JPH0739630B2 - Vacuum deposition equipment - Google Patents

Description

TECHNICAL FIELD The present invention relates to a vacuum vapor deposition apparatus, and more particularly to a vacuum vapor deposition apparatus suitable for forming a thin film at a temperature of room temperature or lower.

[Conventional technology]

The conventional vacuum vapor deposition apparatus includes Review of Scientific Instruments, Vol. 56, No. 9 (1985), pages 1799 to 1803 (Review of Scienfic Instruments, Volume).
e 56, No. 9 (1985) PP1799 to 1803).

Further, Japanese Utility Model Laid-Open No. 59-91734 discloses a substrate cooling device for semiconductors and the like.

[Problems to be Solved by the Invention] In the above-mentioned conventional technique, in order to replace the substrate, it is unavoidable to return the vacuum environment to the atmospheric pressure and work, and it takes several hours to create the high vacuum environment again. Since the above is required, there is a problem that work efficiency is poor. In addition, in order to avoid water adhesion when exposing the main part of the vacuum container force to atmospheric pressure,
When the substrate temperature was below room temperature, it also took time to recover it.

An object of the present invention is to overcome the above-mentioned problems, and in a vacuum environment,
An object of the present invention is to provide a vacuum vapor deposition apparatus capable of exchanging substrates while keeping the substrate cooling means at a low temperature.

[Means for solving problems]

The above-mentioned object is that the first member and the second member having heat conductivity are relatively movable at least in the direction of the substrate, and means for elastically sealing the chamber formed between both members is provided. Means for supplying heat to the member and the second member, means for supplying the refrigerant to the chamber, means for detachably holding the susceptor on the first member, the other surface of the susceptor, and the second member. The means for moving the second member so as to be in close contact with the member, the preliminary vacuum chamber connected to the vacuum container through the partition valve, and the vacuum container and the preliminary vacuum chamber are traversed to attach and detach the substrate. It is achieved by providing a manipulator which operates.

[Action]

When the substrate is mounted, the susceptor to which the substrate is fixed in the preliminary vacuum chamber is guided by the manipulator to the normal transmission. The chamber formed by the first member, the second member, and the sealing means is kept in a vacuum state, the susceptor is attached to the first member by the holding means, and then the refrigerant is supplied to the room. Due to the supply of the refrigerant, the chamber receives the internal pressure, the sealing means expands, the second member and the susceptor come into close contact with each other, and the contact thermal resistance between the second member and the susceptor decreases. Therefore, the substrate is cooled by the coolant.
Further, the cooling temperature of the substrate can be changed to an arbitrary temperature depending on the amount of heat supplied by the means for supplying heat. Next, when removing the substrate from the susceptor, the refrigerant is discharged to make the chamber vacuum, and the second
By removing the contact pressure between the member and the susceptor, the susceptor can be easily disengaged from the holding means, and the manipulator transfers the susceptor to the preliminary vacuum chamber.

〔Example〕

An embodiment of the present invention will be described below with reference to FIGS. 1 and 2. FIG. 1 is a schematic diagram of a vacuum vapor deposition apparatus, in which a vacuum container 1 is connected to a vacuum exhaust system 3 via a valve 2 to maintain a high vacuum inside a vacuum container 4. A sluice valve 5 is provided in the vacuum container 1, and separates the preliminary vacuum chamber 6 from the inside of the vacuum container 4. The preliminary vacuum chamber 6 is provided with another vacuum evacuation system 7 and a substrate introducing mechanism 8 (manipulator) so that the substrate can be taken in and out of the atmosphere. The main part 9 of the apparatus will be described in detail with reference to FIG. Reference numeral 10 is a susceptor having a substrate (described later) attached to one surface thereof, which evaporates different substances from an evaporation source 11 and controls a deposition amount by a shutter 12. The device main part 9 includes a chamber 14 for storing the first refrigerant 13, a chamber 16 (not shown) for storing the refrigerant 15 in FIG. 2, flexible pipes 17, 18, 19, 20, and chamber 16 for the refrigerant. It is composed of a rotating mechanism 21 and a vertical moving mechanism 22. Reference numeral 23 is a shroud cooled with liquid nitrogen or the like and plays a role in maintaining a vacuum.

24 is a storage tank for supplying a second refrigerant such as liquid nitrogen, 25 is a container for gas or liquid for supplying the first refrigerant such as liquid nitrogen, 26 is a container for gas or liquid different from the container 25, 27
Is a vacuum pump, 28 is a flow meter, 29 is a pressure gauge, 30, 31, 3
2,33 are valves.

Next, the main part 9 of the apparatus will be described in detail with reference to FIG. The substrate 35 made of silicon, gallium arsenide, quartz or the like is attached to the copper susceptor 10 with indium, gallium, solder or the like.
The susceptor 10 has a groove 36 engraved on the outer circumference,
37 (holding means) connects to the block 37 (first member). A cooling stage 39 (second member) that is in contact with the susceptor 10 to form the chamber 14 is airtightly attached to the lower portion of the block 38 via a bellows 40 (expandable sealing means). The block 38 and the cooling stage 39 are preferably made of copper, aluminum, Shin Yu, stainless steel, or the like. An electrically insulated heater 41 (means for supplying heat) is thermally connected to the block 38. 42 is a lead wire of the heater 41, which is electrically insulated. When the heater 41 and the lead wire 42 are completely covered with a stainless steel case and drawn out of the vacuum container 1, the gas emitted from the heater wire and the insulating material does not matter. The thermal connection between the heaters 41 and 38 is made by cold fitting, shrink fitting, brazing, welding or the like.

The supply pipe 19 for the first refrigerant 13 is a chamber 16 in which the second refrigerant 15 is stored.
Inside, it leads to the chamber 14 via the guiding spiral tube 43. Cooling stage
Grooves 44 are formed on the surface of 39 on the chamber 14 side to increase the heat dissipation area. Alternatively, instead of the groove 44, a porous surface that promotes boiling heat transfer may be formed. It is desirable that the discharge pipe 20 should be exposed to the outside without heat exchange with the second refrigerant 15. Reference numeral 45 is a shaft provided on the central axes of the chambers 16 and 14, and is used to rotate or vertically move from the outside.

Thirdly, the structure is almost the same as that shown in FIG. 2 except that a permanent magnet 46 containing a rare earth element as a main component is attached to the block 38. As the heater 41, a ceramic substrate coated with a heater material is shown.

2 and 3 show only the pipes 19 and 20 as a means for fixing the chamber 14 and the block 38, but in order to secure the strength,
A plurality of support rods may be added. However, all of them use a material having low thermal conductivity such as stainless steel, and have a small cross-sectional area to reduce heat leakage.

Gold is plated on both surfaces (the other surface) where the cooling stage 39 and the susceptor 10 are in contact with each other. This is to prevent oxidation of the contact surface and reduce contact heat resistance.

FIG. 4 is an exploded perspective view showing the vicinity of the bayonet 37 shown in FIG. The cooling stage 39 is welded to and integrated with the bellows 40. The bayonet 37 is provided with a plurality of pawls 47 on its inner periphery at the lower portion, and a groove 48 is carved on the outer periphery of the susceptor 10 at a position corresponding to the pawls 47.

This operation is as follows. First, the susceptor 10 installed in the preliminary vacuum chamber 6 is supported by the holder 49 provided at the tip of the substrate introducing mechanism 8 at the groove 50 and is conveyed to the lower part of the cooling stage 39. In this state, the rotation mechanism 21 and the vertical movement mechanism 22
Align the tab 47 of the bayonet with the groove 48 of the susceptor by operating, and insert it. Then, the bayonet side is rotated so that the pawl 47 is inserted into the groove 36 of the susceptor so that the susceptor 10 does not drop. The chamber 14 is evacuated during this operation. If there is no pressure difference between the inside and the outside of the chamber 14, the cooling stage 39 and the susceptor 10 are preliminarily manufactured with a proper gap so that they can freely rotate with respect to each other. After the setting of the susceptor 10 is completed, the holder 49 is pulled out and gas is introduced into the chamber 14. Due to the introduction, a pressure difference is generated between the inside and the outside of the chamber 14, and the force due to the dust presses the cooling stage 39 against the susceptor 10. When it is necessary to cool the substrate 35 to a temperature close to the liquid nitrogen temperature, the first refrigerant 13 and the second refrigerant 15 are liquid nitrogen, and nitrogen gas is supplied from the container 25 at a constant flow rate. Although not shown, the flow rate is adjusted by monitoring the instruction of a thermometer attached to the cooling stage 39. The heater 41 can also be used to adjust the temperature. Especially when the temperature level is raised, the supply of the first refrigerant 13 is stopped. Or second
Increase the temperature level of the cooling 15 and add non-condensable gas to the container 26
It may be supplied at a more constant flow rate.

When the substrate 35 is replaced after the vapor deposition work, the chamber 14 is evacuated, the holder 49 is set on the susceptor 10, and the rotation mechanism 21 and the vertical movement mechanism 22 remove the susceptor 10 from the bayonet 37 and hold it. The container 49 may be drawn into the preliminary vacuum chamber 6, the valve 5 may be closed, the preliminary vacuum chamber 6 may be opened to the atmosphere, the susceptor 10 may be taken out, and the substrate 35 may be replaced. Since the inside 4 of the vacuum container 1 is not exposed to the atmosphere, even if a new substrate is introduced and the degree of vacuum is temporarily deteriorated, the high vacuum is restored in a short time.

FIG. 5 is a modification of the embodiment shown in FIG. The feature is that the first refrigerant and the second refrigerant are the same. That is, the supply pipe 19 can be opened at the bottom of the chamber 16 that stores the refrigerant 15, and the pressure of the chamber 16 can be increased to supply the refrigerant 15 to the chamber 14. The refrigerant that has been vaporized in the chamber 14 and has increased in temperature passes through the pipe 51 and is discharged to the outside from the heat-insulated discharge pipe 20. Refrigerant
The supply of 15 is continuously or intermittently performed through the supply pipe 17.
Multiple low thermal conductivity supports to secure chamber 16 and chamber 14
52 is used. Also, unlike FIG. 2, the cooling stage 39
The susceptor 10 has a flat plate shape.

FIG. 6 is another embodiment of the embodiment shown in FIG.
Instead of the supply pipe 19 and the discharge pipe 20 connected to the outside, a plurality of thin pipes 5 having an opening at the bottom of the chamber 16 for storing the refrigerant 15
Provide 2,53. Instead of the cooling stage 39 and the bellows 40, a diaphragm 55 having a flexure 54 is used.
Further, instead of the heater 41, a filament for heating 56 made of a tungsten wire or the like is used and is attached to a current terminal 58 fixed to a substrate 57 of the ceramic. Reference numeral 59 is a cap, and the current conducting wire 60 is insulated and drawn out, and is drawn out through the insulating terminal 61 to the outside. In this embodiment, the refrigerant 15 is supplied to the chamber 14 by natural circulation. When raising the temperature of the sample, energize filament 55 and block it with its axial heat.
38 is heated and the thin tubes 52, 53 are blocked with the vapor of the refrigerant 15. Alternatively, the refrigerant 15 may be removed from the bottom of the supply pipe 17. Diaphragm 55 is a thin wall of copper or stainless steel 0.1 mm ~ 1
mm) plate, the adhesion to the susceptor 10 is improved in the state where pressure is applied to the chamber 14, and the thermal resistance due to contact is small.

FIG. 7 shows an embodiment different from the embodiment shown in FIG.
The feature is that the chamber 16 and the chamber 14 are thermally connected by a connecting portion 61, and a gas that does not condense with the refrigerant 15 is introduced into the chamber 14 through the thin tube 60, and is comb-shaped. Combined block 38
And the cooling stage 39 is thermally connected through a narrow gap 62. In this case, the block 38 and the cooling stage 39 are preferably made of a material having a high thermal conductivity, for example, steel or the like, and the connecting portion 61 is preferably made of stainless steel or shinchi which has a medium thermal conductivity. The size of the gap 62 is about 10 μm to 100 μm, and the gas introduced into the chamber 14 is preferably helium. In this way, when the substrate 35 is cooled, the heater 41 is turned off, and the cooling stage 39 is cooled by the heat conduction in the connecting portion 61 and the block 38 and the heat conduction of helium in the gap 62. In the case of heating, the connection 61 acts as a thermal resistance to provide a temperature difference between the chamber 16 and the chamber 14. When attaching or detaching the susceptor 10, the chamber 14 may be evacuated and the cooling stage 39 may be separated from the susceptor 10 by the restoring force of the bellows 40.

〔The invention's effect〕

According to the present invention, it is possible to attach and detach the substrate in a high vacuum environment, and there is an effect that work efficiency is significantly improved.

[Brief description of drawings]

1 to 7 are explanatory views of a vacuum vapor deposition apparatus according to the present invention. FIG. 1 is a schematic view of an embodiment, FIG. 2 is a sectional view of a main part of the apparatus, and FIG. 3 is a view of another embodiment. Sectional view of the main part of the device, No. 4
FIG. 5 is an exploded perspective view of the holding means, FIG. 5 is a sectional view of a main part of the apparatus of yet another embodiment, FIG. 6 is a sectional view of a main part of the apparatus of yet another embodiment, and FIG. It is sectional drawing of the apparatus main part of an Example. 1 ... Vacuum container, 8 ... Substrate introduction mechanism (manipulator), 9 ... Main part of apparatus, 10 ... Susceptor, 38 ... Block (first member), 39 ... Cooling stage (second member) , 40 …… Bellows (expandable sealing means), 19,2
0 …… Small tube, 37 …… Bayonet (holding means), 46 …… Permanent magnet, 54 …… Diaphragm, 56 …… Filament.

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Naoyuki Tamura 502 Jinritsucho, Tsuchiura-shi, Ibaraki Hiritsu Seisakusho Co., Ltd. (72) Inventor Keno Kanai 794 Higashitoyoi Higashitoyo, Kumamatsu-shi, Yamaguchi Hiritsu Seisakusho Co., Ltd. Inside the factory

Claims (2)

[Claims] 1. A vacuum vapor deposition apparatus for forming a thin film on a substrate, comprising a vacuum container, a means for evacuating the interior of the vacuum container, a susceptor for mounting a substrate on one surface, a vapor deposition source or a molecular beam source, and thermal conduction. Of the flexible first member and the second member are relatively movable in at least the direction of the substrate, and a means for elastically sealing the chamber formed between the two members, and the first member is the second member. Means for supplying heat to the member, means for supplying the refrigerant to the member, means for detachably holding the susceptor on the first member, the other surface of the susceptor and the second member.
Means for moving the second member so as to bring the member into close contact with the other member, a preliminary vacuum chamber connected to the vacuum container through a partition valve, and a vacuum container and the preliminary vacuum chamber are moved back and forth to attach and detach the substrate. To do. A vacuum vapor deposition device characterized by being provided with a manipulator. 2. The vacuum vapor deposition apparatus according to claim 1, wherein a permanent magnet is provided on the second member.