JPH0738250B2 - Method of manufacturing thin film magnetic head - Google Patents

Description

Description: TECHNICAL FIELD The present invention relates to a method of manufacturing a thin film magnetic head in a magnetic recording / reproducing apparatus, and more particularly, to a lead portion formed in the thin film magnetic head outside a substrate for assembly. The present invention relates to a connection method for connecting to a connection terminal.

(Conventional Technology) In recent years, along with the demand for higher density of the digital magnetic recording / reproducing system, IC process technology using the conventional wafer process, in particular, vapor deposition, sputtering, CVD (chemical vapor deposition), etc. The thin-film magnetic head using the thin-film forming technology and the fine processing technology such as dry etching has attracted attention and has been partially put into practical use.

This thin-film magnetic head is suitable for mass production as compared with the conventional monolithic thin-film magnetic head, and it is possible to narrow the track and increase the number of tracks, and in terms of characteristics, the recording leakage flux is steep, which is short. It has excellent wavelength recording characteristics and is optimal for high density recording. For example, its use in audio PCM recording, computer magnetic recording devices, video floppies, etc. is also under consideration.

However, when a large number of magnetic heads or magnetic heads having multiple channels are formed on the substrate by taking advantage of the wafer process, these magnetic heads are separated as individual units, and then each thin film magnetic head is attached to a supporting member. At the time of assembling work, etc., how to simplify the method of pulling out the lead wire and the assembly itself remains a problem.

The structure and assembly method of the conventional thin film magnetic head will be described below as an example.

FIG. 9 is a perspective view showing a main part of a conventional thin film magnetic head chip 10, and FIG. 10 shows a protective substrate forming a part of a sliding surface of a recording medium in the thin film magnetic head chip 10 shown in FIG. FIG. 11 is a perspective view for explaining the attaching step, FIG. 11 is a perspective view for explaining the step of attaching the thin film magnetic head chip shown in FIG. 9 to the holder, and FIG. 12 is a connection of the thin film magnetic head shown in FIG. It is a partially expanded perspective view which shows the connection structure of a terminal part.

In FIG. 9, reference numeral 11 denotes a substrate, which is formed on one plane of the non-magnetic material block 11a made of glass or ceramics.
For example, Sendust (registered trademark) amorphous magnetic material,
The magnetic film 11b made of permalloy or the like is formed, but a magnetic block material such as single crystal ferrite or the like may be used if necessary.

Reference numeral 12 is a non-magnetic insulating material made of, for example, glass or the like, and is melt-filled in the groove 13 formed in the substrate 11 to form the same plane 12a as the substrate 11.

14 is, for example, a thin film core made of a magnetic film such as sendust, an amorphous magnetic material, and permalloy, and is formed on the substrate 11 so as to straddle the groove 13, and one end 14a of the thin film core 14 has a magnetic gap. It is connected to the magnetic film 11b via the material 15, forms a track width W on the recording medium sliding surface 16, and the other end 14b is connected to the magnetic film 11b.
Together with this, it constitutes the ring core. Reference numeral 17 denotes a ladder coil, which is formed in the nonmagnetic insulating material 12 below the thin film core 14 so as to cross the thin film core 14 and a row of conductive films (not shown) formed so as to intersect the thin film core 14. Conductive film
The row of 17a is electrically connected through a through hole (not shown) to form a three-dimensional coil around the thin film core 14.

Reference numerals 18 and 19 denote lead portions connected to the ladder-type coil 17, which are formed of a conductive thin film similarly to the ladder-type coil 17, and have one end of the first row of the conductive film 17a and the non-magnetic insulating material 13. It is formed on the substrate 11 so as to be drawn out from one end of the last row of the conductive film (not shown) formed therein and to extend rearward through the insulating film (not shown).

The thin-film magnetic head chip 10 having the above structure is usually not formed as a single body on the substrate 11, but on a wafer made of glass, ceramics or the like that forms the substrate 11, a thin-film deposition technique and a high-precision lithography technique. The thin film magnetic head chip 10 having a uniform track width and a uniform gap length can be obtained with high accuracy because it is formed in a large amount by making full use of fine processing technology and the like.

A large number of thin film magnetic head chips 10 formed on a wafer
Is cut into blocks 20 having an appropriate quantity, and a protective substrate 21 for forming a part of the recording medium sliding surface 16 is integrally attached to the blocks 20 by an adhesive or the like as shown in FIG. After the predetermined tip polishing, the thin film magnetic head chip 10 having the protective substrate 21 is obtained by cutting into chips as shown by the dotted line.

At this time, the lead portions 18 and 1 formed to extend on the wafer
9 is not completely covered by the protective substrate 21 and is partially exposed. The thin film magnetic head chip 10 configured in this way,
As shown in FIG. 11, it is attached to the head attaching portion 22a of the holder 22 having a shape according to the purpose of use, and as shown in FIG. The output terminal connecting portions 23a, 23b and the lead portions 19, 18 formed on the thin film magnetic head chip 10 are electrically connected by wire bonding 24, 25 to obtain a thin film magnetic head assembly, and the mounting holes 22b and the like are used. To be attached to the device.

(Problems to be solved) As described above, the wire bonding means or the like is used for the connecting portions 23a, 23b of the external input / output terminals formed on the holder 22 with the lead portions 18, 19 formed on the thin film magnetic head chip 10. In the case of connection by wire connection, the pad area for wire bonding of the lead portions 18 and 19 is required to be about 100 μm × 100 μm per terminal, and the inter-terminal pitch is required to be about 200 μm. On the other hand, the actual size of a thin-film magnetic head is 100 track width x 100 core length.
Although it is only about μm × 300μm, when many thin film magnetic heads are constructed from one wafer, the pad area for wire bonding becomes relatively large, and the pad area and the pitch between terminals occupy the wafer. There is a problem that the number of thin film magnetic heads that can be configured above is fixed.

In particular, when a thin film magnetic head having multiple channels is constructed by taking advantage of the wafer process, this tendency becomes great, productivity is significantly impaired, and there is a problem in cost.

(Means for Solving Problems) The present invention has been made to solve the above problems, and is made of a magnetic material, an insulating material, a conductive material, or the like on the first surface of a substrate having a substantially rectangular parallelepiped shape. Thin films are sequentially formed and etched to form the magnetic gap, the thin film core, the thin film coil, and the magnetic gap among the four surfaces connected to both ends of the thin film coil and adjacent to the first surface. A thin film magnetic head chip by forming at least a pair of thin film leads extending to any of the three lead derivation surfaces excluding the surface to be the medium sliding contact surface, and the thin film. Second step of joining the thin film magnetic head chip and the holding member so that the lead lead-out surface of the magnetic head chip and a predetermined surface of the holding member for holding the thin film magnetic head chip form substantially the same surface. And joined together A third step of polishing the lead-out surface of the thin-film magnetic head chip forming one surface and the predetermined surface of the holding member, and directly to the end portions of the pair of thin-film leads exposed at the lead-out surface. A fourth method for forming a thin film lead line pattern electrically connected on the surface polished by the third step.
And a method of manufacturing a thin film magnetic head, which comprises at least the steps of.

(Embodiment) FIG. 1 is a perspective view showing the structure of a thin film magnetic head to be manufactured by the method of manufacturing a thin film magnetic head according to the present invention, and FIG. 2 is formed inside the thin film magnetic head shown in FIG. FIG. 6 is a partially cutaway perspective view showing the formed lead portion. Below, the first
The description will be made with reference to FIG. 2 and FIG. 2, but the same components as the components described in the conventional example are denoted by the same reference numerals and the description thereof will be omitted.

In FIG. 1, reference numeral 30 denotes a holder made of a non-magnetic material such as ceramic or glass. The holder 30 has a mounting hole 30a formed substantially in the center and a groove 30b formed at one end surface of the holder 30. The thin film magnetic head chip 31 is mounted in the groove 30b by a bonding means such as an adhesive. The thin-film magnetic head chip 31 has a structure similar to that of the thin-film magnetic head chip 10 shown in FIG. 9, except that the lead portion 18, formed on the substrate 11, as shown in FIG. 19 is bent at about 90 ° on the way and board 1
The magnetic head forming portion and the lead portions 18 and 19 formed in 1 are completely covered by the protective substrate 21, and the lead portions 18 and 19 are substantially perpendicular to the track width W direction of the thin film core 14.
c and the surface 21a of the protective substrate 21, and the tip portions 18a, 19
The point is that a is exposed on these surfaces.

Then, two lead line patterns made of a conductive film are directly connected to the tip portions 18a, 19a of the lead portions 18, 19 exposed on the substrate surface 11c and the surface 21a of the protective substrate 21.
32a and 32b are formed using a known thin film deposition technique, photolithography technique, or the like. Two leader line patterns 32a,
The area, shape, etc. of 32b may be selected so that they can be soldered to the connection terminals of the external device in the usual manner.

Next, a method of assembling the thin film magnetic head chip 31 and the holder 30 described above will be described.

3 and 4 are thin film magnetic head chips shown in FIG.
FIG. 11 is a perspective view for explaining a step of attaching 31 to holder 30.

In FIG. 3, 33 is a wafer on which a plurality of holders 30 shown in FIG. 1 are formed. One holder 30 shows a portion surrounded by a one-dot chain line showing a cutting line 34, and each holder 30 has a mounting hole 30a and a groove 30b formed in a part of the escape groove 35.

In order to form such grooves 30b and 35 on the wafer 33, it is possible to use, for example, a ceramic that can be exposed by a mask and etched such as Photoceram (registered trademark).

In the groove 30b of the wafer 33 configured as described above, the second
The thin film magnetic head chip 31 shown in the figure is inserted so that the tip portions 18a and 19a of the lead portions 18 and 19 face upward and fixed using an adhesive or the like.

Next, the substrate surface 11c of the thin film magnetic head chip 31 and the protective substrate surface 21a inserted into the groove 30b are polished so as to form the same plane with respect to the surface of the wafer 33, and the tips of the lead portions 18 and 19 are polished. 18a and 19a are exposed on the same surface as the surface of the wafer 33.

Next, the tip portion 18 is formed by a known wafer process.
Holder 30 in which the pattern of two lead lines 32a, 32b made of a conductive film is polished so as to touch the exposed portions of a, 19a.
And the substrate surface 11c and the protective substrate surface 21a.

Next, the wafer 33 is cut with a dicing machine or the like.
The thin film magnetic head assembly shown in FIG. 1 is obtained by cutting along the line 34.

As described above, according to the method of manufacturing the thin film magnetic head of the first embodiment of the present invention, the thin film magnetic head chip 31 is attached to the holder 30.
After being embedded in the
Rather than electrically connecting to the external terminals of 30 by means such as wire bonding, the tip portions 18a, 19a of the lead portions 18, 19 exposed on the substrate surface 11c are configured to be flush with the holder. Since the lead line patterns 32a and 32b made of a conductive film are formed on the surface so as to come into contact with the exposed portions of the lead portions 18 and 19 by using known thin film deposition means and photolithography technology, the lead portions 18 and 19 are wire-bonded. Therefore, it is not necessary to provide a pad portion having a large area for, so that the pitch interval between the lead portions 18 and 19 can be made small, and many thin film magnetic heads can be obtained from one wafer.

Further, when a photocellum or the like is used as a wafer, a large number of holders 30 can be formed on one wafer by a known wafer technique, so that the assembly of the thin film magnetic head and the formation of the lead line patterns 32a, 32b are efficiently performed. Therefore, it is possible to obtain a connection structure of connection terminals which is homogeneous and has high reliability.

Next, as a second embodiment, a case where the method of manufacturing a thin film magnetic head according to the present invention is applied to a magnetic head for a floppy disk drive (hereinafter referred to as FDD magnetic head) will be described. FIG. 5 is a perspective view showing an FDD magnetic head 40 in which a thin film magnetic head chip 42 is incorporated in a slider 41.
FIG. 7 is an enlarged perspective view showing the structure of the thin film magnetic head chip 42, and FIG. 7 is a perspective view showing the connection structure of the lead portion of the thin film magnetic head chip 42 shown in FIG. 5, which will be described below with reference to the drawings. To do.

In FIG. 5, reference numeral 40 denotes an FDD magnetic head having a structure in which a thin film magnetic head chip 42 is embedded in a slider 41. The slider 41 is made of a non-magnetic insulating material such as ceramic having excellent wear resistance, and has a sliding contact groove 41 formed in a substantially central portion.
On both sides of a, there is a sliding contact surface 41b that directly contacts the recording medium, and a rectangular through hole 41c for embedding the thin film magnetic head chip 42 is formed in a part of the sliding contact surface 41b. Hole 41c
The thin film magnetic head chip 42 is integrally mounted so that the recording medium sliding surface 16 forms the same surface as the sliding contact surface 41b of the slider 41.

The thin film magnetic head chip 42 has a ladder type coil 17 which is substantially the same as the thin film magnetic head chip 10 shown in FIG. 9, but the characteristic point is that the lead portions 18 and 19 are provided as shown in FIG. So that the board 11 extends straight downward at a narrow pitch P.
The point is that it is formed above and that the magnetic head portion formed on the substrate 11 is not provided with a protective substrate 21 as shown in FIG.

The thin film magnetic head chip 42 is directly attached to the through hole 41c of the slider 41 so that the slider 41 serves as a kind of protective substrate. Further, as shown in FIG. 7, the tip portions 18a and 19a of the lead portions 18 and 19 are configured to be flush with the back surface 41d of the slider 41, and the lead portions 18 and 19 are provided on the back surface 41d. Since the two lead line patterns 32a, 32b made of a conductive film are formed in the same manner as in the first embodiment by using the known thin film deposition technique, photolithography technique, etc. so as to touch the tip portions 18a, 19a of the The slider 41 plays the role of the holder 30 in the first embodiment.

The areas, shapes, etc. of the two lead line patterns 32a, 32b may be selected so that they can be soldered to the connection terminals of the external device as usual.

Next, a method for connecting the thin film magnetic head chip 42 and the slider 41 described above will be described.

FIG. 8 is a perspective view for explaining a process of attaching the thin film magnetic head chip 42 shown in FIG. 6 to the slider 41.

In FIG. 8, 43 is a wafer having a plurality of sliders 41 shown in FIG. One slider 41 indicates a portion surrounded by a dashed line showing a cutting line 44, and each slider 41
The sliding contact groove 41a and the through hole 41c are formed in the 41. Wafer
The thickness of 43 is set to be slightly thinner than the height t of the thin film magnetic head chip 42. When the thin-film magnetic head chip 42 is inserted into the through hole 41c so that the sliding surface 16 of the recording medium coincides with the sliding contact surface 41b of the slider 41 and is integrally fixed with an adhesive, the tips of the lead parts 18, 19 are formed. Parts 18a and 19a are only wafers 43
Since it protrudes from the back surface of the wafer 43, the protruded portion is dropped by polishing, and the tip portions 18a and 19a are exposed on the back surface of the wafer 43.

Next, by the known wafer process, the tips 18a and 19a are formed.
Two lead lines 32a, 32b made of a conductive film are formed on the back surface of each wafer 43 so as to touch the exposed portion of a.

Next, the wafer 43 is cut using a dicing machine or the like.
If cut along the line 44, the thin film magnetic head assembly shown in FIG. 5 or 7 is obtained.

The main effect of the second embodiment is considered to be substantially the same as that of the first embodiment, and the description thereof will be omitted.

(Effects of the Invention) As described above, in the method of manufacturing a thin film magnetic head according to the present invention, a thin film made of a magnetic material, an insulating material, a conductive material, and the like is sequentially formed on the first surface of a substantially rectangular parallelepiped substrate. , A magnetic gap, a thin film core, a thin film coil, and a medium sliding contact surface on which the magnetic gap is formed among four surfaces adjacent to the first surface and connected to both ends of the thin film coil. A first step of forming a thin film magnetic head chip by forming at least a pair of thin film leads extending to any of the three lead derivation surfaces excluding the surface to be formed; A second step of joining the thin film magnetic head chip and the holding member so that the lead lead-out surface and a predetermined surface of the holding member for holding the thin film magnetic head chip form substantially the same surface; Forming substantially the same plane A third step of polishing the lead-out surface of the film magnetic head chip and the predetermined surface of the holding member, and direct electrical connection to the end portions of the pair of thin-film leads exposed at the lead-out surface. Forming a thin film leader line pattern on the surface polished by the third step;
Since the thin film magnetic head chip does not need to be provided with a pad portion that requires a large area for wire bonding, the pitch interval of the thin film leads can be reduced, and Many thin film magnetic head chips can be obtained from the wafer, which is advantageous in terms of cost.

In addition, since the holding member can be formed using a wafer, it is possible to form a thin film lead line pattern that takes advantage of the wafer process, and the thin film lead formed on the thin film magnetic head chip and the thin film lead line pattern can be evenly connected. It can be highly reliable.

[Brief description of drawings]

FIG. 1 is a perspective view showing a structure of a thin film magnetic head to be manufactured by a method of manufacturing a thin film magnetic head according to the present invention, and FIG. 2 is a partially cutaway perspective view showing a lead portion formed inside a thin film magnetic head chip. FIGS. 3, 3 and 4 are perspective views for explaining a process of attaching the thin film magnetic head chip shown in FIG. 2 to a holder, and FIG. 5 shows an FDD magnetic head in which the thin film magnetic head chip is incorporated in a slider. FIG. 6 is an enlarged perspective view showing the structure of the thin film magnetic head chip shown in FIG. 5, FIG. 7 is a perspective view showing the connecting structure of the lead portion of the thin film magnetic head chip shown in FIG. 5, and FIG. 6 is a perspective view for explaining a step of attaching the thin film magnetic head chip shown in FIG. 6 to a slider, FIG. 9 is a perspective view showing a main part of a conventional thin film magnetic head chip, and FIG. 10 is shown in FIG. Thin film magnetic head FIG. 11 is a perspective view for explaining a step of attaching a protective substrate which forms a part of the sliding surface of the recording medium, and FIG. 11 is a perspective view for explaining a step of attaching the thin film magnetic head chip shown in FIG. 9 to a holder. FIG. 12 and FIG. 12 are partially enlarged perspective views showing the connection structure of the lead portion of the thin film magnetic head chip shown in FIG. 11 ... Substrate, 18, 19 ... Lead part, 30 ... Holder, 31, 42 ... Thin film magnetic head chip, 32a, 32b ... Leader line pattern, 41
…Slider

Claims (1)

[Claims] 1. A magnetic gap, a thin film core, a thin film coil, and a thin film made of a magnetic material, an insulating material, a conductive material, and the like are sequentially formed and etched on a first surface of a substantially rectangular parallelepiped substrate, Up to any one of the lead derivation surfaces of the four surfaces that are respectively connected to both ends of the thin-film coil and that are adjacent to the first surface, except for the surface to be the medium sliding contact surface in which the magnetic gap is formed. A first step of forming a thin film magnetic head chip by forming at least a pair of extending thin film leads, and a predetermined lead member on the thin film magnetic head chip and a holding member for holding the thin film magnetic head chip. A second step of joining the thin film magnetic head chip and the holding member so as to form substantially the same plane, and the lead lead surface of the thin film magnetic head chip that is joined to form the substantially same plane Where the holding member is A third step of polishing the surface and a surface polished in the third step with a thin film lead wire pattern which is directly electrically connected to the end portions of the pair of thin film leads exposed on the lead leading surface. Fourth formed on
And a process for manufacturing the thin-film magnetic head.