JPH073638Y2 - Clamping device for wire cutting in wire bonder - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION (Industrial field of application) The present invention relates to a wire cutting clamp device in a wire bonder, in which a clamp pad that clamps the wire presses the wire with an excessive force to flatten the wire. It is designed to prevent deformation.

(Prior Art) After mounting a die on a substrate, a wire bonding means for connecting the electrode of this die and the electrode on the substrate side by a wire is
First, the lower end of the wire drawn from the cylindrical capillary is bonded to the electrode of the die, then the wire is guided onto the electrode of the substrate, the lower end of the capillary crimps the wire to this electrode, and then The wire is clamped by a clamp pad above the capillary and the pad is lifted to cut the wire from the crimping point.

FIG. 4 is a plan view of a conventional wire-cutting clamp device of this type, in which 101 and 102 are arm members rotatably mounted around a hinge 103, and 104 is a sub-arm member attached to the arm member 101. 105, 105 are clamp pads attached to the tip ends of the arm member 101 and the sub arm member 104, and 106.
Is a spring member for urging the arm members 101, 102 in a direction to clamp the wire 107 between the pads 105, 105, and 108 is the pads 105, 10
This is a solenoid that rotates the arm members 101 and 102 in the direction in which the 5 is separated. This device drives a solenoid 108 and separates the pads 105, 105 (see a chain line) to pass a wire 107 between the pads 105, 105, and the solenoid 108.
Is turned off and the wire 107 is held between the pads 105, 105, and the apparatus is moved up to cut the wire 107 from the crimping point to the substrate as described above.

(Problems to be solved by the invention) However, in the above-mentioned conventional device, the solenoid 108 is operated to separate the pads 105, 105 of the arm members 101, 104 from each other, and then the solenoid 108 is turned off so that the spring force of the spring member 106 causes the pads 105, 105 to move. When the wire 107 is clamped by the wire 107, the wire 107 is easily flattened due to the strong pressure contact force,
When it becomes hard, the stress or bendability of the wire 107 becomes directional, and there is a problem that the work of connecting the electrodes by the wire 107 as described above is likely to be hindered. Particularly, in the above conventional device, the arm members 101 and 104 are excessively opened by the operation of the solenoid 108 to open the pad 105 and the pad.
105 is easily separated from each other excessively, and when it becomes clogged, the operation of the solenoid 108 is stopped, and the pads 105, 105 are extremely strongly pressed against the wire 107 by the spring force of the spring material 106. There was a problem that it was easily deformed flat due to impact.

Therefore, it is an object of the present invention to provide a wire cutting clamp device which can prevent the wire from being flatly deformed by the pressure contact force of the pad when the wire is sandwiched between the pads as described above.

(Means for Solving the Problem) For this purpose, the present invention is to attach a wire to the first and second arm members rotatably supported by a hinge portion and to attach the wires to the tip end portions of these arm members. A clamp pad, a spring member for urging the first arm member in a direction in which the clamp pad of the first arm member is pressed against the clamp pad of the second arm member, and a direction in which the clamp pad and the clamp pad are separated from each other. A solenoid that rotates the first arm member, a stopper that defines the rotation limit of the second arm member in the separating direction, a cushion spring member that elastically holds the arm member, and a spring force of the cushion spring member. And adjusting means of the above.

(Operation) According to the above configuration, the first arm member is rotated and opened by the operation of the solenoid, and the state where the wire is held between the pad and the pad is released. When the solenoid is turned off, the spring force of the spring material causes the first arm member to rotate in the closing direction, and the wire is clamped by the pads of the first and second arm members. The shock applied to the pad of the second arm member from this pad is absorbed by the cushion spring material. At that time, the pressing force applied from the first arm member causes the second arm member to rotate in the opposite direction against the spring force of the cushion spring member, but the excessive rotation is blocked by the stopper. .

(Example) Next, the Example of this invention is described, referring drawings.

FIG. 1 is a perspective view of a wire cutting clamp device in a wire bonder, FIG. 2 is a plan view, and 1 is a frame, on the lower surface of which a first arm member 2 and a second arm member 3 are hinged. It is rotatably supported by the portion 4. Reference numerals 5 and 5 are clamp pads attached to the tip ends of the arm members 2 and 3, and the wire 6 is held by these pads 5 and 5. 8 is a solenoid provided between the side wall portion 1a of the frame 1 and the first arm member 2, 9 is a spring material composed of a coil spring, and 10 is a diaphragm adjusting screw for adjusting the spring force of the spring material 9. is there. This spring material 9 is arranged such that one arm member 2 is counterclockwise in FIG. 2, that is, the pad 5 of this arm member 2 presses against the pad 5 of the other arm member 3 so that the wires 5 and 5 are used. 6 is urged in the direction of sandwiching. When the rod 8a of the solenoid 8 retreats, the arm member 2 is rotated in the clockwise direction in FIG. 2 to separate the pads 7 and 7 from each other, and the clamped state of the wire 6 is released. Reference numeral 11 is a set screw for the solenoid 8, and 12 is a manual release lever mounted on the arm member 2.

Reference numeral 13 denotes a cushion spring material which is a leaf spring elastically contacting the back surface of the second arm member 3, and its base end portion is attached to the inner surface of the side wall 1a by a pin 14. Reference numeral 15 is a means for adjusting the spring force of the spring member 13 formed of a screw rod,
It is screwed to 1a, and its tip end is in contact with the back surface of the spring member 13. By changing the screwing amount, the arm member 3
Adjust the spring force to press. Reference numerals 21 and 22 are first and second stoppers formed of pins provided so as to sandwich the rear end of the arm member 3. The first stopper 21 prevents excessive rotation of the arm member 3 in the closing direction. The second stopper 22 defines the rotation limit of the arm member 3 in the pad separating direction, that is, in the counterclockwise direction in FIG.

In FIG. 1, 16 is a guide ring of the wire 6 extending above the pads 5 and 5, and 17 is below the pads 5 and 5,
A capillary for guiding the wire 6, a holding horn 18 for the capillary 17, a substrate 19, a die 20 mounted on the substrate 19, and a wire 6a for connecting the electrode of the die 20 and the electrode of the substrate 19. It should be noted that description of devices such as a die bonder body that are not directly related to the present invention is omitted.

The present apparatus has the above-mentioned configuration, and the operation will be described next.

While holding the wire 6 between the pads 5 and 5,
By moving the lower end of the wire 6 out of the lower end of the capillary 17, forming a molten ball on the lower end of the wire 6 by the sputtering means, and then landing the ball on the electrode of the die 20. By doing so, the lower end of the wire 6 is connected to the electrode of the die 20. Next, the solenoid 8 is actuated, and the wire 6 by the pads 5 and 5 is activated.
The pinch state is released, and the substrate 19 is moved in the XY directions by means not shown so that the capillaries 17 face the electrodes of the substrate 19 above. Next, the capillary 6 is moved downward and the lower end of the capillary 17 presses the wire 6 against the substrate 19, thereby crimping the wire 6 to the electrode of the substrate 19 (see FIG. 3). Next, in this state, turn off the solenoid 8 and pad
The wire 6 is sandwiched by 5, 5, and the wire 6 is pulled up as it is, so that the wire 6 is cut from the crimping point a.

In this way, when the electrodes of the die 20 and the substrate 19 are connected to each other by the wire 6, the arm members 2 and 3 are opened and closed, and the holding and opening of the wire 6 by the pads 5 and 5 are repeated. This pinching is performed by the spring force of the spring material 9, and opening is performed by operating the solenoid 8. In this case, solenoid 8
Is turned off, and when the first arm member 3 is rotated in the closing direction by the spring force of the spring member 9 and the pad 5 thereof is pressed against the pad 5 side of the second arm member 3, the wire 6 It is strongly sandwiched between 5, 5 and easily deforms flat. However, when the pads 5 and 5 are closed, the shock applied to the wire 6 is absorbed by the cushion spring material 13, so that such a problem does not occur. At that time, due to the pressing force applied from the first arm member 2, the second arm member 3 rotates in the opposite direction against the spring force of the cushion spring member 13, but the excessive rotation thereof causes the stopper 22. Blocked by. That is, the amount of rotation of the arm member 3 in this case is only the gap t with the stopper 22, and the impact applied to the wire 6 is absorbed when the arm member 3 escapes by this amount. Further, by changing the screwing amount of the screw rod 15, the spring force of the spring member 13 can be adjusted to adjust the shock absorbing force and the clamping force by the pad 5 and the pad 5.

(Effects of the Invention) As described above, the present invention provides the first and second arm members that are rotatably pivoted by the hinge portion, and the clamps that are attached to the distal end portions of these arm members to clamp the wire. The pad and the clamp pad of the first arm member to the second
Spring member for urging the first arm member in a direction in which the first arm member is pressed against the clamp pad, a solenoid for rotating the first arm member in a direction for separating the clamp pad from the clamp pad, and a second arm member. Since the stopper defines the rotation limit in the separating direction, the cushion spring material that elastically holds the arm member, and the spring force adjusting means of the cushion spring material, the clamp device is configured. It is possible to prevent the wire from being deformed into a flat shape due to a strong impact force applied to the wire when the wire is closed and the wire is clamped.

[Brief description of drawings]

1 is a perspective view of a clamping device, FIG. 2 is a plan view, FIG. 3 is a front view during wire bonding, and FIG. 4 is a plan view of a conventional device. It is a figure. 2 ... Arm member 3 ... Arm member 4 ... Hinge part 6 ... Wire 7 ... Clamp pad 8 ... Solenoid 9 ... Spring material 13 ... Cushion spring material 15 ... Spring force adjusting means 22 ... …stopper

Claims (1)

[Scope of utility model registration request] 1. A first rotatably mounted by a hinge portion.
A second arm member, a clamp pad that is attached to the tip ends of these arm members to clamp the wire, and
Of the spring member for urging the first arm member in the direction in which the clamp pad of the arm member is pressed against the clamp pad of the second arm member, and the first arm member in the direction of separating the clamp pad from the clamp pad. And a stopper for defining the rotation limit of the second arm member in the separating direction, a cushion spring member for elastically holding the arm member, and a spring force adjusting unit for the cushion spring member. A wire cutting clamp device for a wire bonder.