JPH0736498U - Wireless device shield structure - Google Patents

Wireless device shield structure

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Publication number
JPH0736498U
JPH0736498U JP6530893U JP6530893U JPH0736498U JP H0736498 U JPH0736498 U JP H0736498U JP 6530893 U JP6530893 U JP 6530893U JP 6530893 U JP6530893 U JP 6530893U JP H0736498 U JPH0736498 U JP H0736498U
Authority
JP
Japan
Prior art keywords
partition
shield
shield case
circuit board
case
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6530893U
Other languages
Japanese (ja)
Inventor
幸弘 守時
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Kokusai Electric Inc
Original Assignee
Hitachi Kokusai Electric Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Kokusai Electric Inc filed Critical Hitachi Kokusai Electric Inc
Priority to JP6530893U priority Critical patent/JPH0736498U/en
Publication of JPH0736498U publication Critical patent/JPH0736498U/en
Pending legal-status Critical Current

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  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

(57)【要約】 【目的】 仕切板に段差がなく高さ一様な仕切シールド
ケースによりシールド性を高めることができ、且つ部品
点数を削減して組立時間を短縮できるシールド構造の提
供。 【構成】 金型によるダイカストで仕切板に段差がなく
一体成形された仕切シールドケース1を設ける。仕切シ
ールドケース1の上下両端面に形成した溝15にシール
ド材2を嵌込み介在させ、これを介して下端面を回路基
板3に固定する。固定は仕切シールドケース1にダイカ
ストで一体成形したボス14の孔に止め用ネジ5を挿入
して固定する。また仕切シールドケース1の上端面には
カバー4を固定する。固定は止め用ネジ6で仕切シール
ドケース1に設けたボス13にネジ止めする。
(57) [Abstract] [Purpose] To provide a shield structure in which the partitioning plate has a uniform height with no step on the partition plate, which can enhance the shielding property and reduce the number of parts to shorten the assembly time. [Structure] A partition shield case 1 is provided which is die-cast by a mold and is integrally molded without a step on a partition plate. The shield material 2 is fitted and inserted into the grooves 15 formed in the upper and lower end surfaces of the partition shield case 1, and the lower end surface is fixed to the circuit board 3 via the shield material 2. The fixing is carried out by inserting the fixing screw 5 into the hole of the boss 14 integrally formed by die casting in the partition shield case 1. A cover 4 is fixed to the upper end surface of the partition shield case 1. For fixing, a fixing screw 6 is screwed to a boss 13 provided on the partition shield case 1.

Description

【考案の詳細な説明】[Detailed description of the device]

【0001】[0001]

【産業上の利用分野】[Industrial applications]

本考案は、無線機器の高周波シールドを行なうシールド構造に関する。 The present invention relates to a shield structure for high-frequency shielding of wireless devices.

【0002】[0002]

【従来の技術】[Prior art]

従来のシールド構造は、図3に示す構造になる。図3で(a)図は仕切シール ドケースの上面図、(b)図は組立状態の側面図であり、仕切板31を何枚か組 合せ(実施例図では8種8枚)て所要の回路ブロックを個々に仕切った状態にシ ールドする形状の仕切シールドケース32を構成する。この仕切シールドケース 32の片面にシールド材33を介在させ各回路ブロックが仕切られるように回路 基板34を固定する。固定用ネジ35は、組立られた各仕切板31の要所に明け られた孔を通して回路基板34にネジ止め固定する。また仕切シールドケース3 2の他方の端面にシールド材33を介在させ、このシールド材33を介してカバ ー36を固定する。このカバー36の固定は仕切シールドケースに組立られた各 仕切板31の内側に各々柱37を立設し、且つこの柱37にネジ孔を形成してカ バー36の外側から止めネジ38を挿入してネジ止め固定する。なお39は回路 基板34の裏側に固定した取付け台で放熱板を兼ねる。 The conventional shield structure is the structure shown in FIG. 3 (a) is a top view of the partition shield case, and FIG. 3 (b) is a side view in the assembled state. The combination of several partition plates 31 (eight pieces of 8 types in the embodiment diagram) is required. A partition shield case 32 having a shape that shields the circuit blocks into individual partitions is constructed. A circuit board 34 is fixed so that each circuit block is partitioned by interposing a shield material 33 on one surface of the partition shield case 32. The fixing screws 35 are screwed and fixed to the circuit board 34 through the holes formed in the essential parts of the assembled partition plates 31. Further, a shield material 33 is interposed on the other end surface of the partition shield case 32, and the cover 36 is fixed via the shield material 33. To fix the cover 36, pillars 37 are erected inside the partition plates 31 assembled in the partition shield case, and screw holes are formed in the pillars 37 to insert the setscrews 38 from the outside of the cover 36. And fix it with screws. Reference numeral 39 is a mounting base fixed to the back side of the circuit board 34, which also serves as a heat dissipation plate.

【0003】[0003]

【考案が解決しようとする課題】[Problems to be solved by the device]

上記のように複数枚の仕切板31を組合せて構成した仕切シールドケース32 による場合は、次のような各問題点がある。 ・加工等に費用がかかる。 ・仕切板の加工誤差により段差が生じる。 ・部品点数が多くなる。 ・組立に時間がかかる。 本考案の目的は、上記問題点を解決し、加工等の費用がかからないで、仕切板 の段差をなくした仕切シールドケースを作成し、シールド性を高める。且つ部品 点数を削減し組立時間が短縮できるシールド構造の提供にある。 In the case of the partition shield case 32 configured by combining a plurality of partition plates 31 as described above, there are the following problems.・ Processing costs money.・ Steps are generated due to machining error of the partition plate.・ The number of parts increases.・ It takes time to assemble. The object of the present invention is to solve the above-mentioned problems and to create a partition shield case that eliminates the step of the partition plate without increasing the cost of processing, etc., and improve the shielding property. Moreover, it is to provide a shield structure that can reduce the number of parts and the assembly time.

【0004】[0004]

【課題を解決するための手段】[Means for Solving the Problems]

上記の目的は、回路基板上の各回路ブロックを個々に仕切った状態にシールド する形状に構成した仕切シールドケースを設け、該仕切シールドケースの両端面 にシールド材を介して回路基板及びカバーを取付け固定してなる無線機器のシー ルド構造において、上記回路基板上の各回路ブロックを個々に仕切った状態にシ ールドする形状の仕切シールドケースに一体成形構造体を設けた、特に金型によ るダイカスト成形の一体成形構造体を設けたことによって達成される。 The purpose of the above is to provide a partition shield case configured to shield each circuit block on the circuit board individually, and attach the circuit board and the cover to both end faces of the partition shield case with a shield material. In the shield structure of fixed wireless devices, an integrally molded structure is provided in a partition shield case that is shaped to shield each circuit block on the circuit board individually, especially by a mold. This is achieved by providing a die-cast molded unitary structure.

【0005】[0005]

【作用】[Action]

上記本考案の無線機器のシールド構造は、仕切シールドケースを金型によるダ イカスト成形によって一体成形構造体とし、仕切板に段差のない仕切シールドケ ースを成形する。またダイカスト化する際に取付部を同時に成形することによっ て部品点数を削減する。ダイカスト化された仕切シールドケースは両端面にシー ルド材を介して回路基板とカバーを固定することによってシールド構造とする。 これにより部品点数が少なく組立てが簡単にできる。組立精度も仕切板に段差が なく、隙間の無い組立ができシールド性が高められる。 In the shield structure for a wireless device according to the present invention, the partition shield case is integrally molded by die casting using a mold, and the partition shield case without steps is formed on the partition plate. In addition, the number of parts can be reduced by molding the mounting part at the same time when it is die cast. The die-cast partition shield case has a shield structure by fixing the circuit board and the cover on both end faces with a shield material. As a result, the number of parts is small and the assembly is easy. As for the assembly accuracy, there is no step on the partition plate, and the assembly without gaps is possible, and the shielding property is improved.

【0006】[0006]

【実施例】【Example】

以下図面の一実施例により本考案を説明する。 図1は本考案一実施例の分解斜視図で、1が金型によるダイカストで一体成形 された仕切シールドケースで、上面図は図2に示すように、回路基板上の各回路 ブロックに合せて、その個々のブロックを仕切った状態にシールドできる形状、 即ち各ブロック11……が仕切板12で仕切られた構造に一体に、ダイカスト成 形され、これにより仕切板12に段差がなく高さ一様に成形される。且つ各ブロ ックの内側の4隅もしくは要所にはダイカスト品にする際に取付け用ボス13, 14も同時にダイカスト成形する。ボス13はケース1の上側にカバーを固定す るために設けられ、ボス14はケース1の下側に基板を固定するために設けられ る。仕切シールドケース1の上下両端面には各々シールド材を嵌込むシールド材 用溝15を形成し、ここにシールド材2を介在する。 The present invention will be described below with reference to an embodiment of the drawings. FIG. 1 is an exploded perspective view of an embodiment of the present invention, in which 1 is a partition shield case integrally formed by die casting with a mold, and the top view is shown in FIG. 2 in accordance with each circuit block on a circuit board. , The individual blocks can be shielded in a partition state, that is, each block 11 ... Is die-cast integrally with the structure partitioned by the partition plate 12, so that the partition plate 12 has no step and has a uniform height. Is shaped like. In addition, the mounting bosses 13 and 14 are die-cast at the same time at the four corners of the block or at the key points when making the die-cast product. The boss 13 is provided on the upper side of the case 1 for fixing the cover, and the boss 14 is provided on the lower side of the case 1 for fixing the substrate. A shield material groove 15 into which a shield material is fitted is formed in each of the upper and lower end surfaces of the partition shield case 1, and the shield material 2 is interposed therein.

【0007】 以上の仕切シールドケース1を用いた回路基板3及びカバー4の取付け組立は 、仕切シールドケース1の下端面をシールド材2を介して回路基板3に固定し、 仕切シールドケース1の他方の上端面にシールド材2を介してカバー4を固定す る。回路基板3への固定は仕切シールドケース1に設けた下側のボス14に明け た孔を通して止め用ネジ5を挿入して固定する。仕切シールドケース1の各部全 体に分布させて設けた各ボス14によって回路基板3の全体に隙間のないよう密 着固定したら、次の仕切シールドケース1の上端面にカバー4を被せ、仕切シー ルドケース1の上側ボス13の位置に合せて明けた孔を通して止め用ネジ6を挿 入し、ボス13にネジ込み固定する。この固定位置はカバー4と仕切シールドケ ース1との間に隙間が生じないように分布させてあり、これによりカバー4が確 実に均等に固定される。なお、7は回路基板3の裏側の取付台で放熱板を兼ねる 。The above-described mounting and assembling of the circuit board 3 and the cover 4 using the partition shield case 1 is performed by fixing the lower end surface of the partition shield case 1 to the circuit board 3 with the shield material 2 interposed therebetween. The cover 4 is fixed to the upper end surface of the via the shield material 2. The fixing to the circuit board 3 is carried out by inserting a fixing screw 5 through a hole formed in a lower boss 14 provided in the partition shield case 1. After the bosses 14 are distributed over all parts of the partition shield case 1 and are tightly fixed to the entire circuit board 3 so that there are no gaps, the cover 4 is placed on the upper end surface of the next partition shield case 1, and The fixing screw 6 is inserted through the hole opened in accordance with the position of the upper boss 13 of the case 1 and screwed into the boss 13 to be fixed. The fixing positions are distributed so that no gap is formed between the cover 4 and the partition shield case 1, and thus the cover 4 is reliably and evenly fixed. In addition, 7 is a mount on the back side of the circuit board 3 which also serves as a heat sink.

【0008】 以上のようにして組立られたシールド構造は、仕切シールドケース1がダイカ スト成形によって仕切板12に段差のない一体成形体で構成され、この上下両端 面にシールド材2を介して回路基板3及びカバー4を隙間なく密着固定されたも のであるから、高周波シールド性が高いものが容易に得られる。In the shield structure assembled as described above, the partition shield case 1 is formed by die-cast molding into the partition plate 12 as an integrally molded body having no step, and the circuit board is provided on both upper and lower end surfaces of the partition member with the shield material 2 interposed therebetween. Since the substrate 3 and the cover 4 are closely fixed to each other without a gap, a substrate having high high-frequency shielding property can be easily obtained.

【0009】 なお、仕切シールドケース1の形状は上記の一実施例のものに限らず、回路基 板3の各回路ブロックに合せた任意の形状に形成することができ、ダイカスト成 形により複雑なパターンも容易に対応できる。The shape of the partition shield case 1 is not limited to that of the above-described embodiment, but can be formed in any shape suitable for each circuit block of the circuit board 3, and is complicated by die casting. Patterns can be easily accommodated.

【0010】[0010]

【考案の効果】[Effect of device]

以上に説明したように、本考案によれば、仕切シールドケースを一体成形構造 体とし、またその一体成形構造を金型によるダイカスト成形して成るものである から、仕切板の段差のない高さが一様なものとなり、この上下両端面には回路基 板及びカバーを隙間なく密着して固定することができ、シールド効果を向上させ ることができる。また回路基板上の回路ブロックに対応させた仕切板とか取付用 ボス等を一体化したため部品点数が削減され、組立が容易で短時間に組立ができ る。また加工費や工数の削減により経済的効果も大きい。さらにダイカスト品と することにより複雑なパターンにも容易に対応することができ、シールド性の高 いものが容易に得られる効果がある。 As described above, according to the present invention, since the partition shield case is an integrally molded structure, and the integrally molded structure is die-cast by a die, the height of the partition plate without step is formed. The circuit board and the cover can be closely adhered and fixed to the upper and lower end surfaces without any gap, and the shield effect can be improved. In addition, since the partition plate corresponding to the circuit block on the circuit board and the mounting boss are integrated, the number of parts is reduced, and the assembly is easy and can be assembled in a short time. In addition, the economic effect is great due to the reduction of processing cost and man-hours. Furthermore, by using a die-cast product, it is possible to easily deal with complicated patterns, and it is easy to obtain a product with high shielding properties.

【図面の簡単な説明】[Brief description of drawings]

【図1】本考案の一実施例構造分解斜視図である。FIG. 1 is an exploded perspective view of the structure of an embodiment of the present invention.

【図2】図1の一部上面図である。FIG. 2 is a partial top view of FIG.

【図3】従来例の構造図である。FIG. 3 is a structural diagram of a conventional example.

【符号の説明】[Explanation of symbols]

1…仕切シールドケース、2…シールド材、3…回路基
板、4…カバー、5,6…止め用ネジ、7…取付台、1
1…ブロック、12…仕切板、13,14…取付け用ボ
ス、15…シールド材用溝。
1 ... Partition shield case, 2 ... Shield material, 3 ... Circuit board, 4 ... Cover, 5, 6 ... Fixing screw, 7 ... Mounting base, 1
1 ... Block, 12 ... Partition plate, 13, 14 ... Mounting boss, 15 ... Shield material groove.

Claims (2)

【実用新案登録請求の範囲】[Scope of utility model registration request] 【請求項1】 回路基板上の各回路ブロックを個々に仕
切った状態にシールドする形状に構成した仕切シールド
ケースを設け、該仕切シールドケースの両端面にシール
ド材を介して回路基板及びカバーを取付け固定してなる
無線機器のシールド構造において、上記回路基板上の各
回路ブロックを個々に仕切った状態にシールドする形状
の仕切シールドケースに一体成形構造体を設けて成るこ
とを特徴とする無線機器のシールド構造。
1. A partition shield case configured to shield each circuit block on a circuit board in an individually partitioned state is provided, and the circuit board and the cover are attached to both end faces of the partition shield case via a shield material. A fixed shield structure for a wireless device, characterized in that an integrally molded structure is provided in a partition shield case of a shape that shields each circuit block on the circuit board into individual partitions. Shield structure.
【請求項2】 仕切シールドケースに金型によるダイカ
スト成形の一体成形構造体を設けて成ることを特徴とす
る請求項1記載の無線機器のシールド構造。
2. The shield structure for a wireless device according to claim 1, wherein the partition shield case is provided with an integrally molded structure formed by die casting using a mold.
JP6530893U 1993-12-07 1993-12-07 Wireless device shield structure Pending JPH0736498U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6530893U JPH0736498U (en) 1993-12-07 1993-12-07 Wireless device shield structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6530893U JPH0736498U (en) 1993-12-07 1993-12-07 Wireless device shield structure

Publications (1)

Publication Number Publication Date
JPH0736498U true JPH0736498U (en) 1995-07-04

Family

ID=13283155

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6530893U Pending JPH0736498U (en) 1993-12-07 1993-12-07 Wireless device shield structure

Country Status (1)

Country Link
JP (1) JPH0736498U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003092538A (en) * 2001-09-18 2003-03-28 Hitachi Kokusai Electric Inc Radio equipment

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003092538A (en) * 2001-09-18 2003-03-28 Hitachi Kokusai Electric Inc Radio equipment

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