JPH07331495A - Insoluble electrode plate fixing part - Google Patents
Insoluble electrode plate fixing partInfo
- Publication number
- JPH07331495A JPH07331495A JP12999994A JP12999994A JPH07331495A JP H07331495 A JPH07331495 A JP H07331495A JP 12999994 A JP12999994 A JP 12999994A JP 12999994 A JP12999994 A JP 12999994A JP H07331495 A JPH07331495 A JP H07331495A
- Authority
- JP
- Japan
- Prior art keywords
- lead
- electrode plate
- alloy
- titanium
- insoluble electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electroplating Methods And Accessories (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、鋼帯等の金属ストリッ
プを連続的に電気メッキ又は電解酸洗を行う装置の陽極
として用いられる不溶性電極板の取付け部の構造に関す
るものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a structure of a mounting portion for an insoluble electrode plate used as an anode of an apparatus for continuously electroplating or electrolytically pickling a metal strip such as a steel strip.
【０００２】[0002]
【従来の技術】錫，亜鉛，クロム等の鋼板メッキ用陽極
としては現在、鉛又は鉛合金を使用した電極が一般に使
用されているが、鉛は比較的消耗が速く、溶出した鉛に
よるメッキ液の汚染，メッキ皮膜の劣化等の問題点があ
る。これに代る陽極としてチタン等を基材として白金族
金属又はそれらの酸化物を電極活性物質とした不溶性電
極が種々提案されており、経済性，加工性の面から広く
用いられつつある。2. Description of the Related Art At present, an electrode made of lead or a lead alloy is generally used as an anode for plating steel sheets of tin, zinc, chromium and the like. However, there are problems such as contamination of the metal and deterioration of the plating film. As an alternative to this, various insoluble electrodes have been proposed in which a platinum group metal or an oxide thereof is used as an electrode active material with titanium or the like as a base material, and it is being widely used from the viewpoint of economy and workability.
【０００３】図４は水平型電気メッキ設備の概略を示
し、不溶性電極板１とこれを支持する通電板２及び通電
バー３よりなる陽極装置が使用されており、この陽極と
相対して走行する金属ストリップＳに対し、通電バー
３，通電板２及び不溶性電極板１を通じて流れるメッキ
電流によりメッキがなされるようになっている。通常通
電板２上に取付けられる不溶性電極板１は図３に示すよ
うに複数個（約２０枚）に分割され、それぞれ２個乃至
３個以上のボルト４により接合されている。図２は取付
け部の構造を示し、不溶性電極板１は白金族金属又はそ
の酸化物を含む電極触媒層５をその表面に有するチタン
等の導電性金属基体６よりなり、その裏面は基体と同材
質のボス７が設けられて同じくチタン等の通電板７と接
触しボルト４により締め付けられている。FIG. 4 shows an outline of horizontal electroplating equipment, in which an anode device composed of an insoluble electrode plate 1, a current-carrying plate 2 and a current-carrying bar 3 supporting the insoluble electrode plate 1 is used. The metal strip S is plated by the plating current flowing through the current-carrying bar 3, current-carrying plate 2 and insoluble electrode plate 1. As shown in FIG. 3, the insoluble electrode plate 1 usually attached on the current-carrying plate 2 is divided into a plurality of pieces (about 20 pieces), each of which is joined with two or more bolts 4. FIG. 2 shows the structure of the mounting portion. The insoluble electrode plate 1 is made of a conductive metal substrate 6 such as titanium having an electrode catalyst layer 5 containing a platinum group metal or its oxide on its surface, and its back surface is the same as the substrate. A boss 7 made of a material is provided so that the boss 7 is also in contact with the current-carrying plate 7 made of titanium or the like and is fastened by the bolt 4.
【０００４】この場合、通電中に不溶性電極板１と通電
板２との接触抵抗が増大するため、ボルト４によって締
め付けられる電極板１と通電板２の両接触面８に白金メ
ッキを施している。しかし長期使用中には腐食を起こし
て白金の剥離により抵抗が増大し、電極触媒が正常な状
態であっても通電不能な状態になることも多く、再取付
けの際には接触面の再コーティングが必要となる。この
ために電極板，通電板を取り外し再コーティングするこ
とになるが、これらの工程，特に通電板の再コーティン
グ工程は非常に手間のいる作業でありその改善が求めら
れていた。In this case, since the contact resistance between the insoluble electrode plate 1 and the current-carrying plate 2 increases during energization, both contact surfaces 8 of the electrode plate 1 and the current-carrying plate 2 which are tightened by the bolts 4 are plated with platinum. . However, during long-term use, corrosion often occurs and the resistance increases due to the peeling of platinum, and even when the electrode catalyst is in a normal state, it is often in a state where it cannot be energized. Is required. For this reason, the electrode plate and the current-carrying plate have to be removed and re-coated, but these processes, particularly the re-coating process of the current-carrying plate, are very laborious work, and their improvement has been required.
【０００５】[0005]
【課題を解決するための手段】本発明は以上の課題を解
決するためのものであってすなわち、電極触媒層を有す
るチタン又はチタン基合金よりなる電極板とこれを支持
する通電板とを厚さ０．０４〜１ｍｍの鉛又は鉛合金よ
りなる薄層を介してボルトにより密着接合せしめたこと
を特徴とする金属ストリップ連続式メッキ用又は酸洗用
の不溶性電極板の取付け部である。Means for Solving the Problems The present invention is to solve the above problems, that is, an electrode plate made of titanium or a titanium-based alloy having an electrode catalyst layer and a current-carrying plate supporting the electrode plate are thickened. A metal strip continuous plating or pickling insoluble electrode plate mounting portion, characterized in that it is tightly joined by a bolt through a thin layer of 0.04 to 1 mm of lead or lead alloy.
【０００６】図１は本発明の実施態様を示し不溶性電極
板１のボス７と通電板２との接触面８の間に鉛又は鉛合
金のシート状ガスケットよりなる薄層９を挿入し、ボル
ト４にて緊締したものである。不溶性電極板１の基体６
及び通電板２の材質はチタン又はチタン基合金であり、
電極触媒層は白金族金属又は白金族金属酸化物を含む触
媒層であり、白金族金属酸化物２０重量％以上を含み残
部がバルブ金属酸化物よりなる電極が好ましい。ボルト
４は通常チタン製である。FIG. 1 shows an embodiment of the present invention, in which a thin layer 9 made of a sheet gasket of lead or a lead alloy is inserted between a contact surface 8 of a boss 7 of an insoluble electrode plate 1 and a current-carrying plate 2, and a bolt is inserted. It was tightened in 4. Base 6 of insoluble electrode plate 1
And the material of the current-carrying plate 2 is titanium or a titanium-based alloy,
The electrode catalyst layer is a catalyst layer containing a platinum group metal or a platinum group metal oxide, and an electrode containing 20% by weight or more of the platinum group metal oxide and the balance being a valve metal oxide is preferable. The bolt 4 is usually made of titanium.
【０００７】鉛合金の種類としては鉛−錫，鉛−インジ
ウム，鉛−銀，鉛−インジウム−銀，鉛−錫−インジウ
ム，鉛−錫−銀の各合金が挙げられるが、鉛以外の金属
含量は０．５〜１０重量％が適当である。鉛合金として
他成分の含有量が多すぎると硬度が大となり、締め付け
が悪くなり、また耐食性も悪くなるので好ましくない。
特に経済面，性能面から錫含量０．５〜１０重量％の鉛
−錫合金が好ましい。Examples of the type of lead alloy include lead-tin, lead-indium, lead-silver, lead-indium-silver, lead-tin-indium, and lead-tin-silver alloys, but metals other than lead. A suitable content is 0.5 to 10% by weight. If the content of other components as a lead alloy is too large, the hardness becomes large, the tightening deteriorates, and the corrosion resistance also deteriorates, which is not preferable.
Particularly, from the viewpoint of economy and performance, a lead-tin alloy having a tin content of 0.5 to 10% by weight is preferable.
【０００８】鉛又は鉛合金の薄層の厚みは重要であって
０．０４〜１．０ｍｍの範囲が必要である。特に０．１
〜０．３ｍｍの厚みが好ましい。厚みがこの範囲より大
きければ柔い金属のため締め付け後、時間と共に圧力が
減少し、かえって接触不良を起こす。すなわちボルトに
よる締め付け時の変形が大きく回復力が乏しいので接触
不良による通電中の電圧上昇を起こし易い。また厚みが
この範囲未満であれば、接触面の間隙を埋めるのに十分
でなく、また取扱い難い。The thickness of the thin layer of lead or lead alloy is important and should be in the range 0.04 to 1.0 mm. Especially 0.1
A thickness of ~ 0.3 mm is preferred. If the thickness is larger than this range, since the metal is soft, the pressure will decrease with time after tightening, which will cause poor contact. That is, since the deformation during bolting is large and the recovery force is poor, a voltage rise during energization due to poor contact is likely to occur. On the other hand, if the thickness is less than this range, it is not sufficient to fill the gap between the contact surfaces and it is difficult to handle.
【０００９】このような鉛又は鉛合金の薄層はシート状
ガスケットを挿入して形成する以外、例えば不溶性電極
板又は通電板の接触面に鉛又は鉛合金の溶射等によるメ
ッキを行って形成することができる。またこれらの接触
面には従来のごとく、予め白金メッキを行っておいても
よい。なおトルクレンチによるボルトの締め付け圧力は
１０ｋｇｆ−ｃｍ／ｃｍ2 以上で行うことが好ましい。
本発明は錫，亜鉛，クロム等の鋼板電気メッキ用の陽極
としてのほか、これら鋼板の電解酸洗を行う場合の電極
として適用される。Such a thin layer of lead or lead alloy is formed, for example, by plating the contact surface of the insoluble electrode plate or the current-carrying plate with thermal spraying of lead or lead alloy, etc. be able to. Further, these contact surfaces may be preliminarily plated with platinum in the conventional manner. The tightening pressure of the bolt with the torque wrench is preferably 10 kgf-cm / cm 2 or more.
INDUSTRIAL APPLICABILITY The present invention is applied not only as an anode for electroplating steel sheets of tin, zinc, chromium, etc., but also as an electrode when electrolytic pickling of these steel sheets is performed.
【００１０】[0010]
【実施例】以下、実施例，比較例により本発明を説明す
る。 実施例１〜８ 比較例１〜４ チタン板表面に酸化タンタル（４０モル％）と酸化イリ
ジウム（６０モル％）との混合酸化物よりなる皮膜を形
成し、酸化イリジウムとして３０ｇ／ｍ2 含有する電極
活性層を持つチタン製電極板９枚を作製した。この電極
板９枚を７５０ｍｍ×１７００ｍｍの大きさのチタン製
通電板に取付けられる構造の陽極体を４基準備した。チ
タン製電極板にはチタン製通電板をボルトにより取付け
るために同材質の径５５ｍｍのボスが４２個設けられて
おり、この接触面には両方とも５ｇ／ｍ2 の白金メッキ
を施したものと施さないものを準備した。EXAMPLES The present invention will be described below with reference to Examples and Comparative Examples. Examples 1 to 8 Comparative Examples 1 to 4 A film made of a mixed oxide of tantalum oxide (40 mol%) and iridium oxide (60 mol%) is formed on the surface of a titanium plate, and 30 g / m 2 of iridium oxide is contained. Nine titanium electrode plates having an electrode active layer were prepared. Four anode bodies having a structure in which nine of these electrode plates were attached to a titanium current-carrying plate having a size of 750 mm × 1700 mm were prepared. The titanium electrode plate is provided with 42 bosses of the same material with a diameter of 55 mm for mounting the titanium current-carrying plate with bolts. Both of these contact surfaces are plated with 5 g / m 2 of platinum. I prepared something that was not applied.
【００１１】上記のチタン製電極板とチタン製通電板と
の間には、表１に示すように各種の鉛合金又は鉛のシー
ト状ガスケットを挿入し、一定条件の締め付けトルクに
て固定した。実施例として使用した電気メッキ浴の組成
を示す。 ＺｎＳＯ4 ・４Ｈ2 Ｏ ２８０ｇ／ｌ Ｎａ2 ＳＯ4 ４０ｇ／ｌ ｐＨ １．２ 陽極電流密度５０〜１００Ａ／ｄｍ2 にて１５０日間運
転した結果を表１に示す。As shown in Table 1, various lead alloy or lead sheet gaskets were inserted between the titanium electrode plate and the titanium current-carrying plate, and fixed with a tightening torque under a certain condition. The composition of the electroplating bath used as an example is shown below. Table 1 shows the results of operation for 150 days at a ZnSO 4 .4H 2 O 280 g / l Na 2 SO 4 40 g / l pH 1.2 anode current density of 50 to 100 A / dm 2 .
【００１２】[0012]
【表１】 [Table 1]
【００１３】＊，実施例８〜１０は予め白金コーティン
グを施していない。接触部の判定方法は下記による。 優 秀 ： 変化なし。 良 好 ： 白金コーティングを施していない部分が
変色。 良 ： 多少変色している部分がある。 不 良 ： 電極板を外すと白金が浮いている。 不 可 ： 電圧が上昇している。 接触不良 ： ほとんど電流が流れない。*, Examples 8 to 10 are not preliminarily coated with platinum. The method of determining the contact portion is as follows. Yu Shu: No change. Good: The part not coated with platinum is discolored. Good: There is some discoloration. Bad: Platinum is floating when the electrode plate is removed. No: The voltage is rising. Poor contact: Almost no current flows.
【００１４】[0014]
【発明の効果】本発明によれば、不溶性電極板と通電板
との間に柔軟な鉛又は鉛合金の薄層を介在させ締め付け
により密着させるので、この個所より電解液の侵入を防
ぎ両板間の電気伝導性を良好に維持することができる。
この結果、電極更新時に電極板又は通電板の接触部分に
白金メッキ等の再補修を要せずに取付けられるので煩雑
な整備作業を省略し得る。According to the present invention, since a flexible thin layer of lead or lead alloy is interposed between the insoluble electrode plate and the current-carrying plate and they are tightly adhered to each other, the invasion of the electrolytic solution is prevented from this point. It is possible to maintain good electrical conductivity between them.
As a result, when the electrode is renewed, it can be attached to the contact portion of the electrode plate or the current-carrying plate without re-repairing such as platinum plating, so that complicated maintenance work can be omitted.
【図１】本発明の電極板取付け部の構造を示す断面図で
ある。FIG. 1 is a cross-sectional view showing a structure of an electrode plate mounting portion of the present invention.
【図２】従来の電極板取付け部の構造を示す断面図であ
る。FIG. 2 is a cross-sectional view showing a structure of a conventional electrode plate mounting portion.
【図３】電極板が通電板に取付けられた状態を示す斜視
図である。FIG. 3 is a perspective view showing a state in which an electrode plate is attached to a conducting plate.
【図４】金属ストリップの連続式メッキ装置を示す説明
図である。FIG. 4 is an explanatory view showing a continuous plating device for metal strips.
１ 不溶性電極板 ２ 通電板 ３ 通電バー ４ ボルト ５ 電極活性層 ６ 導電性金属基体 ７ ボス ８ 接触面 ９ 鉛又は鉛合金薄層 Ｓ 金属ストリップ Ｃ コンダクターロール 1 Insoluble Electrode Plate 2 Current Plate 3 Current Bar 4 Volt 5 Electrode Active Layer 6 Conductive Metal Substrate 7 Boss 8 Contact Surface 9 Lead or Lead Alloy Thin Layer S Metal Strip C Conductor Roll
───────────────────────────────────────────────────── フロントページの続き (72)発明者 池田 俊幸 大阪府豊中市利倉西２丁目19番２号 (72)発明者 中村 昭二 兵庫県加古川市金沢町１番地 株式会社神 戸製鋼所加古川製鉄所内 (72)発明者 椿野 啓明 兵庫県加古川市金沢町１番地 株式会社神 戸製鋼所加古川製鉄所内 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Toshiyuki Ikeda 2-19-2 Rikuranishi, Toyonaka-shi, Osaka (72) Inventor Shoji Nakamura 1 Kanazawa-machi, Kakogawa-shi, Hyogo Kadogawa Works Kakogawa Works (72) Inventor Hiroaki Tsubakino 1 Kanazawa-machi, Kakogawa-shi, Hyogo Prefecture Kadogawa Works Kakogawa Works
Claims (10)
合金よりなる電極板とこれを支持する通電板とを、厚さ
０．０４〜１ｍｍの鉛又は鉛合金よりなる薄層を介して
ボルトにより密着接合せしめたことを特徴とする金属ス
トリップ連続式メッキ用又は酸洗用の不溶性電極板の取
付け部。1. An electrode plate made of titanium or a titanium-based alloy having an electrode catalyst layer and a current-carrying plate supporting the electrode plate are bolted through a thin layer made of lead or a lead alloy having a thickness of 0.04 to 1 mm. Metal strip continuous plating or pickling insoluble electrode plate mounting part characterized by being closely bonded.
接合面に予め白金メッキを施した請求項１に記載の不溶
性電極板の取付け部。2. The mounting portion for an insoluble electrode plate according to claim 1, wherein the joint surface of the electrode plate and / or the current-carrying plate with the bolt is preliminarily plated with platinum.
を含む触媒層である請求項１に記載の不溶性電極板の取
付け部。3. The mounting portion for an insoluble electrode plate according to claim 1, wherein the electrode catalyst layer is a catalyst layer containing platinum or a platinum group metal oxide.
金である請求項１に記載の不溶性電極板の取付け部。4. The mounting portion for an insoluble electrode plate according to claim 1, wherein the joint surface of the current-carrying plate is titanium or a titanium-based alloy.
銀，鉛−インジウム−銀，鉛−錫−インジウム，鉛−錫
−銀のいずれかの合金である請求項１に記載の不溶性電
極板の取付け部。5. The lead alloy is lead-tin, lead-indium, lead-
The mounting portion of the insoluble electrode plate according to claim 1, which is an alloy of any one of silver, lead-indium-silver, lead-tin-indium, and lead-tin-silver.
載の不溶性電極板の取付け部。6. The mounting portion for an insoluble electrode plate according to claim 5, wherein the lead alloy is a lead-tin alloy.
０重量％である請求項５又は６に記載の不溶性電極板の
取付け部。7. A lead alloy having a metal content other than lead of 0.5 to 1
The attachment portion of the insoluble electrode plate according to claim 5 or 6, which is 0% by weight.
スケットである請求項１，５，６，７のいずれかに記載
の不溶性電極の取付け部。8. The mounting portion for an insoluble electrode according to claim 1, wherein the thin layer made of lead or lead alloy is a sheet-like gasket.
通電板にメッキされている請求項１，５，６，７のいず
れかに記載の不溶性電極板の取付け部。9. The mounting portion for an insoluble electrode plate according to claim 1, wherein a thin layer made of lead or a lead alloy is plated on the electrode plate or the current-carrying plate.
ｃｍ／ｃｍ2 以上である請求項１に記載の不溶性電極板
の取付け部。10. The tightening pressure of the bolt is 10 kgf-
The attachment portion of the insoluble electrode plate according to claim 1, having a cm / cm 2 or more.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12999994A JPH07331495A (en) | 1994-06-13 | 1994-06-13 | Insoluble electrode plate fixing part |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12999994A JPH07331495A (en) | 1994-06-13 | 1994-06-13 | Insoluble electrode plate fixing part |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH07331495A true JPH07331495A (en) | 1995-12-19 |
Family
ID=15023650
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12999994A Pending JPH07331495A (en) | 1994-06-13 | 1994-06-13 | Insoluble electrode plate fixing part |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH07331495A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11293500A (en) * | 1998-04-08 | 1999-10-26 | Sumitomo Metal Ind Ltd | Surface scratch removing method for hot-rolled band steel |
| KR200468565Y1 (en) * | 2011-11-04 | 2013-08-27 | 주식회사 우진 | High Silicon Cast Iron Electrode with Screw Joint Type Bus-bar |
| JP2018044238A (en) * | 2016-09-12 | 2018-03-22 | Ｊｆｅスチール株式会社 | Electrolytic cleaning device for steel sheet, continuous annealing equipment, and method for producing steel sheet |
| KR20180121397A (en) | 2017-04-28 | 2018-11-07 | 가부시키가이샤 오사카소다 | Electrode structure |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS614026A (en) * | 1984-06-19 | 1986-01-09 | Canon Inc | Driving method of liquid crystal element |
| JPS614021A (en) * | 1984-06-19 | 1986-01-09 | Canon Inc | Driving method of liquid crystal element |
-
1994
- 1994-06-13 JP JP12999994A patent/JPH07331495A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS614026A (en) * | 1984-06-19 | 1986-01-09 | Canon Inc | Driving method of liquid crystal element |
| JPS614021A (en) * | 1984-06-19 | 1986-01-09 | Canon Inc | Driving method of liquid crystal element |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11293500A (en) * | 1998-04-08 | 1999-10-26 | Sumitomo Metal Ind Ltd | Surface scratch removing method for hot-rolled band steel |
| KR200468565Y1 (en) * | 2011-11-04 | 2013-08-27 | 주식회사 우진 | High Silicon Cast Iron Electrode with Screw Joint Type Bus-bar |
| JP2018044238A (en) * | 2016-09-12 | 2018-03-22 | Ｊｆｅスチール株式会社 | Electrolytic cleaning device for steel sheet, continuous annealing equipment, and method for producing steel sheet |
| KR20180121397A (en) | 2017-04-28 | 2018-11-07 | 가부시키가이샤 오사카소다 | Electrode structure |
| CN108796591A (en) * | 2017-04-28 | 2018-11-13 | 株式会社大阪曹达 | Electrode structural body |
| JP2018188679A (en) * | 2017-04-28 | 2018-11-29 | 株式会社大阪ソーダ | Electrode structure |
| CN108796591B (en) * | 2017-04-28 | 2021-10-29 | 株式会社大阪曹达 | Electrode structure |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP3001844U (en) | Mounting part of insoluble electrode plate | |
| CA1232227A (en) | Manufacturing electrode by immersing substrate in aluminium halide and other metal solution and electroplating | |
| CN1620525A (en) | Hanger bar | |
| JPH07331495A (en) | Insoluble electrode plate fixing part | |
| EP0519407B1 (en) | Spot-weldable aluminum sheet and production thereof | |
| Bradley et al. | Pulse-plating of copper–nickel alloys from a sulfamate solution | |
| US4620915A (en) | Bipolar finger electrode | |
| JP3006846U (en) | Vertical steel plate plating electrode | |
| JP2806116B2 (en) | Molten salt electroplating equipment | |
| US3954571A (en) | Wire and strip line electroplating | |
| JPH057474B2 (en) | ||
| JP3242056B2 (en) | Insoluble electrode for chrome plating | |
| JP3137771B2 (en) | Corrosion protection method for concrete structures by thermal spray coating. | |
| JPH01176100A (en) | Nonsoluble anode for plating steel strip | |
| US4064034A (en) | Anode structure for wire and strip line electroplating | |
| JP3403260B2 (en) | Platinum strike plating bath, method and plated product | |
| JPS6024197B2 (en) | Pb alloy insoluble anode for electroplating | |
| Baker et al. | Practical Corrosion Problems in Relation to Welded Joints. I. Special Characteristics of the Welding Process Which can Cause Corrosion Problems | |
| JP2719041B2 (en) | Base treatment method for steel with excellent corrosion resistance | |
| US20020003092A1 (en) | Process for the production of refractory metal plates and expanded metal grids platinized on one side | |
| JP3061544B2 (en) | Insoluble electrode | |
| JPH0673483A (en) | Aluminum alloy sheet excellent in weldability | |
| JP3260493B2 (en) | Dissolution method of metal thin film | |
| JPH0617288A (en) | Laminated plated aluminum sheet excellent in spot weldability | |
| KAMEGAYA et al. | A Newly Designed Titanium Anode for Oxygen Evolution at High Current Densities |