JPH0745691A - Wafer holder - Google Patents

Abstract

PURPOSE:To hardly slip, crack, cut out a wafer, to reduce heat absorption in a furnace and to reduce a weight of a boat by installing an SiC support plate at a support of the boat, and holding a periphery of the wafer. CONSTITUTION:A ringlike SiC support plate 3A is placed in a groove 2 of an SiC boat 1, and a periphery of a wafer 5 is held at the plate 3A. Thus, an own weight of the wafer 5 is dispersed to the plate 3A to be held, and even if the wafer 5 is heated to 1000 deg.C or higher, a slip, a crack, a cutout hardly occurs. The degree of absorption of heat in a furnace to the plate 3A can be reduced, it can not only be reduced in weight as compared with the case that the weight of the boat is supported to a disclike support plate, but also no deformation occurs due to a high temperature heat treatment, since it is made of SiC, and since it is formed of a simple shape, it can be easily processed at a low cost.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a vertical semiconductor manufacturing apparatus, and more particularly to a holder for supporting a wafer.

[0002]

2. Description of the Related Art When a wafer is heat-treated at a high temperature, slippage occurs due to the weight of the wafer itself or the like. In order to solve this problem, the shape of the wafer support portion of the boat is being studied so that the weight of the wafer is not locally applied. Figure 6
FIG. 3 is a perspective view showing an example of a conventional wafer holder mounted on a boat, which is the wafer holder described in JP-A-61-247048. In this conventional example, by providing the annular supporting portion 8 for mounting the wafer 5 on the groove portion 2 of the boat 1, the load of the self-weight for supporting the wafer 5 is dispersed, and the slip, crack, and chip of the wafer are less likely to occur. Also, by making the portion of the support plate 8 annular, it is possible to reduce the degree to which the heat in the furnace is absorbed by the support plate, and to reduce the weight of the boat as compared with the case where a disk-shaped support plate is provided.

[0003]

However, in the above-mentioned conventional example, quartz is deformed in the case of high-temperature treatment, so S
iC products are used. Since SiC is extremely difficult to mechanically process, a boat having a shape capable of sufficiently distributing its own weight is currently not practically used because the production cost is very high.

[0004]

DISCLOSURE OF THE INVENTION The present invention aims to provide a wafer holder which prevents the occurrence of wafer slippage, reduces heat absorption in the furnace, reduces the weight of the boat, and of course is easy to process. It is a thing. That is, the wafer holder of the present invention has a ring-shaped or central concave support plate made of SiC installed on the support part of the boat. Since the wafer holder of the present invention has such a configuration, the ring-shaped or center-shaped concave support plate 3A or 3B made of SiC is installed on the support part 2 of the boat 1, and the wafer 5 is attached to the support plate 3A or 3B.
By holding the peripheral portion of the wafer, the occurrence of wafer slip can be prevented, heat absorption in the furnace can be reduced, and the weight of the boat can be reduced.
Since B has a ring shape or a simple shape in which the central portion 4 is concave, it can be easily processed.

[0005]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1A is a plan view of a wafer holder of the present invention mounted on a boat. FIG. 1B is a sectional view taken along line aa of the first embodiment in FIG. 1A. (C) is also FIG.
It is the aa sectional view taken on the line of the 2nd Example in (A). In the first embodiment, a ring-shaped support plate 3A made of SiC is placed in the groove 2 of the boat 1, and the support plate 3A holds the peripheral portion of the wafer 5 (see FIG. 2). In the second embodiment, the SiC support plate 3B having a concave central portion 4 is placed in the groove portion 2 of the boat,
The supporting plate 3B holds the peripheral portion of the wafer 5 (see FIG. 2).
reference). FIG. 3 is a plan view of the third embodiment. The third embodiment is an example in which a support plate 3A shown in FIG. 1 (B) is provided with a notch 6A for escape of a wafer suction plate of a wafer carrier,
Insert the wafer suction plate into the boat, and support plate 3A
This is the case where the wafer 5 placed on the top is sucked from the back surface thereof by the wafer suction plate, and the wafer suction plate can be carried out from the boat through the escape notch 6A while the wafer is sucked. Enable listing. FIG. 4 is a plan view showing the fourth embodiment. The fourth embodiment is an example in which a rectangular wafer suction plate escape notch 6B is provided in the support plate 3B shown in FIG. 1C, and has the same function as that in FIG.

Since the wafer holder of the present invention has the above-mentioned structure, it is conventionally used Si as shown in FIG.
An SiC support plate 3A or 3B having a ring shape or a concave center portion 4 is placed in the groove 2 of the C boat 1 and the support plate 3A
Alternatively, by holding the peripheral portion of the wafer 5 in 3B, the weight of the wafer can be dispersed and held in the supporting plate 3A or 3B, so even if the wafer is heated to 1000 ° C. or higher, slips, cracks, and chips are less likely to occur, By making the support plate ring-shaped or concave in the central portion 4, the degree to which heat in the furnace is absorbed by the support plate can be reduced, and the weight of the boat can be made lighter than when a disk-shaped support plate is provided. Of course, S
Since it is made of iC, it does not deform due to high temperature treatment, and it has a simple shape, so it can be easily processed and can be implemented at low cost.

FIG. 5 is a plan view of the fifth embodiment. The fifth embodiment is a support plate 3 made of SiC having a ring shape or a concave central portion 4.
Positioning rods 7 are provided at symmetrical positions of A or 3B. With such a configuration, the present wafer holder, that is, the support plate 3A or 3B can be easily positioned and placed on the boat 1, and the positional deviation is unlikely to occur.

[0008]

As described above, according to the present invention, the ring-shaped or central concave SiC support plate is installed on the support portion of the boat, so that the weight of the wafer is reduced to the support plate 3A or 3A.
It can be dispersed and held in B, and even if the wafer is heated to 1000 ° C. or higher, slips, cracks, and chips are less likely to occur, heat absorption in the furnace is reduced, and the weight of the boat can be reduced. Since 3A or 3B has a ring shape or a simple shape with a concave central portion, it can be easily processed and can be implemented at low cost.

[Brief description of drawings]

FIG. 1A is a plan view of a wafer holder of the present invention mounted on a boat. (B) is the first in FIG. 1 (A)
It is the aa sectional view taken on the line of an Example. (C) is also FIG.
It is the aa sectional view taken on the line of the 2nd Example in (A).

FIG. 2 is an enlarged sectional view showing a state in which a wafer is mounted on the boat by using the wafer boat of the present invention.

FIG. 3 is a plan view of a third embodiment.

FIG. 4 is a plan view of a fourth embodiment.

FIG. 5 is a plan view of a fifth embodiment.

FIG. 6 is a perspective view showing an example of a conventional wafer boat mounted on a boat.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 boat 2 support part (groove part) 3A ring-shaped support plate made of SiC 3B SiC support plate having a concave central part 4 5 wafer 6A notch for escape of wafer suction plate 6B notch for escape of wafer suction plate 7 positioning part (rod) )

Continuation of the front page (51) Int.Cl. ⁶ Identification number Reference number within the agency FI Technical display area H01L 21/22 511 G 9278-4M

Claims (3)

[Claims] 1. A wafer holder characterized in that a ring-shaped or central concave support plate made of SiC is installed on a support part of a boat to hold the periphery of the wafer. 2. The wafer holder according to claim 1, wherein the support plate has a notch for evacuating the wafer suction plate. 3. The supporting plate has a positioning portion.
Wafer holder.