JP2832562B2 - Thin film conductor coil chip for magnetic head and magnetic head using the same - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a by a conductive coil of the magnetic head in thin film conductor coil, the magnetic head recording allows to respond to downsizing as well as improve the reproduction characteristics and the influence of external noise Magnetically resistant
Thin film conductor coil chip for head and magnetic head using it
It relates to head.

[0002]

2. Description of the Related Art Conventional magnetic heads are shown in FIGS.
As shown in FIG. 1, a magnetic head 3 is provided on a slider 2 on which a rail 1 is formed. This magnetic head 3 is shown in FIG.
As shown in FIG. 21, an I-shaped core 4 and a U-shaped core 5 are provided, and either the I-shaped core 4 or the U-shaped core 5 (FIG.
In the case of 0, the coil 6 coated with insulation on the I-shaped core 4) is wound. A very small gap 7 is provided between the I-shaped core 4 and the U-shaped core 5, and a magnetic circuit 8 is formed between the I-shaped core 4 and the U-shaped core 5. It has become. And the rail 1 airflow exit side inclined surface 9 and the air flow entrance side inclined surface 10 is formed as shown in FIG. 19,
The slider 2 flies. In addition, a wide space 11 is formed in the U-shaped core 5 so that the coil 6 can be wound.

[0003] At present, magnetic recording tends to have a higher density. Therefore, in order to cope with this increase in magnetic recording density, the magnetic head must also be reduced in size and weight. However, when the magnetic head is reduced in size and weight, the conventional magnetic head has the following problems.

That is, to reduce the size of the conventional magnetic head, the I-shaped core and the U-shaped core are also reduced. In order to wind a coil around this small I-shaped core or U-shaped core, the space becomes narrow, so that an extremely thin coil must be used. For this reason, there has been a problem that the coil is disconnected in the coil winding step, or the insulating coating is peeled off, resulting in a defective product, resulting in a low yield and low reliability. As a countermeasure against the yield and reliability, it is conceivable to manually wind a coil, but there is a problem that productivity is low. For these reasons, there is a limit to the size and weight reduction of a magnetic head using a coil-wound conductor coil from a structural point of view, and it is not possible to sufficiently cope with high density magnetic recording. Was. In order to solve these problems, a thin film magnetic head has been developed at present.

In the above-mentioned conventional thin film magnetic head, a magnetic head 12 having a small thickness t is provided at one end of the slider 2 as shown in FIG. In this magnetic head, a gap 7 is formed as shown in FIG. 18, and a magnetic circuit 13 is formed within a small thickness t.

[0006]

The above-mentioned conventional thin-film magnetic head solves the problem of the conventional magnetic head using a conductor coil of the type wound with a coil, but the following problem is further solved. is there. That is, in the above-mentioned conventional thin-film magnetic head, the magnetic circuit 13 is formed in the magnetic head 12 having a small thickness t, so that the cross-sectional area of the magnetic circuit is reduced and the magnetic resistance is increased. When the circuit area is reduced and the magnetic resistance is increased, the induced electromotive force is reduced, and there is a problem that the recording and reproducing characteristics are deteriorated.

To explain this theoretically, the magnetic flux Φ of the magnetic core is proportional to the number of turns N of the coil and the current i.
It is inversely proportional to m. This relationship can be expressed by an equation: Φ = Ni / R
In order to increase the magnetic flux Φ, it is necessary to increase the magnetic circuit area and reduce the magnetic resistance Rm. On the other hand, the induced electromotive force e required for the reproduction output is proportional to the time derivative of the magnetic flux Φ. This can be expressed as follows: e = −N × dΦ / d
In order to increase the induced electromotive force e, it is necessary to increase the magnetic flux Φ. To increase the magnetic flux Φ, the magnetic circuit area must be increased and the magnetic resistance Rm must be reduced according to the above equation. As described above, when the magnetic circuit area is small, the magnetoresistance increases, the induced electromotive force decreases, and the recording and reproducing characteristics deteriorate.

In addition, the following problems arise with the downsizing of the magnetic head. That is, the induced electromotive force e must be increased to improve the reproduction output characteristics. In order to increase the induced electromotive force e, as is apparent from the above equation, the magnetic circuit area is increased to increase the magnetic flux Ф, and the time t for reading information from one recording portion on the magnetic disk is reduced. There is a need. In order to reduce the time t, the linear velocity V of the magnetic head must be increased. That is, since the linear velocity V is the product of the distance L from the position of the magnetic head to the center of rotation of the magnetic disk and the angular rotational velocity ω of the magnetic disk, V = ωL, it is necessary to increase the linear velocity V of the magnetic head. Must increase L. However, since the diameter of the magnetic disk must be reduced due to the demand for downsizing the magnetic disk drive, there is a situation in which the distance L from the position of the magnetic head to the rotation center of the magnetic disk cannot be increased. Therefore, there is no other way to reduce the size of the magnetic desk to increase the induced electromotive force e and improve the reproduction output, except to increase the magnetic circuit area to increase the magnetic flux Φ. There is a problem that the head cannot sufficiently cope with a miniaturized magnetic disk.

Next, external noise is generated by the current flowing through the coil.
In order to offset and reduce the coil, make the coil a balanced winding.
The Although it is ideal that, the conventional thin film magnetic head so as to form a magnetic circuit in the thin film core, since the conductor coil and the core thin film integrally to the balance turn coil Can not. The external noise to the
There is a problem that the offset cannot be reduced .

According to the present invention, unlike the above-mentioned conventional thin film magnetic head, both the conductor coil and the core are not formed as thin films.
By making the conductor coil only a thin film, the magnetic circuit area is made sufficiently large to reduce the magnetic resistance, improve the recording and reproduction characteristics, enable miniaturization, and balance winding of the coil. And a thin-film conductor coil chip for a magnetic head, which improves the yield, reliability and productivity of a coil-type magnetic head, and at the same time , uses the same.
The present invention provides a magnetic head .

[0011]

Means for solving the above problem is to provide a magnetic head having a gap formed by a pair of cores.
For magnetic heads to form a magnetic circuit by bonding to a head
In the thin film conductor coil chip, the magnetic head
I-shaped core made of non-magnetic material and U-shaped core
Formed on the thin film conductor coil chip for the magnetic head.
With a magnetic material in between, a substrate with the magnetic material integrated at both ends is installed.
Magnetically connected to the magnetic material across the non-magnetic material of the substrate
A magnetic core is provided, and the magnetic core is used as a thin-film magnetic core.
To form a thin-film conductor coil by balanced winding on the substrate
And the leading end of the thin film conductor coil is connected to the thin film conductor coil.
Subsequently, an electrode pad portion is formed, and the I-type core is formed.
A magnetic circuit is formed by bonding the substrate to
And a thin film conductor coil chip for a magnetic head. Ma
Further, the substrate is provided integrally with the I-shaped core.
2. The thin film conductor coil for a magnetic head according to claim 1,
Up. Further, the thin film conductor for a magnetic head described above.
Air outflow from coil tip to slider formed rail
A thin film conductor for a magnetic head, which is bonded to a side end surface.
This is a magnetic head using a body coil chip.

[0012]

According to the present invention, since only the conductor coil is formed into a thin film, a magnetic circuit is formed between the magnetic core and the magnetic body of the substrate. As a result, the area of the magnetic circuit is determined by arbitrarily selecting the shapes and dimensions of the magnetic material of the magnetic core and the substrate, and a necessary magnetic circuit area can be obtained. Since the thin-film conductor coil is formed with the magnetic core as the magnetic core, it is possible to perform balanced winding of the thin-film conductor coil. Further
The pad for the electrode is continuously connected to the tip of the thin film conductor coil.
By being formed, this can be easily provided
In addition, the number of man-hours for the operation is reduced.

[0013]

An embodiment of the present invention will be described below with reference to the drawings. 1 and 2, the mounting magnetic piece 14 is configured as follows. A substrate 23 is formed by bonding the magnetic members 15 and 16 with a non-magnetic member 17 and integrating them.
A magnetic core 20 having magnetic cores 21 and 22 is provided on the substrate 23.
The thin film conductor coil 19 is formed using the magnetic cores 21 and 22 as magnetic cores. 18 is an insulating material. In the present embodiment, the thin-film conductor coil 19 is formed in two layers of 19A and 19B, and is wound in a balanced manner with the two magnetic cores 21 and 22 as the magnetic cores. The end of the coil 19B is
Formed on the electrode pad portion P on the surface of the mounting magnetic piece 14
Have been. Also, as shown in FIGS. 3 and 4, it is also possible to make the thin film conductor coil 19 single-turn with the magnetic core 21 as the magnetic core. The other parts are the same as those in FIG. 1, and the same parts are denoted by the same reference numerals and description thereof will be omitted.

Next, the manufacture of the mounting magnetic piece 14 will be described with reference to FIG.
The substrate 23 is manufactured by bonding and integrating 5 and 16 (eg, ferrite) with a non-magnetic material 17 (eg, glass). The substrate 23 is manufactured by forming a groove in the magnetic material by machining, filling the groove with a non-magnetic material that has been melted and solidifying, and then grinding both surfaces of the magnetic material into mirror surfaces. Next, after forming the first insulating layer 29A on the mirror surface of the substrate 23 in the second step (b), the first layer thin film conductor coil 19A is formed by a known technique. Next, in a third step (c), after forming the second layer insulating film 29B on the first layer thin film conductor coil 19A, the second layer thin film conductor coil 19B is formed by a known technique. Then, in the fourth step (d), after forming the third-layer insulating film 29C on the second-layer thin-film conductor coil 19C, the magnetic core 20 is formed, and the process is completed.

In the manufacture of the mounting magnetic piece 14, first,
The second and third insulating films 29A, 29B, and 29C are made of an organic resin-based insulating film such as photoresist, polyimide, or Si.
An inorganic insulating film such as O ₂ or Al ₂ O ₃ is formed by a known technique, and the first and second thin film conductor coils 19A and 19B are copper-plated by a frame plating method using a resist frame. It is formed by a forming method, a method of etching a conductive thin film of copper or the like using a photoresist mask, or the like. Next, in forming the magnetic core 20, a through hole for forming the magnetic cores 21 and 22 of the magnetic core 20 is opened by etching, and a par plating is performed by a frame plating method using a resist frame.
It is performed by a method of plating a magnetic film such as a metal alloy, a method of etching a magnetic thin film such as a permalloy using a resist mask, or a method of bonding a U-shaped magnetic core.

The mounting magnetic piece 14 manufactured as described above
Is mounted on the slider as follows. In FIG. 6, the I-shaped core 24 and the U-shaped core 27 are integrated with the slit 2A of the slider 2 on which the rail 1 is formed by bonding and bonded by glass bonding which is a non-magnetic material. Next, the substrate 23 of the mounting magnetic piece 14 is bonded to the end surface 2B of the slider 2 and the upper surface of the I-shaped core 24 by glass bonding or a resin adhesive. FIG. 7 and FIG.
In this manner, the mounted magnetic piece 14 is moved out of the slider 2 by air.
Mounted on the side end surface (upper part in FIG. 7, front part in FIG. 8)
It shows the state where it was done.

Next, the manufacture of the core will be described. First, in the manufacture of the core shown in FIG. 9, in the second step (b), the I-shaped core 24A and the U-shaped core 27, which are magnetic bodies formed separately in the first step (a), are glass-bonded. To adhere together. Next, in the third step (c), the intermediate portion of the I-shaped core 24A
24B is cut off, and a glass material is injected into the cut off portion in the fourth step (d) to form an I-shaped core 24.

Next, in the manufacture of the core shown in FIG. 10, in the first step, the glass material 17 is previously integrated with the I-shaped core 24A made of a magnetic material, and in the next second step (b), the core made of a magnetic material is used. The glass core is bonded to the U-shaped core 27. In the third step (c), the I-shaped core 24A is ground until the glass material 17 is exposed, thereby completing the process.

Next, the manufacture of the core shown in FIG.
30 is joined so as to provide a gap 32 below.
At this time, the gap 32 side is a non-magnetic adhesive
At 31, the magnetic bodies 29 and 30 are bonded together, and the other parts are bonded with an adhesive made of a magnetic or non-magnetic body. The magnetic bodies 29 and 30 thus joined are then cut away so as to form a concave groove 29c as shown in FIG. As a result, the part 29A of the magnetic body 29 is joined to the magnetic body 30A in a magnetically connected state, while the part 29A of the magnetic body 29 is joined.
B is bonded to the magnetic body 30A in a state where it is magnetically insulated by the adhesive 31 which is a non-magnetic body, and the I-type core 24 is formed.

A state in which the core manufactured in this way and the mounting magnetic piece 14 are bonded will be described with reference to FIG. I
The mold core 24 is integrally formed by bonding magnetic materials 25 and 26 with a non-magnetic material 17, and the substrate 23 of the mounting magnetic piece 14 is bonded to the I-type core 24. Reference numeral 27 denotes a U-shaped core made of a magnetic material. The U-shaped core 24 is bonded to the I-shaped core 24 with a slight gap 28 provided between the U-shaped core 24 and the I-shaped core 24. 29 is an insulating material. FIG.
The embodiment shown in FIG. 4 differs from the embodiment shown in FIG. 13 in that the I-shaped core 24 is omitted and the substrate 23 of the mounting piece 14 is
7 was directly adhered. The gap 28 is the substrate 2
3 and between the U-shaped core 27. Other parts are the same as those shown in FIG.
The same portions are denoted by the same reference numerals and description thereof will be omitted.

15 and 16, with the mounting magnetic piece 14 mounted on the slider 2, the lower end of the substrate 23 is inclined.
It is processed into 33 to form an air inflow inclined surface. And figure
In the case of 15, the substrate 23, the I-shaped core 24 and the U-shaped core 27
Are the same height, and are lower than the height of the slider 2. In the case of FIG. 16, the slider 23 is mounted on the slider 2 with the substrate 23 and the slider 2 having the same height and the I-shaped core 24 and the U-shaped core 27 having the same height.

The operation of this embodiment having the above-described configuration will be described below. As shown in FIGS. 1 to 4, only the thin film conductor coil 19 is formed on the substrate 23. This thin-film conductor coil 19 has a resist frame as described with reference to FIG.
Since it is formed by a method of forming by copper plating by a frame plating method using a method, or a method of etching a conductive thin film of copper or the like using a photoresist mask,
There is no disconnection, and a thin film conductor coil 19 with high yield and high reliability can be obtained.
Further, the thin film conductor coil 19 is formed in this way, and the substrate 23
Can be produced by machining, and the formation of the magnetic core 20 is also achieved by opening a through hole for forming the magnetic cores 21 and 22 of the magnetic core by etching, and by frame plating using a resist frame. It is performed by a method of plating a magnetic film such as permalloy by a method, a method of etching a magnetic thin film such as permalloy using a resist mask, or a method of bonding a U-shaped magnetic core. In addition, the mounted magnetic piece 14 can be manufactured by an automatic processing line, thereby improving productivity.

Next, since the conductor coil 19 is formed on the surface of the substrate 23, the area thereof can be arbitrarily determined.
As shown in FIGS. 1 and 2, it is possible to carry out balanced winding of the conductor coil 19 with the magnetic cores 21 and 22 of the magnetic core 20 as the magnetic cores. As a result, external noise is canceled.

Next, referring to FIG. 13, the magnetic members 15 and 16
And the magnetic members 25 and 26 of the I-type core 24 are nonmagnetic members 17
Magnetically insulated by the thin film conductor coil 19
When current is passed through A and 19B, the magnetic material of the magnetic core 20 and substrate 23
15, 16, magnetic body 25, 26 of I-shaped core 24 and U-shaped core
27 forms a magnetic circuit. The area of the magnetic circuit 34 can be arbitrarily determined by selecting the shapes and dimensions of the magnetic core 20, the magnetic members 15 and 16 of the substrate 23, the magnetic members 25 and 26 of the I-type core 24, and the U-shaped core 27. Is possible. Also,
Also in the case of the embodiment shown in FIG. 14, the magnetic circuit is a magnetic core 20, a substrate
23 are formed between the magnetic members 15, 16 and the U-shaped core 27, and the area of the magnetic circuit is also the same as the magnetic core 20, the magnetic members 15, 16 and the U-shaped core 27 of the substrate 23. The selection allows arbitrary determination. Similarly, in the case shown in FIG. 12, a magnetic circuit is formed between the magnetic core 20, the magnetic bodies 15 and 16 of the substrate 23, and the magnetic bodies 29A, 30A and 29B, and the area of the magnetic circuit is It can be arbitrarily determined by selecting the shapes and dimensions of the magnetic bodies 15, 16 of the substrate 23 and the magnetic bodies 29A, 30A, 29B.

In FIG. 13, a similar magnetic circuit 34 is formed even if the portion of the non-magnetic member 17 of the I-shaped core 24 is a gap.

[0026]

According to the present invention, as described in detail above, according to the present invention, a mounted magnetic piece having only a conductor coil as a thin-film conductor coil is formed on a substrate having a magnetic material integrated with a non-magnetic material interposed therebetween. Since the magnetic circuit is formed via the magnetic core and the magnetic material of the substrate, the area of the magnetic circuit can be selectively and sufficiently increased. Thereby, the magnetic resistance can be reduced and the recording and reproducing characteristics can be improved. In addition, since only the conductor coil is formed on the substrate as a thin-film conductor coil, balanced winding of the thin-film conductor coil becomes possible, and magnetic noise can be eliminated. Since the area of the magnetic circuit can be arbitrarily and selectively determined, even if the diameter of the magnetic disk is small, it is possible to increase the reproduction output and to cope with miniaturization. Since the thin-film conductor coil is formed on the substrate, there is no disconnection, and the yield and the reliability can be improved, and the productivity can be improved. In addition, the end of the coil is
Is formed on the electrode pad part,
Extremely easy fabrication of the pole parts.

[Brief description of the drawings]

FIG. 1 is a perspective view showing an embodiment of the present invention.

FIG. 2 is a longitudinal sectional view taken along line AA of FIG.

FIG. 3 is a perspective view of another embodiment of the present invention.

FIG. 4 is a longitudinal sectional view taken along line BB in FIG. 3;

FIG. 5 is a view showing a manufacturing process of the embodiment of FIG. 1;

FIG. 6 is a perspective view showing a state where the mounting magnetic piece of FIG. 1 is mounted on a slider.

FIG. 7 is a perspective view showing a mounted state in FIG. 6;

FIG. 8 is an enlarged perspective view of a main part of FIG. 7;

FIG. 9 is a view showing a manufacturing process of the core.

FIG. 10 is a diagram showing another manufacturing process of the core.

FIG. 11 is a perspective view of still another manufacturing process of the core.

FIG. 12 is a perspective view showing a state in which the core material of FIG. 11 has been processed and completed.

FIG. 13 is a longitudinal sectional view showing a state where the core and the mounting magnetic piece are bonded.

FIG. 14 is a longitudinal sectional view when a substrate of a mounting magnetic piece is directly adhered to a U-shaped core.

FIG. 15 is a longitudinal sectional view showing a state where the slider is mounted on the slider.

FIG. 16 is a longitudinal sectional view showing a state where the slider is mounted on the slider.

FIG. 17 is a plan view of a conventional example.

18 is a front view of FIG.

FIG. 19 is a perspective view of a conventional example.

FIG. 20 is a side view of the conductor coil in FIG. 19;

FIG. 21 is a right side view of FIG. 20.

[Description of Symbols] 1 Rail 2 Slider 2B End surface 9 Air outflow side inclined surface 15 Magnetic body 16 Magnetic body 17 Nonmagnetic body 19 Thin film conductor coil 20 Magnetic core 23 Substrate 24 I-type core 25 Magnetic body 26 Magnetic body 27 Mold core 28 Gap 34 Magnetic circuit P Pad part

──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int.Cl. ⁶ , DB name) G11B 5/17 G11B 5/127 G11B 5/31

Claims (3)

(57) [Claims] 1. A magnet having a gap formed by a pair of cores.
Magnetic head for bonding to the magnetic head to form a magnetic circuit.
In the thin-film conductor coil chip for magnetic head,
I-shaped core and U-shaped core whose middle part is made of non-magnetic material
To form a thin film conductor coil chip for the magnetic head.
Is a substrate with a magnetic material integrated at both ends with a non-magnetic material sandwiched between
And a magnetic material is provided across the non-magnetic material of the substrate.
Providing a connected magnetic core, and connecting the magnetic core to a thin-film magnetic core;
To form a thin-film conductor coil with balanced winding on the substrate
And the thin film conductor coil at the tip of the thin film conductor coil.
A pad portion for an electrode is formed continuously,
It is characterized in that the substrate was bonded to the core to form a magnetic circuit.
Thin-film conductor coil chips for magnetic heads. 2. The substrate according to claim 1 , wherein said substrate is provided integrally with said I-shaped core.
The thin film conductor for a magnetic head according to claim 1, wherein
Body coil chip. 3. The magnetic head according to claim 1, wherein
A thin-film conductor coil chip for
Magnetic head, which is adhered to the air outlet side end face of the
Magnetic head using a thin-film conductor coil chip for a pad.