JPH0744353B2 - Automatic taping machine for electronic parts, forming means and taping method - Google Patents

Description

Description: TECHNICAL FIELD The present invention relates to taping of electronic components for cutting (cutting) electronic components from a frame, forming (molding) lead terminals, and loading into recesses of a carrier tape. Regarding automatic machines.

[Prior art]

Plastic embossed carrier tape (carrier tape) was used in response to chipping of electronic components such as capacitors, resistors, coils, switches, variable resistors, and crystal oscillators, and improvement of automatic mounting technology on printed circuit boards. The range of packaging applications is expanding.

There is provided a taping unit in which a chip-type electronic component (chip) is housed in a recess of a carrier tape and the cover tape seals the recess of the carrier tape. The cover tape has a hot melt layer,
After being brought into contact with the upper surface of the carrier tape, the carrier tape and the cover tape are heat-sealed by melting the hot melt layer.

Taping unit, parts feeder, magazine,
There is known an automatic taping machine for electronic components, which is a combination of component supply means such as a lead frame loader and checking means for checking the characteristics of electronic components.

A vibrating bowl feeder is generally used as a means for supplying electronic components. In this vibrating bowl feeder, a spiral track is formed on the peripheral wall of the bowl, and a large number of pre-separated electronic components are fed to the bottom of the bowl. The center of the bottom of the bowl is formed higher, and when the bowl is vibrated in the circumferential direction, it falls from the center of the bottom to the periphery of the bottom and enters the spiral trajectory, and is aligned and oriented while climbing the spiral trajectory. Since the upper end of the spiral track is connected to the linear transport path, electronic components that have climbed up the spiral track are pushed later and transported along the linear transport path.

Checking means such as a contact probe is arranged along the linear conveying path, and while the electronic parts are conveyed along the linear conveying path, the characteristic checking of the electronic parts is performed by the checking means, and it is determined that the product is defective. The judged electronic parts are
Ejected from the linear transport path. Then, the non-defective electronic component that reaches the end of the linear transport path is transferred to the taping unit and loaded in the carrier tape recess, and the packaging of the electronic component is completed.

With such an automatic taping machine, the supply of electronic components to the loading of the carrier tape recesses can be automated, and a large amount of electronic components can be quickly packaged.

[Problems to be Solved by the Invention]

In the above-described known automatic taping machine, each process of characteristic check, defective product discharge, and taping is sequentially performed while the supplied electronic components are transported along the linear transport path. Therefore, the checking means, the taping unit, and the like are sequentially arranged along the linear transport path, and the automatic taping machine becomes long in the longitudinal direction, which makes it difficult to downsize the automatic taping machine.

Further, the known automatic taping machine does not have a forming function of forming (forming) the lead terminals of the electronic component into a predetermined shape. Therefore, as a pre-step of taping, the lead terminals must be formed into a predetermined shape in advance. Since the electronic components that have been previously formed are supplied to the automatic taping machine, the component supply means is structurally complicated, and the electronic components may be deformed or damaged during supply and during transportation.

Tolerance on the characteristics of electronic parts is a value specific to each electronic part. Taking the capacitance of a tantalum capacitor as an example, it is ± 20% of the absolute value. However, recently, highly precise and highly accurate products have been desired, and the tolerance is often required to be ± 10% of the absolute value. Furthermore, in tantalum capacitors used in specific industrial fields, , Only ± 5% of the absolute value is allowed as a tolerance. And, because of the large and small tolerance, in the tantalum capacitor, it is M class (the tolerance is ± 20% of the absolute value.
, The same shall apply hereinafter), K class (± 10% of absolute value), J class (± 5% of absolute value).

The allowable tolerance is stored (recorded) in advance, and the checking means determines the quality of the electronic component based on this memory value. Here, since the conventional linear conveying path type automatic taping machine is difficult in terms of space, it has only one taping unit. Therefore, for example, if a class K is set as the allowable tolerance, an M class electronic component that can be incorporated into a general product must be disposed of as a defective product, and it is difficult to effectively use the electronic component.

An object of the present invention is to provide an automatic taping machine for electronic parts, which has a forming function and can be miniaturized and which can be effectively used.

Another object of the present invention is to provide a forming means for an electronic component that prevents internal destruction of the electronic component, damage to the lead terminal, and cutting.

Further, an object of the present invention is to provide a taping method for electronic components, which performs cutting, forming, characteristic checking, and loading of supplied electronic components while classifying good products into a plurality of classes, for example, two classes. There is.

[Means for Solving the Problems]

In order to achieve this object, according to the taping device for electronic parts of the present invention, a circular transport path is formed instead of a linear transport path by using a rotary table that is intermittently fed. Around the rotary table, cutting means, forming means, checking means, and taping unit are sequentially arranged. Two taping units are provided.

Therefore, if the electronic components that have not been formed and are still connected to the frame are sent to the rotary table, all the necessary processes such as cutting, forming, checking, and loading can be performed during one round of the rotary table.

〔Example〕

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

The automatic taping machine 10 cuts a chip (electronic component) 14 of a tantalum capacitor connected to a frame 12 (see FIGS. 2A to 2D), and left and right lead terminals 15
After forming into a predetermined shape shown in FIG. 2 (E),
It is configured to load.

The structure of the automatic taping machine 10 will be briefly described. As shown in FIG. 1, the automatic taping machine has an intermittent drive means.
A rotary table 16 that is intermittently fed by means of 15 is provided in the center, and other components are arranged around the rotary table. In the example, a rotary table
The indexing angle of 16 is set to 22.5 ° and 16 indexing positions (stations) are formed. Among them, as shown in the figure, A, B
It is supposed that the predetermined process is carried out at six stations of 1, B2, C, D1, D2.

The station A is a cutting station, and the cutting means 22 is arranged around the rotary table 16 so as to face the cutting station A.
Then, the chip 14 supplied from the component supply means 20 is transferred to the frame by the cutting means 22 at the station A.
Disconnected from 12. Sixteen support means 24 are equiangularly arranged on the rotary table 16, and after the chips 14 are cut, they are supported by the support means and conveyed. The support means 24 is usually a suction head that uses vacuum pressure, but may have a configuration other than the suction head.
The rotary table 16 is configured to be able to move up and down, and the support means (suction head) 24 is moved up and down integrally with the rotary table while sucking the chip 14.

In the embodiment, the forming station includes the first and second forming stations.
Forming means B1 and B2, and forming means 26 and 28 are arranged around the rotary table 16 facing the stations B1 and B2. At the first forming station B1, the lead terminals 15 of the chip 14 are first bent at right angles. Then, another right-angled bending is applied to the lead terminals 15 at the second forming station B2, and the chip is formed (formed) into a predetermined shape.

The chip 14 is then sent to the check station C, subjected to a characteristic check by a check means 30 such as a contact probe, and sent to the loading station D.

In the present invention, two taping units 32, 34 are arranged 90 ° apart from each other and arranged around the rotary table 16, and two loading stations are provided. The taping units 32 and 34 are long in the longitudinal direction and
Since it is about mm, the installation space is reduced by disposing the rotary table 16 in the tangential direction.

For example, the checking means 30 may set the tolerance to the absolute value ± 20.
The quality is judged as%, and the good products are classified as M class (tolerance is ± 20% of absolute value), K class (± 10% of absolute value), J
Judge by classifying into grade (± 5% of absolute value). The non-defective chips 14 judged to be K-class or J-class by the checking means 30 are loaded separately in the corresponding taping units 32 and 34. For example, a K-class chip 14 is placed in the first taping unit 32, and a J-class chip is placed in the second taping unit 34.
Are loaded from the rotary table 16 respectively.

Since there are three empty stations between the loading stations D and D2, defective and M-class chips 14 are collected in these empty stations. For example, in the first empty station, defective products are collected in the defective product box, and in the next empty station, M-class chips 14 are collected in the stick magazine.

The automatic taping machine 10 is provided with a control means 36 having a microcomputer (microcomputer) 35 built-in, and the constituent members such as the intermittent drive means 15, the component supply means 20 and the like are all connected to the control means, and the control means 36 is provided. The operation is controlled.

Hereinafter, the configuration and operation of the automatic taping machine 10 will be described in detail.

As shown in FIGS. 2 (A) and 2 (B), the frame 12 is formed integrally with, for example, eight chips (tantalum capacitors) 14, and is provided with a series of guide holes 37 for pitch feed.
Is formed on the frame.

The component supply means 20 includes a known caterpillar-shaped conveyor (not shown) and is provided adjacent to the cutting means 22. For example, 30 frames 12 can be simultaneously stocked on the conveyor. Each frame 12 is supported upright by a frame holder 13 on the conveyor, stocked upright, and turned 90 ° together with the frame holder at the end of the conveyor (see FIGS. 3A and 3B). The transport mechanism 38 stands by below the inverted frame holder 13, and the frame 12 is gradually extracted from the frame holder 13 and transported to the cutting station A by the transport mechanism.

The transport mechanism 38 has a series of feed pins 39 (only one is shown in the figure), and with the feed pins engaged with the guide holes 37 of the frame, the transport mechanism moves to the cutting station side, in FIG. By sliding to the left, the tips 14 at the left end are fed to the cutting station A one by one. The transport mechanism 38 is configured to be slidable and movable up and down, and in addition to FIG. 3 (B), FIG. 3 (C),
As is clear from (D) and (E), the frame 12 is pitch-fed to the left by repeating sliding to the left, descending, sliding to the right, and rising.

When all the chips 14 have been cut from the frame 12 (cutting will be described later), the empty frame is discharged from the frame holder 13 to the left. And
The next frame holder 13 is turned over by 90 °, and the succeeding frame 12 is moved to the transport position shown in FIG. 3 (B).

As shown in FIG. 4 (A), the cutting means 22 comprises a pair of shearing cutters 42, 43 which are vertically separated from each other, and is arranged around the rotary table 16 at the cutting station A. The chips 14 are fed from the component supply means 20 between the cutters 42 and 43 one by one. The upper cutter 42 has a pair of left and right fixed cutters 42a, and the lower cutter 43 has a blade 43b between a pair of guide pieces 43a and is configured to be movable up and down.

When the sensor 14 or the like detects the feed of the tip 14 from the component supply means 20 to the cutting station A, the (movable) cutter 43 moves up, and the blade 43a moves the tip 1 into the frame 1.
Cut (cut) from 2 (see FIG. 4 (B)). The tip 14 after cutting is shown in FIG.
An enlarged view is shown in (D).

In the configuration of the embodiment, the feed pin 39 of the transport mechanism is engaged with the guide hole 37 of the frame to pitch feed the frame 12, and the pair of guide pieces 43a of the movable cutter insert the lead terminal 15 between them. While sandwiching and guiding, blade 43
The lead terminal 15 of the chip is cut at a. for that reason,
The play of the feed pin 39 and the guide hole 37 of the frame
It is absorbed by the guide of the lead terminal 15 of the chip by 43a, and cutting of the lead terminal can be performed under high-precision related dimensions.

The movable cutter 43 rises with the cut tip 14 still mounted. The suction head (support means) 24 on the rotary table 16 has its suction surface facing the movable cutter 43 and stands by above the movable cutter. When the chip 14 approaches the suction head 24, vacuum pressure is applied to the suction head, and the suction head sucks the chip. When the chip 14 is moved to the suction head 24, the movable cutter 43 descends and returns to the initial position, the frame 12 is pitch-fed by the transport mechanism 38, and the above cutting is repeated.

In the embodiment, since the suction head using vacuum pressure is used as the support means 24 and the chip 14 is supported by the suction force instead of the force such as the gripping force, the chip can be surely supported without being damaged. . Further, since the suction surface faces downward, the chip 14 can be sucked quickly and easily. Further, by removing the action of the vacuum pressure, the chip 14 can be easily separated and removed, and the defective product described later and the taping unit 3 can be removed.
Loading of chips (non-defective products) to 2,34 is extremely easy.

With the suction head 24 sucking the chips 14 loaded, the rotary table 16 is intermittently (pitch) fed by the indexing angle, that is, 22.5 °. The intermittent driving means 15 of the rotary table comprises a roller cam type indexing unit.

By intermittently feeding the rotary table 16,
The suction head 24 is conveyed from the cutting station A to the next forming station B while sucking the chip 14.

As shown in FIG. 1, forming station B
Is the first 90 ° away from cutting station A
It is divided into a forming station B1 and a second forming station B2 which is separated by 45 °.
The forming means 26, 28 provided in the first and second forming stations B1, B2 are friction roller mechanisms 4
It has almost the same configuration with 6,48 respectively.

Before explaining the configuration of the friction roller mechanisms 46, 48,
Describing the conventional forming, as shown in FIG. 5, the conventional forming means 126 is configured by combining a die (lower die for forming) with a punch (upper die). As shown in FIG. 5, the conventional forming means 12
6, the chip 114 sucked by the suction head 124 is
It is placed on the die 129, and the stopper 131 holds the lead terminal 115 from both sides with the die. And punch 1
The chip 114 is formed (folded) as shown by the alternate long and short dash line by descending 33 and contacting and pressing the lead terminal 115.

In such forming, due to the pressing of the punch 133, a large frictional force acts between the upper surface of the lead terminal 115 and the punch 133 to generate a tensile force on the lead terminal 115. Due to the tensile force generated in the lead terminal 115, the chip 114 may be pulled from both sides, and internal damage such as peeling of solder may occur inside the chip. Also, dice 129, punch 133
Since it is forcibly bent at, the lead terminal 115 is easily damaged and cut.

On the other hand, according to the forming means 26, 28 of the present invention, the disadvantages of the prior art as described above are eliminated. The friction roller mechanisms 46 and 48 have almost the same configuration using the same principle, and the configuration of the friction roller mechanism 46 will be schematically described.

As can be seen from FIG. 6 schematically showing, the friction roller mechanism 46 includes a pair of rotatable friction rollers 33 each pivotally supported on one end of a support plate 50,
The other end of the support plate is swingably connected to a connector 54 by a rotating pin 52. The connector 54 is configured to be able to move up and down and has a spring, for example, a tension spring.
56 is installed between a pair of support plates 50.

In such a configuration, the support plate 50 is
With the center of rotation 52, the inward biasing force that brings the friction rollers 33 closer to each other is received, as seen from the arrow. The swinging of the support plate 50 inward is restricted by a stopper (not shown).

As shown in FIG. 7 (A), the tip 14 has a suction head 24.
, Is placed on the die 29, sandwiched between the dies by the stopper 31, and set in the forming station B. Then, the connector 54 descends, and the friction roller 33, as shown in FIGS. 7 (A) and (B),
The lead terminal 15 of the chip is contacted and pressed from above to form (bend) the lead terminal. In addition, in order to avoid complication of the drawing, in FIG.
The constituent members of the friction roller mechanism 46 other than 33 are omitted.

If the friction roller 33 is pressed and the lead terminal 15 is formed by the friction roller and the die 29, the frictional force pulling the lead terminal from both sides tends to act between the upper surface of the lead terminal and the friction roller 33. . However, as described above, since the friction roller 33 is rotatable, the frictional force between the lead terminal 15 and the friction roller 33 is the friction roller as shown by the arrow in FIG. 7 (B). The frictional force is absorbed by the rotation. Therefore, the tensile force due to the frictional force is not generated in the lead terminal 15. In this way, since an unreasonable external force (tensile force) does not act on the chip 14 during forming, there is no risk of internal damage such as peeling of solder on the chip.

Further, not only the friction roller 33 can be rotated, but also the tension spring 56 can be extended to escape outward against the biasing force. Therefore, when the lead terminal 15 is pressed and receives resistance, the friction roller 33 is rotated and escapes outward, whereby the pressing force transmitted from the friction roller 33 to the lead terminal 15 is reduced, and an excessive pressing force is applied. Is prevented. Therefore, the forming can always be performed under an appropriate pressing force, and the lead terminal 15 can be sufficiently prevented from being damaged or cut.

Further, in the known forming method, as easily understood from FIG. 5, the punch 133 can move only in the vertical direction and cannot move (slide) in the lateral direction. Therefore, it is difficult to form (bend) at 90 ° or more, and even if the 90 ° forming is performed accurately, the 90 ° accurate forming cannot be obtained due to the deformation due to the back tension.

On the other hand, in the present invention, since the friction roller 33 is attached to the swingable support plate 50, the friction rollers can slide so as to approach or separate from each other by swinging the support plate. . Here, the support plate 50 is biased inward by the tension spring 56, and the inward swing of the support plate is merely restricted by the stopper. Therefore, 90
At the time of FIG. 7 (B), where the forming of ° is almost completed, the restriction of the stopper is released and the support plate 50 is freed. The support plate 50 is biased by the tension spring 56, and the support plate swings inward. To be done. Therefore, as shown in FIG. 7 (C), the friction roller 33 presses the lead terminal 15 against the inclined side surface 29a of the die, and the forming of 90 ° or more can be easily performed. Also, even if the deformation due to the back tension is taken into consideration, 90 ° forming can be surely obtained. Further, by appropriately setting the inclination angle and shape of the inclined side surface 29a of the die, it is possible to perform forming at an appropriate angle of 90 ° or more.

In FIG. 6, a tension spring 56 is installed between the support plates 50 as a spring of the friction roller function 46. However, as long as it imparts a biasing force to the friction rollers 33 in a direction in which they approach each other, a compression spring, a leaf spring or the like may be used instead of the tension spring.

FIG. 8 shows a specific structure of the friction roller mechanism 46 of the first forming means. As far as possible, the same reference numeral as that in FIG. 6 is used, and the friction roller 33, which is a bearing, is rotatably attached to the support plate 50. In addition, the pair of support plates 50 are bearings.
It is swingably attached to the connector 54 by a rotating pin 52 with a pin 53 interposed therebetween. The tension spring 56 is locked to the locking pin 57 of the support plate 50 and is installed on the support plate side.

One side of the support plate 50, in the embodiment, the right side support is formed by being divided into two members 50a and 50b. An insertion hole is formed in the member 50a supporting the friction roller 33, and a female screw is formed in the other member. They are provided and these members are bolted. In such a configuration, the amount corresponding to the clearance of the insertion hole,
The member 50a can be slid, and the centering of the friction roller 33 and the like can be adjusted.

Further, the support plate 50 on the right side has an extending portion 50c, and a cam follower 58 composed of a bearing is pivotally supported on this extending portion. Since the spring between the support plates is the tension spring 56, the extension part 50c of the support plate is
In FIG. 8, it is biased counterclockwise about the pivot pin 52. An arm 50d extends from the left side surface of the right support plate 50, and an arm 50e extending from the opposing side surface (right side surface) of the left support plate 50 extends from above.
It is in contact with 0d. By bringing the arms 50e and 50d into contact with each other in this way, the left support plate 50 can swing in conjunction with the right support plate 50.

A guide 60 is fixed to the back surface of the connector 54, and the guide is fitted in a vertically elongated hole (guide hole) 64 of a fixed frame 62. The stopper 66 is bolted to the frame 62, and the side surface (left side surface) facing the bearing 58 is a cam.
66a. The cam 66a is formed in such a shape that the friction roller 33 can move inward as the friction roller 33 descends.

The connector 54 is fixed to the drive link 68, and is moved up and down together with the drive link by moving the drive link up and down with the cam 70. When the connector 54 descends, the friction roller 33 forms the lead terminal 15 of the chip. Then, the cam follower 58 pressed against the cam 66a moves outward along the cam,
The right support plate 50 swings inward with the left support plate. That is, when the pair of support plates 50 moves up and down together with the connector 54, which is an elevating member, the right support plate first swings in response to the locus of the cam follower 58 along the cam 66a, and the arm 50 moves.
By the contact of d and 50e, the left support plate is always interlocked and swings integrally. Therefore, the pair of friction rollers 33 slide inward while descending,
Forming over 90 ° as shown in FIG. 3C is performed symmetrically and simultaneously.

In the embodiment, the friction roller 33 and the cam follower 58 are used.
Is used as a bearing, and the bearing is arranged around the rotation pin 52. Therefore, the friction roller
33, the rotation of the cam follower 58 and the swinging of the support plate 50 occur smoothly, and the forming can be performed with high accuracy.

Note that, contrary to the embodiment, the cam follower 58 is attached to the stopper 66.
In addition, the cam 66a may be provided on the support plate 50. Further, the left and right support plates 50 can be interlocked by bringing the arms 50d and 50e into contact with each other, but the support plates may be interlocked from other configurations.

Since the lead terminal 15 is formed so as to hold the chip, the die (lower die) 29 is slid backward in FIG. 8 to allow it to escape, and then the rotary table.
The chips 14 are pitch-fed again, and the chips 14 are conveyed to the next step.

Since the lead terminal 15 is formed so as to hold the chip, the die (lower die) 29 is slid backward in FIG.
Are again fed by pitch, and the chip 14 is conveyed to the next step.

The locus L of the center of the friction roller 33 in the above configuration is shown in FIG. 9 from the starting point 01 to the contact start point (forming end point) 02 of the friction roller 33 and the lead terminal 15. , Extends diagonally. When the forming by the friction roller 33 is started, the locus L vertically descends, and when the lead terminal 15 is pressed against the inclined side surface 29a of the die (pressing start point 03), it escapes outward due to the molding resistance of the lead terminal. When the forming of the lead terminal 15 is completed (forming ending point 04),
The same locus as the inclined slope 29a is drawn.

The same forming is performed in the next second forming as well, and the chip 14 is formed into a predetermined shape shown in FIG. 2 (E). The forming means 28 for the second forming has the same structure as the first forming means 26, and therefore detailed description thereof will be omitted.

As described above, in the present invention, the rotary table 16 is used to form the circular transport path instead of the linear transport path. Therefore, the automatic taping machine 10 can be downsized without lengthening in the longitudinal direction.

By reducing the size of the automatic taping machine 10, a space can be provided and the forming means 26, 26 can be mounted, and the chip (electronic component) 14 is removed from the component supply means 20 in a state before forming. It can be supplied directly to automatic taping machines. As described above, since the chip 14 before forming can be supplied, the structure of the component supplying means 20 is simplified, and the chip is prevented from being deformed or damaged during the supply and the transportation.

The chip 14 formed into a predetermined shape is conveyed by one pitch (22.5 °), and the next check station C is formed.
(See FIG. 1). A check means 30 is provided in the check station C, and the check means is provided with, for example, a Kelvin-type contact probe.

Although the contact probe has a known structure and will not be described in detail, when the suction head 24 sucking the chip 14 reaches the check station C, a pair of measuring terminals of the probe standing by below rises. Then, the lead terminals 15 are brought into contact with each other. In the embodiment, since the chip 14 is the tantalum capacitor, the capacitance of the chip is measured by the taping checker, and the quality of the chip and the classification of good products are performed. Measurement terminal is lead terminal
When 15 is contacted, the quality of the chip and the class of non-defective product are immediately judged, and the measurement terminal immediately separates from the lead terminal and returns to the initial position.

Fix the measurement terminal, and when the rotary table 16 descends,
The lead terminal 15 may be brought into contact with a fixed measuring terminal.

In the embodiment, the quality check is judged based on ± 20% of the absolute value which is the allowable tolerance of the capacitance of the tantalum capacitor. In addition, good products are classified into M class (tolerance is ± 20% of absolute value), K class (± 10% of absolute value), and J class (± 5% of absolute value) according to the tolerance. Be divided. However, the quality check and the classification of non-defective products can be appropriately selected by storing the reference allowable tolerance in the taping checker in advance.

The determination result of the taping checker is sent to the control means 36 and stored in memory. Defective products are, for example,
It is collected at the station (empty station) next to the first taping station D1. That is, when the chip 14 is determined to be a defective product, the control unit 36 generates a defective product determination signal when the suction head 24 to which the defective product is attached reaches the station (defective product collecting station).
Then, the supply of the vacuum pressure to the suction head 24 is cut off, and the chip 14 is naturally dropped and collected in the defective box below.

In the embodiment, a suction head is adopted as the support means 24,
Since the suction surface is provided facing downward, the defective chip 14 can be quickly and easily removed by cutting off the supply of the vacuum pressure.

On the other hand, the chips 14 judged as non-defective are classified into M class, K class, and J class, and the corresponding tape unit 32, 34
Is moved to and loaded. Which grade of chip 14 is loaded into which tape unit 32, 34 is pre-stored in the control means 36. For example, the K grade chip is the first tape unit 32 and the J grade chip is the second. It is processed by the tape unit 34. Then, the M-class chip 14 is separated from the suction head 24 in an empty station next to the defective product collecting station and is collected in the lower stick magazine.

Of course, it is possible to arbitrarily set which class of non-defective product is processed by which taping unit or is recovered without taping. For example, M-class and K-class chips are loaded into the first tape unit 32, J-class chips are loaded into the second tape unit 34, and M-class chips are loaded into the first tape unit 32 and K-class. Class J chips may be loaded into the second tape unit 34.

Known taping units, such as the taping unit disclosed in Japanese Patent Laid-Open No. 63-012417, are used as the first and second taping units 32 and 34.

Since taping by the taping units 32 and 34 is well known, the chip 14 determined to be M-class or K-class will be roughly described, for example, by the suction head 24 on the rotary table. The carrier tape (plastic embossed carrier tape) is directly supplied and stored in the recess. Then, by the image processing by binarizing the shape pattern recognition means using a CCD camera or the like, the shape of the chip in the recessed portion of the carrier tape (the stored state) is recognized, and whether the stored state is good or not is determined. The quality of is determined.

When the shape pattern recognition means determines that at least one of the storage state of the chip in the carrier tape concave portion and the chip itself is defective, the corresponding component (defective product) is removed from the concave portion by the component replacement means. Then, the parts replacement unit takes out the chips (non-defective products) stocked in the adjacent stocker in the correct posture, supplies the chips to the recesses of the carrier tape in the correct storage state, stores them, and replaces the chips. To do.

After that, the cover tape is covered with the carrier tape,
The hot melt layer of the cover tape is heated, the cover tape is adhered to the carrier tape and heat-sealed, and loading of the chip 14 is completed.

In the present invention, since the conveying path of the chip 14 is circular, a space for mounting two taping units can be secured without much difficulty. By mounting the two taping units 32 and 34, it is possible not only to determine whether the product is a defective product or a non-defective product, but also to load the non-defective product by classifying it according to the allowable tolerance. Therefore, it is possible to perform the proper classification of loading according to the purpose of use.

Small tolerance, for example, ± 10% of absolute value (K class) as a standard, M class chip 14 or ± 5% of absolute value
The K-class and M-class chips based on (J-class) were judged to be defective products by the conventional taping automatic machine. It can be effectively used as a good product in a large class.

Even if you decide only good or bad without selecting good products,
The two taping units 32, 34 can be effectively used.
For example, if taping in the first taping unit 32 is completed or a trouble occurs, switching to the second taping unit 34 allows loading to continue without interruption. That is, even if the reel of the carrier tape is replaced or a trouble occurs, the loading is not interrupted, and the automatic taping machine 10 can be operated with a high operating rate.

The above-described embodiments are for explaining the present invention, and do not limit the present invention in any way, and all modifications and alterations made within the technical scope of the present invention are also included in the present invention. Needless to say.

For example, although two taping units are almost sufficient, three or more taping units may be arranged if space is available.

Further, the defective product may be collected before the taping station.

〔The invention's effect〕

As described above, according to the present invention, since the circular transport path is formed by using the rotary table, the automatic taping machine can be miniaturized without being long in the longitudinal direction.

Since the taping automatic machine is downsized, there is more space, and the forming means can be installed.Electronic parts can be directly supplied to the taping automatic machine from the parts supply means before forming. It is possible to prevent deformation and damage of electronic parts during transportation.

In addition, the space to install two taping units is
It can be secured without much difficulty. By mounting two taping units, you can not only judge defective products and non-defective products, but you can also load non-defective products by class according to the size of the tolerance, and you can perform proper classification according to the purpose of use. It Therefore, in the present invention, K-class and M-class electronic components, which have been conventionally regarded as defective,
It can be effectively used as a good product in a class with a large tolerance, without being judged as a defective product.

Even when non-defective products are not sorted into classes, by effectively utilizing the two taping units, loading is not interrupted and the taping automatic machine can operate at a high operating rate.

Further, as described above, according to the forming means of the present invention, the frictional force between the lead terminal and the friction roller is absorbed by the rotation of the friction roller. Therefore, during forming, an unreasonable external force does not act on the electronic component, and there is no risk of internal damage such as peeling of solder.

The friction roller rotates and escapes to the outside to reduce the pressing force of the friction roller, preventing the excessive pressing force from acting and allowing the forming to always be performed under an appropriate pressing force. Sufficiently prevent breakage and cutting.

By controlling the swing of the support plate, the support plate is swung inward together with the friction roller, so that the forming of 90 ° or more can be easily performed.

A pair of rotatable support plates provided on the lifting member are brought into contact with each other, and one support plate,
Since the combination of the cam and the cam follower is provided between the stoppers, the left and right support plates swing integrally, and the forming can be performed symmetrically at the left and right.

Further, according to the electronic component taping method of the present invention, from cutting to forming, checking, and loading are sequentially performed during one round of the rotary table while classifying a good product, and taping is appropriate according to the purpose of use. You can classify into

[Brief description of drawings]

FIG. 1 is a conceptual view of an automatic taping machine of the present invention, and FIGS. 2 (A) to (E) are plan views, front views, enlarged front views after cutting of electronic components (chips) before cutting, and enlarged views. Right side view, enlarged front view after forming, FIGS. 3 (A) to 3 (E) are process drawings showing supply of electronic components to the cutting station, and FIGS. 4 (A) to (C) are electronic components. FIG. 5 is a schematic view showing the forming by the conventional forming means, FIG. 6 is a schematic view of the configuration of the forming means of the present invention, and FIGS. 7 (A) to 7 (C). FIG. 8 is a process drawing of forming by the forming means of the present invention, FIG. 8 is a front view of the forming means, and FIG. 9 is a locus diagram of the center of the friction roller. 10: Automatic taping machine, 12: Frame, 14: Electronic parts (chip of tantalum capacitor), 15: Intermittent drive means, 16:
Rotary table, 20: Parts supplying means 22: Cutting means, 24: Supporting means (suction head), 26, 28: Forming means, 29: Die (lower die), 30: Checking means, 3
1: Stopper, 32, 34: Taping unit, 36: Control means, 38: Conveying mechanism, 42, 43: Cutter, 46, 48: Friction roller mechanism, 50: Support plate, 52: Rotating pin, 54: Connector, 56: tension spring, 57: cam follower, 66: stopper, 66a: cam.

Claims (7)

[Claims] 1. A rotary table which is equiangularly provided with cutting means for cutting the supplied electronic parts into a predetermined shape and a large number of support means for supporting the electronic parts cut by the cutting means, and which is intermittently fed. Forming means for molding the lead terminals of electronic parts on a rotary table into a predetermined shape, and checking the characteristics of the electronic parts by contacting the lead terminals with the measuring terminals, and judging the quality of the electronic parts. The cutting means is provided with a checking means capable of making a judgment by selecting a plurality of classes according to the tolerance of each of the classes, and two loading units in which electronic parts after rejected defective products are transferred and loaded into the recesses of the carrier tape. Means, forming means, checking means,
Each of the loading units is arranged around the rotary table, and two types of carrier tapes of the loading units are provided to automatically select and load good electronic components of the corresponding class. Machine. 2. The support means on the rotary table is
The automatic taping machine for electronic parts according to claim 1, further comprising a suction head that utilizes vacuum pressure, and a suction surface of the suction head faces downward. 3. A pair of support plates, on which a forming means is swingably attached to the elevating member by means of a rotating pin and which can abut against each other on opposite surfaces; and facing each other above the electronic components on the die. A pair of friction rollers rotatably supported by the support plate; a biasing force in a direction of approaching the friction roller, and the opposing surfaces of the pair of support plates are brought into contact with each other to interlock the pair of support plates. By providing a spring capable of swinging; a stopper that abuts on one of the pair of support plates to restrict swinging of the pair of support plates, and by providing a combination of a cam and a cam follower on one of the support plates, the stopper. , A pair of support plates according to the trajectory of the cam follower along the cam as the lifting member moves up and down The automatic taping machine for electronic parts according to claim 1, wherein the friction rollers are pressed against the lead terminals of the electronic parts by the rocking of the support plates in conjunction with each other. 4. The automatic taping machine for electronic parts according to claim 3, wherein arms are extended from the facing surfaces of the pair of support plates of the forming means and abutted against each other. 5. Forming means of an electronic component, which is combined with a die to form a lead terminal of the electronic component on the die into a predetermined shape, is attached to an elevating member so as to be swingable by a rotating pin, and has a facing surface. A pair of support plates that can abut each other, a pair of friction rollers that face each other above the electronic components on the die, and are rotatably supported by the support plate, and a friction roller that applies a biasing force in the approaching direction. And a spring that abuts the opposing surfaces of the pair of support plates to allow the pair of support plates to swing together, and abuts one of the pair of support plates to swing the pair of support plates. It has a stopper to regulate, and one of the support plates and the stopper must be provided with a combination of a cam and a cam follower. Allows the pair of support plates to interlock with each other according to the locus of the cam follower along the cam as the elevating member moves up and down, and the friction roller presses the lead terminals of the electronic component by the swing of the pair of support plates. Forming means for electronic components. 6. An electronic component is supplied to a rotary table which is intermittently fed; forming a lead terminal of the electronic component, checking the characteristics of the electronic component, discharging a defective product, and feeding to a carrier tape while the rotary table makes one revolution. Electronic component loading is performed sequentially; In addition to determining defective products and non-defective products by performance checking of electronic components, the non-defective products are sorted into multiple classes according to the tolerance, and two tape loading units are provided. A method for taping electronic components that selects and loads good electronic components of the corresponding class on the corresponding carrier tape of. 7. An electronic component is supplied to a rotary table which is intermittently fed; forming a lead terminal of the electronic component, checking the characteristics of the electronic component, discharging a defective product, and feeding to a carrier tape while the rotary table makes one revolution. Electronic component loading is performed sequentially; in addition to judging defective products and non-defective products by performance checking of electronic components, non-defective products are sorted into three classes according to the tolerance, and three tape loading units are prepared. A method for taping electronic components that selects and loads good electronic components of the corresponding class on the corresponding carrier tape of.