JPH07302796A - Solder ball bonding device - Google Patents

Abstract

PURPOSE:To provide a solder ball bonding device of a structure, wherein in the case where solder balls are bonded on a substrate or a chip, the balls in a container are reliably vacuum-sucked in suction holes formed in a suction head and can be picked up. CONSTITUTION:A container 11 with solder balls 1 stagnated therein is made to cause an ultrasonic vibration by a vibrator 14, whereby the balls 1 are fluidized and are vacuum-sucked in suction holes 4 formed in a suction head 3. The head 3 is moved over a substrate and is made to conduct a vertically moving operation there, whereby the balls 1 are bonded on the substrate.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a solder ball bonding apparatus for bonding solder balls to be bumps to the surface of a work such as a chip or a substrate.

[0002]

2. Description of the Related Art It is known that solder balls are bonded to the surface of a chip or a substrate and then the solder balls are melted and solidified to form bumps (protruding electrodes). FIG. 5 is a side view of essential parts of a conventional solder ball bonding apparatus. Solder balls 1 that are the material of the bumps are stored in a container 2. Denoted at 3 is a suction head, which is driven by an ascending / descending means (not shown) to perform an ascending / descending operation so that the solder ball 1 is vacuum-sucked to an adsorption hole 4 formed in the lower surface thereof and reciprocating means (see It is driven by a not-shown) to move horizontally to move above a work such as a substrate, and then elevate and lower again to bond the solder ball 1 to a predetermined position on the substrate. The container 2 is attached to the hood 5, and nitrogen gas or dry air is sent from the hood 5 (see the broken line arrow) and blows out from a blow-out hole 6 formed at the bottom of the container 2.

A large number of suction holes 4 are generally formed in a matrix, and nitrogen gas or dry air is blown up into the container 2 from the blow-out holes 6 so that all the suction holes 4 suck the solder balls 1 under vacuum. The solder ball 1 in the container 2 is caused to flow, and the suction head 3 moves up and down in that state to vacuum-suck the solder ball 1 into the suction hole 4.

[0004]

However, since the conventional means uses a large amount of gas such as nitrogen gas and dry air, there is a problem that the running cost is too high. Further, the size and weight of the solder ball 1 are various. Therefore, it is desirable that the amount of gas blown up from the blowout hole 6 is adjusted according to the size and weight of the solder ball 1 to always obtain a constant flow effect. However, it is difficult for the conventional means to perform such adjustment precisely, and as a result, the solder balls 1 excessively flow or underflow, so that the solder balls 1 cannot necessarily be vacuum-sucked to all the suction holes 4. There was a problem.

Therefore, it is an object of the present invention to provide a solder ball bonding apparatus capable of reliably vacuum-sucking a solder ball in a suction hole of a suction head and reducing the running cost.

[0006]

To this end, the present invention is designed to fluidize the solder balls by vibrating a container in which the solder balls are stored by vibrating means such as a piezoelectric element.

[0007]

According to the above construction, the solder balls are made to flow by driving the vibrating means to vibrate the container, and the solder balls are surely vacuum-sucked and picked up by the suction holes of the suction head to be picked up on a work such as a substrate. Bond.

[0008]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will now be described with reference to the drawings. 1 is a side view of a solder ball bonding apparatus according to an embodiment of the present invention, and FIG. 2 is a vertically inverted perspective view of a suction head provided in the solder ball bonding apparatus.
3A and 3B are cross-sectional views of the suction head provided in the solder ball bonding apparatus during a pickup operation, and FIG. 4 is a configuration block diagram of the solder ball bonding apparatus.

In FIG. 1, 11 is a container in which the solder balls 1 are stored. Reference numeral 12 denotes a base, which elastically supports the container 11 so that the container 11 can swing from the side and the bottom. Reference numeral 14 denotes a vibrator such as a piezoelectric element as an ultrasonic vibration means, which is mounted on the lower surface of the container 11. The vibrator 14 ultrasonically vibrates when a high-frequency voltage is applied, and the container 11 also ultrasonically vibrates, and the solder balls 1 stored therein are fluidized. By adjusting the magnitude of this high frequency voltage, the magnitude of ultrasonic vibration of the container 11 can be adjusted.

Reference numeral 15 denotes a solder ball supply device, which supplies the solder ball 1 to the container 11 through a pipe 16.
The container 11 is provided with a remaining amount detection sensor 47 for the solder balls 1, such as an optical sensor (described later), and when it is detected that the remaining amount of the solder balls 1 in the container 11 is low, the solder balls 1 are detected. Supply 1. Reference numeral 17 is a base of the supply device 15.

On the lower surface of the suction head 3, a large number of suction holes 4 for the solder balls 1 are formed in a matrisk shape (see also FIG. 2). The suction head 3 includes a support shaft 18 and a tube 19.
The solder ball 1 is vacuum-sucked to the suction holes 4 and is released from the vacuum suction state by being driven by the vacuum device 20.

Reference numeral 21 is a holding block of the suction head 3, and the support shaft 18 of the suction head 3 is held by the holding block 21. Reference numeral 22 denotes a movable block, and two guide rails 23 are vertically arranged on the front surface of the movable block.
The holding block 21 is mounted on the guide rail 23 so as to be vertically movable. The nut 2 is provided on the side of the holding block 21.
4 and the nut 24 has a vertical feed screw 2
5 is screwed in. When the feed screw 25 is rotated by being driven by the motor 26 provided in the movable block 22, the holding block 21 and the suction head 3 move up and down. That is, the nut 24, the feed screw 25, and the motor 26 serve as an elevating unit that causes the suction head 3 to perform an elevating operation.

Reference numeral 30 denotes a moving table, and the movable block 22 is mounted on the moving table 30 slidably in the lateral direction. A motor 31 is attached to a side portion of the moving table 30, and when the motor 31 is driven, a feed screw 32 incorporated in the moving table 30 rotates, and the movable block 22 moves laterally along the feed screw 32. Move back and forth. That is, the moving table 30 serves as a means for reciprocating the suction head 3.

Numeral 40 is a positioning portion, and a base 41 and
The X table 42 and the Y table 43 are stacked. A clamper 44 is provided on the Y table 43, and the substrate 45 is clamped from the left and right to be positioned. The suction head 3 is moved by the moving table 30 into the container 1
It reciprocates between 1 and the positioning unit 40.

In FIG. 3A, reference numeral 46 is a lead wire connected to the vibrator 14, and a high frequency voltage is applied to the vibrator 14 through the lead wire 46. Further, a remaining amount detecting sensor 47 including an optical sensor is provided on the side surface of the container 11. The container 11 is transparent, and the remaining amount detection sensor 47 detects the level of the solder balls 1, that is, the remaining amount of the solder balls 1. When the remaining amount of the solder balls 1 becomes small, the solder balls 1 are supplied from the supply device 15 to the container 11 as described above. When detecting the remaining amount of the solder ball 1, it is possible to detect the remaining amount more accurately by stopping the vibration of the vibrator 14 and keeping the solder ball 1 stationary. Reference numeral 48 is a detection circuit to which the remaining amount detection sensor 47 is connected.

In FIG. 4, 53 is a vacuum device 20.
The valve 19 for opening and closing the suction passage provided in the tube 19 (see also FIG. 1), 54 is a valve drive circuit. By opening and closing the valve 53, the suction head 3 vacuum-sucks the solder ball 1 and releases the vacuum suction state.

Reference numeral 55 is a pressure sensor for detecting the vacuum suction force of the vacuum device 20 (see also FIG. 1), 56 is its detection circuit, 57 is a motor drive circuit for driving the motor 26,
Reference numeral 58 is a vibrator drive circuit for driving the vibrator 14, 59 is a motor drive circuit for controlling the drive of the motor 31, and 60 is a supply device drive circuit for controlling the drive of the supply device 15. The above circuits are connected to a control unit (CPU) 62 via an interface 61. The control unit 62 controls each circuit while reading the program data and the like stored in the memory 63.

The solder ball bonding apparatus is constructed as described above, and the overall operation will be described below.
In FIG. 1, when the motor 26 rotates forward, the suction head 3 moves down. In FIG. 3A, the container 14 is ultrasonically vibrated by driving the vibrator 14, and the solder balls 1 stored therein flow. Then, when the suction head 3 descends (see the suction head 3 shown by the chain line in the figure), the solder ball 1 is vacuum-sucked to the suction hole 4. Next, when the motor 26 rotates in the reverse direction, the suction head 3 rises and the solder ball 1 is picked up.

Next, in FIG. 1, when the motor 31 rotates forward, the suction head 3 moves above the substrate 45, and when the motor 26 rotates forward there, the suction head 3 descends and the solder ball 1 moves. Are mounted on the upper surface of the substrate 45. Next, the vacuum suction state by the vacuum device 20 is released, the suction head 3 rises, and the motor 31 rotates in the reverse direction, whereby the suction head 3 returns to above the container 11. Flux is previously applied to the upper surface of the substrate 45 by means not shown, and the solder balls 1 are bonded to the substrate 45 by the adhesive force of this flux.

By repeating the above operation, the solder balls 1 are bonded to the upper surface of the substrate 45 one after another. The bonded solder ball 1 is heated and melted in a later process to form a bump. In this example, the substrate 4
Although the description has been given by taking the case of forming bumps on the substrate 5 as an example, the present invention can be applied to a means for forming bumps on a chip.

[0021]

As described above, according to the present invention, the solder balls can be fluidized by vibrating the container, and can be reliably vacuum-sucked and picked up by the suction holes formed in the lower surface of the suction head. Further, by adjusting the strength of vibration according to the size and weight of the solder ball, it is possible to always fluidize the solder ball with a desired strength. Further, the running cost of the vibrating means is extremely low, and the cost can be greatly reduced.

By holding the container by the holding means, excessive shaking of the container can be eliminated, the container can be stably vibrated, and the solder balls can be always fluidized to the same degree. Further, by providing the remaining amount detecting sensor and the solder ball supplying device, the solder balls can be automatically supplied when the remaining amount of the solder balls becomes small, so that the solder ball supplying work can be saved.

[Brief description of drawings]

FIG. 1 is a side view of a solder ball bonding apparatus according to an embodiment of the present invention.

FIG. 2 is a vertically inverted perspective view of a suction head provided in a solder ball bonding apparatus according to an embodiment of the present invention.

FIG. 3A is a sectional view of the suction head provided in the solder ball bonding apparatus according to the embodiment of the present invention during a pickup operation; and FIG. 3B is provided in the solder ball bonding apparatus according to the embodiment of the present invention. Sectional view during pickup operation of the suction head

FIG. 4 is a configuration block diagram of a solder ball bonding apparatus according to an embodiment of the present invention.

FIG. 5 is a side view of essential parts of a conventional solder ball bonding apparatus.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Solder ball 3 Suction head 4 Suction hole 11 Container 13 Elastic support part 14 Vibrator 15 Supply device 24 Nut 25 Feed screw 26 Motor 30 Moving table 40 Positioning part 45 Board (work) 47 Remaining amount detection sensor

Claims (3)

[Claims] 1. A container for storing solder balls, a vibrating means for vibrating the container, a suction head for vacuum-sucking the solder balls into a plurality of suction holes formed in the lower surface of the container, and a lifting head for the suction head. A solder ball bonding apparatus comprising: an elevating means for performing an operation; a workpiece positioning portion; and a reciprocating movement means for reciprocating the suction head between the container and the positioning portion. 2. The solder ball according to claim 1, wherein the container is rockably held by a holding means, and the vibrating means is a piezoelectric element mounted on a wall surface of the container. Bonding equipment. 3. A residual amount detecting means for detecting the residual amount of the solder balls stored in the container, and a supplying means for supplying the solder balls to the container based on a detection signal of the residual amount detecting means. The solder ball bonding apparatus according to claim 1, wherein: