JPH0732220B2 - Integrated circuit cooling structure - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial field of application] The present invention can efficiently discharge heat generated from a cooling structure of an integrated circuit, particularly a semiconductor chip, to the outside of the device.
Regarding cooling structure of LSI package.

[Conventional technology]

Conventionally, as a cooling structure for an integrated circuit of this type, a cold plate that comes into contact with the integrated circuit and a cooling container that serves as a coolant flow path are provided, and these are divided into two (for example, Japanese Patent Application No. 183889 in 1985). issue).

[Problems to be Solved by the Invention]

The above-described conventional cooling structure for an integrated circuit has a drawback that the higher the heat generated from the semiconductor chip, the more the flow rate of the coolant has to be changed and the like. Further, since the cold plate that comes into contact with the integrated circuit and the cooling container that serves as the coolant passage are divided into two parts, there is a drawback that the thermal resistance with the integrated circuit increases.

[Means for Solving the Problems]

The cooling structure for an integrated circuit according to the present invention includes an integrated circuit mounted on a substrate, a cold plate provided with a counterbore on the back side of the surface facing the upper surface of the integrated circuit with a minute gap, and a coolant intake port. A cooling container having a suction chamber to be connected and a discharge chamber to be connected to an outlet of the refrigerant, which is in close contact with the cold plate to seal the counterbore, and a right angle to the bottom of the counterbore provided on the bottom of the suction chamber. And a second nozzle provided in the counterbore and passing through the suction chamber and directly connected to the first nozzle of the adjacent counterbore.

〔Example〕

 Next, the present invention will be described with reference to the drawings.

FIG. 1 is a sectional view of an embodiment of the present invention. Referring to FIG. 1, 1 is a substrate and 2 is an integrated circuit mounted on the substrate. The outer peripheral edge of the substrate 1 is firmly fixed to the substrate frame 3. There is a cold plate 5 facing the upper surface of the integrated circuit 2 with a minute gap and having a counterbore 4 on the surface on the back side of the surface facing the integrated circuit 2.

On the cold plate 5, a refrigerant inlet 8 and an outlet 9 are provided.
A cooling container 11 having a partition wall 10 for partitioning the two is closely attached.

The cooling container 11 has a first nozzle 7 facing the bottom surface of each countersunk hole 4 at a right angle, and a first nozzle 7 adjacent to the countersunk hole 4 (except for the countersunk hole at the right end of FIG. 1). A second nozzle 12 is provided, and the second nozzle 12 is directly connected to the first nozzle 7 of the counterbore 4 on the right side in FIG. 1 in the cooling container 11.

When the refrigerant 6 flows in through the intake port 8 of the cooling container 11, the partition wall 10
It is filled in the suction chamber 14 partitioned by and is sprayed from the first nozzle 7 at the left end in FIG. 1 to the bottom surface of the counterbore 4 of the cold plate 5 to collide with it. The colliding refrigerant 6 is the second
Through the nozzle 12 of the cooling container 11 and sequentially flows to the first nozzle 7 on the right side, and finally through the hole provided in the bottom surface of the discharge chamber 15 of the cooling container 11 to be collected in the discharge chamber 15 and discharged from the outlet 9 to the outside. To be done.

Since the direct connection part of the nozzles 7 and 12 is located in the suction chamber 14,
It is constantly immersed in the refrigerant 6. As a result, the refrigerant 6 that is heated by the heat of the integrated circuit and flows into the nozzle 12 is also cooled by the refrigerant 6 in the suction chamber 14 in the nozzle until the jet flow in the next counterbore 4, so that the temperature is always at a substantially constant temperature. The refrigerant 6 can be circulated. The arrows in the figure show the flow of the refrigerant.

FIG. 2 is a cross-sectional view of another embodiment of the present invention. First, except that a protrusion 16 is provided on the bottom surface of the counterbore 4.
It has the same configuration as the embodiment shown in the figure. The refrigerant 6 ejected from the first nozzle 7 collides with the bottom surface of the counterbore 4 to form a protrusion.
It flows around 16 and flows into the second nozzle 12 or the discharge chamber 15. Heat from the integrated circuit 2 is removed by the coolant 6 through the bottom of the counterbore 5 of the cold plate 5 and the projection 16.

〔The invention's effect〕

As described above, according to the present invention, by adopting the above structure, the heat generated from the semiconductor chip can be efficiently held down with a simple structure and without increasing the flow rate of the refrigerant, while keeping the thermal resistance with the integrated circuit low. The effect is that it can be discharged to the outside of the equipment.

[Brief description of drawings]

FIG. 1 is a sectional view of an embodiment of the present invention, and FIG. 2 is a sectional view of another embodiment of the present invention. 1 ... Substrate, 2 ... Integrated circuit, 3 ... Substrate frame, 4 ... Counterbore,
5 ... Cold plate, 6 ... Refrigerant, 7 ... First nozzle,
8 ... Inlet, 9 ... Outlet, 10 ... Partition, 11 ... Cooling container, 12
... second nozzle, 14 ... suction chamber, 15 ... discharge chamber, 16 ... projection.

Claims (2)

[Claims] 1. An integrated circuit mounted on a substrate, a cold plate having a counterbore on the back side of the surface opposed to the upper surface of the integrated circuit with a minute gap, and a suction chamber connected to a refrigerant intake port. A cooling container having a discharge chamber connected to the outlet for the refrigerant and closely contacting with the cold plate to seal the counterbore; and a first container provided at the bottom of the suction chamber and facing the bottom of the counterbore at a right angle. And a second nozzle provided in the counterbore and passing through the suction chamber and directly connected to the first nozzle of the counterbore adjacent thereto. 2. The cooling structure for an integrated circuit according to claim 1, wherein a protrusion is provided on the bottom surface of the counterbore.