JPH0732969U - Light emitting diode lamp - Google Patents
Light emitting diode lampInfo
- Publication number
- JPH0732969U JPH0732969U JP014015U JP1401594U JPH0732969U JP H0732969 U JPH0732969 U JP H0732969U JP 014015 U JP014015 U JP 014015U JP 1401594 U JP1401594 U JP 1401594U JP H0732969 U JPH0732969 U JP H0732969U
- Authority
- JP
- Japan
- Prior art keywords
- lead wire
- light emitting
- wiring
- emitting diode
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
- H01L2224/49113—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Abstract
(57)【要約】
【目的】 ランプの直径が大きくなっても、輝度や色調
むらの少ない発光ダイオードランプを提供する。
【構成】 単一のリード線と、その両端に配置された複
数の配線用リード線と、リード線の先端の略中央に各々
が近接して配置され、各々の配線用リード線に配線が施
された色の異なる複数の発光ダイオードと、少なくとも
リード線の一部と発光ダイオードを覆う透光性の樹脂と
を備え、リード線の先端は配線方向に開放してなり、配
線方向と略直交する方向に於て樹脂と近接した反射壁を
有し、リード線は樹脂の略中央に於て先端と反対側に延
びる他端を有し、配線用リード線は反射壁と連なる側壁
を有するものである。
(57) [Abstract] [Purpose] To provide a light emitting diode lamp with less unevenness in brightness and color tone even if the diameter of the lamp is increased. [Structure] A single lead wire, a plurality of wiring lead wires arranged at both ends of the lead wire, and the lead wires are arranged close to each other substantially at the center of the tip of the lead wire, and the wiring lead wires are wired. A plurality of light emitting diodes of different colors, and at least a part of the lead wire and a translucent resin that covers the light emitting diode, and the tip of the lead wire is open in the wiring direction and is substantially orthogonal to the wiring direction. Has a reflection wall adjacent to the resin in the direction, the lead wire has the other end extending in the opposite direction to the tip at substantially the center of the resin, and the wiring lead wire has a side wall continuous with the reflection wall. is there.
Description
【０００１】[0001]
本考案は反射器をもった発光ダイオードランプに関する。 The present invention relates to a light emitting diode lamp having a reflector.
【０００２】[0002]
従来より発光ダイオードランプは、リード線の上に載置され配線が施されてき たが、その光を特定の表示面に効率よく指向するためには、その発光ダイオード の周囲を包囲する反射壁を設けていた。 Conventionally, a light emitting diode lamp has been placed and wired on a lead wire, but in order to efficiently direct the light to a specific display surface, a reflective wall surrounding the light emitting diode is provided. It was provided.
【０００３】 このような発光ダイオードランプにおいて複数の発光ダイオードを載置するに は、発光ダイオードの位置が散在すると表示面での輝度むらや色調むらが生じる ので、実公昭５３−１５２６９号公報の如く、中央のリード線に反射壁を設け、 その反射壁で囲まれた中に全ての発光ダイオードを載置してきた。When a plurality of light emitting diodes are mounted in such a light emitting diode lamp, unevenness in brightness or color tone on the display surface occurs when the positions of the light emitting diodes are scattered. Therefore, as disclosed in Japanese Utility Model Publication No. 53-15269. , A reflection wall is provided on the central lead wire, and all the light emitting diodes are mounted inside the reflection wall.
【０００４】[0004]
ところがこのような構成とすると、発光ダイオードの数が増えれば増えるだけ 反射壁の直径は大きくなり、これによって配線の長さが長くなると共にランプの 外形も大きくなる。配線が長くなると短絡や断線事故を多発するし、ランプの直 径が大きくなると輝度や色調にむらができ易くなり、又透光性の樹脂にクラック などが入り易くなるので、いずれも好ましくない。 However, with such a structure, as the number of light emitting diodes increases, the diameter of the reflection wall increases, which increases the length of the wiring and the size of the lamp. If the wiring becomes long, short-circuit and disconnection accidents frequently occur, and if the diameter of the lamp becomes large, the brightness and color tone are likely to be uneven, and cracks are easily generated in the translucent resin.
【０００５】[0005]
上述の課題を解決するために第１の本考案は、単一のリード線と、その両端に 配置された複数の配線用リード線と、リード線の先端の略中央に各々が近接して 配置され、各々の配線用リード線に配線が施された色の異なる複数の発光ダイオ ードと、少なくともリード線の一部と発光ダイオードを覆う透光性の樹脂とを備 え、リード線の先端は配線方向に開放してなり、配線方向と略直交する方向に於 て樹脂と近接した反射壁を有し、リード線は樹脂の略中央に於て先端と反対側に 延びる他端を有し、配線用リード線は反射壁と連なる側壁を有するものである。 In order to solve the above-mentioned problems, the first aspect of the present invention is to provide a single lead wire, a plurality of wiring lead wires arranged at both ends of the single lead wire, and a lead wire in the vicinity of the center of each of the lead wires. Each of the wiring lead wires is provided with a plurality of light emitting diodes of different colors, and a transparent resin that covers at least a part of the lead wires and the light emitting diode. Has a reflection wall that is open in the wiring direction and is close to the resin in a direction substantially orthogonal to the wiring direction, and the lead wire has the other end that extends in the direction opposite to the tip at approximately the center of the resin. The wiring lead wire has a side wall continuous with the reflection wall.
【０００６】 そして第２の本考案は、単一のリード線と、その近傍に配置された複数の配線 用リード線と、リード線の略中央に各々が近接して載置され、各々の配線用リー ド線に配線が施された複数の発光ダイオードと、少なくともリード線の一部と発 光ダイオードを覆う透光性の樹脂とを備え、リード線の反射壁は全てのリード線 にまたがって設けられた樹脂成形品からなり、発光ダイオードは複数の青色発光 ダイオードと、それと色の異なる単数の発光ダイオードを含むものである。A second aspect of the present invention is that a single lead wire, a plurality of wiring lead wires arranged in the vicinity of the single lead wire, and the lead wires are placed close to each other in the approximate center thereof. It is equipped with a plurality of light-emitting diodes with lead wires wired, and a translucent resin that covers at least a part of the lead wires and the light emitting diodes, and the reflection wall of the lead wires extends over all the lead wires. The light emitting diode is composed of a resin molded product provided, and includes a plurality of blue light emitting diodes and a single light emitting diode different in color from the blue light emitting diodes.
【０００７】[0007]
上述の様に第１の本考案では、リード線の先端に形成された反射壁は配線方向 に略直交しているので、反射壁と側壁の大きさは配線に係わりなく、所定のラン プの外形に対して十分大きくできる。その結果、発光ダイオードからの光は、反 射壁と側壁に囲まれた広い空間で反射されるので、効率よく指向され、所望の指 向特性が得られる。 As described above, according to the first aspect of the present invention, since the reflection wall formed at the tip of the lead wire is substantially orthogonal to the wiring direction, the size of the reflection wall and the side wall does not depend on the wiring, It can be made large enough for the outer shape. As a result, the light emitted from the light emitting diode is reflected in a wide space surrounded by the reflection wall and the side wall, so that the light is efficiently directed and a desired pointing characteristic is obtained.
【０００８】 そして第２の本考案では、単一のリード線の略中央に於て各々が近接する様に 複数の色の異なる発光ダイオードを配置し、かつ全てのリード線にまたがる反射 壁を形成するので、透光性の樹脂の表面に於て、輝度むらや色調むらが少ない。 また、認識しにくい青色発光ダイオードを複数個用いるので、他の色の発光ダイ オードと共に用いる時に、色の混じり方が向上する。According to the second aspect of the present invention, a plurality of light emitting diodes of different colors are arranged so that they are close to each other at substantially the center of a single lead wire, and a reflective wall extending over all the lead wires is formed. Therefore, the unevenness of brightness and the unevenness of color tone are small on the surface of the translucent resin. Further, since a plurality of blue light-emitting diodes, which are difficult to recognize, are used, color mixing is improved when used with light-emitting diodes of other colors.
【０００９】[0009]
図１は本考案の第１実施例に係る発光ダイオードランプの側面断面図（ａ）と 平面断面図（ｂ）である。図において（１０）は突出した反射壁（２１）を有す るリード線で、そのリード線（１０）の近傍には複数の配線用リード線（３０） （３０）が配置してある。（４０）（４０）は互いに色の異なる複数の発光ダイ オードであり、リード線（１０）の反射壁（２１）近傍に載置され、配線用リー ド線（３０）（３０）にワイヤボンド線などで配線が施されている。（６０）は 少なくともリード線の一部と発光ダイオードとを覆う、エポキシ樹脂などから成 る透光性の樹脂で、略円形の表示面を有している。 FIG. 1 is a side sectional view (a) and a plan sectional view (b) of a light emitting diode lamp according to a first embodiment of the present invention. In the figure, (10) is a lead wire having a reflecting wall (21) protruding, and a plurality of wiring lead wires (30) and (30) are arranged in the vicinity of the lead wire (10). Reference numerals (40) and (40) denote a plurality of light emitting diodes of different colors, which are placed near the reflection wall (21) of the lead wire (10) and wire-bonded to the wiring lead wires (30) and (30). Wiring is done with wires. Reference numeral (60) is a translucent resin such as an epoxy resin which covers at least a part of the lead wire and the light emitting diode, and has a substantially circular display surface.
【００１０】 ここで特徴的なことは、前記リード線（１０）の反射壁（２１）は、配線用リ ード線（３０）（３０）側を解放してなり、配線用リード線（３０）（３０）に は反射壁（２１）と連なる側壁（３２）（３２）が設けてあり、その両方で円形 又は楕円形の反射壁を形成していることである。これにより反射壁はランプの外 形にほぼ近くなる程度に大きく形成できるとともに、リード線（１０）と配線用 リード線（３０）（３０）の間隔が狭く、その間に障害物もないので、発光ダイ オードの載置面積は十分広く取れ、配線も短くできる。このように連なった反射 壁は、リード線を打抜き成形する過程でリードフレーム材をヘッダ加工すること により得られる。What is characteristic here is that the reflection wall (21) of the lead wire (10) is open on the side of the lead wire (30) (30) for wiring, and the lead wire (30) for wiring is formed. ) (30) is provided with side walls (32) and (32) connected to the reflection wall (21), and both sides form a circular or elliptical reflection wall. As a result, the reflection wall can be made large enough to be almost close to the outer shape of the lamp, and the distance between the lead wire (10) and the lead wires (30) (30) for wiring is narrow, and there is no obstacle between them, so that the light emission The mounting area of the diode can be made large enough and the wiring can be shortened. The reflection wall connected in this way is obtained by processing the lead frame material into a header in the process of punching and forming the lead wire.
【００１１】 また、リード線が平面的に広がるときには、本考案の第２実施例を示す図２の 如く全てのリード線（１１）（３１）（３１）にまたがって設けられた樹脂成形 品からなる反射壁（２３）を一体成形するのがよい。このようにすることで発光 ダイオードの載置面積は先の第１実施例よりも広くすることができるので、発光 ダイオード（４１Ｒ）（４１Ｇ）（５１Ｂ）（５１Ｂ）は略同じ波長の短波長発 光ダイオード（５１Ｂ）（５１Ｂ）を複数用いることによって認識しにくい青色 などを高輝度化することができる。Further, when the lead wires spread out in a plane, from the resin molded product provided over all the lead wires (11) (31) (31) as shown in FIG. 2 showing the second embodiment of the present invention. It is preferable to integrally form the reflecting wall (23). By doing so, the mounting area of the light emitting diode can be made larger than that of the first embodiment, so that the light emitting diodes (41R) (41G) (51B) (51B) emit short wavelength light having substantially the same wavelength. By using a plurality of photodiodes (51B) (51B), it is possible to increase the brightness of blue, which is difficult to recognize.
【００１２】 また近年発光ダイオードは屋外などでも使用されるようになり輝度が高くなけ れば表示が認識できない。赤色についてはＧａＰに比べて高輝度なＧａＡｌＡｓ などの材料が開発されているが、他の色についてはこのような素子が開発されて いない。従って従来と同じ大きさのランプで高輝度化を要求されると、直径５ｍ ｍとか３ｍｍなどの樹脂の中に複数の同色発光ダイオードを用いなければならな い。Further, in recent years, the light emitting diode has been used even outdoors and the display cannot be recognized unless the brightness is high. For red, materials such as GaAlAs that have higher brightness than GaP have been developed, but for other colors, such devices have not been developed. Therefore, if higher brightness is required for a lamp of the same size as the conventional one, it is necessary to use a plurality of LEDs of the same color in a resin having a diameter of 5 mm or 3 mm.
【００１３】 次に、本考案の第３実施例を図３（ａ）に従い説明する。この図に於て、反射 壁（２３）はリード線（１２）に設けるものの、リード線（３３）（１２）（３ ３）の整列方向に対し傾斜した方向に長軸を有する略楕円形をなして配置する。 図の例では整列方向である水平方向に対して、右上がり約３５度に傾斜させてい る。傾斜角は４５度±１５度が好ましい。また、この傾斜角度を外れた範囲の角 度でも、十分実用に供する。Next, a third embodiment of the present invention will be described with reference to FIG. In this figure, although the reflection wall (23) is provided on the lead wire (12), it has a substantially elliptical shape having a major axis in a direction inclined with respect to the alignment direction of the lead wires (33) (12) (33). Do not place it. In the example shown in the figure, it is inclined to the right by about 35 degrees with respect to the horizontal direction, which is the alignment direction. The inclination angle is preferably 45 ° ± 15 °. In addition, an angle outside the range of this tilt angle is sufficient for practical use.
【００１４】 そして中央にＧａＡｌＡｓ赤色発光ダイオード（４２）、略楕円形の長軸の両 端近傍にＧａＰ緑色発光ダイオード（５２）（５２）を配置している。一般に表 示面が小さいと樹脂（６２）のレンズ効果が大きくなり、中心位置から外れるに したがって輝度が著しく低下する。従ってこの例では緑色が赤色に比べて低輝度 になるが、図３（ｂ）に示すように発光ダイオード（５２）（５２）を同時に点 灯することによって、赤色よりも広い表示範囲においてしかも赤色とほぼ同じ輝 度とすることができる。A GaAlAs red light emitting diode (42) is arranged in the center, and GaP green light emitting diodes (52) (52) are arranged in the vicinity of both ends of the substantially elliptical long axis. Generally, when the display surface is small, the lens effect of the resin (62) becomes large, and the brightness deviates remarkably due to the deviation from the center position. Therefore, in this example, green has lower luminance than red, but by simultaneously lighting the light emitting diodes (52) (52) as shown in FIG. Can have almost the same brightness as.
【００１５】[0015]
上述の様に第１の本考案では、単一のリード線の先端に於て、その略中央に各 々が近接する様に複数の色の異なる発光ダイオードを配置するので、透光性の樹 脂の表面に於て輝度むらや色調むらが少ない。更に、リード線の先端は配線方向 に開放しており、配線用リード線との障害物がないので、発光ダイオードの載置 面積が十分広くとれ、配線し易く、配線も短くできる。また、リード線の先端に 形成された反射壁は配線方向に略直交しているので、反射壁と側壁の大きさは配 線に係わりなく、所定のランプの外形に対して十分大きくできる。その結果、発 光ダイオードからの光は、反射壁と側壁に囲まれた広い空間で反射されるので、 効率よく指向され、所望の指向特性が得られる。 As described above, according to the first aspect of the present invention, a plurality of light emitting diodes of different colors are arranged so that they are close to each other substantially at the center of the tip of a single lead wire. There is little unevenness in brightness or color on the surface of the oil. Further, since the tip of the lead wire is open in the wiring direction and there is no obstacle with the wiring lead wire, the mounting area of the light emitting diode can be made sufficiently large, and wiring can be facilitated and the wiring can be shortened. Further, since the reflection wall formed at the tip of the lead wire is substantially orthogonal to the wiring direction, the size of the reflection wall and the side wall can be made sufficiently large for a given lamp outer shape regardless of the wiring. As a result, the light from the light emitting diode is reflected in a wide space surrounded by the reflection wall and the side wall, so that the light is efficiently directed and a desired directivity characteristic is obtained.
【００１６】 そして第２の本考案では、単一のリード線の略中央に於て各々が近接する様に 複数の色の異なる発光ダイオードを配置し、かつ全てのリード線にまたがる反射 壁を形成するので、透光性の樹脂の表面に於て、輝度むらや色調むらが少ない。 また、認識しにくい青色発光ダイオードを複数個用いるので、他の色の発光ダイ オードと共に用いる時に、色の混じり方が向上する。In a second aspect of the present invention, a plurality of light emitting diodes of different colors are arranged so that they are close to each other at approximately the center of a single lead wire, and a reflective wall extending over all the lead wires is formed. Therefore, the unevenness of brightness and the unevenness of color tone are small on the surface of the translucent resin. Further, since a plurality of blue light-emitting diodes, which are difficult to recognize, are used, color mixing is improved when used with light-emitting diodes of other colors.
【図１】図１（ａ）は本考案の第１実施例に係る発光ダ
イオードランプの側面断面図、図１（ｂ）はその発光ダ
イオードランプの平面断面図である。FIG. 1A is a side sectional view of a light emitting diode lamp according to a first embodiment of the present invention, and FIG. 1B is a plan sectional view of the light emitting diode lamp.
【図２】図２（ａ）は本考案の第２実施例に係る発光ダ
イオードランプの側面断面図、図２（ｂ）はその発光ダ
イオードランプの平面断面図である。FIG. 2 (a) is a side sectional view of a light emitting diode lamp according to a second embodiment of the present invention, and FIG. 2 (b) is a plan sectional view of the light emitting diode lamp.
【図３】図３（ａ）は本考案の第３実施例に係る発光ダ
イオードランプの平面断面図、図３（ｂ）はそれの等価
回路図である。FIG. 3 (a) is a plan sectional view of a light emitting diode lamp according to a third embodiment of the present invention, and FIG. 3 (b) is an equivalent circuit diagram thereof.
（１０）（１１）（１２） リード線 （２１）（２２）（２３） 反射壁 （６０）（６１）（６２） 樹脂 (10) (11) (12) Lead wire (21) (22) (23) Reflective wall (60) (61) (62) Resin
───────────────────────────────────────────────────── フロントページの続き (72)考案者 博田 邦彦 鳥取県鳥取市南吉方３丁目201番地 鳥取 三洋電機株式会社内 (72)考案者 光井 準 鳥取県鳥取市南吉方３丁目201番地 鳥取 三洋電機株式会社内 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Kunihiko Hirota, 3-1, 201 Minamiyoshikata, Tottori City, Tottori Prefecture Santoyo Sanyo Electric Co., Ltd. Electric Co., Ltd.
Claims (2)
れた複数の配線用リード線と、前記リード線の先端の略
中央に各々が近接して配置され、各々の配線用リード線
に配線が施された色の異なる複数の発光ダイオードと、
少なくとも前記リード線の一部と前記発光ダイオードを
覆う透光性の樹脂とを備え、前記リード線の先端は前記
配線方向に開放してなり、前記配線方向と略直交する方
向に於て前記樹脂と近接した反射壁を有し、前記リード
線は前記樹脂の略中央に於て前記先端と反対側に延びる
他端を有し、前記配線用リード線は前記反射壁と連なる
側壁を有する事を特徴とする発光ダイオードランプ。1. A single lead wire, a plurality of wiring lead wires arranged at both ends of the single lead wire, and a lead wire for wiring, which are arranged close to each other at substantially the center of the tip of the lead wire. A plurality of light emitting diodes of different colors wired to
At least a part of the lead wire and a translucent resin that covers the light emitting diode are provided, the tip of the lead wire is opened in the wiring direction, and the resin is provided in a direction substantially orthogonal to the wiring direction. And the lead wire has the other end extending to the side opposite to the tip at substantially the center of the resin, and the wiring lead wire has a side wall continuous with the reflection wall. Characteristic light emitting diode lamp.
れた複数の配線用リード線と、前記リード線の略中央に
各々が近接して載置され、各々の配線用リード線に配線
が施された複数の発光ダイオードと、少なくとも前記リ
ード線の一部と前記発光ダイオードを覆う透光性の樹脂
とを備え、前記リード線の反射壁は全てのリード線にま
たがって設けられた樹脂成形品からなり、前記発光ダイ
オードは複数の青色発光ダイオードと、それと色の異な
る単数の発光ダイオードを含む事を特徴とする発光ダイ
オードランプ。2. A single lead wire, a plurality of wiring lead wires arranged in the vicinity of the single lead wire, and a lead wire mounted on each of the lead wires in close proximity to each other at substantially the center thereof. The light emitting diode is provided with wiring, and at least a part of the lead wire and a translucent resin that covers the light emitting diode are provided, and the reflection wall of the lead wire is provided across all the lead wires. A light emitting diode lamp comprising a resin molded product, wherein the light emitting diode includes a plurality of blue light emitting diodes and a single light emitting diode having a different color.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP014015U JPH0732969U (en) | 1994-11-14 | 1994-11-14 | Light emitting diode lamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP014015U JPH0732969U (en) | 1994-11-14 | 1994-11-14 | Light emitting diode lamp |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0732969U true JPH0732969U (en) | 1995-06-16 |
Family
ID=11849377
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP014015U Pending JPH0732969U (en) | 1994-11-14 | 1994-11-14 | Light emitting diode lamp |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0732969U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001230453A (en) * | 1999-12-08 | 2001-08-24 | Nichia Chem Ind Ltd | Led lamp and its manufacturing method |
| JP2002094130A (en) * | 1999-01-05 | 2002-03-29 | Nichia Chem Ind Ltd | Light emitting diode, its manufacturing method and indicating device using the same |
| JP2003016808A (en) * | 2001-06-29 | 2003-01-17 | Matsushita Electric Ind Co Ltd | Lighting system |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5315269U (en) * | 1976-07-19 | 1978-02-08 | ||
| JPS5621471B2 (en) * | 1974-06-12 | 1981-05-19 |
-
1994
- 1994-11-14 JP JP014015U patent/JPH0732969U/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5621471B2 (en) * | 1974-06-12 | 1981-05-19 | ||
| JPS5315269U (en) * | 1976-07-19 | 1978-02-08 |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002094130A (en) * | 1999-01-05 | 2002-03-29 | Nichia Chem Ind Ltd | Light emitting diode, its manufacturing method and indicating device using the same |
| JP2001230453A (en) * | 1999-12-08 | 2001-08-24 | Nichia Chem Ind Ltd | Led lamp and its manufacturing method |
| JP2003016808A (en) * | 2001-06-29 | 2003-01-17 | Matsushita Electric Ind Co Ltd | Lighting system |
| JP4674418B2 (en) * | 2001-06-29 | 2011-04-20 | パナソニック株式会社 | Lighting equipment |
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