JPH07302975A - Treatment method of terminal of circuit board - Google Patents

Abstract

PURPOSE:To form a bent contact part, a contact protruding part or the like easily at the terminal part of a circuit board. CONSTITUTION:The terminal part of a thin circuit board is bent and molded, or a protruding part for contact, a recessed part for contact or a coupling hole is formed in a circuit at the terminal part. After that, the surface of the circuit at the terminal part is plated with a thick-film conductive plated layer 9, and circuits for contact are formed. A thin conductive plate in which a thin-film copper foil 2 has been fixed and bonded to the surface of an insulating resin sheet 1 is coated with a plating resist, a part in which a circuit is to be formed is plated with a thick-film conductive plated layer 9, the plating resist is removed, and the copper foil in parts other than the part in which the circuit is to be formed is etched and removed. At this time, before the part in which the circuit is to be formed is plated with the thick-film conductive plated layer, a terminal part 7 is bent and molded. The terminal part 7 is bent and molded at 90 deg. or 180 deg.. In addition, before the conductive plated, layer is plated, a protruding part for contact, a recessed part for contact or a coupling hole is formed at the terminal part of the thin conductive plate. The protruding part for contact is formed to be a long circular shape in the length direction of the circuit.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a terminal treatment method for a circuit board in which a thick film contact circuit is formed on a bent terminal portion such as a thin circuit board or a terminal portion having a contact convex portion. Is.

[0002]

2. Description of the Related Art FIG. 24 shows a conventional circuit board terminal processing method described in Japanese Patent Application Laid-Open No. 62-61283. In this terminal treatment method, a terminal portion 38 of a thin circuit board 37 formed by printing a printed circuit 36 on the surface of an insulating resin sheet 35 is bent, and a substantially V-shaped thin spring member 39 is provided inside the terminal portion 38. To fix the
Due to the elasticity of the spring member 39, the circuits 36a exposed on both front and back sides of the terminal portion 38 are pressed into contact with the mating terminals 41 in the connector housing 40.

On the other hand, FIG. 25 shows a general terminal treatment method. By attaching a reinforcing plate 44 made of synthetic resin to the back side of the terminal portion 43 of the thin circuit board 42, the terminal portion 43 is rigidized. To improve the insertability into a connector housing (not shown).

[0004]

However, in the above-mentioned conventional terminal treatment method, the spring member 39 and the reinforcing plate 4 are used.
4 requires a separate member such that the terminal 3
The vicinity of 8, 43 is enlarged, or as shown in FIG.
There is a problem that the contact circuit 36a is easily broken by bending the contact circuit 8. Further, in order to bend the terminal portion 38, the circuit 36 needs to be thin, and in that case, it cannot be used as a large current circuit. If the circuit 36 is made thicker, however, it becomes impossible to bend it.
However, there is a problem that the contactability is poor because only the contact circuit 45 on one side is provided.

In view of the above points, the present invention does not require a separate member such as a spring member or a reinforcing plate, prevents the terminal portion from being enlarged, and prevents the circuit from breaking due to bending of the terminal portion, and a large current circuit. It is also an object of the present invention to provide a terminal treatment method for a circuit board, which can be used as the above and obtains a terminal portion having good contact.

[0006]

In order to achieve the above-mentioned object, the present invention is to bend and form the terminal portion of a thin circuit board having a thin film circuit, or to contact the circuit of the terminal portion with a convex portion or a contact portion. The method is basically based on the terminal treatment method of a circuit board in which a contact circuit is formed by forming a thick conductive plating layer on the circuit surface of the terminal portion after forming the recess or the engaging hole.

Then, a plating resist is applied to a portion of the thin conductive plate formed by fixing a thin copper foil on the surface of the insulating resin sheet other than the circuit planned portion of the copper foil, and a thick film conductive film is applied to the circuit planned portion. In a method of treating a circuit board in which a plating layer is formed by plating, the plating resist is removed, and the copper foil in a portion other than the circuit planned portion is removed by etching, a thick conductive plating layer is plated on the circuit planned portion. Before the bonding and formation, a circuit board terminal treatment method is adopted in which the terminal portion of the thin conductive plate having the circuit planned portion is bent and formed. The terminal portion may be bent and formed at 90 ° or 180 °. Further, in the above method for processing a circuit board, a contact projection, a contact recess or an engagement hole is formed in the circuit planned portion of the terminal portion of the thin conductive plate before the conductive plated layer is formed by plating on the circuit planned portion. It is also effective to do. The contact protrusion or the contact recess may be formed in an elliptical shape in the circuit longitudinal direction.

[0008]

The terminal portion of a thin circuit board having a thin film circuit or a thin conductive plate having a copper foil is thin and therefore easily bent and formed into a desired shape. Then, a conductive plating layer is formed as a thick film on the bent terminal portion, whereby the terminal portion is reinforced and maintains the bent shape. Here, no stress is applied to the bent portion of the conductive plating layer, and breakage or the like does not occur. Further, a large current can be conducted to the thick conductive plating layer. By removing the copper foil of the thin conductive plate by etching, the contact circuit is formed thicker than the thin circuit board by the thickness of the copper foil. When the terminal portion is bent and formed at 180 °, it is reinforced with double strength, and the contact circuits are formed on both sides, so that the electrical contact property is improved.

Further, a contact convex portion, a contact concave portion or an engaging hole can be easily and surely formed in a thin film circuit of the thin circuit board or a predetermined circuit portion of the thin conductive plate with a small processing force. Then, a thick-film conductive plating layer is built up in a convex shape or a concave shape along the shape of the contact convex portion or the contact concave portion. The concave portions and the convex portions allow the circuit boards to be connected to each other, and the concave portions and the convex portions increase the strength (rigidity) of the terminal portion. If the contact protrusion is formed in an oval shape, the strength is further increased.

[0010]

1 to 5 show a first embodiment of a circuit board terminal processing method according to the present invention. First, as shown in FIG. 1, an insulating resin sheet 1 such as polyester is used for this terminal treatment method.
As shown in FIG. 2, a plating resist 6 is applied to a portion 5 of the surface of the copper foil 2 other than the predetermined circuit portion 4 on a thin conductive plate 3 formed by fixing a thin copper foil 2 having a thickness of about 8 to 35 μm. Next, as shown in FIG. 3, the terminal portion 7 of the thin conductive plate 3 is bent 180 °, and an epoxy adhesive 8 or the like is sandwiched between the terminal portion 7 and the terminal portion 7 to be bonded by ultrasonic welding or the like.

Then, as shown in FIG. 4, a conductive plating layer 9 is plated on the copper foil 2 of the planned circuit portion 4 by electroplating to a thickness of about 400 μm. Next, the plating resist 6 on the portion 5 other than the circuit planned portion is removed, and as shown in FIG. 5, the copper foil 2 exposed on that portion is removed by etching. This allows
A contact circuit 10 having a combined thickness of the conductive plating layer 9 and the copper foil 2 is formed on the bent terminal portion 7. Finally, the insulating cover film 11 is applied to the portion other than the terminal portion 7. As a result, the terminal portion 7 having the thick film contact circuit 10 is completed. The insulating cover film 1 behind the terminal
The resin sheet 1 covered with 1 has holes 12 for locking and positioning.
Are provided in parallel.

On the other hand, FIGS. 6 to 8 show an example in which the terminal portion 14 is bent at 90 °, and the plating resist 6 of FIG.
From the coated state, the terminal portion 14 is bent at 90 ° as shown in FIG. Then, as shown in FIG. 7, the conductive plating layer 9'is applied as a thick film to the planned circuit portion 4 ', and a portion 5'other than the planned circuit portion 5'is formed.
Of the plating resist 6'and the copper foil 2'is removed by etching. Finally, as shown in FIG. 8, an insulating cover film 11 ′ is attached to a portion other than the terminal portion 14, a hole 12 ′ for locking and positioning is formed in the resin sheet 1 ′, and the contact circuit 15 of the terminal portion 14 is formed. Engagement hole 1 for contacting the mating terminal
6 is pierced.

When the thin conductive plate 3 is bent at 180 ° as described above, the terminal portion 7 having the contact circuits 10, 10 on both sides is obtained, and when bent at 90 °, the contact circuit 15 is provided on one side. The terminal unit 14 having

9 and 10 show the connection structure of the terminal portion of the above 180 ° bending type. That is, the terminal portion 7 of the circuit board 18 having the contact circuit 10 as shown in FIG.
Fixedly install the male connector housing 19 at the rear of the
The terminal portion 7 is in a state of protruding forward from the housing 19. The male connector housing 19 is fixed to the circuit board 1
The projection 21 of the fixed plate 20 is engaged from below with the locking and positioning hole 12 provided in the plate 8, and the fixed plate 20 is fitted into the housing 19.

The male connector housing 19 and the circuit board 18
Male connector 22 composed of the terminal portion 7 and the fixing plate 20 of
Is fitted into a female connector 24 having a female terminal 23 for connection to the terminal portion 7 (see FIG. 10). The female terminal 23 has upper and lower contact spring pieces 23a and is sandwiched and connected to the contact circuits 10 on both front and back sides of the terminal portion 7. According to this structure, since electrical contact is made on both sides of the terminal portion 7, the connection is highly reliable.

11 and 12 show a connecting structure of the 90.degree. Bending type terminal portion. Contact circuit 15
The circuit board 25 having a connector is routed on the substrate 27 of the electric connection box 26, and the terminal portion 14 is suspended along the inner wall 29 of the female connector cavity 28. Engagement protrusions 30 are provided on the substrate 27, and the engagement and positioning holes 12 ′ of the circuit board 25 engage with the engagement protrusions 30.

A male connector 31 is fitted in the cavity 28. The male connector 31 is provided with a contact spring piece 32 having a spherical projection 32a for the contact circuit 15 on the surface side of the terminal portion 14, and the spherical projection 32a is provided in the engagement hole 16 of the contact circuit 15. Engage. The periphery of the engagement hole 16 is scraped by the engagement of the spherical protrusion 32a to increase the contact area, thereby improving the electrical contactability.

13 to 15 show a second embodiment of the circuit board terminal processing method according to the present invention. This treatment method is performed in the same manner as in FIG. 2 of the first embodiment, except that the thin conductive plate 3 composed of the insulating resin sheet 1 and the copper foil 2 is coated with the plating resist 6 except for the planned circuit portion 4. As shown in FIG. 13, a contact convex portion 52 or a contact concave portion (not shown) is stamped and formed on the circuit planned portion 4 of the terminal portion 51, and then the circuit planned portion 4 is electroplated on the circuit planned portion 4 as shown in FIG. The layer 9 is formed. The plating resist 6 is shown in FIG.
And the copper foil 2 in that part is etched,
Finally, the insulating cover film 11 is applied.

The contact projections 52 or the contact recesses are punched out by a press die (not shown) into a hemispherical shape or a mountain shape having a circular shape as viewed from above with a small processing force. The conductive plating layer 9 is built up along the surface shape of the contact projection 52 or the contact recess, and the contact projection 5 as shown in FIG.
3 or contact recesses are formed. The contact convex portion 53 or the contact concave portion increases the bending strength (rigidity) of the contact circuit 54 of the terminal portion 51.

16 to 17 show a connection structure of the terminal portion of the circuit board. That is, as shown in FIG. 16, the terminal portion 51 of the circuit board 60 having the contact convex portion 53 is inserted and locked in the male connector housing 55. The terminal portion 51 is positioned so as to project into the accommodating chamber 56, and in a state where the tip thereof is placed on the opening edge 57, it is urged by the curved leaf spring 58 in the protruding direction of the contact convex portion 53. The leaf spring 58 is insulation-coated or is made of a non-conductor.

On the other hand, the mating female connector housing 59 accommodates the terminal portion 62 of the circuit board 61 without the contact protrusions 53, and the flat contact circuit 63 is provided on the male housing 55 side circuit board 60 as shown in FIG. The contact protrusion 53 elastically contacts. In this way, the thin circuit boards 60 and 61 are securely connected to each other with a reliable contact. 18 to 19 show FIGS.
15 shows an example in which the contact projections 52 or the contact recesses are formed in an elliptical shape in the circuit longitudinal direction in the processing method shown in FIG.

That is, as shown in FIG. 18 (corresponding to FIG. 13),
After the contact convex portion 64 having an oval shape (oval shape) as viewed from above is stamped and formed on the planned circuit portion 4 on the copper foil 2, the contact convex portion 64 is formed along the shape as shown in FIG. 19 (corresponding to FIG. 15). Then, the conductive plating layer 9 is overlaid to form the oval contact protrusions 65. Since the contacting protrusion 64 has an oval shape in the longitudinal direction and bulges out, the bending rigidity of the terminal portion 66 is further increased as compared with the circular contacting protrusion 52 of FIG. 15, and the contact area is increased. , More reliable connection between thin circuit boards.

FIG. 20 shows the connection state,
The terminal portion 66 of the circuit board 67 having the contact convex portion 65 is accommodated in the male connector housing 55, and the terminal portion of the circuit board 69 having the contact concave portion 68 corresponding to the contact convex portion 65 is accommodated in the female connector housing 59. There is. When the connector housings 55 and 59 are fitted together, the contact convex portion 65 engages with the contact concave portion 68, and good electrical contact is obtained.

In FIGS. 21 to 22, an engaging hole 70 for the contact protrusion 53 is formed in place of the contact protrusion 52. That is, as shown in FIG. 21 (corresponding to FIG. 13), a circular shape (contact protrusion 6
22 (corresponding to FIG. 15) after punching and forming an engagement hole 70 of an oval shape (corresponding to 5) by a punch die not shown.
As described above, the conductive plating layer 9 is formed as a thick film on the planned circuit portion 4. The conductive plating 9 is adhered to the inner peripheral portion 70a of the engaging hole 70 to form a good inner surface of electrical contact with the contact convex portion 53. The engagement hole 70 is a thick film contact circuit 71.
Since it is formed before forming, the processing force is small and the shape is finished.

FIG. 23 shows a connection state of the circuit board 72 having the engagement hole 70. That is, the engagement hole 7
The terminal portion of the circuit board 72 having 0 is housed in the female connector housing 59, the terminal portion of the circuit board 60 having the contact convex portion 53 is housed in the male connector housing 55, and both connector housings 55 and 59 are fitted together. Thus, the contact convex portion 53 is fitted into the engaging hole 70, and the circuit boards 60 and 72 are reliably connected to each other.

[0026]

As described above, according to the present invention, the terminal portion is bent and formed in the state of the thin and flexible thin circuit board or thin conductive plate, and the contact convex portion or the contact concave portion is formed on the terminal portion. Since the engaging hole is formed, the end portion can be easily bent, and the contact convex portion, the engaging hole, and the like can be processed with a small force, and these can be molded neatly into a desired shape. After bending, or after forming the contact protrusions, etc., a thick film contact circuit is formed by conductive plating, so that the terminal portion is reinforced in the bent shape, or the contact protrusion or contact recess is formed. The contacting circuit is built up along the shape of and the terminal portion is reinforced, the conventional reinforcing member is not required, and enlargement due to the reinforcing member is prevented.

Further, since the thick film contact circuit is formed after the terminal portion is bent, the contact circuit is not subjected to the conventional bending stress, and defects such as breakage and cracks of the contact circuit are avoided. Further, since the contact circuit is a thick film, a large current can be conducted, and the range of application for power circuit and the like is expanded. Also, by bending the terminal portion to 180 °, contact circuits are formed on both sides of the terminal portion, and the electrical contactability is improved.

Furthermore, the thin circuit boards are surely connected to each other by the engagement of the contact protrusions and the contact recesses of the contact circuits and the engagement of the contact protrusions and the engagement holes. In particular, if the contact protrusions or contact recesses are formed in an oval shape, the rigidity of the terminal portion is increased, the connectivity between the circuit boards is improved, and the contact area is increased to improve the electrical contactability.

[Brief description of drawings]

FIG. 1 is a perspective view showing an FPC material in a first embodiment of a circuit board terminal treatment method of the present invention.

FIG. 2 is a perspective view showing a state in which a plating resist is applied to a portion other than the planned circuit portion.

FIG. 3 is a perspective view showing a state where the terminal portion is bent 180 °.

FIG. 4 is a perspective view showing a state in which the circuit is thickened by conductive plating.

FIG. 5 is a perspective view showing a state in which a terminal portion is completed.

FIG. 6 is a perspective view showing an example of bending a terminal portion by 90 °.

FIG. 7 is a perspective view showing a state in which the circuit is similarly thickened by conductive plating.

FIG. 8 is a perspective view showing a state in which a terminal portion is completed.

FIG. 9 is an exploded perspective view showing a connection structure using a 180 ° bending type terminal portion.

FIG. 10 is a vertical cross-sectional view showing the same connection state.

FIG. 11 is an exploded perspective view showing a connection structure using a 90 ° bend type terminal portion.

FIG. 12 is a vertical sectional view showing a connection state in the same manner.

FIG. 13 is a perspective view showing a molding state of the contact convex portion in the second embodiment of the circuit board terminal treatment method.

FIG. 14 is a perspective view showing a state in which the circuit is also thickened.

FIG. 15 is a perspective view showing a state in which a terminal portion is completed.

FIG. 16 is an exploded perspective view showing a connection structure of a terminal portion.

FIG. 17 is a vertical cross-sectional view of the same fitted state.

FIG. 18 is a perspective view showing a modified example of the contact protrusion.

FIG. 19 is a perspective view showing a state in which the terminal portion is completed.

FIG. 20 is a vertical cross-sectional view showing a connection state of terminal portions.

FIG. 21 is a perspective view showing a state in which an engagement hole is formed.

FIG. 22 is a perspective view showing a state where the terminal portion is completed.

FIG. 23 is a vertical cross-sectional view showing a connection state of terminal portions.

FIG. 24 is an exploded perspective view showing a conventional example.

FIG. 25 is a perspective view showing another conventional example.

[Explanation of symbols]

 1,1 'Insulating resin sheet 2,2' Copper foil 3 Thin conductive plate 4 Planned circuit part 6 Plating resist 7,14,51,73 Terminal part 9,9 'Conductive plating layer 37,42 Thin circuit plate 52,64 Contact Convex portion 60, 67, 72 circuit board 70 engaging hole

Claims (5)

[Claims] 1. A circuit of a terminal portion of a thin circuit board having a thin film circuit is formed by bending or forming a contact convex portion, a contact concave portion or an engaging hole in the circuit of the terminal portion. A method for terminal treatment of a circuit board, comprising forming a contact circuit by depositing a thick conductive plating layer on the surface. 2. A thin conductive plate formed by fixing a thin copper foil to the surface of an insulating resin sheet, a plating resist is applied to a portion other than the circuit planned portion of the copper foil, and a thick film conductive film is applied to the circuit planned portion. Forming a plating layer by plating, removing the plating resist,
In a method of treating a circuit board by removing a copper foil on a portion other than the circuit planned portion by etching, a thin conductive plate having the circuit planned portion before forming a thick conductive plating layer on the circuit planned portion by plating. A method for terminal treatment of a circuit board, comprising bending and shaping the terminal portion of the. 3. The circuit board terminal treatment method according to claim 1, wherein the terminal portion is formed by bending at 90 ° or 180 °. 4. A thin conductive plate formed by fixing a thin copper foil on the surface of an insulating resin sheet, a plating resist is applied to a portion other than a circuit planned portion of the copper foil, and a thick film conductive film is applied to the circuit planned portion. Forming a plating layer by plating, removing the plating resist,
In a method of treating a circuit board by removing a copper foil on a portion other than the circuit planned portion by etching, a circuit planned portion of a terminal portion of the thin conductive plate is formed on the circuit planned portion before a conductive plating layer is formed by plating on the circuit planned portion. A method for terminal treatment of a circuit board, which comprises forming a contact protrusion, a contact recess or an engagement hole. 5. The method for terminal treatment of a circuit board according to claim 4, wherein the contact protrusions and the contact recesses are formed in an elliptical shape in the circuit longitudinal direction.