JPH0731929B2 - Mounting structure for heat generating equipment - Google Patents

Mounting structure for heat generating equipment

Info

Publication number
JPH0731929B2
JPH0731929B2 JP1161255A JP16125589A JPH0731929B2 JP H0731929 B2 JPH0731929 B2 JP H0731929B2 JP 1161255 A JP1161255 A JP 1161255A JP 16125589 A JP16125589 A JP 16125589A JP H0731929 B2 JPH0731929 B2 JP H0731929B2
Authority
JP
Japan
Prior art keywords
heat
mounting plate
plate
mounting
attached
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1161255A
Other languages
Japanese (ja)
Other versions
JPH0355705A (en
Inventor
宏之 高見
孝 高田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Publication of JPH0355705A publication Critical patent/JPH0355705A/en
Publication of JPH0731929B2 publication Critical patent/JPH0731929B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Circuit Arrangement For Electric Light Sources In General (AREA)
  • Details Of Indoor Wiring (AREA)

Description

【発明の詳細な説明】 [産業上の利用分野] 本発明は、壁等の造営面に埋め込んで取り付ける調光ス
イッチ等の放熱を要する発熱機器の取付構造に関するも
のである。
Description: TECHNICAL FIELD The present invention relates to a mounting structure for a heat generating device such as a dimmer switch which is embedded in a construction surface such as a wall and requires heat radiation.

[従来の技術] 発熱機器としては、半導体素子の導通角を制御すること
により、商用電源の位相制御を行って白熱灯の調光を行
う調光スイッチがあり、この調光スイッチは壁に埋設し
て取り付けられる。以下、上記調光スイッチを壁に埋設
する構造について第7図及び第8図に従って説明する。
この調光スイッチは、第8図に示すように、壁10に穿設
された埋込穴11に後述する取付板2等を用いて埋設して
取り付けるようになっている。この調光スイッチでは、
第7図に示す上面が開口する箱状のボディ1内に位相制
御回路等を構成する回路部品が収められる。ここで、位
相制御用の半導体素子(図示せず)は発熱するので、こ
の半導体素子には放熱のために金属製の放熱板6を取り
付けてある。このボディ1は板状の金属製の取付板2の
背面側にねじ止めして取り付けられる。このとき、ボデ
ィ1の開口は取付板2により略密閉状態に閉塞され、外
部からの塵などが侵入しないようにしてある。なお、こ
の取付板2には放熱板6もねじ止めして、この取付板2
からも放熱を行うようにしてある。ここで、取付板2に
放熱効果を上げるために黒色塗装などの処理を施す場合
もある。また、ボディ1の背面には電源線等の配線を導
入する穴(図示せず)を穿孔してあり、上記位相制御回
路に上記穴を通じて配線を接続する。この取付板2の前
面側には表カバー3がねじ止めされ、取付板2及び表カ
バー3に形成したスライド孔9,12を通して、調光用の可
変抵抗器の操作片7を突出させ、この操作片7の表カバ
ー3から突出する部分に操作つまみ8を固着するように
してある。上記取付板2は、壁10との間に矩形枠状のプ
レート枠4を挟み、取付板2とプレート枠4との両端部
に形成された透孔2a,4aを通して取付ねじ13を壁10に螺
合して取り付けられる。そして、表カバー3を挿通する
開口が形成された表面プレート5を前面側から取付板2
に被着する。ここで、表面プレート5は適宜の嵌合手段
によってプレート枠4に被着される。なお、表面プレー
ト5は取付板2と直接に接触しないようにしてある。
[Prior Art] As a heat generating device, there is a dimmer switch that controls the phase of a commercial power source to control the incandescent lamp by controlling the conduction angle of a semiconductor element. This dimmer switch is embedded in a wall. Then installed. The structure of embedding the light control switch in a wall will be described below with reference to FIGS. 7 and 8.
As shown in FIG. 8, this dimmer switch is designed to be embedded and mounted in an embedding hole 11 formed in a wall 10 by using a mounting plate 2 and the like described later. With this dimmer switch,
Circuit parts constituting a phase control circuit and the like are housed in a box-shaped body 1 having an open upper surface shown in FIG. Here, since the semiconductor element (not shown) for phase control generates heat, a metal heat dissipation plate 6 is attached to this semiconductor element for heat dissipation. The body 1 is attached by screwing to the back side of a plate-shaped metal mounting plate 2. At this time, the opening of the body 1 is closed in a substantially sealed state by the mounting plate 2 so that dust and the like from the outside does not enter. It should be noted that the heat dissipation plate 6 is also screwed to the mounting plate 2 so that the mounting plate 2
It is also designed to radiate heat. Here, the mounting plate 2 may be subjected to a treatment such as black coating in order to enhance the heat radiation effect. Further, a hole (not shown) for introducing a wiring such as a power supply line is bored on the back surface of the body 1, and the wiring is connected to the phase control circuit through the hole. The front cover 3 is screwed to the front side of the mounting plate 2, and the operation piece 7 of the variable resistor for dimming is projected through the slide holes 9 and 12 formed in the mounting plate 2 and the front cover 3. The operation knob 8 is fixed to the portion of the operation piece 7 protruding from the front cover 3. The mounting plate 2 has a rectangular frame-shaped plate frame 4 sandwiched between the wall 10 and the mounting screws 13 on the wall 10 through through holes 2a and 4a formed at both ends of the mounting plate 2 and the plate frame 4. It is attached by screwing. Then, the front surface plate 5 having an opening through which the front cover 3 is inserted is attached to the mounting plate 2 from the front side.
To be attached to. Here, the surface plate 5 is attached to the plate frame 4 by appropriate fitting means. The surface plate 5 does not come into direct contact with the mounting plate 2.

[発明が解決しようとする課題] 上述の調光スイッチを壁10に取り付ける場合に用いられ
る取付板2は、放熱板としての機能を持つため、位相制
御用の半導体素子の放熱に関しては一応の効果が得られ
る。しかしながら、このように取付板2を放熱のために
用いると、取付板2の発熱によって表カバー3や表面プ
レート5の表面温度が上昇してしまう。つまり、手の触
れる部分から見た場合には十分な放熱対策が為されてい
るとは言い難いものであった。
[Problems to be Solved by the Invention] Since the mounting plate 2 used when mounting the above-mentioned dimmer switch on the wall 10 has a function as a heat radiating plate, it has a temporary effect on the heat radiation of the semiconductor element for phase control. Is obtained. However, when the mounting plate 2 is used for heat dissipation in this way, the surface temperature of the front cover 3 and the surface plate 5 rises due to the heat generated by the mounting plate 2. In other words, it was hard to say that sufficient heat dissipation measures were taken when viewed from the part touched by the hand.

本発明は上述の点に鑑みて為されたものであり、その目
的とするところは、手の触れる部分の温度上昇を来すこ
となく、発熱部品の放熱を効果的に行うことができる発
熱機器の取付構造を提供することにある。
The present invention has been made in view of the above points, and an object of the present invention is to provide a heat-generating device that can effectively dissipate heat from a heat-generating component without causing a rise in temperature of a portion touched by a hand. It is to provide a mounting structure.

[課題を解決するための手段] 上記目的を達成するために、本発明は取付板を複数枚の
金属板で構成すると共に、ボディに直接に被着される金
属板と他の金属板との間に空隙を設け、この空隙を中央
にして各金属板を積層してある。ここで、最も前面側の
金属板にのみ上記カバーを取り付けると共に、ボディに
直接に被着される最も背面側の金属板にのみボディ及び
発熱部品を取り付けると、さらに良好は効果が期待でき
る。
[Means for Solving the Problems] In order to achieve the above object, the present invention comprises a mounting plate composed of a plurality of metal plates, and a metal plate directly attached to a body and another metal plate. A space is provided between the metal plates, and the metal plates are laminated with the space at the center. Here, if the cover is attached only to the frontmost metal plate and the body and the heat-generating component are attached only to the rearmost metal plate that is directly attached to the body, a better effect can be expected.

[作用] 本発明は、上述のように取付板を複数枚の金属板で構成
すると共に、ボディに直接に被着される金属板と他の金
属板との間に空隙を設け、この空隙を中央にして各金属
板を積層することにより、発熱部品からの熱を放熱する
ボディに直接に被着される金属板からの熱を空隙に放出
できるようにして、発熱部品の熱が良好に放熱できるよ
うにすると共に、ボディ側の金属板と他の金属板との間
に形成される空隙が断熱層として働くようにして、カバ
ーに発熱部品の熱が及びにくいようにしたものである。
[Operation] In the present invention, the mounting plate is composed of a plurality of metal plates as described above, and a gap is provided between the metal plate directly attached to the body and another metal plate, and this gap is formed. By stacking each metal plate in the center, it is possible to radiate the heat from the heat-generating components into the air gap so that the heat from the metal plates directly attached to the body can be radiated. In addition to this, the gap formed between the metal plate on the body side and the other metal plate acts as a heat insulating layer so that heat of the heat generating component is less likely to reach the cover.

なお、最も前面側の金属板にのみ上記カバーを取り付け
ると共に、ボディに直接に被着される最も背面側の金属
板にのみボディ及び発熱部品を取り付けるようにする
と、発熱部品からの熱が取付板を介して表カバーに伝導
されることを極力少なくでき、表カバーの温度上昇をさ
らに少なくすることができる。
If the cover is attached only to the frontmost metal plate, and the body and heat-generating components are attached only to the rearmost metal plate that is directly attached to the body, the heat from the heat-generating components will be removed. It is possible to minimize the conduction to the front cover via the cover and further reduce the temperature rise of the front cover.

[実施例1] 第1図及び第2図に本発明の一実施例を示す。本実施例
では取付板2を3重構造としてあり、従来例で説明した
と同一形状の2枚の取付板21,23の間に枠状の取付板22
を挟んだ構造となっている。そして、取付板21,23の表
面プレート5の内面に対応する両端部に夫々2個の透孔
2bを穿孔してある。なお、第1図においては以下の説明
を分かりやすくするために、透孔2b及びスライド孔9だ
けを図示してあるが、勿論ボディ1、表カバー3の取付
孔、及び壁10への取付孔2a等も穿孔してある。また、積
層した取付板21〜23は表面プレート5内に収まる厚みに
形成してある。
Example 1 FIGS. 1 and 2 show an example of the present invention. In this embodiment, the mounting plate 2 has a triple structure, and a frame-shaped mounting plate 2 2 is provided between two mounting plates 2 1 and 2 3 having the same shape as described in the conventional example.
It has a structure sandwiching. Then, two through holes are provided at both ends of the mounting plates 2 1 , 2 3 corresponding to the inner surface of the surface plate 5.
2b is perforated. In FIG. 1, only the through hole 2b and the slide hole 9 are shown for easy understanding of the following description, but of course the body 1, the mounting hole for the front cover 3 and the mounting hole for the wall 10 are shown. 2a etc. are also perforated. The mounting plate 2 1 to 2 3 laminated is is formed to a thickness falling within the faceplate 5.

本実施例では、取付板21〜23が積層構造となっている
が、取付は従来例と同様にして行う。ここで、ボディ1
や表カバー3等は基本的には取付枠21を主体として第8
図の場合と同様に取り付けてある。このようにして、取
付板21〜23を積層すると、第2図に示すように取付板
21,23との間に取付板22によって空隙14が形成され、ま
た表面プレート5と取付板23との間の隙間に連通する透
孔2bを形成してあるので、例えば第2図の矢印で示すよ
うに空気が空隙14から透孔2b、そして表面プレート5の
表カバー3やプレート枠4との間にある小さい間隙を通
して流れる。また、取付板22が枠状のため、取付板21,2
3の対向する面が放熱のために有効に使われ、従来例の
1枚だけからなる取付板に比べ、2倍の放熱面積(表面
積を)確保することができ、半導体の発する熱を効率的
に放熱することができる。しかも、本実施例の場合には
取付板23が表カバー3や表面プレート4に直接に熱が加
わることを防止するように働く(つまり空隙14が断熱層
として働く)ため、表面カバー3や表面プレート4の温
度が上昇することを極力抑えることができる。なお、取
付板21は従来例の取付板2と同様にボディ1の開口に略
密閉状態で被着されるものであるので、外部からの防塵
効果に関しては従来例と殆ど同程度の良好な効果が得ら
れる。さらに、取付板21に形成された透孔2bを通して埋
込穴11内にも空気を流すようにすれば、さらに良好な放
熱効果が期待できる。
In this embodiment, the mounting plate 2 1 to 2 3 is a laminated structure, the mounting is performed similarly to the conventional example. Where body 1
The front cover 3 and the like are basically the mounting frame 2 1
It is attached as in the case of the figure. Thus, when stacking the mounting plate 2 1 to 2 3, the mounting plate as shown in Figure 2
2 1, 2 3 void 14 by a mounting plate 2 2 between are formed, and since is formed a through hole 2b which communicates with the gap between the surface plate 5 and the mounting plate 2 3, for example, the second As shown by the arrow in the figure, air flows from the void 14 through the through hole 2b and a small gap between the front cover 3 of the surface plate 5 and the plate frame 4. Also, since the mounting plate 2 2 is frame-shaped, the mounting plates 2 1 , 2
The opposing surfaces of 3 are effectively used for heat dissipation, and the heat dissipation area (surface area) can be secured twice as large as that of the conventional mounting plate consisting of only one sheet, and the heat generated by the semiconductor can be efficiently used. Can dissipate heat. Moreover, (acting as i.e. gap 14 thermal insulation layer) directly acts to prevent the heat is applied mounting plate 2 3 Table cover 3 and the surface plate 4 in the case of this embodiment, the surface cover 3 Ya The temperature rise of the surface plate 4 can be suppressed as much as possible. Since the mounting plate 2 1 is intended to be deposited in a substantially sealed state in the same manner as the opening of the body 1 and the mounting plate 2 of the prior art, good almost the same level as the conventional example with respect to the dust-proof effect of the external The effect is obtained. Furthermore, if to flow air in the embedding hole 11 through the mounting plate 2 1 to the formed hole 2b, it can be expected even better heat dissipation effect.

[実施例2] 第3図乃至第5図に本発明の他の実施例を示す。本実施
例では、取付板22,23を一体に形成したと同様の取付板2
4と取付板21との2重構造にしたものである。本実施例
の取付板24は展開すると第4図(b)に示す形状にな
り、両側に形成された耳片2cを180゜内側に折り曲げる
と共に、両端部を下面が折曲された耳片2cの下面と一致
するように下方に折り曲げ、両端の折曲部に透孔2bを形
成してある。従って、この取付板24を取付板21に積層す
ると、取付板21との間に第1の実施例の取付板22を介装
した場合と略同様の空隙14が形成されることになる。従
って、本実施例でも第1の実施例と同様の効果が得られ
る。
[Embodiment 2] FIGS. 3 to 5 show another embodiment of the present invention. In this embodiment, the same mounting plate 2 2 and 2 3 as the mounting plate 2 2 is formed integrally.
4 and is obtained by the double structure of the mounting plate 2 1. Mounting plate 2 4 of the present embodiment becomes the shape shown in FIG. 4 Expand (b), with bending the lugs 2c formed on both sides on the inside 180 °, ear piece both ends underside is bent It is bent downward so as to coincide with the lower surface of 2c, and through holes 2b are formed in the bent portions at both ends. Accordingly, when laminating the mounting plate 2 4 to the mounting plate 2 1, the mounting plate 2 2 almost the same void 14 as when interposed in the first embodiment is formed between the mounting plate 2 1 become. Therefore, in this embodiment, the same effect as that of the first embodiment can be obtained.

本実施例と従来品との放熱効果を比較したところ、ボデ
ィ1の内部温度においては5deg前後改善され、最も外側
の表カバー3においては0.5〜1.5deg前後の改善が得ら
れた。なお、取付板21としては表面積が約50cm2のもの
を用いて試験を行った。
Comparing the heat dissipation effect between this embodiment and the conventional product, the internal temperature of the body 1 was improved by about 5 deg, and the outermost front cover 3 was improved by about 0.5 to 1.5 deg. Incidentally, the surface area as a mounting plate 2 1 is tested using a of about 50 cm 2.

[実施例3] 第6図に本発明のさらに他の実施例を示す。本実施例で
は、表カバー3を取付板23のみにねじ16でねじ止めする
と共に、ボディ1及び発熱部品は取付板21のみにねじ15
でねじ止めしてある。これは表カバー3と発熱部品とが
最も間接的にしか接触しないようにして、発熱部分から
の熱が表カバー3等に極力及ばないようにしてある。従
って、表カバー3の温度上昇をさらに少なくすることが
できる。なお、このように表カバー3を取付板23にのみ
固定するようにすれば、ボディ1を取付板21,24を貫い
てねじ止めするようにしてもほぼ同程度の効果が期待で
きる。
[Embodiment 3] FIG. 6 shows still another embodiment of the present invention. In this embodiment, the screw 15 the front cover 3 with screwing the mounting plate 2 3 only to the screw 16, the body 1 and the heat-generating component is only the mounting plate 2 1
It is screwed with. This is so that the front cover 3 and the heat-generating component are most indirectly contacted with each other so that the heat from the heat-generating portion does not reach the front cover 3 and the like as much as possible. Therefore, the temperature rise of the front cover 3 can be further reduced. Incidentally, if so only fixed in this way the front cover 3 to the mounting plate 2 3, can be expected about the same extent be screwed body 1 through the mounting plate 2 1, 2 4 .

[発明の効果] 本発明は上述のように、取付板を複数枚の金属板を構成
すると共に、ボディに直接に被着される金属板と他の金
属板との間に空隙を設け、この空隙を中央にして各金属
板を積層すしてあるので、発熱部品からの熱を放熱する
ボディに直接に被着される金属板からの熱を空隙に放出
でき、発熱部品の熱が良好に放熱でき、しかもボディ側
の金属板と他の金属板との間に形成される空隙が断熱層
として働くので、手が触れる部分であるカバーに発熱部
品の熱が及びにくくなる。
[Advantages of the Invention] As described above, the present invention configures a plurality of metal plates as the mounting plate and provides a gap between the metal plate directly attached to the body and another metal plate. Since each metal plate is laminated with the air gap in the center, the heat from the metal plate that directly adheres to the body that radiates the heat from the heat generating component can be radiated to the air gap, and the heat of the heat generating component can be radiated well. In addition, since the gap formed between the metal plate on the body side and the other metal plate acts as a heat insulating layer, heat of the heat generating component is less likely to reach the cover, which is the part touched by the hand.

また、最も前面側の金属板にのみ上記カバーを取り付け
ると共に、ボディに直接に被着される最も背面側の金属
板にのみボディ及び発熱部品を取り付けるようにする
と、発熱部品からの熱が取付板を介して表カバーに伝導
されることを極力少なくでき、表カバーの温度上昇をさ
らに少なくすることができる。
Also, if the above-mentioned cover is attached only to the frontmost metal plate and the body and heat-generating components are attached only to the rearmost metal plate that is directly adhered to the body, heat from the heat-generating components will be removed. It is possible to minimize the conduction to the front cover via the cover and further reduce the temperature rise of the front cover.

【図面の簡単な説明】[Brief description of drawings]

第1図は本発明の一実施例の要部構成の分解斜視図、第
2図は同上の壁面取付時の断面図、第3図は他の実施例
の要部構成の分解斜視図、第4図(a),(b)は同上
の一方の取付板の斜視図及び展開図、第5図は同上の壁
面取付時の断面図、第6図はさらに他の実施例の壁面取
付時の断面図、第7図は従来例の分解斜視図、第8図は
同上の壁面取付時の断面図である。 1はボディ、21〜24は取付板、3は表カバー、5は表面
プレート、14は空隙である。
FIG. 1 is an exploded perspective view of a main part configuration of an embodiment of the present invention, FIG. 2 is a sectional view of the same when a wall is mounted, and FIG. 3 is an exploded perspective view of a main part configuration of another embodiment. 4 (a) and 4 (b) are a perspective view and a developed view of one mounting plate of the same as above, FIG. 5 is a sectional view of the same as above when the wall is mounted, and FIG. A sectional view, FIG. 7 is an exploded perspective view of a conventional example, and FIG. 8 is a sectional view of the same with a wall mounted. 1 the body, 21 to 24 is mounting plate 3 front cover, 5 the surface plate, 14 is a gap.

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】発熱機器を構成する部品を収納する前面が
開口する箱状のボディと、このボディの開口に略密着状
態で被着されると共に、発熱部品の発する熱を放熱する
金属製の取付板と、この取付板の前面側に取り付けられ
るカバーとからなり、上記取付板によって造営面に形成
された埋込穴内にボディを収納して取り付ける発熱機器
の取付構造において、上記取付板を複数枚の金属板で構
成すると共に、ボディの開口に略密着状態で被着される
金属板と他の金属板との間に空隙を設け、この空隙を中
央にして各金属板を積層して成る発熱機器の取付構造。
1. A box-shaped body having an open front surface for housing components constituting a heat-generating device, and a metal body which is attached to the opening of the body in a substantially close contact state and radiates heat generated by the heat-generating component. A mounting structure for a heat-generating device, comprising a mounting plate and a cover mounted on the front side of the mounting plate, wherein the body is housed and mounted in an embedded hole formed on the construction surface by the mounting plate. It is composed of a single metal plate, and a gap is provided between the metal plate which is adhered to the opening of the body in a substantially close contact state with another metal plate, and the metal plates are laminated with the gap as the center. Mounting structure for heat generating equipment.
【請求項2】最も前面側の金属板にのみ上記カバーを取
り付けると共に、ボディに直接に被着される最も背面側
の金属板にのみボディ及び発熱部品を取り付けて成る請
求項1記載の発熱機器の取付構造。
2. The heat generating device according to claim 1, wherein the cover is attached only to the frontmost metal plate, and the body and the heat generating component are attached only to the rearmost metal plate directly attached to the body. Mounting structure.
JP1161255A 1989-04-15 1989-06-24 Mounting structure for heat generating equipment Expired - Lifetime JPH0731929B2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP1-95512 1989-04-15
JP9551289 1989-04-15

Publications (2)

Publication Number Publication Date
JPH0355705A JPH0355705A (en) 1991-03-11
JPH0731929B2 true JPH0731929B2 (en) 1995-04-10

Family

ID=14139634

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1161255A Expired - Lifetime JPH0731929B2 (en) 1989-04-15 1989-06-24 Mounting structure for heat generating equipment

Country Status (1)

Country Link
JP (1) JPH0731929B2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012004017A (en) * 2010-06-18 2012-01-05 Panasonic Electric Works Co Ltd Light control device
JP2021145034A (en) * 2020-03-11 2021-09-24 パナソニックIpマネジメント株式会社 Electrical apparatus

Also Published As

Publication number Publication date
JPH0355705A (en) 1991-03-11

Similar Documents

Publication Publication Date Title
JP2004274018A (en) Wiring-board housing device and discharge-lamp lighting device
JP4006795B2 (en) Information processing apparatus having heat dissipation structure
JP2001168560A (en) Electronic circuit unit
JP4091568B2 (en) Electronic control equipment for engine control
JPH0731929B2 (en) Mounting structure for heat generating equipment
JPH10117078A (en) Heat-dissipating structure for electronic device
JP3680362B2 (en) Electronic component unit
JPH10173371A (en) Housing structure of electronic apparatus
JP2007109991A (en) Control device
JP4309189B2 (en) Portable electronic equipment
JPH01264513A (en) Dimmer
JPH11307302A (en) Non-thermal conducting resistor for servo amplifier and the servo amplifier equipped with the resistor
JPH062313Y2 (en) Radiator for dimmer
JPH08329731A (en) Electric equipment
JPH09114552A (en) Electronic device
JP2723332B2 (en) Heat sink for integrated circuits
JPH04188796A (en) Controller
JP2604139B2 (en) Dimmer
JP3079409B2 (en) Heat dissipation structure of lighting equipment controller
JP3121381B2 (en) Downlight
JP2001217575A (en) Electric apparatus
JP2003258465A (en) Electronic circuit unit
JP2730886B2 (en) Dimmer
JPH09321467A (en) Heat radiating structure for heat generating electronic part
JPH067595Y2 (en) Heater unit

Legal Events

Date Code Title Description
FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20080410

Year of fee payment: 13

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20090410

Year of fee payment: 14

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20090410

Year of fee payment: 14

S533 Written request for registration of change of name

Free format text: JAPANESE INTERMEDIATE CODE: R313533

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20090410

Year of fee payment: 14

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20100410

Year of fee payment: 15

EXPY Cancellation because of completion of term
FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20100410

Year of fee payment: 15