JPH07321158A - Film carrier, liquid crystal display device equipped with it and manufacture thereof - Google Patents

Film carrier, liquid crystal display device equipped with it and manufacture thereof

Info

Publication number
JPH07321158A
JPH07321158A JP11275594A JP11275594A JPH07321158A JP H07321158 A JPH07321158 A JP H07321158A JP 11275594 A JP11275594 A JP 11275594A JP 11275594 A JP11275594 A JP 11275594A JP H07321158 A JPH07321158 A JP H07321158A
Authority
JP
Japan
Prior art keywords
liquid crystal
wiring
film carrier
terminals
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11275594A
Other languages
Japanese (ja)
Inventor
Hitoshi Morishita
均 森下
Tooru Kokogawa
徹 爰河
Kohei Adachi
光平 安達
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
AGC Inc
Original Assignee
Asahi Glass Co Ltd
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Glass Co Ltd, Mitsubishi Electric Corp filed Critical Asahi Glass Co Ltd
Priority to JP11275594A priority Critical patent/JPH07321158A/en
Publication of JPH07321158A publication Critical patent/JPH07321158A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0393Flexible materials
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/36Assembling printed circuits with other printed circuits
    • H05K3/361Assembling flexible printed circuits with other printed circuits

Abstract

PURPOSE:To provide a film carrier whose wiring terminals are very reliably connected to other electrode terminals and which can be improved in productivity. CONSTITUTION:Wiring patterns 12 are formed on an organic insulating film 11 for the formation of a film carrier 10, the ends of the wiring patterns 12 are arranged in lines as wiring terminals 12a, and a wiring terminal group is electrically connected to other wiring terminal groups, and through-holes 15 are bored in the organic film 11 between the wiring terminals 12a on both the sides of a belt section that extends along the alignments of the wiring terminal 12, excluding the above belt section.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は有機絶縁性フィルムに配
線パターンが設けられたフィルムキャリアおよびそれを
用いた液晶表示素子とその製法に関する。さらに詳しく
は、フィルムキャリアの端部に設けられた配線端子群と
他の電極端子群との電気的接続の信頼性を向上するとと
もに、接続の際の加圧加熱ツールを損傷しないようなフ
ィルムキャリアおよびそれを用いた液晶表示素子とその
製法に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a film carrier in which a wiring pattern is provided on an organic insulating film, a liquid crystal display device using the same and a method for producing the same. More specifically, the film carrier that improves reliability of electrical connection between the wiring terminal group provided at the end of the film carrier and another electrode terminal group and does not damage the pressurizing and heating tool at the time of connection. And a liquid crystal display device using the same and a manufacturing method thereof.

【0002】[0002]

【従来の技術】たとえば液晶表示素子などの平面型表示
素子などでは各画素ごとに設けられた電極に接続された
電極端子と各画素電極を駆動するための駆動回路とを接
続するため、折り曲げ可能な可撓性フィルムに銅箔など
で設けられた配線パターンを有するフィルムキャリアが
用いられている。
2. Description of the Related Art For example, in a flat-panel display element such as a liquid crystal display element, electrode terminals connected to electrodes provided for each pixel and a drive circuit for driving each pixel electrode are connected to each other so that they can be bent. A film carrier having a wiring pattern formed of a copper foil or the like on a flexible film is used.

【0003】ここにフィルムキャリアとは、好ましくは
可撓性の、有機絶縁性フィルムにリード線や銅箔などに
より配線パターンが設けられたものをいい、配線パター
ンの途中に信号処理用ICや駆動回路が形成されたLS
Iなどが搭載された、いわゆるTABや、配線パターン
のみが設けられ、直接平面型表示パネルの電極端子群と
駆動回路が形成された回路基板の端子とを仲介して接続
するためのフレキシブルコネクタなども含む意味であ
る。
Here, the film carrier is preferably a flexible organic insulating film provided with a wiring pattern by a lead wire or a copper foil, and a signal processing IC or a drive is provided in the middle of the wiring pattern. LS with circuit
A so-called TAB on which I or the like is mounted, a flexible connector for connecting the electrode terminal group of the flat display panel and the terminal of the circuit board on which the drive circuit is formed, which is provided only with the wiring pattern, etc. Is also meant to include.

【0004】近年、液晶表示素子は表示パネルの大画面
化、高精細化の傾向にあり、電極端子も多くなり細密化
している。それに伴ない、液晶セルの電極端子群と液晶
セル駆動用LSIとの接続方法は、従来のプリント基板
にLSIをワイヤボンディング法で接続したあとヒート
シール、ゼブラゴムなどで液晶セル端部の電極端子群に
接続する方法から、フィルムキャリアに液晶セル駆動用
LSIを搭載し、異方性導電膜を用いて液晶セルの電極
端子群と接続する方法へ変化してきている。
In recent years, liquid crystal display elements have been tending toward larger screens and higher definition of display panels, and the number of electrode terminals has been increasing, resulting in miniaturization. Along with that, the method of connecting the liquid crystal cell electrode terminal group and the liquid crystal cell driving LSI is to connect the LSI to the conventional printed circuit board by the wire bonding method and then heat seal, zebra rubber, etc. There has been a change from a method of connecting to a liquid crystal cell driving LSI on a film carrier and a method of connecting to an electrode terminal group of a liquid crystal cell by using an anisotropic conductive film.

【0005】従来のLSIが設けられたフィルムキャリ
アの一例を図6に、そのフィルムキャリアと液晶セル2
0の電極端子22部の接続手順を図7に示す。
An example of a film carrier provided with a conventional LSI is shown in FIG.
FIG. 7 shows the procedure for connecting the electrode terminal 22 portion of No. 0.

【0006】図6において、11は可撓性の有機絶縁性
フィルムで、その表面に配線パターン12が設けられ、
一端部は配線端子12aとなり、他端部にはLSI30
が接続され、さらに配線パターン12が設けられてい
る。なお13は位置合わせマーク、16はフィルムキャ
リアを曲げ易くするための開口部である。このフィルム
キャリア10の配線端子12a群をたとえば液晶セルの
電極端子群に電気的に接続するにはつぎのようにする。
In FIG. 6, 11 is a flexible organic insulating film, on the surface of which a wiring pattern 12 is provided,
The wiring terminal 12a is provided at one end and the LSI 30 is provided at the other end.
Are connected, and a wiring pattern 12 is further provided. Reference numeral 13 is an alignment mark, and 16 is an opening for facilitating bending of the film carrier. The wiring terminals 12a of the film carrier 10 are electrically connected to the electrode terminals of the liquid crystal cell, for example, as follows.

【0007】まず、図7(a)に示されるように、異方
性導電膜40を液晶セル20の電極端子22上に設置
し、さらにフィルムキャリア10を重ね合わせ、配線端
子12a群が液晶セル20の基板21の端部の電極端子
22の群れと一致するようにフィルムキャリア10を液
晶セル20に位置合わせする。この際フィルムキャリア
10の配線端子12a間および液晶セル20の電極端子
22間に空隙部41ができる。つぎに、図7(b)に示
されるように加熱加圧ツール50をフィルムキャリア1
0の配線端子12a部上の有機絶縁性フィルム11側か
ら押し当て、150〜220℃、2×105〜5×105
Paに加熱、加圧することにより、異方性導電膜40を
硬化させる。異方性導電膜40は、熱硬化性樹脂に導電
粒子が混入されているもので、加熱されることにより熱
硬化性樹脂が液状になり、加圧されることにより空隙部
41側に押し出され、配線端子12aと電極端子22と
のあいだに挟まれた導電粒子を介して両端子間が電気的
に接続される。一方空隙部41に押し出された熱硬化性
樹脂は配線端子12aと電極端子22間のように狭い間
隙ではないため、導電粒子は熱硬化性樹脂内に点在する
状態になり、両隣り(横方向)の端子間のショートはな
く、必要な配線端子12aと電極端子2のみの電気的接
続がえられる。しかし空隙部41に押し出された熱硬化
性樹脂は、加熱状態で粘度が急激に低下しており、流動
性が極めてよくなっているため、もともと空隙部41に
存在していた空気を外に押し出すことができず、樹脂内
にとり込むことになる。その結果、図7(b)、(c)
に示されるように気泡42が発生し、隣接する端子間の
絶縁不良が発生したり、フィルムキャリア10と液晶セ
ル20の端部との密着強度が低下し、剥離が生じたり、
水分が侵入して信頼性を低下させるという問題がある。
なお、図7(c)は熱硬化性樹脂が硬化後、加熱、加圧
ツール50を除去した状態を示す図である。
First, as shown in FIG. 7 (a), an anisotropic conductive film 40 is placed on the electrode terminals 22 of the liquid crystal cell 20, the film carrier 10 is further stacked, and the wiring terminals 12a are connected to the liquid crystal cell. The film carrier 10 is aligned with the liquid crystal cell 20 so as to coincide with the group of the electrode terminals 22 at the end of the substrate 21 of 20. At this time, voids 41 are formed between the wiring terminals 12a of the film carrier 10 and between the electrode terminals 22 of the liquid crystal cell 20. Next, as shown in FIG. 7B, the heating / pressurizing tool 50 is attached to the film carrier 1.
0 from the side of the organic insulating film 11 on the wiring terminal 12a portion, 150 to 220 ℃, 2 × 10 5 to 5 × 10 5
The anisotropic conductive film 40 is cured by heating and pressurizing to Pa. The anisotropic conductive film 40 is a mixture of conductive particles in a thermosetting resin, and when heated, the thermosetting resin becomes liquid, and when pressed, it is extruded toward the void portion 41 side. The two terminals are electrically connected via the conductive particles sandwiched between the wiring terminal 12a and the electrode terminal 22. On the other hand, since the thermosetting resin extruded into the void 41 is not a narrow gap such as between the wiring terminal 12a and the electrode terminal 22, the conductive particles are scattered in the thermosetting resin, and both sides (lateral) There is no short circuit between terminals (direction), and only the required wiring terminal 12a and electrode terminal 2 can be electrically connected. However, the thermosetting resin extruded into the void 41 has its viscosity drastically lowered in a heated state and has extremely good fluidity, so that the air originally present in the void 41 is pushed out. It is not possible, and it will be taken into the resin. As a result, FIG. 7 (b), (c)
As shown in (4), bubbles 42 are generated, insulation failure between adjacent terminals occurs, adhesion strength between the film carrier 10 and the end of the liquid crystal cell 20 decreases, and peeling occurs,
There is a problem that moisture penetrates to lower reliability.
It should be noted that FIG. 7C is a diagram showing a state in which the heating / pressurizing tool 50 is removed after the thermosetting resin is cured.

【0008】一方、このような問題を解決するため、た
とえば特開平4−256926号公報に開示され、図8
に示されるようなフィルムキャリア10が提案されてい
る。このフィルムキャリア10は、有機絶縁性フィルム
11上でかつ、配線パターン12の配線端子12a部全
域の配線端子12a間に貫通孔15が設けられており、
配線端子12a間や電極端子22間の空隙部に存在する
空気を貫通孔15から外へ逃がすものである。図8に示
されるフィルムキャリア10と液晶セル20との接続手
順を図9に示す。前述の図6に示されるフィルムキャリ
ア10のときと同様、図9(a)に示されるように、異
方性導電膜40を前記液晶セル20の基板21端部に設
けられた電極端子22上にのせ、さらにフィルムキャリ
ア10を重ねて配線端子12aが液晶セル20の電極端
子22と一致するように位置合わせし、図9(b)に示
されるように加熱加圧ツール50を用いて前記異方性導
電膜40により接着する。この際、空隙部41に存在し
た空気はフィルムキャリア10の貫通孔15を介して逃
げるが、異方性導電材料43の一部も貫通孔15内に這
い上がり、図9(C)に加熱加圧ツールを取り除いたあ
との様子が示されるように、加熱加圧ツール50に付着
物44が形成される。
On the other hand, in order to solve such a problem, for example, it is disclosed in Japanese Patent Laid-Open No. 4-256926, and FIG.
The film carrier 10 as shown in FIG. The film carrier 10 is provided with through holes 15 on the organic insulating film 11 and between the wiring terminals 12a in the entire wiring terminal 12a portion of the wiring pattern 12.
The air existing between the wiring terminals 12a and between the electrode terminals 22 is allowed to escape from the through holes 15 to the outside. FIG. 9 shows the procedure for connecting the film carrier 10 and the liquid crystal cell 20 shown in FIG. As in the case of the film carrier 10 shown in FIG. 6 described above, as shown in FIG. 9A, the anisotropic conductive film 40 is provided on the electrode terminal 22 provided at the end of the substrate 21 of the liquid crystal cell 20. Then, the film carrier 10 is further overlapped, and the wiring terminals 12a are aligned so that the wiring terminals 12a and the electrode terminals 22 of the liquid crystal cell 20 are aligned with each other. As shown in FIG. Bonding is performed with the anisotropic conductive film 40. At this time, the air existing in the voids 41 escapes through the through holes 15 of the film carrier 10, but a part of the anisotropic conductive material 43 also crawls into the through holes 15 and is heated by the heat treatment shown in FIG. The deposit 44 is formed on the heating and pressing tool 50 as shown after the pressing tool is removed.

【0009】[0009]

【発明が解決しようとする課題】前述のように、フィル
ムキャリアに貫通孔が設けられていないばあいには、異
方性導電材料中に気泡を取り込み、絶縁性や接着強度が
低下するという問題がある。また、液晶セルとフィルム
キャリアを接続したあとに液晶駆動用LSIの動作不良
などの理由でフィルムキャリアを剥離しなければならな
いとき、たとえばアセトン、トルエン、メチルエチルケ
トンなどの溶剤を用いるが、このとき、フィルムキャリ
アの周囲からしか溶剤を送り込むことができないため、
異方性導電材料が充分膨潤せず、剥離が極めて困難であ
ったり、剥離時に液晶セルの電極端子も一緒に剥離する
という問題がある。
As described above, when the film carrier is not provided with the through holes, air bubbles are trapped in the anisotropic conductive material, and the insulating property and the adhesive strength are lowered. There is. When the film carrier must be peeled off after the liquid crystal cell and the film carrier are connected due to a malfunction of the liquid crystal driving LSI, a solvent such as acetone, toluene, or methyl ethyl ketone is used. Since the solvent can be sent only from around the carrier,
There is a problem that the anisotropic conductive material does not swell sufficiently and peeling is extremely difficult, and the electrode terminals of the liquid crystal cell are peeled together when peeling.

【0010】さらにフィルムキャリアに貫通孔が設けら
れているばあいは、貫通孔から該異方性導電膜を構成す
る材料の一部が流れだして加熱加圧ツールに付着物が形
成され、加熱加圧ツールが平坦でなくなる。平担でない
と均一な加圧ができないため、作業毎に加熱加圧ツール
のクリーニングをしなければならないという問題があ
る。
Further, when the film carrier is provided with a through hole, a part of the material forming the anisotropic conductive film flows out from the through hole to form an adhered substance on the heating / pressurizing tool, which is heated. The pressure tool becomes uneven. There is a problem in that the heating / pressurizing tool must be cleaned after each operation, because uniform pressing cannot be performed unless it is flat.

【0011】本発明は、このような問題を解決し、高信
頼性がある電極端子の接続がえられ、かつ、生産性が向
上するフィルムキャリアを提供することを目的とする。
An object of the present invention is to provide a film carrier which solves such a problem, has highly reliable connection of electrode terminals, and has improved productivity.

【0012】本発明の他の目的は、前記フィルムキャリ
アを用い、信頼性が向上し、かつ、安価で液晶表示素子
およびその製法を提供することにある。
Another object of the present invention is to provide a liquid crystal display device using the film carrier, which has improved reliability and is inexpensive, and a method for producing the same.

【0013】[0013]

【課題を解決するための手段】本発明のフィルムキャリ
アは、有機絶縁性フィルムに複数の配線パターンが形成
され、該複数の配線パターンの端部がそれぞれ配線端子
として整列し、該配線端子の群が他の電極端子群と電気
的に接続されうるフィルムキャリアであって、前記配線
端子の整列方向に沿った帯状部を除き、該帯状部の両側
で、かつ、前記配線端子の間隙の前記有機絶縁性フィル
ムに貫通孔が設けられている。
In the film carrier of the present invention, a plurality of wiring patterns are formed on an organic insulating film, the ends of the plurality of wiring patterns are aligned as wiring terminals, and a group of the wiring terminals is formed. Is a film carrier that can be electrically connected to another electrode terminal group, and the organic film is formed on both sides of the strip-shaped portion except the strip-shaped portion along the alignment direction of the wiring terminals and in the gap between the wiring terminals. Through holes are provided in the insulating film.

【0014】前記貫通孔のうち前記配線端子の整列方向
の両端部近傍のそれぞれ1個が他の貫通孔と異なる形状
または大きさに形成されていることは、フィルムキャリ
アの位置合わせマークとして使用することができるため
好ましい。
One of the through holes in the vicinity of both ends of the wiring terminal in the alignment direction is formed to have a different shape or size from the other through holes, which is used as an alignment mark of the film carrier. It is preferable because it is possible.

【0015】さらに、前記フィルムキャリアに、該フィ
ルムキャリアの位置合わせマークが前記貫通孔の1個の
内側に突出するように形成されていることが位置合わせ
精度を向上させる点からも好ましい。
Further, it is preferable that the alignment mark of the film carrier is formed on the film carrier so as to project to the inner side of one of the through holes from the viewpoint of improving the alignment accuracy.

【0016】また、本発明の液晶表示素子は、電極パタ
ーンが形成された2枚の絶縁性透明基板により液晶材料
が挟持され、前記電極パターンの電極端子群が端部に設
けられた液晶セルと、該液晶セルを駆動する駆動回路と
からなり、前記液晶セルの電極端子群と前記駆動回路の
端子とが請求項1記載のフィルムキャリアにより接続さ
れている。
Further, the liquid crystal display device of the present invention comprises a liquid crystal cell in which a liquid crystal material is sandwiched between two insulating transparent substrates having electrode patterns, and electrode terminal groups of the electrode patterns are provided at the ends. A drive circuit for driving the liquid crystal cell, wherein the electrode terminal group of the liquid crystal cell and the terminal of the drive circuit are connected by the film carrier according to claim 1.

【0017】ここに駆動回路とは液晶表示素子の各画素
に信号を送るための駆動回路の少なくとも一部が形成さ
れているもので、回路基板に形成された回路がIC、L
SIに形成されたもののほか、一部の信号処理をし、配
線数を減らすことができる信号処理用ICなども含む意
味である。
Here, the drive circuit is a circuit in which at least a part of the drive circuit for sending a signal to each pixel of the liquid crystal display element is formed, and the circuit formed on the circuit board is IC, L.
In addition to the one formed in SI, it is meant to include a signal processing IC capable of performing some signal processing and reducing the number of wirings.

【0018】さらに本発明の液晶表示素子の製法は、電
極パターンが形成された2枚の絶縁性透明基板により液
晶材料が挟持された液晶セルの電極端子群と、他端部に
駆動回路を接続しうるとともに一端部に配線端子の群を
有する複数の配線パターンが有機絶縁性フィルムに形成
されたフィルムキャリアの該配線端子群とを電気的に接
続する液晶表示製法であって、前記有機絶縁性フィルム
に前記配線端子が整列する方向の帯状部を除き該帯状部
の両側の前記配線端子間に貫通孔が設けられたフィルム
キャリアを前記配線端子群の各端子が前記液晶セルの電
極端子群と各端子と一致するように異方性導電膜を介し
て重ね合わせ、前記貫通孔が設けられていない前記帯状
部分に加熱加圧ツールを当てつけて接着するとともに前
記電極端子群と前記配線端子群とを電気的に接続するこ
とを特徴とする。
Further, according to the method of manufacturing a liquid crystal display element of the present invention, an electrode terminal group of a liquid crystal cell in which a liquid crystal material is sandwiched by two insulating transparent substrates having electrode patterns formed thereon, and a drive circuit is connected to the other end. A liquid crystal display manufacturing method for electrically connecting a plurality of wiring patterns having a group of wiring terminals at one end to the wiring terminal group of a film carrier formed on an organic insulating film, wherein the organic insulating A film carrier in which a through hole is provided between the wiring terminals on both sides of the strip-shaped portion except for the strip-shaped portion in the direction in which the wiring terminals are aligned with the film, each terminal of the wiring terminal group is an electrode terminal group of the liquid crystal cell. The terminals are overlapped with each other via an anisotropic conductive film so as to match each terminal, and a heating and pressurizing tool is applied to the band-shaped portion where the through hole is not provided to bond the terminals together with the electrode terminal group. Characterized by electrically connecting the wiring terminals.

【0019】[0019]

【作用】本発明によれば、フィルムキャリアの配線端子
部で加熱加圧ツールが接触する帯状部分を除いた領域
で、かつ、配線端子間の有機絶縁性フィルムに貫通孔が
設けられているため、液晶表示素子とフィルムキャリア
の配線端子群と他の電極端子群との接続時に端子間の空
隙部に存在する空気は異方性導電材料が加熱加圧により
前記空隙部に押し出される際に貫通孔を介して放出さ
れ、異方性導電材料中に気泡として取り残されることは
ない。したがって端子間の絶縁性が確実にえられ、しか
も接着力も充分にえられ、信頼性が向上する。
According to the present invention, since the through hole is provided in the organic insulating film between the wiring terminals in the area excluding the strip-shaped portion in contact with the heating and pressing tool in the wiring terminal portion of the film carrier. The air existing in the voids between the terminals when connecting the liquid crystal display element, the wiring terminal group of the film carrier, and the other electrode terminal groups penetrates when the anisotropic conductive material is pushed into the voids by heat and pressure. It is released through the pores and is not left as bubbles in the anisotropic conductive material. Therefore, the insulation between the terminals can be surely obtained, and the adhesive force can be sufficiently obtained, so that the reliability is improved.

【0020】一方、フィルムキャリアと加熱加圧ツール
とが接触する領域には貫通孔が設けられていないので、
異方性導電膜の材料が加熱加圧により空隙部に押し出さ
れても、加熱加圧ツールに付着することはない。
On the other hand, since no through hole is provided in the area where the film carrier and the heating and pressing tool are in contact with each other,
Even if the material of the anisotropic conductive film is extruded into the void by heating and pressing, it does not adhere to the heating and pressing tool.

【0021】また、貫通孔のうち整列方向の両端近傍に
1個ずつ大きさまたは形状の異なる貫通孔を設けて位置
合わせ用マークとしたり、貫通孔内に突出する位置合わ
せマークを設けることにより、LSIの不良などにより
フィルムキャリアを剥離したあとに新しいフィルムキャ
リアの配線端子群を液晶セルなどに設けられた他の電極
端子群などに位置合わせするばあいにも、配線端子群が
形成されていない側からフィルムキャリア位置合わせ用
のマークと液晶セルなどのマークを同時に見ることがで
き、位置合わせを確実にすることができる。
Further, by providing through holes having different sizes or shapes one by one in the vicinity of both ends in the alignment direction as positioning marks, or by providing positioning marks protruding into the through holes, The wiring terminal group is not formed even when the wiring terminal group of the new film carrier is aligned with other electrode terminal groups provided in the liquid crystal cell etc. after the film carrier is peeled off due to an LSI defect or the like. From the side, the mark for aligning the film carrier and the mark on the liquid crystal cell can be seen at the same time, and the alignment can be ensured.

【0022】また本発明の液晶表示素子およびその製法
によれば、液晶セルの端部に設けられた電極端子群と、
駆動用LSIまたは駆動回路と接続された配線パターン
を有するフィルムキャリアの配線端子との接続が確実に
えられ、信頼性の高い液晶表示素子がえられる。しか
も、加熱加圧ツールを貫通孔が形成されていない配線端
子部に載置して加熱加圧する加熱加圧ツールに異方性導
電材料が付着することもない。
According to the liquid crystal display element and the manufacturing method thereof of the present invention, a group of electrode terminals provided at the end of the liquid crystal cell,
The connection with the wiring terminal of the film carrier having the wiring pattern connected to the driving LSI or the driving circuit can be surely obtained, and a highly reliable liquid crystal display element can be obtained. Moreover, the anisotropic conductive material does not adhere to the heating / pressurizing tool that heats and presses by placing the heating / pressurizing tool on the wiring terminal portion where the through hole is not formed.

【0023】[0023]

【実施例】つぎに、図面を参照しながら本発明のフィル
ムキャリアを説明する。
The film carrier of the present invention will now be described with reference to the drawings.

【0024】[実施例1]図1(a)は本発明のフィル
ムキャリアの一実施例の説明図、図1(b)は図1
(a)のA−A線断面図、図2〜3は液晶表示素子を形
成するための液晶セルとフィルムキャリアとの接続の工
程を示す断面説明図である。
[Embodiment 1] FIG. 1 (a) is an illustration of an embodiment of the film carrier of the present invention, and FIG. 1 (b) is FIG.
FIG. 2A is a sectional view taken along the line AA of FIG. 2A, and FIGS. 2 to 3 are sectional explanatory views showing a process of connecting a liquid crystal cell and a film carrier for forming a liquid crystal display element.

【0025】フィルムキャリア10は、ポリイミド樹脂
またはポリエステル樹脂などからなる有機絶縁性フィル
ム11と、銅箔または銅を基体とする合金箔などの導電
性金属箔をフォトリソグラフィー技術を用いて形成さ
れ、一端部が配線端子12aとされた配線パターン12
および配線パターン12と同じ材料で同時に形成される
位置合わせマーク13とからなっている。さらに、有機
絶縁性フィルム11の加熱加圧ツールにより圧接する帯
状部Pを除いた配線端子12a間には図1(a)に示さ
れるように、貫通孔15が複数個形成されている。貫通
孔15を形成する方法としては、プレスなどによる機械
的パンチング、ヒドラジンなどの特殊溶剤などによる化
学的エッチング、またはレーザ切削などの従来から用い
られている方法を採用することができる。この貫通孔1
5の形成は液晶セル駆動用LSI30をフィルムキャリ
ア10に搭載する前後のどちらでもよい。また、前記貫
通孔15は、前述のように、のちに用いる加熱加圧ツー
ルが接触しない位置に形成し、その大きさは電極端子の
ピッチにもよるが5〜500μm程度の大きさが望まし
い。
The film carrier 10 is formed of an organic insulating film 11 made of a polyimide resin or a polyester resin and a conductive metal foil such as a copper foil or a copper-based alloy foil by photolithography. Wiring pattern 12 whose part is a wiring terminal 12a
And the alignment mark 13 formed of the same material as the wiring pattern 12 at the same time. Further, as shown in FIG. 1A, a plurality of through holes 15 are formed between the wiring terminals 12a of the organic insulating film 11 except for the strip-shaped portion P pressed by the heating and pressing tool. As a method of forming the through hole 15, a conventionally used method such as mechanical punching using a press, chemical etching using a special solvent such as hydrazine, or laser cutting can be employed. This through hole 1
5 may be formed before or after the liquid crystal cell driving LSI 30 is mounted on the film carrier 10. Further, as described above, the through hole 15 is formed at a position where a heating and pressing tool to be used later does not come into contact with the through hole 15. The size of the through hole 15 is preferably about 5 to 500 μm, although it depends on the pitch of the electrode terminals.

【0026】図1のフィルムキャリア10を用いて液晶
セルの基板端部に設けられた電極端子とフィルムキャリ
ア10の配線端子12a部とを接続する手順を、図1
(a)のA−A線断面の一部を示した図2と、図1
(a)のB−B線断面の一部を示した図3を用いて説明
する。
The procedure for connecting the electrode terminals provided at the end portions of the substrate of the liquid crystal cell and the wiring terminals 12a of the film carrier 10 using the film carrier 10 of FIG.
FIG. 2 showing a part of the cross section taken along the line AA of FIG.
It demonstrates using FIG. 3 which showed a part of BB sectional drawing of (a).

【0027】図2(a)に示されるように、異方性導電
膜40を液晶セル20の基板21の端部に設けられた電
極端子22が接触するように重ね、さらにフィルムキャ
リア10の配線パターン12が液晶セル20の電極端子
22と一致するよう、フィルムキャリア10と液晶セル
20の位置合わせをする。このとき、フィルムキャリア
10の配線端子12a間および液晶セル10の電極端子
22間に空隙部41が形成される。
As shown in FIG. 2A, the anisotropic conductive film 40 is stacked so that the electrode terminals 22 provided at the ends of the substrate 21 of the liquid crystal cell 20 are in contact with each other, and the wiring of the film carrier 10 is further provided. The film carrier 10 and the liquid crystal cell 20 are aligned so that the pattern 12 matches the electrode terminal 22 of the liquid crystal cell 20. At this time, voids 41 are formed between the wiring terminals 12a of the film carrier 10 and between the electrode terminals 22 of the liquid crystal cell 10.

【0028】ここで液晶セル20は通常の方法で製造さ
れるもので、たとえば電極膜のパターンや配向膜などが
設けられた2枚の絶縁性透明基板が一定間隙で貼着さ
れ、その間隙に液晶材料が封入されたものである。通常
は両透明基板の外側にさらに偏光板が配置される。
Here, the liquid crystal cell 20 is manufactured by a usual method. For example, two insulating transparent substrates provided with a pattern of an electrode film, an alignment film and the like are adhered at a constant gap, and in the gap. A liquid crystal material is encapsulated. Usually, a polarizing plate is further arranged outside the both transparent substrates.

【0029】つぎに、たとえばSUS304などの低炭
素鋼で形成されたような加熱加圧ツール50をフィルム
キャリア10の前述の貫通孔15が設けられていない帯
状部P内で有機絶縁性フィルム11の上から押し当て、
加熱加圧することにより異方性導電膜40を加熱硬化さ
せる。このとき端子間の空隙41内に異方性導電材料4
3が押し出されるが、加熱加圧ツール50の隣接部には
有機絶縁性フィルム11に貫通孔15が設けられている
ため、空隙部41内の空気は貫通孔15から外部へ放出
される。そのため、異方性導電材料43内に気泡ができ
ることはない。また、貫通孔15は加熱加圧ツール50
が当たる領域P(図1参照)の有機絶縁性フィルム11
には存在しないので、図2(c)に示されるように、加
熱加圧ツール50に流れ出した異方性導電材料が付着す
ることはない。また加熱加圧ツール50のない部分で
は、図3に示されるように、有機絶縁性フィルム11の
弾性力によりある程度圧接され各端子12a、22の接
続がえられるとともに、空隙部41内の空気は貫通孔1
5から放出され、異方性導電材料43の一部は貫通孔1
5内を這い上がるが、この部分には加熱加圧ツール50
は存在しないため、ツール50には付着せずむしろ接着
力が強化する。
Next, the heating / pressurizing tool 50 made of a low carbon steel such as SUS304 is used to remove the organic insulating film 11 in the strip portion P of the film carrier 10 where the above-mentioned through holes 15 are not provided. Press from above,
By heating and pressurizing, the anisotropic conductive film 40 is cured by heating. At this time, the anisotropic conductive material 4 is placed in the space 41 between the terminals.
3 is extruded, but since the through hole 15 is provided in the organic insulating film 11 adjacent to the heating / pressurizing tool 50, the air in the void 41 is discharged to the outside through the through hole 15. Therefore, no bubbles are formed in the anisotropic conductive material 43. In addition, the through hole 15 is a heating and pressing tool 50.
Organic insulating film 11 in area P (see FIG. 1)
2C, the anisotropic conductive material that has flowed out to the heating / pressurizing tool 50 does not adhere to the heating / pressurizing tool 50, as shown in FIG. Further, in the portion without the heating / pressurizing tool 50, as shown in FIG. 3, the terminals 12a and 22 are connected to each other by being pressed to some extent by the elastic force of the organic insulating film 11, and the air in the void 41 is Through hole 1
5, a part of the anisotropic conductive material 43 is emitted from the through hole 1
5 Crawl up, but in this part, heating and pressing tool 50
Since it does not exist, it does not adhere to the tool 50, but rather the adhesive force is strengthened.

【0030】[実施例2]図4は本発明のフィルムキャ
リアの他の実施例を示す図で、実施例1と同様に設けら
れる多数の貫通孔15のうち、左右両端部付近にそれぞ
れ1個ずつ他の貫通孔15と異なる形状の貫通孔15a
が形成されているもので、フィルムキャリア10の位置
合わせマークとするものである。前記位置決め用貫通孔
15aの形状は四角形状に形成されているが、この形状
にはとくに限定されず、三角形や他の多角形でもよく、
また同じ円形状でも大きさを変えることによっても位置
合わせマークとすることもできる。
[Embodiment 2] FIG. 4 is a view showing another embodiment of the film carrier of the present invention. Of the many through holes 15 provided in the same manner as in Embodiment 1, one is provided near each of the left and right ends. Through holes 15a each having a different shape from the other through holes 15
Is formed and serves as an alignment mark for the film carrier 10. Although the shape of the positioning through hole 15a is formed in a quadrangular shape, it is not particularly limited to this shape, and may be a triangle or another polygon.
Further, the alignment mark can be formed by changing the size of the same circular shape.

【0031】これにより、フィルムキャリア10の配線
端子12aと液晶セル20の電極端子22を位置合わせ
する際に、有機絶縁性フィルム11上の配線パターンの
ない面からでも両者の位置合わせが容易にでき、実体顕
微鏡や拡大鏡のような簡易光学機器でも容易にフィルム
キャリア10の位置合わせができるようになる。
As a result, when the wiring terminals 12a of the film carrier 10 and the electrode terminals 22 of the liquid crystal cell 20 are aligned with each other, both can be easily aligned with each other even from the surface on the organic insulating film 11 where there is no wiring pattern. The position of the film carrier 10 can be easily adjusted even with a simple optical device such as a stereoscopic microscope or a magnifying glass.

【0032】[実施例3]図5は本発明のフィルムキャ
リア10のさらに他の実施例を示す図で、実施例1と同
様に設けられる多数の貫通孔15のうち、左右両端部付
近のそれぞれ1個の貫通孔15a内に位置合わせマーク
13が突出して設けられていることに特徴がある。この
貫通孔15a内に位置合わせマーク13が突出するよう
に設ける方法としては、たとえば有機絶縁性フィルム1
1に所定の貫通孔15、15aを形成したのち、配線パ
ターン12および配線端子12aを形成するため、銅な
どの金属材料をスパッタ法または蒸着法などにより全面
に設け、フォトグラフィ技術によるパターニングする
が、この際位置合わせマーク13をその一部が貫通孔1
5a内に突出するようにパターニングすることにより配
線パターン12と同時に位置合わせマーク13を形成す
ることができる。
[Embodiment 3] FIG. 5 is a view showing still another embodiment of the film carrier 10 of the present invention. Of a large number of through holes 15 provided in the same manner as in Embodiment 1, the vicinity of each of the left and right ends is shown. It is characterized in that the alignment mark 13 is provided so as to project in one through hole 15a. As a method of providing the alignment mark 13 so as to project into the through hole 15a, for example, the organic insulating film 1
In order to form the wiring pattern 12 and the wiring terminal 12a after forming the predetermined through holes 15 and 15a in 1, the metal material such as copper is provided on the entire surface by the sputtering method or the vapor deposition method and is patterned by the photography technique. At this time, part of the alignment mark 13 is the through hole 1.
The alignment mark 13 can be formed at the same time as the wiring pattern 12 by patterning so as to project into the 5a.

【0033】本実施例によれば空気抜き用の貫通孔を利
用して位置合わせマークを形成しているため、フィルム
キャリア10の裏面側から液晶セルの電極端子群などと
の位置合わせを行うばあいに極めて容易に行うことがで
きる。
According to the present embodiment, since the alignment mark is formed by utilizing the through hole for venting air, when the alignment with the electrode terminal group of the liquid crystal cell is performed from the back side of the film carrier 10. It can be done very easily.

【0034】[0034]

【発明の効果】以上説明したとおり、本発明のフィルム
キャリアによれば、硬化した異方性導電膜には気泡が残
留しなくなり端子間接続の絶縁性および接着強度の信頼
性が向上する。また一部の異方性導電材料が加熱加圧ツ
ールのない部分で貫通孔にせりあがることにより、接続
強度が一層増大するとともに、異方性導電材料が加熱加
圧ツールに付着せず、作業毎に加熱加圧ツールをクリー
ニングする必要がないため、生産性が大幅に向上する。
As described above, according to the film carrier of the present invention, air bubbles do not remain in the cured anisotropic conductive film, and the reliability of the insulation between terminals and the adhesive strength are improved. In addition, some anisotropic conductive material is raised in the through hole in the part where there is no heating / pressurizing tool, which further increases the connection strength and the anisotropic conductive material does not adhere to the heating / pressurizing tool. Since it is not necessary to clean the heating / pressurizing tool every time, productivity is greatly improved.

【0035】また、フィルムキャリアに貫通孔が多数設
けられていることにより、フィルムキャリアを剥離する
際、剥離用の溶剤を容易に異方性導電材料内に染み込ま
せることができる。
Further, since the film carrier is provided with a large number of through holes, the solvent for peeling can be easily impregnated into the anisotropic conductive material when the film carrier is peeled off.

【0036】さらに、本発明により設けられた貫通孔を
利用して貫通孔自身を位置合わせマークとし、または貫
通孔内に位置合わせマークを突出させることにより、フ
ィルムキャリアと液晶セルの各端子同士を位置合わせ
を、有機絶縁性フィルム上の金属導体パターンのない裏
面側からでも容易に位置合わせすることができるという
副次効果も生じる。
Further, by utilizing the through hole provided by the present invention as the alignment mark itself or by projecting the alignment mark into the through hole, the terminals of the film carrier and the liquid crystal cell are connected to each other. There is also a secondary effect that the alignment can be easily performed even from the back surface side on the organic insulating film where there is no metal conductor pattern.

【図面の簡単な説明】[Brief description of drawings]

【図1】 本発明のフィルムキャリアの一実施例を示す
説明図である。
FIG. 1 is an explanatory view showing an example of a film carrier of the present invention.

【図2】 本発明のフィルムキャリアの一実施例の配線
端子部の接続工程を示す図1のA−A線断面説明図であ
る。
FIG. 2 is a cross-sectional view taken along the line AA of FIG. 1, showing a step of connecting wiring terminal portions of an example of the film carrier of the present invention.

【図3】 本発明のフィルムキャリアの一実施例の配線
端子部の接続工程を示す図1のB−B線断面説明図であ
る。
FIG. 3 is a cross-sectional view taken along the line BB of FIG. 1, showing a step of connecting wiring terminal portions of an example of the film carrier of the present invention.

【図4】 本発明のフィルムキャリアの他の実施例の平
面説明図である。
FIG. 4 is a plan view of another embodiment of the film carrier of the present invention.

【図5】 本発明のフィルムキャリアのさらに他の実施
例の平面説明図である。
FIG. 5 is a plan view of still another embodiment of the film carrier of the present invention.

【図6】 従来のフィルムキャリアの一例の平面説明図
である。
FIG. 6 is a plan view illustrating an example of a conventional film carrier.

【図7】 図6の配線端子部の接続工程を説明する図で
ある。
FIG. 7 is a diagram illustrating a connecting step of the wiring terminal portion of FIG.

【図8】 従来のフィルムキャリアの一例の平面説明図
である。
FIG. 8 is an explanatory plan view of an example of a conventional film carrier.

【図9】 図8の配線端子部の接続工程を説明する図で
ある。
FIG. 9 is a diagram illustrating a connecting step of the wiring terminal portion of FIG.

【符号の説明】[Explanation of symbols]

10 フィルムキャリア、11 有機絶縁膜、12 配
線パターン、12a配線端子、15 貫通孔、15a
貫通孔、20 液晶セル、22 電極端子、30 LS
I、40 異方性導電膜、42 気泡、50 加熱加圧
ツール。
10 film carrier, 11 organic insulating film, 12 wiring pattern, 12a wiring terminal, 15 through hole, 15a
Through hole, 20 liquid crystal cell, 22 electrode terminal, 30 LS
I, 40 anisotropic conductive film, 42 bubbles, 50 heating and pressing tool.

───────────────────────────────────────────────────── フロントページの続き (72)発明者 安達 光平 熊本県菊池郡西合志町御代志997番地 株 式会社アドバンスト・ディスプレイ内 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Kohei Adachi, 997 Miyoshi, Nishigoshi-cho, Kikuchi-gun, Kumamoto Prefecture Advanced Display Company

Claims (5)

【特許請求の範囲】[Claims] 【請求項1】 有機絶縁性フィルムに複数の配線パター
ンが形成され、該複数の配線パターンの端部がそれぞれ
配線端子として整列し、該配線端子の群が他の電極端子
群と電気的に接続されうるフィルムキャリアであって、
前記配線端子の整列方向に沿った帯状部を除き、該帯状
部の両側で、かつ、前記配線端子の間隙の前記有機絶縁
性フィルムに貫通孔が設けられてなるフィルムキャリ
ア。
1. A plurality of wiring patterns are formed on an organic insulating film, the ends of the plurality of wiring patterns are aligned as wiring terminals, and the wiring terminal group is electrically connected to another electrode terminal group. A film carrier that can be
A film carrier in which through holes are provided on both sides of the strip-shaped portion and in the organic insulating film in the gap between the wiring terminals, except for the strip-shaped portion along the alignment direction of the wiring terminals.
【請求項2】 前記貫通孔のうち前記配線端子の整列方
向の両端部近傍のそれぞれ1個が他の貫通孔と異なる形
状または大きさに形成されてなる請求項1記載のフィル
ムキャリア。
2. The film carrier according to claim 1, wherein one of the through holes in the vicinity of both ends in the alignment direction of the wiring terminals is formed in a shape or size different from other through holes.
【請求項3】 前記フィルムキャリアに、該フィルムキ
ャリアの位置合わせマークが前記貫通孔の1個の内側に
突出するように形成されてなる請求項1記載のフィルム
キャリア。
3. The film carrier according to claim 1, wherein the film carrier has alignment marks formed so as to project inside one of the through holes.
【請求項4】 電極パターンが形成された2枚の絶縁性
透明基板により液晶材料が挟持され、前記電極パターン
の電極端子群が端部に設けられた液晶セルと、該液晶セ
ルを駆動する駆動回路とからなり、前記液晶セルの電極
端子群と前記駆動回路の端子とが請求項1記載のフィル
ムキャリアにより接続されてなる液晶表示素子。
4. A liquid crystal cell in which a liquid crystal material is sandwiched between two insulating transparent substrates having an electrode pattern formed therein, and an electrode terminal group of the electrode pattern is provided at an end portion, and a drive for driving the liquid crystal cell. A liquid crystal display device comprising a circuit, wherein the electrode terminal group of the liquid crystal cell and the terminal of the drive circuit are connected by the film carrier according to claim 1.
【請求項5】 電極パターンが形成された2枚の絶縁性
透明基板により液晶材料が挟持された液晶セルの電極端
子群と、他端部に駆動回路を接続しうるとともに一端部
に配線端子の群を有する複数の配線パターンが有機絶縁
性フィルムに形成されたフィルムキャリアの該配線端子
群とを電気的に接続する液晶表示の製法であって、前記
有機絶縁性フィルムに前記配線端子が整列する方向の帯
状部を除き該帯状部の両側の前記配線端子間に貫通孔が
設けられたフィルムキャリアを前記配線端子群の各端子
が前記液晶セルの電極端子群と各端子と一致するように
異方性導電膜を介して重ね合わせ、前記貫通孔が設けら
れていない前記帯状部分に加熱加圧ツールを当てつけて
接着するとともに前記電極端子群と前記配線端子群とを
電気的に接続することを特徴とする液晶表示素子の製
法。
5. An electrode terminal group of a liquid crystal cell in which a liquid crystal material is sandwiched between two insulating transparent substrates having an electrode pattern formed thereon, a drive circuit can be connected to the other end, and a wiring terminal can be connected to one end. A method for producing a liquid crystal display in which a plurality of wiring patterns having groups are electrically connected to the wiring terminal group of a film carrier formed on an organic insulating film, wherein the wiring terminals are aligned with the organic insulating film. The film carrier in which through holes are provided between the wiring terminals on both sides of the strip-shaped portion except the strip-shaped portion in the direction so that each terminal of the wiring terminal group and the electrode terminal group of the liquid crystal cell match each terminal. The electrode terminals and the wiring terminals are electrically connected to each other by stacking them via a conductive conductive film, applying a heating and pressing tool to the band-shaped portion where the through hole is not provided and adhering it. And a method for manufacturing a liquid crystal display device, characterized by:
JP11275594A 1994-05-26 1994-05-26 Film carrier, liquid crystal display device equipped with it and manufacture thereof Pending JPH07321158A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11275594A JPH07321158A (en) 1994-05-26 1994-05-26 Film carrier, liquid crystal display device equipped with it and manufacture thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11275594A JPH07321158A (en) 1994-05-26 1994-05-26 Film carrier, liquid crystal display device equipped with it and manufacture thereof

Publications (1)

Publication Number Publication Date
JPH07321158A true JPH07321158A (en) 1995-12-08

Family

ID=14594741

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11275594A Pending JPH07321158A (en) 1994-05-26 1994-05-26 Film carrier, liquid crystal display device equipped with it and manufacture thereof

Country Status (1)

Country Link
JP (1) JPH07321158A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019008106A (en) * 2017-06-23 2019-01-17 三菱電機株式会社 Array substrate and display panel including array substrate
US11495774B2 (en) 2020-01-22 2022-11-08 Seiko Epson Corporation Electro-optical device and electronic apparatus

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019008106A (en) * 2017-06-23 2019-01-17 三菱電機株式会社 Array substrate and display panel including array substrate
US11495774B2 (en) 2020-01-22 2022-11-08 Seiko Epson Corporation Electro-optical device and electronic apparatus

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