JPH07302420A - Structure of wire bonding pad forming surface of floating magnetic head - Google Patents

Abstract

PURPOSE:To prevent an adhesive from flowing to rail surfaces by exposing the surfaces of plural wire bonding pads from a protective film in the central part toward the transverse direction of the end face of a slider substrate and forming these surfaces approximately flush with this protective film. CONSTITUTION:The surfaces 22a to 25a of the wire bonding pads 22 to 25 are exposed from the protective film 20 at the end face 12b of the slider substrate 12 and are composed in this state on the same plane as the surface 20a of the film 20. These pads 22 to 25 are connected by coil conductors 26 to 29 of thin-film magnetic head elements 16, 17. The one element judged to have good characteristics as a result of inspection is selected. Conductors for transmitting recording and reproducing signals to and from external circuits are bonded to the pads 22, 24 or 23, 25 connected to the selected element 16 or 17. At this time, the respective pads do not bulge and, therefore, the smaller amt. of the adhesive for increasing the joining strength is necessitated and the adhesive hardly flows out to the peripheries. As a result, the flowing-in of the adhesive to the rail 14 surfaces is prevented.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a structure of a wire bonding pad forming surface of a floating magnetic head, in which a magnetic head element and an external conductor wire are connected by wire bonding with a wire bonding pad. This is to prevent the adhesive from flowing out to the rail surface and causing the product to be defective when the adhesive is applied to the bonding portion to increase the strength.

[0002]

2. Description of the Related Art An example of a conventional thin film magnetic head used as a magnetic head for a hard disk device is shown in FIG. The thin-film magnetic head 10 constitutes a so-called flying type magnetic head called a slider, and a rail 14 is formed on a lower surface 12a of the slider substrate 12 to form a rail surface. The end surface 1 of the slider substrate 12 corresponding to the end position of the rail 14
The thin film magnetic head elements 16 and 17 of the inductive type or the like are formed on the left and right sides of 2b using a thin film forming technique. The thin film magnetic head elements 16 and 17 are entirely covered with a protective film 20 formed by depositing alumina or the like on the entire slider substrate end surface 12b, and the pole tip portion 16 is provided.
Only a and 17a are exposed on the rail surface 12a.

Wire bonding pads 22, 23, 24, 25 are provided at the center of the slider substrate end face 12b in the width direction.
Is formed with its surface exposed from the protective film 20. Wire bonding pads 22, 23, 24,
25 is the formed two thin film magnetic head elements 16 and 1
Lead wires 26, 27, 28, 29 with respect to the coil conductor wire of 7.
Connected by. As a result of the inspection, one thin film magnetic head element whose characteristics are determined to be good or one thin film magnetic head element 16 (or 17) arbitrarily selected is connected to the wire bonding pads 22, 24 (or,
Wires (conductor wires) are respectively bonded to the wires 23, 25), and the recording signal and the reproducing signal are transmitted between the external circuit and the thin film magnetic head element 16 (or 17) through the wires to record the information on the disk. , Playback is performed.

A manufacturing process of the wire bonding pads 22 and 24 of the thin film magnetic head 10 of FIG. 2 will be described with reference to FIG. Although the manufacturing steps of the wire bonding pads 23 and 25 proceed at the same time, only the pads 22 and 24 are shown here.

(1) Pad lead portion formation Underlayer metal films 30 and 32 are previously formed at the wire bonding pad formation location in the widthwise central portion of the slider substrate end surface 12b.
Is deposited. The base metal films 30 and 32 are made of the same material as the coil base. Then, simultaneously with the film formation of the coil conductor layers and the core layers of the thin film magnetic head elements 16 and 17, the pad portion 2 is made of the same material (Cu, permalloy, etc.).
2 ', 24' and lead wires 26, 28 are deposited.

(2) Pad section padding Only in the above step (1), the pad sections 22 'and 24' are located lower than the thin film magnetic head elements 16 and 17,
If the protective film 20 is directly formed on it, the pad portion 2 is formed.
Since the 2'and 24 'are not exposed to the outside, the pad portion 2
2'and 24 'are raised by Cu plating or the like. As shown in FIG. 4, the heights of the raised pads 34 and 36 are formed higher than the highest portions of the thin film magnetic head elements 16 and 17, and padding polishing is performed after the protection film 20 is formed (step (4) below). At this time, the thin film magnetic head elements 16 and 17 are prevented from being exposed from the protective film 20.

(3) Protective film formation The protective film 20 is formed on the raised pad portions 22 ', 24' by a method such as sputtering.

(4) Pad Out Polishing The surface of the protective film 20 is polished to expose the pad portions 22 'and 24'.

(5) Wire Bonding Crimping Material Forming The wire bonding crimping material 38, 40 such as Ni-Au is formed on the pad portions 22 ', 24' by a method such as plating (Ni and Au are formed in this order). The wire bonding pads 22 and 24 are completed.

FIG. 5 shows a state in which a wire is bonded to the wire bonding pads 22 and 24 thus created. In FIG. 5, (a) shows a state in which the wires 42, 44 are bonded to the wire bonding pads 22, 24 with an ultrasonic bonder or the like. Usually, the bonding strength of wire bonding is weak as it is, so (b)
As described above, the protective adhesive 46 is applied to the bonding portion and hardened to prevent peeling at the time of wire routing in the subsequent assembly work and the like.

[0011]

The floating magnetic head is
Along with the miniaturization of the slider, the film surface (slider substrate end surface) 1
The area of 2b tends to decrease, and the protective adhesive 46 may flow into the rail surface 12a due to variations in the amount of the protective adhesive 46 applied, as shown in FIG. The rail surface 12a is mirror-finished and is a very important part as a surface facing the recording medium (disk), and even a small amount of dirt causes a defect. Therefore, the protective adhesive 46 is applied to the rail surface 12a. The product that flowed out was defective.

The present invention solves the above problems in the prior art and prevents the adhesive for increasing the bonding strength of wire bonding from flowing into the rail surface. It is intended to provide structure.

[0013]

The invention according to claim 1 is
A rail is formed on the lower surface of the slider substrate, a magnetic head element is formed on the end surface of the slider substrate corresponding to the end position of the rail, and a coating film that covers the magnetic head element is formed on the end surface. Further, a bonding pad electrically connected to the magnetic head element is formed on the end face so as to be exposed from the coating film, a conductive wire is bonded to the bonding pad, and an adhesive is applied to the bonded portion. In a floating magnetic head
The surface of the wire bonding pad is formed at substantially the same height as the surface of the coating film or at a position lower than the surface of the coating film.

According to a second aspect of the present invention, a rail is formed on the lower surface of the slider substrate, a magnetic head element is formed on the end surface of the slider substrate corresponding to the end position of the rail, and the magnetic head element is formed on the end surface. A coating film for coating the coating film is formed, and a bonding pad that is electrically connected to the magnetic head element is formed on the end face so as to be exposed from the coating film, and a conductive wire is bonded to the bonding pad, and In the floating magnetic head in which an adhesive is applied to the bonded portion, the wire bonding pad is formed by laminating a wire bonding crimping material made of another conductive material on a pad body made of a conductive material. The wire bonding crimping material is formed at a position lower than the surface of the coating film.

According to a third aspect of the present invention, a rail is formed on the lower surface of the slider substrate, a magnetic head element is formed on the end surface of the slider substrate corresponding to the end position of the rail, and the magnetic head element is formed on the end surface. A coating film for coating the coating film is formed, and a bonding pad that is electrically connected to the magnetic head element is formed on the end face so as to be exposed from the coating film, and a conductive wire is bonded to the bonding pad, and In the floating magnetic head in which an adhesive is applied to the bonded portion, a barrier or groove is formed on the coating film surface on the way from the exposed position of the wire bonding pad to the lower surface of the slider substrate on which the rail is formed. It has been done.

[0016]

In the conventional floating magnetic head 10 shown in FIG. 6, the protective adhesive 46 easily flows into the rail surface 12a because the wire bonding pads 22 and 24 are higher than the surface of the protective film 20. It is believed that this is because there is nothing that prevents the protective adhesive 46 from flowing into the rail surface 12a from the wire bonding pads 22 and 24 to the rail surface 12a.
That is, if the height of the wire bonding pads 22 and 24 is high, the amount of the protective adhesive 46 required to cover the entire bonding portion increases, and since the entire business travels, the adhesive easily flows out to the periphery. Moreover, since there is no means for stopping the adhesive that has flowed out to the periphery, it flows into the rail surface 12a as it is.

Therefore, in order to prevent the adhesive from flowing into the rail surface, the height of the wire bonding pad is lowered or the surface of the coating film (the film coated on the magnetic head element) is coated with the adhesive. It seems that it is effective to have a structure that does not easily flow into the rail surface.

The present invention has been made based on such an idea. That is, according to the first aspect of the invention, the surface of the wire bonding pad is formed at substantially the same height as the surface of the coating film or at a position lower than the surface of the coating film. Since there is no tension, the amount of adhesive itself required to cover the entire bonding site is small, and since there is no protrusion, it is difficult for it to flow out to the periphery, and it becomes difficult for the adhesive to flow into the rail surface.

According to the second aspect of the present invention, the wire bonding pad is the pad body (refers to a portion of the wire bonding pad excluding the wire bonding crimping material).
When the wire bonding crimping material is laminated, the wire bonding crimping material is formed at a position lower than the surface of the coating film. Compared to the conventional one in which the wire bonding crimping material is formed due to the height of the surface of the covering film, the protruding amount of the wire bonding pad is reduced, so that the amount of adhesive used is small and it is difficult to flow out to the periphery. Therefore, it becomes difficult for the adhesive to flow into the rail surface.

According to the third aspect of the present invention, since the barrier or groove is formed on the surface of the coating film on the way from the exposed position of the wire bonding pad to the rail surface, even if the adhesive flows out, the barrier is stopped and the rail is stopped. It can be made difficult to flow into the surface.

[0021]

EXAMPLE An example in which the present invention is applied to an inductive thin film magnetic head will be described below. (Embodiment 1) A first embodiment of the present invention is shown in FIG. The same reference numerals are used for the portions common to the conventional magnetic head. The thin-film magnetic head 50 has rails 14 formed on the lower surface 12a of the slider substrate 12 to form a rail surface. On the end surface 12b of the slider substrate 12 corresponding to the end position of the rail 14, thin film magnetic head elements 16 and 17 of inductive type or the like are formed on the left and right sides by using a thin film forming technique. Thin film magnetic head element 16, 1
7 is entirely covered with a protective film 20 formed by depositing alumina or the like on the entire slider substrate end surface 12b, and only the pole tips 16a and 17a are exposed on the rail surface 12a.

Wire bonding pads 22, 23, 24, 25 are provided at the center of the slider substrate end face 12b in the width direction.
Is formed with its surface exposed from the protective film 20. Wire bonding pads 22, 23, 24,
25 surfaces 22a, (23a), 24a, (25a)
Are formed on the same plane as the surface 20a of the protective film 20. Wire bonding pads 22, 23, 24, 2
5 is the formed two thin film magnetic head elements 16 and 17
Are connected to the coil conductors of the above by lead wires 26, 27, 28 and 29. Wire bonding pads 22, 24 (or 2) connected to one thin film magnetic head element 16 (or 17) arbitrarily selected, which is judged to have good characteristics as a result of the inspection.
3, 25) are respectively bonded with wires (conductor wires), and a recording signal and a reproducing signal are transmitted between the external circuit and the thin film magnetic head element 16 (or 17) through the wires to record information on the disk. , Playback is performed.

A process of manufacturing the wire bonding pads 22 and 24 of the thin film magnetic head 50 shown in FIG. 1 will be described with reference to FIG. Although the manufacturing steps of the wire bonding pads 23 and 25 proceed at the same time, only the pads 22 and 24 are shown here.

(1) Pad lead portion formation Underlayer metal films 30 and 32 are previously formed at the wire bonding pad formation portion in the widthwise central portion of the slider substrate end surface 12b.
Is deposited. The base metal films 30 and 32 are made of the same material as the coil base. Then, simultaneously with the film formation of the coil conductor layers and the core layers of the thin film magnetic head elements 16 and 17, the pad portion 2 is made of the same material (Cu, permalloy, etc.).
2 ', 24' and lead wires 26, 28 are deposited.

(2) Pad section padding Only in the above step (1), the pad sections 22 'and 24' are located lower than the thin film magnetic head elements 16 and 17,
If the protective film 20 is directly formed on it, the pad portion 2 is formed.
Since the 2'and 24 'are not exposed to the outside, the pad portion 2
2'and 24 'are raised by Cu plating or the like.

(3) Formation of Wire Bonding Crimping Material The wire bonding crimping materials 38 and 40 such as Ni-Au are formed by plating and the like after being raised. The pad portion 2 after the wire bonding crimping materials 38 and 40 are formed
As shown in FIG. 8, the entire height of 2'and 24 'is formed higher than the highest portions of the thin film magnetic head elements 16 and 17, and padding polishing after forming the protective film 20 (see the step (5 In the case of)), the thin film magnetic head elements 16 and 17 are prevented from being exposed from the protective film 20.

(4) Protective film formation A protective film 20 of alumina or the like is formed on the raised pad portions 22 ', 24' by a method such as sputtering.

(5) Polishing of Pads The surface of the protective film 20 is polished to expose the bonding pressure-bonding materials 38, 40 of the pad portions 22 ', 24'.

FIG. 9 shows a state in which a wire is bonded to the wire bonding pads 22 and 24 thus created. In FIG. 9, (a) shows a state in which the wires 42, 44 are bonded to the wire bonding pads 22, 24 with an ultrasonic bonder or the like. Further, (b) shows a state in which the protective adhesive 46 is applied after bonding. Since the surfaces of the wire bonding pads 22 and 24 are flush with the surface of the protective film 20 and have not traveled, the protective adhesive 46 is used to have the same adhesive strength as compared with the conventional structure shown in (c). The amount is small. Further, since he has not been on a business trip, the protective adhesive 46 is unlikely to flow out to the periphery. Therefore, as shown in FIG. 10, the protective adhesive 46 is less likely to flow into the rail surface 12a, and it is possible to prevent defective products from being generated.

(Second Embodiment) A second embodiment of the present invention is shown in FIG.
Shown in 1. In this, a concave portion is formed on the surface of the protective film, and a wire bonding pad is formed inside the concave portion.
That is, the thin-film magnetic head 52 has the concave portion 54 in the protective film 20.
Is formed in the wire bonding pad 22,
24 is formed (the same applies to 23 and 25). The wire bonding pads 22 and 24 are, as shown in FIG.
The wire bonding pressure bonding materials 38 and 40 are formed at a position lower than the surface 20 a of the protective film 20. And
Surfaces of the wire bonding pads 22 and 24, that is, surfaces 38a and 40 of the wire bonding crimping materials 38 and 40.
a is the surface 20 of the protective film 20 as shown in FIG.
It is formed at a position lower than a, is formed at the same height as the surface 20a of the protective film 20 as shown in (b), or is formed at the surface 20 of the protective film 20 as shown in (c).
It is formed at a position higher than a. Wires are bonded to the wire bonding pads 22 and 24.

The manufacturing process (the same applies to 23 and 25) of the wire bonding pads 22 and 24 of the thin film magnetic head 52 of FIG. 11 will be described with reference to FIG. (1) Pad lead part formation Underlying metal films 30 and 32 are previously formed at the wire bonding pad formation part in the widthwise central part of the slider substrate end face 12b.
Is deposited. The base metal films 30 and 32 are made of the same material as the coil base. Then, simultaneously with the film formation of the coil conductor layers and the core layers of the thin film magnetic head elements 16 and 17, the pad portion 2 is made of the same material (Cu, permalloy, etc.).
2 ', 24' and lead wires 26, 28 are deposited.

(2) Pad section padding The pad sections 22 'and 24' are padded by Cu plating or the like to be formed higher than the highest portions of the thin film magnetic head elements 16 and 17.

(3) Protective film formation A protective film 20 of alumina or the like is formed on the raised pad portions 22 ', 24' by a method such as sputtering.

(4) Pad Out Polishing The surface of the protective film 20 is polished to expose the pad portions 22 'and 24'.

(5) Pad portion digging The pad portions 22 'and 24' are dug by laser processing including their peripheries.

(6) Wire Bonding Crimping Material Formation Wire bonding bonding materials 38, 40 such as Ni-Au are formed on the pad portions 22 ', 24' by a method such as plating to complete the wire bonding pads 22, 24. .

FIG. 14 shows a state in which a wire is bonded to the wire bonding pads 22 and 24 thus created. In FIG. 14, the height of the wire bonding pads 22 and 24 is shown in each case of FIGS. The wire bonding is performed by bonding the wires 42 and 44 to the wire bonding pads 22 and 24 with an ultrasonic bonder or the like, and then applying a protective adhesive 46 to the bonding portions.

14A and 14B, the protective adhesive 46 is held in the recess 54 (in other words, the inner wall surface 54a of the recess 54 serves as a barrier, or the inner wall surface 54a and the wire bonding are performed. (It is held in the groove 56 between the pads 22 and 24) so that it does not easily go out, or even if it goes out, the amount thereof is small, so that it does not easily flow into the rail surface 12a. Further, in the case of (c), the surface 2 of the wire bonding pads 22 and 24
Since 2a and 24a are exposed above the surface 20a of the protective film 20, the bonding work is facilitated.

(Embodiment 3) A third embodiment of the present invention is shown in FIG.
5 shows. This is a method in which a concave portion is formed on the surface of the protective film and a wire bonding pad is formed inside the concave portion as in the second embodiment, but the manufacturing method is different from that of the second embodiment.
That is, the thin-film magnetic head 58 has the concave portion 6 in the protective film 20.
0 and 62 are formed, and wire bonding pads 22 and 24 are formed therein (the same applies to 23 and 25).
As shown in FIG. 16, the wire bonding pads 22 and 24 are formed from positions where the wire bonding pressure bonding materials 38 and 40 are lower than the surface 20 a of the protective film 20.
The surface of the wire bonding pads 22 and 24, that is, the surface 38 of the wire bonding crimping material 38 and 40.
16a is formed at a position lower than the surface 20a of the protective film 20 as shown in FIG. 16A, or is formed at the same height as the surface 20a of the protective film 20 as shown in FIG. 16B. Or the protective film 2 as shown in FIG.
It is formed at a position higher than the zero surface 20a. Wires are bonded to the wire bonding pads 22 and 24.

The manufacturing process (the same applies to 23 and 25) of the wire bonding pads 22 and 24 of the thin film magnetic head 58 of FIG. 15 will be described with reference to FIG.

(1) Pad Lead Forming Underlying metal films 30, 32 are formed in advance at the wire bonding pad forming location in the widthwise center of the slider substrate end face 12b.
Is deposited. The base metal films 30 and 32 are made of the same material as the coil base. Then, simultaneously with the film formation of the coil conductor layers and the core layers of the thin film magnetic head elements 16 and 17, the pad portion 2 is made of the same material (Cu, permalloy, etc.).
2 ', 24' and lead wires 26, 28 are deposited.

(2) Formation of Protective Film A protective film 20 of alumina or the like is formed by a method such as sputtering so as to cover the entire thin film magnetic head elements 16 and 17.

(3) Hole digging Holes are dug to the depth of exposing the lead portion by laser processing or the like at each position of the pad portions 22 'and 24', and the recess portions 60 and 62 are formed.
To form.

(4) Pad section padding The pad sections 22 'and 24' are padded by Cu plating or the like. The height of the raised portions 34, 36 is made lower than that of the surface 20a of the protective film 20.

(5) Wire Bonding Crimping Material Formation Wire bonding bonding materials 38, 40 such as Ni-Au are formed on the pad portions 22 ', 24' by a method such as plating to complete the wire bonding pads 22, 24. .

FIG. 18 shows a state in which wires are bonded to the wire bonding pads 22 and 24 thus created. In FIG. 18, the height of the wire bonding pads 22 and 24 is shown in each case of FIGS. 16 (a) to 16 (c). The wire bonding is performed by bonding the wires 42 and 44 to the wire bonding pads 22 and 24 with an ultrasonic bonder or the like, and then applying a protective adhesive 46 to the bonding portions.

In the case of FIG. 18A, the protective adhesive 46
Is held in the recesses 60 and 62 (in other words, the recess 6
The inner wall surfaces 60a and 62a of 0 and 62 serve as barriers, making it difficult to go out, or even if it goes out, the amount thereof is small, so that it becomes difficult to flow into the rail surface 12a. In addition, also in the cases of (b) and (c), since the wire bonding pads 22 and 24 are little protruding, the protective adhesive 4
6 does not easily flow into the rail surface 12a. Also,
In the case of (c), the wire bonding pads 22 and 24
Since the surface of the is exposed above the surface of the protective film 20, the bonding work is facilitated.

(Embodiment 4) A fourth embodiment of the present invention is shown in FIG.
9 shows. The thin film magnetic head 64 is the same as the wire bonding pad 24 of the conventional thin film magnetic head 10 shown in FIG.
The groove 66 is formed in the protective film 20 between the rail 25 and the rail surface 12a. According to this, as shown in FIG. 19B, the protective adhesive 46 that has flowed out is dammed by the groove 66, so that it is prevented from flowing into the rail surface 12a. In this case, the wire bonding pads 22, 23,
It is more effective if 24 and 25 are formed low as shown in the first to third embodiments.

(Embodiment 5) A fifth embodiment of the present invention is shown in FIG.
It shows in 0. This thin film magnetic head 68 is the same as the wire bonding pad 24 of the conventional thin film magnetic head 10 shown in FIG.
The barrier 70 is formed on the protective film 20 between the rail 25 and the rail surface 12a. According to this, as shown in FIG. 20 (b), the protective adhesive 46 that has flowed out is dammed by the barrier 70, so that it is prevented from flowing into the rail surface 12 a. In this case, the wire bonding pad 22,
It is more effective if 23, 24 and 25 are formed low as shown in the first to third embodiments.

In the above-mentioned embodiment, the wire bonding pad is applied to the pad body in which the bonding pad crimping material is separately constituted by another material. However, the bonding pad crimping material is separately constituted. Not applicable to wire bonding pad.
Further, the present invention can be applied to thin-film magnetic heads other than inductive, and various other floating magnetic heads.

[0051]

As described above, according to the first aspect of the present invention, the surface of the wire bonding pad is located at substantially the same height as the surface of the coating film or at a position lower than the surface of the coating film. Since it is formed, there is no protrusion of the wire bonding pad, which reduces the amount of adhesive required to cover the entire bonding area itself, and since there is no protrusion, it does not easily flow out to the periphery and The adhesive does not flow easily.

According to the second aspect of the invention, the wire bonding pad is the pad body (refers to the portion of the wire bonding pad excluding the wire bonding crimping material).
When the wire bonding crimping material is laminated, the wire bonding crimping material is formed at a position lower than the surface of the coating film. Compared to the conventional one in which the wire bonding crimping material is formed due to the height of the surface of the covering film, the protruding amount of the wire bonding pad is reduced, so that the amount of adhesive used is small and it is difficult to flow out to the periphery. Therefore, it becomes difficult for the adhesive to flow into the rail surface.

According to the third aspect of the present invention, since the barrier or groove is formed on the surface of the coating film on the way from the exposed position of the wire bonding pad to the rail surface, even if the adhesive flows out, the barrier is stopped and the rail is stopped. It can be made difficult to flow into the surface.

[Brief description of drawings]

FIG. 1 is a perspective view showing a first embodiment of the present invention.

FIG. 2 is a perspective view showing a conventional thin film magnetic head.

FIG. 3 is a diagram showing a process of manufacturing a wire bonding pad of the thin film magnetic head of FIG.

FIG. 4 is an explanatory view of a raised height in a raised pad portion in step (2) of FIG.

5 is a diagram showing a state in which wire bonding is performed on the wire bonding pad of FIG.

FIG. 6 is a perspective view showing a state where the adhesive has flowed into the rail surface 12a by applying the protective adhesive of FIG. 5 (b).

FIG. 7 is a diagram showing a process of manufacturing a wire bonding pad of the thin film magnetic head of FIG.

FIG. 8 is an explanatory diagram of a pad portion height according to steps (2) and (3) of FIG. 7.

9 is a diagram showing a state in which wire bonding is performed on the wire bonding pad of FIG.

FIG. 10 is a perspective view showing a state in which the protective adhesive of FIG. 9 (b) is applied.

FIG. 11 is a perspective view showing a second embodiment of the present invention.

12 is a diagram showing various examples of the height of the wire bonding pad in FIG.

13 is a diagram showing a process of manufacturing a wire bonding pad of the thin film magnetic head of FIG.

FIG. 14 is a diagram showing a state of wire bonding in each case of FIG. 12;

FIG. 15 is a perspective view showing a third embodiment of the present invention.

16 is a diagram showing various configuration examples of the height of the wire bonding pad in FIG.

FIG. 17 is a diagram showing a process of manufacturing a wire bonding pad of the thin film magnetic head of FIG.

FIG. 18 is a diagram showing a state of wire bonding in each case of FIG. 16;

FIG. 19 is a perspective view showing a fourth embodiment of the present invention.

FIG. 20 is a perspective view showing a fifth embodiment of the present invention.

[Explanation of symbols]

12 slider substrate 12a rail surface 14 rails 16 and 17 thin film magnetic head element (magnetic head element) 20 protective film (covering film) 22, 23, 24, 25 wire bonding pad 38, 40 wire bonding crimping material 42, 44 wire ( Conductive wire 46 Protective adhesive (adhesive) 50, 52, 58, 64, 68 Thin film magnetic head (magnetic head) 54a, 62a, 70 Barrier 56, 66 Groove

Claims (3)

[Claims] 1. A rail is formed on a lower surface of a slider substrate,
A magnetic head element is formed on the end surface of the slider substrate corresponding to the end position of the rail, a coating film for coating the magnetic head element is formed on the end surface, and the magnetic head element is formed on the end surface. In the floating magnetic head, a conductive bonding pad is formed so as to be exposed from the coating film, a conductive wire is bonded to the bonding pad, and an adhesive is applied to the bonded portion. A structure of a wire bonding pad formation surface of a floating magnetic head in which a surface of a pad is formed at a height substantially the same as a surface of the coating film or lower than a surface of the coating film. 2. A rail is formed on the lower surface of the slider substrate,
A magnetic head element is formed on the end surface of the slider substrate corresponding to the end position of the rail, a coating film for coating the magnetic head element is formed on the end surface, and the magnetic head element is formed on the end surface. In the floating magnetic head, a conductive bonding pad is formed so as to be exposed from the coating film, a conductive wire is bonded to the bonding pad, and an adhesive is applied to the bonded portion. The pad is formed by laminating a wire bonding crimping material made of another conductive material on a pad body made of a conductive material, and the wire bonding crimping material is formed from a position lower than the surface of the coating film. Structure of the wire bonding pad formation surface of the floating magnetic head formed. 3. A rail is formed on the lower surface of the slider substrate,
A magnetic head element is formed on the end surface of the slider substrate corresponding to the end position of the rail, a coating film for coating the magnetic head element is formed on the end surface, and the magnetic head element is formed on the end surface. In the floating magnetic head, a conductive bonding pad is formed so as to be exposed from the coating film, a conductive wire is bonded to the bonding pad, and an adhesive is applied to the bonded portion. A structure of a wire bonding pad formation surface of a floating magnetic head in which a barrier or groove is formed on the surface of the coating film on the way from the exposed position of the pad to the lower surface of the slider substrate on which the rail is formed.