JPH0730273A - Mounting structure for high-temperature package - Google Patents

Abstract

PURPOSE:To provide a mounting structure for high-temperature packages, which can efficiently remove heat from electronic devices which become very hot because of their high-speed operation and high packing density. CONSTITUTION:A connector 9 is connected, using at least the second slot 24, and a printed wiring board 3 is so arranged that it can be mounted in the second slot 24 at least, and further high-temperature parts 11 are mounted on both sides of the first slot 23 and the second slot 24, and also this has a slot width 10 occupied by a high-temperature electronic circuit package 14, on the front side of a shelf 19. Hereby, a front board 13 to prevent the leadage of air is provided, and also a heat screen plate 16 is provided between the first slot 33 and the adjacent electronic circuit package, and the high- temperature electronic circuit package 14, a front board 13, and the heat screen plate 16 are united so that they can be inserted into and extracted out of the shelf en block.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus for mounting a high heat generation package which has an efficient and high cooling performance for an electronic circuit package which generates high heat due to high speed and high density mounting of an electronic device system.

[0002]

2. Description of the Related Art FIG. 4 is a view showing a conventional shelf mounting structure of a high heat generating electronic circuit package. Here, 1 is a high heat generating component, 2 is a low heat generating component, 3 is a printed wiring board, 4 is a high heat generating electronic circuit package, 5 is a low heat generating electronic circuit package, 6 is a heat sink, 7 is a front plate, 8 is a back panel, 9 is a connector pin, 10 is a slot width, and 23 is a first
Slots and 24 represent the second slots, respectively.

FIG. 5 is a perspective view showing how the high heat generating electronic circuit package is mounted on the shelf 19. Here, 17 is an insertion / removal lever, 18 is an electronic circuit package insertion direction, 19 is a shelf, 20 is a cooling air vent, and 21 is a cooling air flow direction. The view taken along the line AA shown in FIG. 5 is the sectional configuration diagram shown in FIG.

In the conventional mounting example shown here, the high heat generating electronic circuit package 4 is electrically connected to the shelf 19 and the backboard 8 by using the width of 2 slots, and the connector pin 9 of the first slot 23 is used. The second slot 24 is assigned to the cooling space.

[0005]

In this case, although it is possible to mount the high heat sink 6 on the high heat-generating component 1 to cool it, all the heat generated from the high heat-generating electronic circuit package 4 is the first. Slot 23 to second slot 2
4 directions, that is, only one direction, the first
And it is necessary to utilize the space formed by the second slots 23 and 24 to cool. Therefore, the temperature rise of the air flowing through the space formed by the first and second slots 23, 24 becomes high, and when stacking the shelves 19 in multiple stages to form an electronic device rack, the number of stages that can be mounted is limited. There was a problem.

In this case, since the number of shelves 19 that can be mounted on the rack is limited, it is necessary to divide the rack when constructing an electronic device having a certain function, which causes an increase in floor area. There was also.

Further, when the forced air cooling is used, even if the slot width 10 is widened, it is only in the vicinity of the printed wiring board 3 and the high heat generating component 1 that contributes to the cooling of the high heat generating electronic circuit package 4, in other words. In that case, since only the first slot 23 serves as a space that contributes to cooling, there is also a problem that the cooling performance cannot be improved even though many slots are secured.

The present invention has been made in view of the above circumstances, and is achieved by increasing the speed and density of an electronic device system.
It is an object of the present invention to provide a device with a high heat generation package that can realize a high heat dissipation capability for an electronic device that generates high heat.

[0009]

In order to achieve the above object, the high heat generating package mounting apparatus of the present invention is a rack-shaped shelf capable of accommodating a large number of electronic circuit packages at a pitch N times a certain slot width. An electronic device which is mounted and at least one or more of the shelves are stacked, and the shelves can be collectively cooled by forced air cooling means. In the structure for mounting the electronic circuit package, the connector for electrically connecting the high heat generating electronic circuit package and the back panel provided on the back surface of the shelf uses at least the second slot or a slot having a value of not less than this. The printed circuit board that constitutes the high heat generation electronic circuit package by connecting at least A high heat generating component that can be mounted in a slot or a slot having a value of more than this, and that is mounted on the high heat generating electronic circuit package is mounted on both sides of the first slot side and the second slot side, and the front side of the shelf. Has a slot width occupied by the high heat generation electronic circuit package, is provided with a front plate for preventing air leakage, and has a heat capacity substantially equal to the electronic circuit package size between the first slot and the adjacent electronic circuit package. The greatest feature is that a shield plate is provided, and the high heat generating electronic circuit package, the front plate, and the heat shield plate are integrated so that they can be inserted into and removed from the shelf at once.

As a result, the heat generation direction of the high heat generation electronic circuit package can be dispersed in two directions, and therefore, the air flowing through the slots on both sides of the high heat generation electronic circuit package can cool it, so that the temperature rise of the air can be reduced, As a result, the permissible power consumption per electronic circuit package can be increased, and in turn, a multi-tiered device configuration can be achieved, which is a major difference from the prior art.

Further, since the heat shield plate is provided between the adjacent packages, the heat radiation of the adjacent packages is not affected, which is a great difference from the prior art.

Furthermore, in the conventional electronic circuit package using double-sided mounting, there is a limit to the height of components that can be mounted on the back side of the printed wiring board due to the relationship with the slot width, and components with high power consumption should be mounted on the back side. However, in the present invention, since the connector of the second slot can be used to connect to the backboard, it is possible to arrange a component having a sufficiently high component height on the first slot side, that is, on the back side. Therefore, parts can be evenly distributed on the front and back sides,
As a result, it is significantly different from the conventional technique in that the heat generation can be made uniform.

Further, since the parts can be evenly distributed on the front surface and the back surface side, the parts which require high-speed connection can be mounted closer to each other, which is a big difference from the prior art.

[0014]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described in detail below with reference to the drawings.

FIG. 1 is a view showing a shelf mounting structure of a high heat generating electronic circuit package according to the present invention. Here, 2 is a low heat generating component, 3 is a printed wiring board, 5 is a low heat generating electronic circuit package, 7 is a front plate, 8 is a back panel, 9 is a connector pin, 10 is a slot width, 11 is a high heat generating component, 12
Is a heat sink, 14 is a high heat generation electronic circuit package, 1
6 is a heat shield plate, 15 is the direction of heat generation, 23 is the first slot, and 24 is the second slot.

FIG. 2 is a perspective view showing how the high heat generating electronic circuit package 14 is mounted on the shelf 19. Here, 13 is a special front plate, 17 is a punching lever, 18 is an electronic circuit package insertion direction, 19 is a shelf, 20 is a cooling air vent, and 21 is a cooling air flow direction. The view taken along the line AA shown in FIG. 2 is the cross-sectional configuration diagram shown in FIG.

In this embodiment, an example in which the high heat generation electronic circuit package 14 occupying the width of two slots is mounted on the shelf 19 is shown, and a component having a high component height is also mounted on the first slot 23 side (back side). And the second slot 24
Parts are also mounted on the side (front side), and the heat generation direction of the high heat generation electronic circuit package 14 can be dispersed in two directions. Therefore, the air flowing through the slots on both sides of the high heat generation electronic circuit package 14 can cool the air, so that the temperature rise of the air can be reduced.

Further, in the conventional double-sided mounting type electronic circuit package, the printed wiring board 3 has a relationship with the slot width 10.
Although there is a limit to the height of components that can be mounted on the back surface side of the present invention, the connector of the second slot 24 can be used to connect to the backboard 8 in the present invention, so that the first slot 23 side (back surface side) is sufficient. Since a component having a high component height (a heat sink 12 can be mounted) can be arranged, the component can be evenly distributed on the front surface side and the back surface side, and heat generation can be made uniform.

FIG. 3 is a diagram quantitatively showing this effect, and shows a comparison of the air temperature rise values between the conventional mounting structure shown in FIGS. 4 and 5 and the mounting structure according to this embodiment. . In the case of the present embodiment, an example is shown in which heat is evenly distributed to the front surface side and the back surface side. Further, the temperature rise value during normal mounting and when the cooling fan is normally rotating is normalized as 1.

As is clear from this figure, in the conventional mounting, the air is heated above the allowable temperature rise, but
In the case of the present embodiment, in any case, the allowable temperature rise value can be made equal to or lower than the allowable temperature rise value, and the effect of dispersing the heat generation on both sides is remarkable.

Therefore, a device structure in which the high heat generation electronic circuit packages 14 are stacked in multiple stages can be formed.

Furthermore, since the heat shield plate 16 is provided between the adjacent package, it does not affect the heat radiation of the adjacent package.

Further, since the parts can be dispersedly arranged on the front surface and the back surface side, vias (not shown) provided on the printed wiring board 3 can be directly connected between the parts that require high-speed connection, and high density can be achieved. And a high-speed electronic circuit package can be configured.

As described above, in this embodiment, a large number of electronic circuit packages 4 and 5 are connected to the N of a certain slot width 10.
An electronic device mounted on a rack-like shelf 19 that can be stored at a double pitch, and at least one shelf is stacked, and the shelves 19 can be collectively cooled by forced air cooling means. A connector for electrically connecting the high-heat-generating electronic circuit package 14 and the back panel 8 provided on the back surface of the shelf 19 in a structure in which the high-heat-generating electronic circuit package 14 that occupies two or more slot widths due to high power is mounted. 9 is a printed wiring board 3 which constitutes the high heat generating electronic circuit package 14 by connecting using at least the second slot 24 or a slot having a value equal to or larger than the second slot 24.
However, the high heat-generating component 11 can be mounted in at least the second slot 24 or a slot having a value higher than the second slot 24, and is further mounted in the high heat generating electronic circuit package 14.
Is mounted on both sides of the first slot 23 side and the second slot 24 side, and has a slot width 10 occupied by the high heat generating electronic circuit package 14 on the front side of the shelf 19 to prevent air leakage. 13 is provided,
A heat shield plate 16 having a size substantially equal to an electronic circuit package size is provided between the first slot 23 and the adjacent electronic circuit package, and the high heat generation electronic circuit package 14, the front plate 13, and the heat shield plate 16 are provided. The greatest feature is that they are integrated so that they can be inserted into and removed from the shelf 19 at once.

For this reason, the heat generation direction of the high heat generation electronic circuit package 14 can be dispersed in two directions, and the air flowing through the slots located on both sides of the high heat generation electronic circuit package 14 can cool the heat generation. As a result, there is an advantage that the allowable power consumption per electronic circuit package can be increased. Higher heat generation electronic circuit package 14
There is an advantage that a device configuration in which a large number of layers are stacked can be formed.

Further, since the heat shield 16 is provided between the adjacent package, there is an advantage that the heat can be cooled without affecting the heat radiation of the adjacent package.

Further, in the conventional double-sided mounting type electronic circuit package, the height of the parts that can be mounted on the back surface of the printed wiring board 3 is limited due to the relationship with the slot width 10, and it is possible to mount the parts having high power consumption on the back surface. It was difficult,
In this embodiment, since the connector of the second slot 24 can be used to connect to the backboard 8, the first slot 23
Since it is possible to place parts with sufficiently high parts on the side (back side), it is possible to evenly distribute the parts on the front side and the back side,
There is an advantage that heat generation can be made uniform.

Further, since the parts can be dispersedly arranged on the front surface and the back surface side, vias (not shown) provided in the printed wiring board 3 can be directly connected between the parts which require high-speed connection, and high density can be achieved. Moreover, there is an advantage that a high-speed electronic circuit package can be configured.

[0029]

As described above, according to the present invention, there is provided a high heat generation package mounting device capable of realizing a high heat dissipation capability for an electronic device which generates high heat due to high speed and high density mounting of the electronic device system. can do.

[Brief description of drawings]

FIG. 1 is a shelf mounting cross-sectional view of a high heat generation electronic circuit package according to an embodiment of the present invention.

FIG. 2 is a perspective view of the high heat generation electronic circuit package shown in FIG. 1 mounted on a shelf.

FIG. 3 is a characteristic diagram in which an increase in air temperature in a rack according to an embodiment of the present invention is compared with a conventional example.

FIG. 4 is a shelf mounting cross-sectional view of a conventional high heat generation electronic circuit package.

5 is a perspective view of the high heat generation electronic circuit package shown in FIG. 4 mounted on a shelf.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... High heat-generating component, 2 ... Low heat-generating component, 3 ... Printed wiring board, 4 ... High heat-generating electronic circuit package, 5 ... Low heat-generating electronic circuit package, 6 ... Heat sink, 7 ... Front plate, 8 ... Back panel, 9 ... Connector pin, 10 ... Slot width, 11 ... High heat generation component, 12 ... Heat sink, 13 ... Special front plate, 14 ... High heat generation electronic circuit package, 15 ... Heat generation direction, 16 ... Heat shield plate, 17 ... Insertion / removal lever, 18 ... Electronic circuit package insertion direction, 19 ... Shelf, 20 ... Cooling air vent, 21 ... Cooling air flow direction, 23 ... First slot, 24 ... Second slot.

Claims (1)

[Claims] 1. An electronic device in which a plurality of electronic circuit packages are mounted on a rack-like shelf which can be accommodated at a pitch N times a certain slot width, and the shelves can be collectively cooled by forced air cooling means. In a structure in which a high heat generating electronic circuit package occupying a slot width of 2 or more is mounted, a connector for electrically connecting the high heat generating electronic circuit package and a back panel provided on the back surface of the shelf is at least the second slot or this. The wiring board forming the high heat-generating electronic circuit package can be mounted in at least the second slot or a slot having a value higher than the above by connecting using the slots having the above-mentioned values. If the components to be mounted on the circuit package are mounted on both sides of the first slot side and the second slot side. In both cases, the front side of the shelf has a slot width occupied by the high heat generation electronic circuit package, a front plate for preventing air leakage is provided, and the electronic circuit package is provided between the first slot and the adjacent electronic circuit package. A high heat generation package mounting apparatus, characterized in that a heat shield plate of substantially the same size is provided, and the high heat generation electronic circuit package, the front plate, and the heat shield plate can be collectively inserted into and removed from the shelf.