JPH0743273U - Wafer insulation device - Google Patents

Abstract

(57) [Summary] [Object] An object of the present invention is to provide a wafer heat retention apparatus capable of controlling the temperature of a wafer with high accuracy in a wafer processing step. A wafer stage 12 on which a wafer 11 is placed in order to raise or lower the temperature of the wafer to a predetermined temperature or to keep the temperature at a constant temperature in a wafer processing apparatus, and a heating and heat retaining unit provided inside the wafer stage. A heating device 13 for a wafer, the heating device 13 includes a passage 13a circulating in the wafer stage.
The wafer heat retention device 10 is configured so as to include the liquid 13b whose temperature is controlled to flow in the passage.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a wafer heat insulating device in a wafer processing process.

[0002]

[Prior art]

 Generally, when manufacturing a semiconductor device such as an IC, in various processing steps, a wafer is processed in a processing apparatus at a predetermined temperature. For this reason, in each processing apparatus, a wafer heat retention apparatus is used for raising or lowering the temperature of the wafer to a predetermined temperature or keeping it at a constant temperature.

As such a wafer heat retention device, there is known a wafer heat retention device configured as shown in FIG. 3, for example. That is, in FIG. 3, the wafer heat retention apparatus 1 is composed of a wafer stage 3 on which the wafer 2 is placed and a heater 4 for heating and heat retention provided inside the wafer stage 3.

The upper surface of the wafer stage 3 is formed substantially flat so as to support the wafer 2. The heater 4 is connected to a control device (not shown), and the control device controls the temperature of the wafer 2 to be raised or lowered to a predetermined temperature or kept at a constant temperature.

According to the wafer heat retention apparatus 1 having such a configuration, the wafer 2 is first placed on the upper surface of the wafer stage 3 and the heater 4 is drive-controlled by the controller, whereby the entire wafer stage 3 is Heated and kept warm. As a result, the wafer 2 placed on the upper surface of the wafer stage 3 can be raised or lowered to a predetermined temperature or kept at a constant temperature.

[0006]

[Problems to be solved by the device]

 However, in such a wafer heat retention apparatus 1, since the heat conduction efficiency from the heater 4 to the wafer stage 3 is relatively low, the accuracy of temperature control of the wafer 2 becomes low. Therefore, the wafer processing cannot be performed at a predetermined temperature, the processing cannot be performed well, and the yield of the wafer processing is reduced.

In view of the above points, an object of the present invention is to provide a wafer heat insulating device that can control the temperature of a wafer with high accuracy in a wafer processing step.

[0008]

[Means for Solving the Problems]

 According to the present invention, in order to raise or lower the temperature of a wafer in a wafer processing apparatus or to keep it at a constant temperature, a wafer stage on which a wafer is placed and an inside of the wafer stage are provided. In a wafer heat retention device including a heating heat retention device provided, the heating device comprises a passage circulating in the wafer stage and a heat-controlled liquid flowing in the passage. This is achieved by the wafer heat insulation device, which is characterized by that

[0009]

[Action]

 According to the above configuration, the heated liquid flows in the passage formed so as to circulate inside the wafer stage. As a result, the wafer stage is heated and kept warm by the liquid circulating inside. Therefore, as compared with the conventional heating by the heater, the heat conduction efficiency is improved, and the wafer stage and the wafer are uniformly heated and kept warm, so that the temperature control of the wafer can be performed with high accuracy. You will get it.

[0010]

【Example】

 Hereinafter, the present invention will be described in detail with reference to the embodiments shown in the drawings. FIG. 1 shows an embodiment of a wafer heat insulating device according to the present invention. In FIG. 1, the wafer heat insulation device 10 is composed of a wafer stage 12 on which a wafer 11 is placed, and a heating device 13 for heating and heat insulation provided inside the wafer stage 12.

The upper surface of the wafer stage 12 is formed substantially flat.

The above structure is similar to the conventional wafer heat retention device 1 shown in FIG. 3, but in the wafer heat retention device 10 according to the embodiment of the present invention, the heating device 13 is not a heater but a wafer stage. It is composed of a passage 13a formed so as to circulate inside 12 and a heating liquid flowing in the passage 13a.

In the illustrated case, the passages 13 a are arranged in a zigzag shape so that the passage length becomes longer from the left side to the right side of the wafer stage 12.

The liquid flowing in the passage 13a is supplied from a supply source (not shown) while being temperature-controlled to a predetermined temperature, and a liquid having a relatively large heat capacity such as oil can be used.

The wafer heat insulation apparatus 10 according to the embodiment of the present invention is configured as described above, and when used, the operation is performed as follows.

That is, the wafer 11 is first placed on the upper surface of the wafer stage 12, and a heating liquid whose temperature is controlled to a predetermined temperature is caused to flow into the passage 13a from a supply source (not shown).

Here, the liquid heats and keeps the temperature of the wafer stage 12 when passing through the passage 13a, so that the temperature of the wafer stage 12 is raised and lowered to a predetermined temperature or kept at a constant temperature. At that time, since the passage 13a circulates in the wafer stage 12 in a zigzag manner, the entire wafer stage 12 can be heated uniformly. As a result, the wafer 11 placed on the wafer stage 12 can be uniformly heated and kept warm throughout.

Therefore, the wafer stage 12 is heated and kept warm by the liquid circulating in the passage 13a, so that the heat conduction efficiency is improved, and the temperature of the wafer 11 can be controlled with high accuracy. It will be. Thus, the wafer processing can be performed accurately at a predetermined temperature, and the processing can be performed satisfactorily, so that the yield of wafer processing can be improved.

FIG. 2 shows a modified example of the wafer heat retention apparatus according to the present invention. In the figure, those parts corresponding to those in FIG. 1 are designated by the same reference numerals, and a detailed description thereof will be omitted.

In the wafer heat retention device 20 according to the present modification, the passage 13 a of the heating device 13 is spirally arranged, and is devised so as to heat the stage surface all over.

In the above-described embodiment, oil is used as the liquid flowing in the passage 13a, but the liquid is not limited to this, and any liquid may be used as long as it has a relatively large heat capacity. That is clear.

[0022]

[Effect of device]

 As described above, according to the present invention, it is possible to provide an extremely excellent wafer heat retaining device that enables the temperature of the wafer to be controlled with high accuracy in the wafer processing step.

[Brief description of drawings]

FIG. 1 is a schematic cross-sectional view showing an embodiment of a wafer heat insulating device according to the present invention.

FIG. 2 is a schematic perspective view showing a modified example of the wafer heat insulating device according to the present invention.

FIG. 3 is a schematic cross-sectional view showing an example of a conventional wafer heat retention device.

[Explanation of symbols]

 10, 20 Wafer insulation device 11 Wafer 12 Wafer stage 13 Heating device 13a Passage 13b Oil

Claims (1)

[Scope of utility model registration request] 1. A wafer stage on which a wafer is placed in order to raise or lower the temperature of the wafer to a predetermined temperature or to keep the temperature at a constant temperature in a wafer processing apparatus, and a heating and heat retaining unit provided inside the wafer stage. And a heating device for heating the wafer, wherein the heating device includes a passage circulating in the wafer stage,
A wafer heat retention device, which is composed of a liquid whose temperature is controlled to flow in the passage.