JPH0740078A - Particulate solder paste - Google Patents
Particulate solder pasteInfo
- Publication number
- JPH0740078A JPH0740078A JP20567693A JP20567693A JPH0740078A JP H0740078 A JPH0740078 A JP H0740078A JP 20567693 A JP20567693 A JP 20567693A JP 20567693 A JP20567693 A JP 20567693A JP H0740078 A JPH0740078 A JP H0740078A
- Authority
- JP
- Japan
- Prior art keywords
- solder
- solder particles
- solder paste
- protective layers
- particulate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、粒子状はんだペースト
に係り、とくに表面実装プリント基板の電子部品のはん
だ付け用として好適な粒子状はんだペーストに関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a particulate solder paste, and more particularly to a particulate solder paste suitable for soldering electronic components of surface mount printed circuit boards.
【０００２】[0002]
【従来の技術】電子部品を基板上に、リフローはんだ付
けする際に用いるはんだペーストにおいて、従来のはん
だペーストは、はんだ粒子とフラックスとが均一に混合
されたペースト状となっており、このはんだペースト
は、印刷または吐出しにより基板上の所定位置に供給さ
れ、その後に部品搭載が行われ、しかるのち加熱されて
ハンダ付けが行われる。2. Description of the Related Art In a solder paste used for reflow soldering an electronic component onto a substrate, the conventional solder paste is a paste in which solder particles and flux are uniformly mixed. Is supplied to a predetermined position on the substrate by printing or ejecting, then components are mounted, and then heated and soldered.
【０００３】そして、この従来のはんだペーストでは、
はんだ付けが確実に行われたか否かの判断を目視により
行っていた。即ち、はんだ粒子が溶融して再凝固した際
に生じる金属光沢を目視で確認し、これによってはんだ
付けが確実に行われたか否かが判断されていた。And, in this conventional solder paste,
The judgment as to whether or not the soldering was performed properly was made visually. That is, the metallic luster produced when the solder particles are melted and re-solidified is visually confirmed to judge whether or not the soldering is reliably performed.
【０００４】[0004]
【発明が解決しようとする課題】しかしながら、この目
視によるはんだ付けの確認は、金属光沢の度合いによっ
て未溶融はんだを見分けるため、多くの熟練を要すると
いう不都合があり、また、確認作業者の疲労の度合いも
高くなって作業性が悪いという不都合があった。また、
はんだ粒子は小さく且つ表面積が広いため、はんだ粒子
表面の酸化があって長期保存が困難であるという不都合
も生じていた。However, this visual confirmation of soldering has the inconvenience of requiring a lot of skill because the unmelted solder is discriminated depending on the degree of metallic luster, and the fatigue of the confirmation operator is reduced. There was an inconvenience that the degree was high and the workability was poor. Also,
Since the solder particles are small and have a large surface area, the surface of the solder particles is oxidized, which makes it difficult to store for a long period of time.
【０００５】[0005]
【発明の目的】本発明は、かかる従来例の有する不都合
を改善し、とくに熟練を要することなく，はんだ付けが
確実に行われたか否かを容易に見分けることができる粒
子状はんだペーストを提供することを、その目的とす
る。It is an object of the present invention to provide a particulate solder paste capable of improving the disadvantages of the conventional example and easily discriminating whether or not the soldering has been reliably performed without requiring special skill. That is the purpose.
【０００６】[0006]
【課題を解決するための手段】本発明では、電子部品を
基板上にリフローはんだ付けする際に用いる無数の粒子
状はんだ素材から成る粒子状はんだペーストにおいて、
粒子状はんだ素材の外面に、色素を含む熱溶融性保護層
を付加する、という構成を採っている。これによって前
述した目的を達成しようとするものである。According to the present invention, there is provided a particulate solder paste made of a myriad of particulate solder materials used for reflow soldering an electronic component onto a substrate,
A heat melting protective layer containing a pigment is added to the outer surface of the particulate solder material. This aims to achieve the above-mentioned object.
【０００７】[0007]
【作 用】はんだペーストの保存状態または加熱前の状
態にあっては、はんだ粒子表面を保護層によって酸素と
遮断される。これにより、はんだの酸化が防止される。
また、加熱状態で、はんだ粒子が溶融すると保護層が分
離し、金属光沢をもった、はんだが表面にあらわれる。
仮に、温度が充分に上昇せずに、はんだ粒子が溶融しな
かった場合には、保護層は、はんだ粒子の表面にそのま
ま残る。これらの違いは、保護層が有色であるため、目
視により容易に判別が可能である。[Operation] When the solder paste is stored or before heating, the surface of the solder particles is shielded from oxygen by the protective layer. This prevents solder oxidation.
In addition, when the solder particles are melted in the heated state, the protective layer is separated, and solder having a metallic luster appears on the surface.
If the temperature does not rise sufficiently and the solder particles do not melt, the protective layer remains on the surface of the solder particles. Since the protective layer is colored, these differences can be easily distinguished visually.
【０００８】[0008]
【発明の実施例】以下、本発明の一実施例を図１に基づ
いて説明する。この図１に示す実施例は、電子部品を基
板上にリフローはんだ付けする際に用いる無数の粒子状
はんだ素材（はんだ粒子）１と、このはんだ粒子１の外
面に付加された色素を含む熱溶融性保護層（有色保護
層）２とを備えている。このように構成された粒子状は
んだペーストの一例を図１に示す。DETAILED DESCRIPTION OF THE INVENTION An embodiment of the present invention will be described below with reference to FIG. The embodiment shown in FIG. 1 is a thermal melting process including an infinite number of particulate solder materials (solder particles) 1 used when reflow soldering an electronic component onto a substrate, and a dye added to the outer surface of the solder particle 1. And a sex protection layer (colored protection layer) 2. An example of the particulate solder paste thus configured is shown in FIG.
【０００９】この有色保護層２は、はんだペーストが加
熱されるまでのあいだ、はんだ粒子１が酸化するのを防
止する。また、加熱され，はんだ粒子１が溶融し液化す
ると、はんだ粒子の形状が変化するため、有色保護層２
は分離する。これにより、はんだ粒子１が溶融した部分
は金属光沢が表れる。また、溶融しなかった部分は、有
色保護層２がそのまま残る。このため、とくに熟練を要
することなく目視にて容易に検査を行うことが可能とな
る。The colored protective layer 2 prevents the solder particles 1 from being oxidized until the solder paste is heated. When the solder particles 1 are heated and melted and liquefied, the shape of the solder particles changes, so that the colored protective layer 2
Separate. Thereby, a metallic luster appears in the portion where the solder particles 1 are melted. In addition, the colored protective layer 2 remains as it is in the portion which is not melted. Therefore, it is possible to easily perform visual inspection without requiring special skill.
【００１０】[0010]
【発明の効果】以上説明したように、本発明によると、
はんだ粒子表面に有色の保護層を付着することにより、
はんだ前にあっては、はんだペーストの酸化を有効に防
止することができ、又はんだ付け作業後は、はんだ付け
不良における未溶融の箇所を目視にて容易に判定するこ
とができるという従来にない優れた粒子状はんだペース
トを提供することができる。As described above, according to the present invention,
By attaching a colored protective layer to the surface of the solder particles,
Before soldering, it is possible to effectively prevent the oxidation of the solder paste, or after soldering, it is possible to easily visually determine the unmelted portion in the soldering failure. It is possible to provide an excellent particulate solder paste.
【図１】本発明の一実施例を示す断面図である。FIG. 1 is a sectional view showing an embodiment of the present invention.
１ 粒子状はんだ素材としてのはんだ粒子 ２ 熱溶融性保護層としての有色保護層 1 Solder particles as a particulate solder material 2 Colored protective layer as a heat-melting protective layer
Claims (2)
けする際に用いる無数の粒子状はんだ素材から成る粒子
状はんだペーストにおいて、 前記粒子状はんだ素材の外面に、色素を含む熱溶融性保
護層を付加して成ることを特徴とした粒子状はんだペー
スト。1. A particulate solder paste comprising innumerable particulate solder materials used for reflow soldering an electronic component onto a substrate, wherein a heat-melting protective layer containing a pigment is provided on the outer surface of the particulate solder material. A particulate solder paste characterized by being added.
の成分に応じて異なった色あいのものが使用されている
ことを特徴とした請求項１記載の粒子状はんだペース
ト。2. The particulate solder paste according to claim 1, wherein different colors are used as the pigment depending on components of the particulate solder material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5205676A JP2580963B2 (en) | 1993-07-28 | 1993-07-28 | Particulate solder paste |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5205676A JP2580963B2 (en) | 1993-07-28 | 1993-07-28 | Particulate solder paste |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0740078A true JPH0740078A (en) | 1995-02-10 |
| JP2580963B2 JP2580963B2 (en) | 1997-02-12 |
Family
ID=16510855
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5205676A Expired - Lifetime JP2580963B2 (en) | 1993-07-28 | 1993-07-28 | Particulate solder paste |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2580963B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07323391A (en) * | 1994-06-03 | 1995-12-12 | Eastern:Kk | Colored soldering material and method for forming colored film on soldered part |
| EP1693142A1 (en) * | 2005-02-15 | 2006-08-23 | Qualitek International, Inc. | Lead-free solder paste |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS525013A (en) * | 1975-06-28 | 1977-01-14 | Kubota Ltd | Clamper in a pipe separater |
| JPS61115692A (en) * | 1984-11-09 | 1986-06-03 | Nippon Superiashiya:Kk | Coloring solder cream |
| JPH03237590A (en) * | 1990-02-14 | 1991-10-23 | Matsushita Refrig Co Ltd | Sample commodity exhibiting device for automatic vending machine |
-
1993
- 1993-07-28 JP JP5205676A patent/JP2580963B2/en not_active Expired - Lifetime
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS525013A (en) * | 1975-06-28 | 1977-01-14 | Kubota Ltd | Clamper in a pipe separater |
| JPS61115692A (en) * | 1984-11-09 | 1986-06-03 | Nippon Superiashiya:Kk | Coloring solder cream |
| JPH03237590A (en) * | 1990-02-14 | 1991-10-23 | Matsushita Refrig Co Ltd | Sample commodity exhibiting device for automatic vending machine |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07323391A (en) * | 1994-06-03 | 1995-12-12 | Eastern:Kk | Colored soldering material and method for forming colored film on soldered part |
| EP1693142A1 (en) * | 2005-02-15 | 2006-08-23 | Qualitek International, Inc. | Lead-free solder paste |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2580963B2 (en) | 1997-02-12 |
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