JPH0735954A - Receptacle for optical semiconductor - Google Patents

Abstract

PURPOSE:To provide the receptacle for an optical semiconductor which does not eliminate repolishing, etc., of the inside wall surface of a sleeve and is capable of easily molding a member including the sleeve. CONSTITUTION:This receptacle 30 for the optical semiconductor is formed connectably in an optical semiconductor element mounting part 20 consisting of a metallic member mounted with the optical semiconductor element 10 and is mounted with a sleeve 18 to be inserted with a connector ferrule disposed in an optical fiber, etc. A recessed part 26 for positioning of the sleeve 18 is formed at the end face of the connecting member 16 made of metal connected to the optical semiconductor element mounting part 20 and at least a part of the outer peripheral surface of the sleeve 18 positioned by inserting its one end into the recessed part 26 for positioning is sealed with a resin over the entire periphery. The part of the resin sealing is a part of the resin molding member 24 molded to a prescribed shape.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a receptacle for optical semiconductors, and more particularly to a receptacle for optical semiconductors, which is formed so as to be connectable to an optical semiconductor element mounting portion made of a metal member on which an optical semiconductor element is mounted. The present invention relates to a receptacle for an optical semiconductor, in which a sleeve formed so that the connector ferrule can be inserted therein is attached.

[0002]

2. Description of the Related Art An optical semiconductor device 100 for optical communication or the like.
A receptacle type module for optical semiconductors (hereinafter referred to as a module) shown in FIG. 6 is used for a connection portion between the optical fiber and the like. This optical semiconductor receptacle type module has an optical semiconductor element mounting portion (hereinafter, also referred to as an element mounting portion) 20 on which the optical semiconductor element 100 is mounted.
0, and an optical semiconductor receptacle 300 (hereinafter, referred to as a receptacle 300) provided with a sleeve 108 into which a connector ferrule provided in a connector attached to an optical fiber or the like can be inserted.
The element mounting portion 200 includes a holder 102 for fixing the optical semiconductor element 100, a lens holder 103 for fixing the lens 112, and an end surface of the receptacle 300 and the lens 1.
It is composed of a spacer 104 that adjusts the distance to 12. Further, the receptacle 300 has a light transmitting hole 1 at the center.
The member 106 in which 07 is bored and the tubular member 1 connected to the end surface of the spacer 104 constituting the element mounting portion 200.
And 10. In this cylindrical member 110, a sleeve 108 is forcibly inserted, and a flange portion is formed in which a through hole for inserting a screw or the like for fixing the module at a predetermined position is formed.

A module sleeve 1 formed by combining the element mounting portion 200 and the receptacle 300 as described above.
A connector ferrule forming a connector mounted on the optical fiber is inserted into 08. Therefore, when the optical semiconductor element 100 is a laser element (LD element), the optical signal transmitted from the optical semiconductor element 100 is condensed by the lens 112 fixed by the lens holder 103, and the light transmission hole of the member 106 is formed. It passes through 107 and is transmitted to the optical fiber. Further, when the optical semiconductor element 100 is a photo element (PD element), an optical signal from the optical fiber is transmitted to the optical semiconductor element 100 after the light passing through the light transmitting hole 107 of the member 106 is condensed by the lens 112. It By the way, each of the element mounting portion 200 and the receptacle 300 constituting the module is required to have high dimensional accuracy. Therefore, conventionally, the members constituting the module are made of metal except for the sleeve 108, and the sleeve 108 is also made of a material having excellent morphological stability such as ceramics.

[0004]

In the conventional module shown in FIG. 6, since all members for fixing the optical semiconductor element 100 and the sleeve 108 are made of metal, high dimensional accuracy can be achieved. However, in order to form a metal member into a predetermined shape, it is necessary to form it by cutting from a metal rod or the like, and a member having a complicated shape, particularly the receptacle 30.
It is difficult to easily form the tubular member 110 forming 0. On the other hand, the shape and the like of the fixing portion of the module are not limited, and it is required that the shape of the tubular member 110, particularly the shape of the flange portion, can be easily changed. Also, the sleeve 10
Since 8 is forcibly inserted into the tubular member 110, distortion may occur in the sleeve 108 after insertion, and it is also necessary to re-polish the inner wall surface of the sleeve 108. Therefore, an object of the present invention is to provide a receptacle for an optical semiconductor that can eliminate the need for re-polishing the inner wall surface of the sleeve and can easily mold a member including the sleeve.

[0005]

Means for Solving the Problems The inventors of the present invention have conducted studies to achieve the above-mentioned object. As a result, in the receptacle 300 shown in FIG. 6, the member 106 has a relatively simple shape and is made of metal. Cutting is easy. On the other hand, since the tubular member 110 has a complicated shape, it is difficult to easily manufacture it by cutting. Therefore, the present inventors have arrived at the present invention as a result of examining whether the tubular member 110 can be formed by resin molding instead of metal. That is, according to the present invention, a sleeve is formed that is connectable to an optical semiconductor element mounting portion made of a metal member on which an optical semiconductor element is mounted, and in which a connector ferrule provided in an optical fiber or the like can be inserted. In the receptacle for an optical semiconductor, the positioning recess of the sleeve is formed on the other end face of the metal connecting member to which the optical semiconductor element mounting portion is connected to one end face, and one end of the positioning recess is formed. At least a part of the outer peripheral surface of the sleeve inserted and positioned is resin-sealed over the entire circumference, and the resin-sealed portion is a part of a resin-molded member molded into a predetermined shape. It is in a receptacle for optical semiconductors characterized by the above.

In the present invention having such a structure, the outer peripheral surface of the sleeve to be resin-sealed is roughened, or the outer peripheral surface of the sleeve is intermittently formed with concave portions or convex portions to form a sealing resin. The adhesion with the sleeve can be improved. Further, by molding the resin molded member with resin such as liquid crystal polymer having a thermal expansion coefficient close to that of the metal forming the metal connecting member, the difference in thermal expansion between the metal connecting member and the resin molded member is obtained. It is possible to minimize the deviation of the sleeve due to the above, and it becomes unnecessary to form the positioning recess of the sleeve on the end surface of the metal connecting member.

[0007]

According to the present invention, since the portion including the sleeve, which constitutes the optical semiconductor receptacle connected to the element mounting portion on which the optical semiconductor element is mounted, can be resin-molded, the shape of the resin molding member can be changed. In addition, the resin-formed member having an arbitrary shape in which a screw portion is engraved on the outer peripheral surface can be easily formed. Further, since the portion including the sleeve can be molded by insert molding, the receptacle for optical semiconductor can be molded without forcibly inserting the sleeve into the tubular member, and the step of re-polishing the inner wall surface of the sleeve can be omitted. .

[0008]

The present invention will be described in more detail with reference to the drawings.
FIG. 1 is a partial cross-sectional perspective view showing an example of a module in which a receptacle for an optical semiconductor according to the present invention is mounted. The module is provided with a semiconductor element mounting portion 20 (hereinafter referred to as element mounting portion 20) on which the optical semiconductor element 10 is mounted, and a zirconia sleeve 18 into which a connector ferrule of a connector mounted on an optical fiber or the like is inserted. Optical semiconductor receptacle 30 (hereinafter, referred to as “receptacle 30”). The element mounting portion 20 has the same structure as the element mounting portion 200 shown in FIG. That is,
Holder 12, lens 22 for fixing optical semiconductor element 10
Lens holder 13 for fixing the lens, and receptacle 30
14 for adjusting the distance between the end surface of the lens and the lens 22
Composed of. In addition, the receptacle 30 includes a metal connecting member 16 (hereinafter, also referred to as a connecting member 16) having a light transmitting hole 17 formed in the center thereof and connected to an end surface of the spacer 14, and a cylindrical resin. It is composed of a molded resin molding member 24. The resin molded member 24 is formed with a collar portion having a through hole for inserting a screw or the like for fixing the module at a predetermined position. One end of the sleeve 18 is inserted and positioned in the recess 26 formed on the end face side of the connecting member 16 where the light transmission hole 17 is opened. Most of the outer peripheral surface of the sleeve 18 thus positioned is resin-sealed with a resin forming a part of the resin molded member 24.

Into the sleeve 18, a connector ferrule forming a connector mounted on an optical fiber or the like is inserted. Therefore, when the optical semiconductor element 10 is a laser element (LD element), the optical signal transmitted from the optical semiconductor element 10 is condensed by the lens 22 fixed by the lens holder 13, and the light transmission hole of the member 16 is formed. 17
Is transmitted to the optical fiber. When the optical semiconductor element 10 is a photo element (PD element), the optical signal from the optical fiber is transmitted to the optical semiconductor element 10 after the light passing through the light transmitting hole 17 of the member 16 is condensed by the lens 112. It

When manufacturing the receptacle 30 constituting the module shown in FIG. 1, first, one end of the sleeve 18 is placed in the convex portion 26 formed on the end face of the connecting member 16 where the light transmission hole 17 is opened. By inserting, the sleeve 18 is positioned and fixed to the end surface of the connecting member 16.
Next, the resin molding member 24 having a predetermined shape can be easily formed by inserting the connecting member 16 and the sleeve 18 into a predetermined mold and performing insert molding. Thereafter, the end surface of the connecting member 16 of the insert-molded receptacle 30 and the end surface of the spacer 14 forming the element mounting portion 20 are welded by laser welding or the like, whereby the module shown in FIG. 1 can be obtained. The receptacle 30 obtained in this embodiment does not require the sleeve 18 to be forcibly inserted into the resin molding member 24, so that the step of re-polishing the inner wall surface of the sleeve 18 can be omitted.

As described above, in this embodiment, the resin molding member 24 can be insert-molded, and the cylindrical resin molding member 24 having the complicated shape shown in FIG. 1 can be easily molded. The resin molded member 24 is provided with a collar portion having a through hole for inserting a screw or the like for fixing the obtained module at a predetermined position. Furthermore, FIG.
As shown in, the threaded portion 28 can be easily formed on the outer surface of the resin molded member 24, and the connection with the connector such as the optical fiber can be reliably performed. When a resin having a coefficient of thermal expansion close to that of the metal forming the connecting member 16, for example, a resin having a low coefficient of thermal expansion such as a liquid crystal polymer or polyphenylene sulfide is used as the resin forming the resin molded member 24, As shown in FIG. 3, it is not necessary to mechanically position the sleeve 18 by the recess 26 formed in the end surface of the connecting member 16. Resin molded member 2 made of resin
This is because the deviation of the sleeve 18 due to the difference in thermal expansion between the No. 4 and the metallic connecting member 16 can be minimized. still,
When the sleeve 18 is insert-molded without being mechanically positioned by the positioning recess, it is preferable to temporarily fix the sleeve 18 to a predetermined position on the end surface of the connecting member 16 with an adhesive or the like in advance.

By the way, the ceramic (zirconia) forming the sleeve 18 and the resin forming the resin molding member 24 are usually unfamiliar, and the fixing strength of the sleeve 18 by the resin molding member 24 is different from that of the conventional receptacle shown in FIG. It may be lower than 300. In this case, it is possible to improve the fixing strength of the sleeve 18 by forming a line on the outer surface of the sleeve 18 to make the surface rough. Further, as shown in FIG. 4A, even if the concave portion 32 is formed on the outer peripheral surface of the sleeve 18, the fixing strength of the sleeve can be improved. As shown in FIG. 4B, the recess 32 is formed intermittently in the minor axis direction of the sleeve 18. This is because, if the concave portion 32 has a groove shape that goes around the outer peripheral surface of the sleeve 30, the sleeve 18 may rotate. Further, as shown in FIG. 4A, the recess 34 is intermittently formed on the outer peripheral surface of the recess 26 formed at the end of the connecting member 16, so that the resin molding member 24 and the connecting member 16 are connected to each other. The foodability of can also be improved. The recess 32 may be formed intermittently in the long axis direction of the sleeve 18.

In FIGS. 4A and 4B, the sleeve 1
8 and the recesses 32 and 34 are formed on the outer peripheral surfaces of the recess 26, the protrusions 36 and 38 are intermittently formed on the outer peripheral surfaces of the sleeve 18 and the recess 26 as shown in FIGS. Even if formed, the same effect as that of the recesses 32 and 34 can be obtained. The convex portion 36 may be formed intermittently in the long axis direction of the sleeve 18. Further, when inserting the connector ferrule into the sleeve 18, when it is difficult to insert the connector ferrule due to insertion resistance, as shown in FIG. 5B, the inner wall surface of the sleeve 18 and the long axis method of the sleeve 18 are used. It is preferable to form the extended groove 40. Since the air inside the sleeve 18 is easily discharged to the outside after passing through the groove 40, the insertion resistance of the connector ferrule can be made as small as possible, and the connector ferrule can be easily formed.
8 can be inserted. Such a groove 40 is shown in FIG.
Of course, it may be provided on the inner wall surface of the sleeve 18 shown in (b).

[0014]

According to the present invention, it is possible to easily form a screw, a collar or the like on the outer peripheral surface of the receptacle for an optical semiconductor, and to easily and surely connect it to a connector such as an optical fiber. it can. Further, re-polishing of the inner wall surface of the sleeve provided in the optical semiconductor receptacle can be eliminated. Therefore, the manufacturing process can be simplified and the manufacturing cost can be reduced.

[Brief description of drawings]

FIG. 1 is a partial cross-sectional perspective view showing an example of a module using an optical semiconductor receptacle according to the present invention.

FIG. 2 is a partial cross-sectional view showing an improved example of the optical semiconductor receptacle shown in FIG.

FIG. 3 is a partial cross-sectional view showing another modified example of the optical semiconductor receptacle shown in FIG.

FIG. 4 is a partial cross-sectional view showing another embodiment of the present invention.

FIG. 5 is a partial cross-sectional view showing another embodiment of the present invention.

FIG. 6 is a partial cross-sectional perspective view showing an example of a module using a conventional optical semiconductor receptacle.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Optical semiconductor element 16 Metal connecting member 18 Sleeve 20 Optical semiconductor element mounting part 24 Resin molding member 26 Recessed part formed in the end surface of the connecting member 16 Receptacle for optical semiconductors

Claims (4)

[Claims] 1. A sleeve, which is formed so as to be connectable to an optical semiconductor element mounting portion made of a metal member on which an optical semiconductor element is mounted, and in which a connector ferrule provided in an optical fiber or the like can be inserted is mounted. In the receptacle for an optical semiconductor, the positioning recess of the sleeve is formed on the other end face of the metal connecting member to which the optical semiconductor element mounting portion is connected to one end face, and one end is inserted into the positioning recess. At least a part of the outer peripheral surface of the positioned and positioned sleeve is resin-sealed over the entire circumference, and the resin-sealed portion is a part of a resin-molded member molded into a predetermined shape. A receptacle for optical semiconductors. 2. The receptacle for optical semiconductors according to claim 1, wherein the outer peripheral surface of the sealed sleeve is formed into a rough surface. 3. The outer peripheral surface of the sleeve of the sealed portion,
The receptacle for optical semiconductors according to claim 1, wherein recesses or protrusions are formed intermittently. 4. A sleeve, which is formed so as to be connectable to an optical semiconductor element mounting portion made of a metal member on which an optical semiconductor element is mounted and in which a connector ferrule provided in an optical fiber or the like can be inserted, is mounted. In the receptacle for optical semiconductors, at least a part of the outer peripheral surface of the sleeve positioned at one end in contact with the other end surface of the metal connecting member to which the optical semiconductor element mounting portion is connected The resin sealing member is a part of the resin molded member molded in a predetermined shape, and the resin molded member has a coefficient of thermal expansion of the metal forming the metal connecting member. A receptacle for an optical semiconductor, which is made of a resin such as a liquid crystal polymer having a thermal expansion coefficient close to that of the above.