JPH0745335B2 - Colored alumina sintered body - Google Patents

Colored alumina sintered body

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Publication number
JPH0745335B2
JPH0745335B2 JP62276728A JP27672887A JPH0745335B2 JP H0745335 B2 JPH0745335 B2 JP H0745335B2 JP 62276728 A JP62276728 A JP 62276728A JP 27672887 A JP27672887 A JP 27672887A JP H0745335 B2 JPH0745335 B2 JP H0745335B2
Authority
JP
Japan
Prior art keywords
alumina
colorant
sintered body
amount
weight
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP62276728A
Other languages
Japanese (ja)
Other versions
JPH01119557A (en
Inventor
邦英 四方
浩司 松下
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Corp
Original Assignee
Kyocera Corp
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Filing date
Publication date
Application filed by Kyocera Corp filed Critical Kyocera Corp
Priority to JP62276728A priority Critical patent/JPH0745335B2/en
Publication of JPH01119557A publication Critical patent/JPH01119557A/en
Publication of JPH0745335B2 publication Critical patent/JPH0745335B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、半導体集積回路素子を収納する半導体素子収
納用パッケージや半導体集積回路素子が搭載される多層
配線基板等の絶縁基体に用いる着色アルミナ質焼結体に
関するものである。
Description: TECHNICAL FIELD The present invention relates to a colored alumina used for an insulating substrate such as a semiconductor element housing package for housing a semiconductor integrated circuit element or a multilayer wiring board on which the semiconductor integrated circuit element is mounted. Quality sintered body.

〔従来の技術〕[Conventional technology]

従来、半導体集積回路素子を収納するパッケージや半導
体集積回路素子が搭載される多層配線基板等は電気絶縁
性に優れたアルミナ(Al2O3)を基体として使用し、そ
の表面にタングステン(W)、モリブテン(Mo)、マン
ガン(Mn)等の金属から成る電気配線を施すことによっ
て製作されている。
Conventionally, a package for housing a semiconductor integrated circuit device, a multilayer wiring board on which the semiconductor integrated circuit device is mounted, and the like use alumina (Al 2 O 3 ) having excellent electrical insulation as a substrate, and tungsten (W) is formed on the surface thereof. , Molybdenum (Mo), manganese (Mn), and other electrical wiring made of metal.

しかし乍ら、半導体集積回路素子をパッケージ等の外部
リード端子と自動ワイヤボンダで接続する際、上記パッ
ケージ等の位置合わせ用ターゲットマークを上記自動機
のセンサーで検知して位置合わせするが、金色のターゲ
ットマークと白色のアルミナの基体との色調のコントラ
ストが弱いため、誤った位置合わせをすることがあっ
た。
However, when connecting a semiconductor integrated circuit device to an external lead terminal of a package or the like with an automatic wire bonder, the alignment target mark of the package or the like is detected by the sensor of the automatic machine and aligned, but a gold target Due to the weak color tone contrast between the mark and the white alumina substrate, misalignment may occur.

そこで、上記従来の欠点を解消するために、アルミナに
チタン(Ti)、銅(Cu)、ニッケル(Ni)、コバルト
(Co)、鉄(Fe)、バナジウム(V)、タングステン、
モリブデン、マンガン等の主として酸化物から成る着色
剤を加え、加湿した水素−窒素混合ガス雰囲気中で1500
〜1600℃の温度で焼成し、着色アルミナ質焼結体を得る
方法がとられていた。
Therefore, in order to solve the above-mentioned conventional defects, titanium (Ti), copper (Cu), nickel (Ni), cobalt (Co), iron (Fe), vanadium (V), tungsten,
Add a colorant consisting mainly of oxides such as molybdenum and manganese, and add 1500 in a humidified hydrogen-nitrogen mixed gas atmosphere.
A method of obtaining a colored alumina-based sintered body by firing at a temperature of ~ 1600 ° C has been used.

しかし乍ら、上記着色剤を加えて加湿した水素−窒素混
合ガス雰囲気中の焼成にて得られる着色アルミナ質焼結
体は色ムラを生じたり、電気絶縁性や誘電損失等の電気
的諸特性の劣化を引き起こすという問題があった。
However, the colored alumina-based sintered body obtained by firing in a hydrogen-nitrogen mixed gas atmosphere which is humidified by adding the above-mentioned coloring agent causes color unevenness, and has various electrical characteristics such as electric insulation and dielectric loss. There was a problem of causing deterioration of.

そこで、上記欠点を解消するためにアルミナと鉱化剤か
ら成るアルミナ磁器組成物に酸化クロムと該酸化クロム
の等量以下の金属モリブデン及び/又はタングステンと
を含有せしめて着色セラミックスを得ることが特公昭61
−12868号公報に提案されている。
Therefore, in order to eliminate the above-mentioned drawbacks, it is preferable to obtain a colored ceramics by adding an alumina porcelain composition comprising alumina and a mineralizer to chromium oxide and molybdenum and / or tungsten in an amount equal to or less than the chromium oxide. Kosho 61
-12868.

〔発明が解決しようとする問題点〕[Problems to be solved by the invention]

しかしながら、近時、情報処理装置の高性能化に伴い、
それを構成する半導体素子も高密度化、高集積化が急激
に進み、該半導体素子は作動に際し、大電力を要する結
果、該半導体素子の発熱量が著しく増加している。その
ために、半導体素子収納用パッケージや多層配線基板等
の絶縁基体として前記アルミナ質着色をセラミックスを
用いた場合、該アルミナ質着色セラミックスはその熱伝
導率が17W/mK程度と近く放熱に不充分となり、上記半導
体素子を正常かつ安定に作動させることが困難となる恐
れがあり、上記絶縁基体として高い熱伝導率が望まれて
いる。
However, in recent years, as the performance of information processing devices has increased,
The density and integration of the semiconductor elements that compose the semiconductor elements have rapidly increased, and the semiconductor elements require a large amount of power when operating, resulting in a significant increase in the amount of heat generated by the semiconductor elements. Therefore, when using the above-mentioned alumina coloring ceramics as an insulating substrate such as a package for housing a semiconductor element or a multilayer wiring board, the alumina coloring ceramic has a thermal conductivity of about 17 W / mK and is insufficient for heat dissipation. However, it may be difficult to operate the semiconductor element normally and stably, and a high thermal conductivity is desired for the insulating substrate.

一方、前記半導体素子収納用パッケージ等はその製造や
半導体素子を実装するに際し、前記自動ワイヤボンダ等
の自動機が使用されており、前記アルミナ質セラミック
スはその曲げ強さが30kg/mm2程度と低く、耐チッピング
性、耐摩耗性に劣るため高強度化が望まれている。
On the other hand, the semiconductor element storage package, etc., is used in the manufacturing or mounting of the semiconductor element, and an automatic machine such as the automatic wire bonder is used, and the bending strength of the alumina ceramics is as low as about 30 kg / mm 2. In addition, chipping resistance and wear resistance are poor, so higher strength is desired.

〔発明の目的〕[Object of the Invention]

本発明は上述の欠点に鑑み案出されたもので、その目的
は半導体素子収納用パッケージや多層配線基板の絶縁基
体として十分な濃度に着色させるとともに電気的諸特性
を劣化させることなく、熱伝導率の向上を実現した高強
度の着色アルミナ質焼結体を提供することにある。
The present invention has been devised in view of the above-mentioned drawbacks, and its object is to conduct heat conduction without deteriorating various electrical characteristics while coloring to a sufficient density as an insulating substrate of a package for accommodating semiconductor elements or a multilayer wiring board. The object is to provide a high-strength colored alumina-based sintered body that achieves an improved rate.

〔問題点を解決するための手段〕[Means for solving problems]

本発明はアルミナ、着色剤及び焼結助剤から成る着色ア
ルミナ質焼結体において、前記アルミナと着色剤の各量
が第1図の下記ABCDの各点で囲まれた範囲内にあり、前
記着色剤は酸化クロムと金属モリブデン及び/又はタン
グステンとから成り、酸化クロム量に対する金属モリブ
デン及び/又はタングステン量の比が1.5を越え5.0以下
であり、熱伝導率が20W/mk以上、曲げ強度が50kg/mm2
上であることを特徴とする着色アルミナ質焼結体。
The present invention relates to a colored alumina sintered body comprising alumina, a colorant and a sintering aid, wherein the respective amounts of the alumina and the colorant are within the range surrounded by the following ABCD points in FIG. The colorant is composed of chromium oxide and metallic molybdenum and / or tungsten, the ratio of the amount of metallic molybdenum and / or tungsten to the amount of chromium oxide is more than 1.5 and 5.0 or less, the thermal conductivity is 20 W / mk or more, and the bending strength is A colored alumina-based sintered body characterized by being 50 kg / mm 2 or more.

A:アルミナ96.0重量%、着色剤0.5重量% B:アルミナ92.0重量%、着色剤0.5重量% C:アルミナ87.8重量%、着色剤4.7重量% D:アルミナ91.8重量%、着色剤4.7重量% である。A: Alumina 96.0 wt%, colorant 0.5 wt% B: Alumina 92.0 wt%, colorant 0.5 wt% C: Alumina 87.8 wt%, colorant 4.7 wt% D: Alumina 91.8 wt%, colorant 4.7 wt% .

すなわち、本発明はアルミナと着色剤の各量を特定量に
設定し、且つ、着色剤中の金属モリブデン及び/または
タングステンの量を上記酸化クロム量に対して1.5を越
え5.0以下含有させることにより、意外にも20W/mK以上
と高い熱伝導率と曲げ強さが50.0kg/mm2以上の高強度の
着色アルミナ質焼結体を実現したものである。これはア
ルミナ中に固溶する酸化クロムが少ないため、粒内での
フォノン散乱の要因がなくなり、熱伝導率が向上すると
共に、アルミナ質焼結体の粒成長を抑制する結果、強度
が増加したものと考えられる。
That is, the present invention is to set each amount of alumina and colorant to a specific amount, and by containing the amount of metallic molybdenum and / or tungsten in the colorant in an amount of more than 1.5 and 5.0 or less with respect to the amount of chromium oxide. Surprisingly, this is a high-strength colored alumina sintered body having a high thermal conductivity of 20 W / mK or more and a bending strength of 50.0 kg / mm 2 or more. This is because the amount of chromium oxide that forms a solid solution in alumina is small, the cause of phonon scattering within the grains is eliminated, thermal conductivity is improved, and grain growth of the alumina sintered body is suppressed, resulting in increased strength. It is considered to be a thing.

なお、本発明において前記着色剤中の酸化クロム量に対
する金属モリブデン及び/またはタングステンの量の比
が1.5以下となると熱伝導率は向上せず、同じく5.0を越
えると電気的特性が劣化するため不適当となる。
In the present invention, if the ratio of the amount of metallic molybdenum and / or tungsten to the amount of chromium oxide in the colorant is 1.5 or less, the thermal conductivity does not improve, and if it exceeds 5.0, the electrical characteristics are deteriorated. Will be appropriate.

また、本発明において着色アルミナ質焼結体中のアルミ
ナ量Xと酸化クロムと金属モリブデン及び/またはタン
グステンとから成る着色剤の量Yが第1図に示すAB線
外、すなわち着色剤Yが0.5重量%未満となると、アル
ミナ質焼結体は灰色を呈し、前記自動ワイヤーボンダ等
の正確な位置合わせが期し難くなる。
In the present invention, the amount X of alumina in the colored alumina sintered body and the amount Y of the coloring agent composed of chromium oxide, molybdenum and / or tungsten are outside the line AB shown in FIG. 1, that is, the coloring agent Y is 0.5. If the content is less than 10% by weight, the alumina-based sintered body is gray and it is difficult to accurately align the automatic wire bonder.

また同様に、第1図に示すCD線外、すなわち着色剤量Y
が4.7重量%を越えると電気的特性、とりわけ誘電率が1
1以上と高くなり、半導体素子収納用パッケージや多層
配線基板等の絶縁基体として使用するのが不適となる。
Similarly, outside the CD line shown in FIG. 1, that is, the colorant amount Y
If the content exceeds 4.7% by weight, the electrical characteristics, especially the dielectric constant will be 1
It becomes high as 1 or more, which makes it unsuitable for use as an insulating substrate for a semiconductor element housing package, a multilayer wiring board, or the like.

一方、第1図に示すBC線外、すなわちアルミナ量Xと着
色剤量Yが、それぞれBC線未満の範囲では熱伝導率及び
強度が低くなり、本発明の目的を達成し得ない。
On the other hand, outside the BC line shown in FIG. 1, that is, when the alumina amount X and the colorant amount Y are less than the BC line, the thermal conductivity and the strength are low, and the object of the present invention cannot be achieved.

同様にしてアルミナ量Xと着色剤量Yがそれぞれ第1図
に示すAD線を越える範囲では、前記タングステン、モリ
ブデン、マンガン等の金属から成る電気配線用のメタラ
イズ金属層を均一に被着形成することが困難となり実用
的でない。
Similarly, in the range where the alumina amount X and the colorant amount Y each exceed the AD line shown in FIG. 1, the metallized metal layer for electric wiring, which is made of the metal such as tungsten, molybdenum or manganese, is uniformly deposited. Is difficult and impractical.

なお、本発明において前述のアルミナ量Xと着色剤量Y
は、第1図の下記BCEFの各点で囲まれた範囲内、好まし
くは下記BGHFの各点で囲まれた範囲内である。
In the present invention, the amount of alumina X and the amount of colorant Y described above are used.
Is within the range surrounded by the following BCEF points in FIG. 1, preferably within the range surrounded by the following BGHF points.

X(重量%) Y(重量%) B 92.0 0.5 C 87.8 4.7 E 90.3 4.7 E 94.5 0.5 G 89.5 3.0 H 92.0 3.0 〔実施例〕 次に本発明を実施例に基づき説明する。 X (wt%) Y (wt%) B 92.0 0.5 C 87.8 4.7 E 90.3 4.7 E 94.5 0.5 G 89.5 3.0 H 92.0 3.0 [Examples] Next, the present invention will be described based on Examples.

まず、純度99.8%、平均粒径1.8μmのアルミナ(Al
2O3)粉末とSiO2、CaO、MgO等を主成分とする焼結助剤
と酸化クロム(Cr2O3)及び焼結後、金属モリブデン(M
o)またはタングステン(W)の少なくとも1種となる
モリブデンまたはタングステンの酸化物あるいは塩酸か
ら成る着色剤を焼結後の含有量が第1表に示した重量と
なる様に秤量し、有機溶媒およびアルミナボールととも
に回転ミルにて混合粉砕し、次いで該混合粉砕物にブチ
ラール樹脂等のバインダーを加えて混合し、原料スラリ
ーを調製した。
First, alumina (purity 99.8%, average particle size 1.8 μm) (Al
2 O 3 ) powder and a sintering aid mainly composed of SiO 2 , CaO, MgO, etc. and chromium oxide (Cr 2 O 3 ) and after sintering, metal molybdenum (M 2
o) or tungsten (W), which is at least one of molybdenum or tungsten oxide or a coloring agent made of hydrochloric acid, is weighed so that the content after sintering is the weight shown in Table 1, and an organic solvent and A raw material slurry was prepared by mixing and grinding with an alumina ball in a rotary mill, and then adding and mixing a binder such as butyral resin to the mixed and ground product.

かくして得られたスラリーをドクターブレード法により
シート状に成形し、該成形体を複数枚加熱密着した後、
加湿した水素−窒素混合ガス雰囲気中で1500〜1600℃の
範囲内の焼成温度で2時間焼成し、着色アルミナ質焼結
体を得た。
The slurry thus obtained is formed into a sheet by the doctor blade method, and a plurality of the formed bodies are heated and adhered to each other,
Firing was performed for 2 hours at a firing temperature in the range of 1500 to 1600 ° C. in a humidified hydrogen-nitrogen mixed gas atmosphere to obtain a colored alumina sintered body.

その後、上記着色アルミナ質焼結体を直径10mm、厚さ2m
mの円板状に研摩加工し、レーザーフラッシュ法により
熱伝導率を、同様にして研摩加工した長さ40mm、3mm×4
mm角の角柱を使用して、JIS R 1601の規定に基づき3点
曲げ強さをそれぞれ測定した。
Then, the colored alumina sintered body is 10 mm in diameter and 2 m in thickness.
Polished in the shape of a disk of m, and the thermal conductivity was similarly polished by the laser flash method. Length 40 mm, 3 mm x 4
Three-point bending strength was measured based on the JIS R 1601 rule using a square prism of mm square.

また同様にして、縦・横各50mm、厚さ2mmの板状に研摩
加工し、JIS C 2141の規定に基づき体積固有抵抗(100
℃、相対湿度50%)及び誘電率(室温、1MHz)を測定
し、誘電損失を導出した。
In the same way, the plate shape of 50 mm in length and width and 2 mm in thickness is polished, and the volume resistivity (100 mm) is measured according to JIS C 2141.
℃, relative humidity 50%) and dielectric constant (room temperature, 1MHz) were measured and the dielectric loss was derived.

更に、上記着色アルミナ質結晶体表面にタングステンの
メタライズ金属層を被着形成すると共に、該メタライズ
金属層表面にニッケルめっきを行ない、これに低熱膨張
の金属片を低融点ロウ材でロウ付けし、3kg/mm2の引張
り応力でもって該金属片を引張り、剥離の有無を確認
し、メタライズの強度評価を行なった。
Further, while depositing a metallized metal layer of tungsten on the surface of the colored alumina crystalline body, nickel plating is performed on the metallized metal layer surface, and a metal piece with low thermal expansion is brazed with a low melting point brazing material, The metal piece was pulled with a tensile stress of 3 kg / mm 2 , the presence or absence of peeling was confirmed, and the strength of metallization was evaluated.

なお、焼結体中のアルミナ及び各着色剤の量はICP発光
分光分析法によりそれぞれ測定した。
The amounts of alumina and each colorant in the sintered body were measured by ICP emission spectroscopy.

その結果を第1表に示す。The results are shown in Table 1.

また試料番号69,70,71は従来例を示す。Further, sample numbers 69, 70 and 71 are conventional examples.

第1表より明らかな様に、従来例の試料番号69,70,71は
いずれも熱伝導率が17W/mKと低く、曲げ強度も30kg/mm2
と低い。また、試料番号1,2,4,10,51,62は第1図に示す
AB線外または着色剤中の酸化クロム量に対する金属モリ
ブデン及び/またはタングステンの量の比が1.5以下の
場合であり、いずれも色調が灰色となり実用的でない。
また、試料番号14,32は第1図に示すBC線外、試料番号5
0は第1図に示すCD線外、試料番号3,21,36は第1図に示
すAD線外の場合であり、それぞれ熱伝導率、誘電率、誘
電損失、メタライズ強度が満足すべきものでない。また
試料番号4,10,25,29,37,45,62及び7,13,27,31,41,19,5
5,68は酸化クロム量に対する金属モリブデン及び/また
はタングステンの量の比が1.5以下または5.0を越える場
合で、それぞれ熱伝導率が19W/mK以下または誘電率、誘
電損失等の電気的特性を満足するものではない。
As is clear from Table 1, the sample numbers 69, 70 and 71 of the conventional example all have low thermal conductivity of 17 W / mK and bending strength of 30 kg / mm 2
And low. The sample numbers 1, 2, 4, 10, 51, 62 are shown in Fig. 1.
This is the case where the ratio of the amount of molybdenum metal and / or tungsten to the amount of chromium oxide outside the AB line or in the colorant is 1.5 or less, and the color tone is gray and not practical.
Sample numbers 14 and 32 are outside the BC line shown in Fig. 1, sample number 5
0 is outside the CD line shown in FIG. 1, and sample numbers 3, 21, and 36 are outside the AD line shown in FIG. 1, and the thermal conductivity, dielectric constant, dielectric loss, and metallization strength are not satisfactory. . Sample numbers 4,10,25,29,37,45,62 and 7,13,27,31,41,19,5
5,68 is when the ratio of the amount of molybdenum metal and / or tungsten to the amount of chromium oxide is 1.5 or less or exceeds 5.0, and the thermal conductivity is 19 W / mK or less, or the electrical characteristics such as dielectric constant and dielectric loss are satisfied. Not something to do.

これに対し、本発明の着色アルミナ質焼結体は熱伝導率
が20W/mK以上で、かつ曲げ強さも50kg/mm2以上と極めて
高く、色調及び電気的諸特性とも半導体素子収納用パッ
ケージや半導体集積回路素子が搭載される多層配線基板
等の絶縁基体として満足すべきものであった。
On the other hand, the colored alumina-based sintered body of the present invention has a thermal conductivity of 20 W / mK or more, and a bending strength of 50 kg / mm 2 or more, which is extremely high, and has a color tone and various electrical characteristics in a package for storing semiconductor elements and It has been satisfactory as an insulating substrate such as a multilayer wiring board on which a semiconductor integrated circuit element is mounted.

〔発明の効果〕〔The invention's effect〕

本発明によれば、電気的諸特性を劣化させることなく意
外な程、高い熱伝導率を有しかつ高強度の十分かつ均質
な色調を有する着色アルミナ質焼結体を得ることができ
るため、放熱が良好な半導体素子収納用パッケージや多
層配線基板を得ることができる。
According to the present invention, it is possible to obtain a colored alumina-based sintered body having a high thermal conductivity and a sufficient and uniform color tone of high strength, which is surprisingly high without deteriorating various electrical characteristics. It is possible to obtain a package for housing a semiconductor element and a multilayer wiring board that have good heat dissipation.

【図面の簡単な説明】[Brief description of drawings]

第1図は本発明の着色アルミナ質焼結体中のアルミナ量
Xと着色剤量Yの含有範囲を示した図である。
FIG. 1 is a diagram showing the content range of the amount of alumina X and the amount of colorant Y in the colored alumina sintered body of the present invention.

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】アルミナ、着色剤及び焼結助剤から成る着
色アルミナ質焼結体において、前記アルミナと着色剤の
各量が第1図の下記ABCDの各点で囲まれた範囲内にあ
り、前記着色剤は酸化クロムと金属モリブデン及び/又
はタングステンとから成り、酸化クロム量に対する金属
モリブデン及び/又はタングステン量の比が1.5を越え
5.0以下であり、熱伝導率が20W/mk以上、曲げ強度が50k
g/mm2以上であることを特徴とする着色アルミナ質焼結
体。 A:アルミナ96.0重量%、着色剤0.5重量% B:アルミナ92.0重量%、着色剤0.5重量% C:アルミナ87.8重量%、着色剤4.7重量% D:アルミナ91.8重量%、着色剤4.7重量%
1. In a colored alumina sintered body comprising alumina, a coloring agent and a sintering aid, the respective amounts of the alumina and the coloring agent are within a range surrounded by respective points of ABCD shown in FIG. The coloring agent is composed of chromium oxide and molybdenum and / or tungsten, and the ratio of molybdenum and / or tungsten to chromium oxide exceeds 1.5.
5.0 or less, thermal conductivity of 20W / mk or more, bending strength of 50k
A colored alumina-based sintered body characterized by having g / mm 2 or more. A: Alumina 96.0% by weight, colorant 0.5% by weight B: Alumina 92.0% by weight, colorant 0.5% by weight C: Alumina 87.8% by weight, colorant 4.7% by weight D: Alumina 91.8% by weight, colorant 4.7% by weight
JP62276728A 1987-10-30 1987-10-30 Colored alumina sintered body Expired - Fee Related JPH0745335B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62276728A JPH0745335B2 (en) 1987-10-30 1987-10-30 Colored alumina sintered body

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62276728A JPH0745335B2 (en) 1987-10-30 1987-10-30 Colored alumina sintered body

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP4168076A Division JP2580439B2 (en) 1992-06-26 1992-06-26 High dielectric constant alumina sintered body and method for producing the same

Publications (2)

Publication Number Publication Date
JPH01119557A JPH01119557A (en) 1989-05-11
JPH0745335B2 true JPH0745335B2 (en) 1995-05-17

Family

ID=17573511

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62276728A Expired - Fee Related JPH0745335B2 (en) 1987-10-30 1987-10-30 Colored alumina sintered body

Country Status (1)

Country Link
JP (1) JPH0745335B2 (en)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03226987A (en) * 1990-01-31 1991-10-07 Kyocera Corp Ceramic heater
JP2580439B2 (en) * 1992-06-26 1997-02-12 京セラ株式会社 High dielectric constant alumina sintered body and method for producing the same
JP3859354B2 (en) * 1998-04-30 2006-12-20 日本特殊陶業株式会社 Spark plug, spark plug insulator and method of manufacturing the same
JP4540223B2 (en) * 2000-12-26 2010-09-08 京セラ株式会社 Electronic component mounting board
EP4041829A1 (en) * 2019-10-09 2022-08-17 DIC Corporation Composite particle and method of producing composite particle
WO2021068128A1 (en) * 2019-10-09 2021-04-15 Dic Corporation Plate-like alumina particle and method for manufacturing plate-like alumina particle
JP7151935B2 (en) * 2019-10-09 2022-10-12 Dic株式会社 Plate-like alumina particles and method for producing plate-like alumina particles

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63182252A (en) * 1987-01-20 1988-07-27 三菱電機株式会社 Manufacture of black ceramics

Also Published As

Publication number Publication date
JPH01119557A (en) 1989-05-11

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