JPH0732936U - Multilayer ceramic electronic components - Google Patents

Abstract

(57) [Summary] (Modified) [Purpose] To simultaneously satisfy the requirements for high density internal conductor layers and heat resistance, moisture resistance, and insulation. [Structure] The laminated ceramic electronic component has a laminated body 17 formed by laminating a ceramic layer and inner conductor layers 14 and 14 'having a width narrower than the ceramic layer. The laminate 17 is polished,
The corners are ground roundly, and the edge of the inner conductor layer 14 ′ that is laminated outside is closer to the center of the laminate 17 than the edge of the inner conductor layer 14 that is laminated between them.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a laminated ceramic electronic component having a laminated body in which ceramic layers and inner conductor layers having a width narrower than that of the ceramic layers are alternately laminated.

[0002]

[Prior art]

 2. Description of the Related Art In recent years, as electronic devices have become smaller and lighter, there has been a strong demand for miniaturization and large capacity of capacitors, which are circuit components. A monolithic ceramic capacitor is receiving attention as one that is suitable for the demand for miniaturization and large capacity of such a capacitor. As shown in FIG. 4, the monolithic ceramic capacitor constitutes a laminated body 7 in which a large number of internal conductor layers 4 which are layered internal electrodes are stacked via ceramic layers. Have been pulled out alternately. Then, external electrodes 5 and 5 are formed on both end surfaces of the laminated body 7 from which the internal electrodes 4 are drawn out. 4 is a vertical sectional front view of the monolithic ceramic capacitor, and only one external electrode 5 is shown.

A method for manufacturing such a multilayer ceramic capacitor is, for example, a ceramic slurry in which a dielectric ceramic powder is dispersed in an organic binder is formed into a sheet shape to form a green sheet, and the green sheet is formed by a screen printing method or the like. Print the internal conductor pattern on the sheet with conductive paste. Then, a plurality of green sheets on which the internal electrode patterns are printed are stacked, and further, a plurality of green sheets on which the internal electrode patterns are not printed are stacked on both sides thereof. The laminate thus obtained is cut into chips so that the internal electrodes are exposed at the end faces. Since the laminated body cut in this way has square edges, it is brittle and easily broken, so the corners are polished by barrel polishing or the like to form a curved surface. Then, after applying the conductive paste to the end surface of the polished laminated body where the internal conductor pattern is exposed, the laminated body is fired. This completes the monolithic ceramic capacitor.

[0004]

[Problems that the device is trying to solve]

 Recently, such monolithic ceramic capacitors are also required to have smaller sizes and larger capacities. In order to realize this further reduction in size and capacity, it is required to make the area of the internal conductor layers as wide as possible and increase the number of laminated layers. However, when the laminated body is polished and the corners thereof are curved as described above, the area of the internal conductor layer is increased, and when the number of laminated layers is increased at the same time, the inner conductor layer 4 which is laminated on the outermost side is formed. The distance between the edge and the outer surface of the laminated body 7 becomes smaller. However, when the laminated body receives a mechanical or thermal impact, the corners of the laminated body 7 are the portions where the stress is most likely to be concentrated, and therefore cracks are more likely to occur than the other portions. Therefore, widening the area of the internal conductor layer and increasing the number of layers are naturally limited from the viewpoint of ensuring heat resistance, moisture resistance, and insulation.

That is, as shown in FIG. 4, some margins ma and mb must be provided between the edge of the inner conductor layer 4 and the outer surface of the laminate 7. For example, in FIG. 4A, the width of the internal conductor layer 4 is narrowed to some extent, and the margin ma between the inner conductor layer 4 and the side surface of the laminate 7 is secured to some extent wide. On the other hand, in FIG. 4B, the number of laminated internal conductor layers 4 is reduced to some extent, and the margin mb between the upper and lower surfaces of the laminate 7 is secured to some extent. In any case, if such a margin is secured, the acquired capacitance becomes smaller.

Further, such a problem is not limited to the monolithic ceramic capacitor, and other monolithic ceramic electronic components are similarly included. For example, if the size of the monolithic ceramic inductor is reduced and the number of turns of the inner conductor layer connected in a coil is increased at the same time, the space between the inner conductor and the outer surface at the corners of the laminated body is necessarily reduced. , A similar problem occurs. Therefore, an object of the present invention is to provide a monolithic ceramic electronic component satisfying at the same time a high density of internal conductor layers and ensuring heat resistance, moisture resistance, and insulation, in view of the problems of the conventional monolithic ceramic electronic component. Especially.

[0007]

[Means for Solving the Problems]

 That is, according to the present invention, in order to achieve the above object, in a laminated ceramic electronic component having a laminated body formed by laminating a ceramic layer and an inner conductor layer having a width narrower than the inner layer, an inner conductor layer laminated on the outside is provided. There is provided a monolithic ceramic electronic component characterized in that the edge of is closer to the center of the laminated body than the edge of the internal conductor layer laminated therebetween.

[0008]

[Action]

 In the multilayer ceramic electronic component according to the present invention, the edge of the inner conductor layer laminated on the outside is closer to the center of the laminated body than the edge of the inner conductor layer laminated between them. Even if the number is increased, the distance between the edge of the inner conductor layer laminated on the outer side and the corner of the laminate can be increased to some extent. Moreover, only the inner conductor layer laminated on the outer side may be narrowed or shortened, and the edge thereof may be closer to the center of the laminated body, and the inner conductor layer laminated between them may be wider or longer. Therefore, it is possible to increase the overall area or length of the inner conductor layer, obtain a large capacitance, or secure the number of turns of the coil-shaped inner conductor.

[0009]

【Example】

 Next, the embodiments of the present invention will be described in detail. FIG. 1 shows a monolithic ceramic capacitor as an example of a monolithic ceramic electronic component according to an embodiment of the present invention. This laminated ceramic electronic component has a laminated body 17 formed by laminating ceramic dielectrics, and a pair of external electrodes 15 and 15 provided at both ends thereof.

In the laminated body 17, two sets of internal conductor layers 14 and 14 ′ are alternately laminated so as to face each other with the ceramic layers interposed therebetween. The edges of the inner conductor layers 14, 14 ′ of one set reach one end face of the laminate 17 and are electrically connected to one outer electrode 15. The edges of the inner conductor layers 14 and 14 ′ of the other set reach the other end face of the laminated body 17 and are electrically connected to the other external electrode 15.

Here, as shown in FIG. 1B, of the internal conductor layers 14 and 14 ′, a part of the internal conductor layers 14 ′ that are laminated on the outer side, that is, in FIG. The width of the inner conductor layers 14 ′ stacked vertically is narrower than the width of the inner conductor layers 14 1 in the middle part stacked between them. As a result, both side edges of the outer inner conductor layer 14 ′ are closer to the center of the laminated body 17 than both side edges of the middle inner conductor layer 14. Therefore, even if the number of laminated internal conductor layers 14 and 14 ′ is increased, the distance between the side edges of the laminated internal conductor layers 14 ′ and the corners of the laminate 7 can be increased to some extent. it can. In particular, in this embodiment, it is possible to increase the distance between the corners between the upper and lower surfaces of the laminate and the side surfaces and both side edges of the internal conductor layer 14 '. Moreover, since the width of only the inner conductor layer 14 ′ that is laminated on the outer side is narrow and the width of the inner conductor layer 14 in the middle portion is wide, the overall area of the inner conductor layers 14 and 14 ′ is large, and the large electrostatic capacitance is large. You can get the capacity.

An example of manufacturing such a monolithic ceramic capacitor will be described with reference to FIG. First, a ceramic slurry in which dielectric ceramic powder is dispersed in an organic binder is formed into a sheet shape to make ceramic green sheets 21, 21 ... Next, the internal conductor patterns 25, 25 ', 26, 26' are printed on the ceramic green sheets 21, 21 ... With a conductive paste by a screen printing method or the like. The internal conductor patterns 25, 25 ', 26, 26' form the internal conductor layers 14, 14 'described above, respectively. The inner conductor patterns 25 'and 26' for forming the inner conductor layer 14 'laminated on the outer side are narrower in width than the inner conductor patterns 24 and 25 laminated between them. The narrow inner conductor patterns 25 'and 26' may be printed with a narrow print pattern from the beginning, or may be printed with the same print pattern as the inner conductor patterns 25 and 26, and then trimmed to be narrow. . The internal conductor patterns 25, 25 ', 26, 26' are formed so as to be alternately led out to the opposite edges of the ceramic green sheets 21, 21 ...

Next, the ceramic green sheets 21, 21 ... With the internal conductor patterns 25, 25 ', 26, 26' printed thereon are laminated as shown in FIG. Stack a plurality of unprinted ceramic green sheets 27, 28. The laminated body thus obtained is cut into chips so that the internal conductor patterns 25, 25 ', 26, 26' are exposed at the end faces. Then, the cut laminated body 17 is polished by barrel polishing or the like, and the corner portions are rounded off. Then, a conductive paste is applied to the end surface of the laminated body where the internal conductor patterns 25, 25 ', 26, 26' are exposed. Further, by firing this laminated body, a laminated chip capacitor as shown in FIG. 1 is completed.

For convenience of description, FIG. 2 shows a ceramic green sheet for one monolithic ceramic electronic component. However, in practice, the internal conductor patterns for a large number of monolithic ceramic electronic components are printed simultaneously on the ceramic green sheet, laminated, cut into chips for each monolithic ceramic electronic component, and then fired. Is generally taken. Further, the above-described manufacturing method is an example of manufacturing the laminated ceramic capacitor by printing the internal electrode pattern on the ceramic green sheet and stacking the ceramic green sheets, but alternating the ceramic paste and the conductive paste. There is also a manufacturing method for obtaining a laminate while printing.

Next, the embodiment of FIG. 3 will be described. In this embodiment, the length of the inner conductor layer 14 ′ laminated on the outer side is shorter than that of the inner conductor layer 14 between the inner conductor layers 14 ′. The leading edge of the inner conductor layer 14 ′ is closer to the center of the laminated body 17 than the leading edge of the intermediate inner conductor layer 14. In this case, it is possible to increase the distance between the corners between the upper and lower surfaces of the laminate and the end face and the leading edge of the internal conductor layer 14 '. It is possible to carry out the embodiment of FIG. 3 and the embodiment of FIG. 1 described above in combination.

In the above-described embodiments, the monolithic ceramic capacitor has been described as an example of the monolithic ceramic electronic component. However, the present invention is not limited to this, and can be similarly applied to other monolithic ceramic electronic components, for example, monolithic ceramic inductors.

[0017]

[Effect of device]

 As described above, according to the present invention, even if the number of laminated inner conductor layers is increased, the distance between the edge of the inner conductor layer laminated on the outer side and the corner of the laminate can be increased to some extent. it can. Moreover, since it is only necessary to narrow or shorten the width of only some of the internal conductor layers and to widen or lengthen the other internal conductor layers, it is possible to obtain a large capacitance or secure the number of turns of the coiled internal conductor. In addition, it is possible to obtain a monolithic ceramic electronic component capable of ensuring heat resistance, moisture resistance, and insulation.

[Brief description of drawings]

FIG. 1 is a perspective view of a monolithic ceramic electronic component according to an embodiment of the present invention and a sectional view taken along the line AA.

FIG. 2 is an exploded perspective view showing an example of a stacking order of sheets when manufacturing a multilayer ceramic electronic component.

FIG. 3 is a vertical sectional side view of a monolithic ceramic electronic component according to an embodiment of the present invention.

FIG. 4 is a vertical sectional front view of a conventional monolithic ceramic electronic component.

[Explanation of symbols]

 14 inner conductor layer 14 'narrow inner conductor layer 15 outer electrode 17 laminate

Claims (1)

[Reference number] 0050424-01 [Claims for utility model registration] 1. In a laminated ceramic electronic component having a laminated body formed by laminating a ceramic layer and an internal conductor layer narrower than the ceramic layer, an edge of the internal conductor layer laminated outside is
A monolithic ceramic electronic component characterized in that it is closer to the center of the laminated body than the edges of the internal conductor layers laminated between them.