンチ（27）の位置を前後に調整することによ
って加減しており、これは第１成形の状態あるいは打抜
きの状態に応じて精密を極めるものであった。Such a defect that the accuracy of the bonding portion is unstable becomes particularly noticeable when several bonding portions are simultaneously processed by a multi-cavity progressive die. The pressing force for forming the bonding portion by the second forming is adjusted by adjusting the forming amount, that is, the position of the punch (27) where the forming is completed, back and forth. This is the state of the first forming or the state of punching. It was something that was extremely precise.
第２の問題点としては第７図に示すようにボンディング
リードに局部的に抜きバリが出易い問題点がある。と言
うのは第１成形によってボンディングリード先端部が厚
さ方向にふくれ（33）を生じると共に、加工硬化を起し
ていることによってポンチの摩耗を促進するためであ
る。The second problem is that, as shown in FIG. 7, a burr easily occurs locally on the bonding lead. This is because the first molding causes the tip of the bonding lead to bulge (33) in the thickness direction, and also causes work hardening to accelerate wear of the punch.
更に、第３の欠点は金型加工工数が増大する点である。
第１成形によってボンディング部の平担面を形成すると
同時に材料の厚さ方向にふくれが発生するため、金型の
後工程では材料であるリードを挟むストリッパ面と下型
上面にリード先端部をつぶさないように逃がし凹部を設
ける必要があり加工工数の増大をもたらす。Furthermore, the third drawback is that the number of man-hours for processing the mold increases.
Since the flat surface of the bonding part is formed by the first molding and at the same time swelling occurs in the thickness direction of the material, the tip of the lead is crushed on the stripper surface that sandwiches the lead which is the material and the upper surface of the lower mold in the post process of the mold. It is necessary to provide a relief recess so as not to occur, resulting in an increase in processing man-hours.
背景技術ではボンディング部の平坦な端面を得るのに第
１成形及び第２成形とに分けて加工する方法を採用して
おり、しかも成形の大きいボンディングリードの打抜加
工だけでは座屈が発生するとの判断から剛性がある打抜
き前に第１成形を行なっていた。In the background art, in order to obtain a flat end surface of the bonding portion, a method of separately processing the first molding and the second molding is adopted, and further, if the punching process of the bonding lead, which is large in molding, causes buckling. Therefore, the first molding was performed before punching, which has rigidity.
本発明ではリードが座屈しない手段を施して第１成形を
省き背景技術の欠点を除去するものである。In the present invention, means for preventing the lead from buckling is provided, and the first molding is omitted to eliminate the drawbacks of the background art.
本発明ではボンディング部を成形するに当って、特殊な
リードフレームに利用する。すなわち金属支持板に交差
する方向に、互いに隣接かつ平行に形成された一方のリ
ード端部にペレットマウント部を、他方のリード端部に
ワイヤボンディング部をプレス加工法で形成する。この
際所定のリード幅より若干小さく、リードの厚さにほぼ
等しいブランク幅を持った部分をボンディングリードす
なわち隣接する一方のリードの先端に近い位置までに設
け、かつ長手方向に押圧して平坦なボンディング端面が
得られるようにした。この押圧工程によって一方のリー
ドの先端部分はその幅より小さくなると共に、両者の境
界には切欠部が形成される。この切欠部は成形時の逃げ
場となるほかに、切欠効果との相乗効果によって押圧力
が吸収されるのでボンディングリードには座屈が発生し
ない。更に背景技術の第２成形と異なりブランクが加工
硬化していないので成形性がよく、しかも第２成形が省
けるので有利となる。In the present invention, a special lead frame is used for molding the bonding portion. That is, in the direction intersecting the metal supporting plate, a pellet mount portion is formed at one lead end portion formed adjacent to and parallel to each other and a wire bonding portion is formed at the other lead end portion by a press working method. At this time, a portion having a blank width which is slightly smaller than the predetermined lead width and is approximately equal to the thickness of the lead is provided up to a position close to the tip of the bonding lead, that is, one of the adjacent leads, and is pressed in the longitudinal direction to be flat. The bonding end surface was obtained. By this pressing step, the tip portion of one lead becomes smaller than its width, and a notch is formed at the boundary between the two. This notch serves as an escape area at the time of molding, and since the pressing force is absorbed by the synergistic effect with the notch effect, buckling does not occur in the bonding lead. Further, unlike the second molding of the background art, the blank is not work-hardened, so that the moldability is good, and the second molding can be omitted, which is advantageous.
〔実施例〕 本発明を第１図a,b及び第２図ａ〜ｄにより詳細に説明
する。EXAMPLES The present invention will be described in detail with reference to FIGS. 1a and 1b and 2a to 2d.
第２図ａに示すように、ボンディング部の成形に必要な
形状に金属板を打抜くが、この金属板としてはFeもしく
はFe合金の外に、Alクラッド材更にはCuもしくはCu合金
などが使用される。このブランクにはマウント部（１）
及びボンディング部（２）を形成するが、ボンディング
部（２）の幅W3はｃ図に示すボンディングリード（３）
の幅W2より多少小さ目に設定し、かつｄ図の成形によっ
て必要な大きさとするべくリードの厚さとほぼ等しくす
る。As shown in Fig. 2a, a metal plate is punched into the shape required for forming the bonding part. As the metal plate, in addition to Fe or Fe alloy, Al clad material or Cu or Cu alloy is used. To be done. This blank has a mount (1)
And the bonding portion (2) is formed, and the width W 3 of the bonding portion (2) is the bonding lead (3) shown in FIG.
The width W 2 is set to be slightly smaller than the width W 2 and the lead thickness is made substantially equal to the required size by molding shown in FIG.
次にマウント部（１）を円錐状ポンチによって成形後、
背景技術と異なり直ぐに所定の打抜き加工を行って第２
図ｃに示すボンディングリードを得る。この結果ボンデ
ィングリード（３）の先端部分には幅W3を持った径小な
ボンディング部（２）が形成され、径大なボンディング
リード（３）との境目には幅方向に段差が形成される。Next, after molding the mount part (1) with a conical punch,
Different from the background art, a predetermined punching process is immediately performed, and the second
The bonding leads shown in Figure c are obtained. As a result, a small-diameter bonding portion (2) having a width W 3 is formed at the tip of the bonding lead (3), and a step is formed in the width direction at the boundary with the large-diameter bonding lead (3). It
更に、最終工程であるボンディングリード先端の成形を
背景技術欄で説明した第５図、第６図の設備により実施
する。すなわちスプリング（32）を付設したストリッパ
（25）と下型（26）間にボンディングリード（３）を挟
み、ポンチ（27）による押圧を行うが、ボンディングリ
ード（３）先端部分に発生する変形は先ずブランク先端
部から幅方向に形成する径差間で座屈してつぶされ更に
所定の位置までポンチを押圧してブランク先端の端面に
発生した抜きダレ及び破断面が平担に成形される。Further, the molding of the tip of the bonding lead, which is the final step, is carried out by the equipment shown in FIGS. 5 and 6 described in the background art section. That is, the bonding lead (3) is sandwiched between the stripper (25) provided with the spring (32) and the lower die (26) and pressed by the punch (27), but the deformation generated at the tip of the bonding lead (3) is not affected. First, the blank is buckled and crushed between the blank tips from the width difference formed in the width direction, and the punch is pressed to a predetermined position to flatten the punched sag and fracture surface generated on the end surface of the blank tip.
このようにボンディング先端部分に径小部を設置して径
大部間に段差を形成することによって材料の変形が段差
より先端の径小部に集中してボンディングリード全体の
座屈変形が防止でき、しかも最終の１回の成形工程で済
み、又安定した精度でボンディングリードが得られる。
この成形工程によって第２図ｄに示すようにボンディン
グリード（３）の先端部分には切欠部分（４）が形成さ
れる。By installing a small diameter portion at the bonding tip and forming a step between the large diameter portions in this way, the deformation of the material is concentrated on the small diameter portion at the tip of the step, and buckling deformation of the entire bonding lead can be prevented. Moreover, the final molding step is sufficient, and the bonding leads can be obtained with stable accuracy.
As a result of this molding step, a notch portion (4) is formed at the tip portion of the bonding lead (3) as shown in FIG. 2d.
第１図（ａ）（ｂ）には成形後のリードフレーム断面図
を示した。（ａ）はLED用、（ｂ）はフォトカプラ用リ
ードフレームを示し、後者では受光側ならびに発光側の
リードフレーム先端部分に径小部を設置して前述の成形
工程によって平担なボンディング面を設け、更に金属支
持板（５）ならびに治具穴を示した。1 (a) and 1 (b) are sectional views of the lead frame after molding. (A) shows a lead frame for LEDs and (b) shows a photo coupler lead frame. In the latter, a small diameter portion is installed at the tip of the lead frame on the light receiving side and the light emitting side, and a flat bonding surface is formed by the above-mentioned molding process. The metal support plate (5) and jig holes are shown.
ボンディング面の位置精度測定値を下表に示す。 The following table shows the measured position accuracy of the bonding surface.
この表から判るようにボンディング面の位置精度が向上
し、成形量の調整も容易になった。次に、ボンディング
リード先端の幅方向打抜きに際して材料のふくれが発生
しないので局部的なバリも防止できる。 As can be seen from this table, the positional accuracy of the bonding surface was improved and the adjustment of the molding amount was facilitated. Next, since blistering of the material does not occur when the tip of the bonding lead is punched in the width direction, local burr can be prevented.
更に、この材料ふくれが無いので、最終のボンディング
面成形工程までの間金型のストリッパ下面及び下型上面
での逃げ加工が不要となり金型の加工工数を削減でき、
具体的には背景技術での逃げ加工工数9H（部品点数：ス
トリッパ12点、下型:13点）が本提案では不要となるの
で経済的に有利となる。Furthermore, since there is no blistering of this material, there is no need for relief processing on the lower surface of the mold stripper and the upper surface of the lower mold until the final bonding surface molding process, and the number of mold processing steps can be reduced.
Specifically, 9H of relief processing (number of parts: 12 strippers, 13 lower molds) in the background art is not required in this proposal, which is economically advantageous.
第１図a,bは本発明に係るリードフレーム正面図、第２
図ａ〜ｄは第１図a,bのリードフレームを成形する過程
を示した図、第３図ａ〜ｄは従来技術によるリードフレ
ーム成形過程を示す図、第４図は従来のボンディング部
ブランクを示す斜視図、第５図は従来技術の第１成形工
程を示す斜視図、第６図は従来技術による第２成形工程
を示す断面図、第７図は従来技術による第１成形後のリ
ードフレームの斜視図である。1a and 1b are front views of the lead frame according to the present invention,
FIGS. 3A to 3D are views showing a process of molding the lead frame of FIGS. 1A and 1B, FIGS. 3A to 3D are views showing a process of molding a lead frame according to a conventional technique, and FIG. 4 is a conventional bonding portion blank. FIG. 5, FIG. 5 is a perspective view showing a first molding step of the prior art, FIG. 6 is a cross-sectional view showing a second molding step of the prior art, and FIG. 7 is a lead after the first molding according to the prior art. It is a perspective view of a frame.
Claims (1)
つ並行に形成されたリードの一方端部にペレットマウン
ト部を他方端部にワイヤボンディング部をプレス加工法
で形成するに当り，ワイヤボンディング部が形成される
前記一方のリード端部付近に前記リード幅より若干小さ
くかつリードの厚さにほぼ等しい部分を設け、これをリ
ードの長手方向に押圧して交差する方向に平坦な端面を
成形すると共に前記リードとの境界部分に切欠部を形成
することを特徴とするリードフレームの製造方法1. When forming a pellet mount portion at one end portion of a lead formed adjacent to and parallel to each other in a direction intersecting with a metal supporting plate and a wire bonding portion at the other end portion by a press working method, wire bonding is performed. A portion slightly smaller than the lead width and substantially equal to the thickness of the lead is provided near the one lead end portion where the portion is formed, and this is pressed in the longitudinal direction of the lead to form a flat end face in the intersecting direction. And forming a notch at the boundary with the lead.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28306985A JPH0746715B2 (en) | 1985-12-18 | 1985-12-18 | Method for manufacturing lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28306985A JPH0746715B2 (en) | 1985-12-18 | 1985-12-18 | Method for manufacturing lead frame |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62143449A JPS62143449A (en) | 1987-06-26 |
| JPH0746715B2 true JPH0746715B2 (en) | 1995-05-17 |
Family
ID=17660799
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP28306985A Expired - Lifetime JPH0746715B2 (en) | 1985-12-18 | 1985-12-18 | Method for manufacturing lead frame |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0746715B2 (en) |
-
1985
- 1985-12-18 JP JP28306985A patent/JPH0746715B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62143449A (en) | 1987-06-26 |
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