JPH07299723A - Thin groove processing machine - Google Patents

Abstract

PURPOSE:To provide such a thin groove processing machine that can efficiently remove fouling such as processing scraps by efficiently supplying cutting liquid to a part to be processed and supplying the cutting liquid to the part to be processed at a high pressure. CONSTITUTION:In a thin groove processing machine comprising a grinding wheel blade 1 which rotates at a high speed, a pedestal 16 which is fixed to a rotary shaft and to which the grinding wheel blade 1 is attached, and a flange 2 which fixes the grinding wheel blade 1 to the pedestal 16, at least either one of the flange 2 or the pedestal 16 is provided with a plurality of grooves 6 in its surface in the direction of a radiation ray whose center is set as the rotation center.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a thin grooving machine used for grooving a semiconductor wafer or cutting out a magnetic head of a VTR, and in particular, a cutting fluid supplied for cooling during cutting and removal of machining chips. The present invention relates to a thin groove processing machine capable of efficiently supplying the processed portions of a grindstone blade and a workpiece.

[0002]

2. Description of the Related Art A thin groove machine is widely used for processing thin grooves between chips in order to separate semiconductor chips formed on a semiconductor wafer. Further, such a thin groove processing machine is also used when cutting out a magnetic head of a VTR or processing the surface into a predetermined shape. Such a thin groove processing machine is generally called a dicing device. FIG. 4 is a diagram showing a basic configuration of a conventional thin groove processing machine. Note that, in the drawings, common functional portions are denoted by the same reference numerals for ease of explanation.

In FIG. 4, reference numeral 100 is a semiconductor wafer of a workpiece to be grooved, and 101 is a stage for holding the semiconductor wafer 100, which has a moving function. 1 is a grindstone blade, which rotates at high speed. This grindstone blade 1 is usually called a blade, and the name of this blade will be used in the following description. Reference numeral 2 is a flange for fixing the blade 1 to the base of the rotary shaft. 9 is a spindle motor for rotating the grindstone blade 110. The blade 1 is made by fixing abrasive grains such as diamond with nickel or the like.

At the time of processing with a thin groove processing machine, it is necessary to supply a cooling liquid such as pure water and a cutting liquid for cooling the processed portion and discharging the processing waste by cutting. Reference numeral 3 is a cooling liquid supply pipe for supplying the cooling liquid to the processed portion, and the cooling liquid is supplied to the cooling liquid supply pipe 3 by the hose 12.
1 and 122. Coolant supply pipe 3
Are usually provided on both sides of the blade 1, so that there are two blades in parallel with the blade 1, but here it is assumed that only one blade is provided.

Further, it is desirable that the cutting liquid is always adhered to the blade 1 so that the blade 1 and the cutting liquid are well compatible with each other. However, since the blade 1 is rotating at a high speed, there is a problem that the attached cutting fluid is scattered from the blade 1 by the centrifugal force of rotation. Therefore, cutting fluid is sprayed to the blade 1 in front of the rotational position of the processed portion to improve the familiarity between the processed portion and the blade.
Reference numeral 25 is an injection nozzle that ejects cutting fluid for this purpose, and is attached to the block 26. 123
Is a hose that supplies cutting fluid to the injection nozzle 25.

5A and 5B are views showing the supply of the cooling liquid to the processed portion by the cooling liquid supply pipe 3, FIG. 5A is a view seen from a direction perpendicular to the rotation axis of the blade, and FIG. 5B is a view of the blade. It is the figure seen from the rotating shaft direction. As shown in FIG.
From the cooling liquid supply pipe 3, the cooling liquid 5 is supplied to the processing portion of the workpiece 100 by the blade 1. Since the cooling liquid is supplied in a large amount, it covers the surface of the workpiece 100, rinses off the cutting waste on the surface of the workpiece, and flows out onto the stage 101. Since the blade 1 rotates at a high speed, the cooling liquid and the cutting liquid are intensely scattered toward the rear side in the rotation direction. In addition,
Reference numeral 16 is a pedestal to which the blade 1 is attached.

The cutting fluid sprayed from the jet nozzle 25 to the blade 1 is the same as that supplied from the cutting fluid supply pipe 3, but the cutting fluid jetted from the jet nozzle 25 is the same as the blade 1 and the cutting fluid. Its main purpose is to improve compatibility with the liquid, and cooling of the processed portion and removal of processing waste have not been considered so far.

A conventional example of the jet nozzle 25 for jetting the cutting fluid to the blade 1 on the front side of the processed portion will be described. Figure 6
Is a view showing a conventional example of the injection nozzle 25, (a) is a view seen from above perpendicular to the rotation axis of the blade,
(B) is the figure seen from the rotating shaft direction of a blade. Figure 6
In the figure, 16 is a pedestal attached to the spindle motor 9. Reference numeral 2 denotes a flange for fixing the blade 1 to the base 16, which is fixed to the base 16 with a nut 15. The flange 2 is usually thicker at the center than at the periphery.

As shown in the figure, in this conventional example, the cutting fluid is jetted from the lateral direction of the blade 1 toward the center of the blade 1. When jetted as shown in FIG. 6, the cutting fluid is well adapted to the blade 1, but the surfaces of the blade 1, the flange 1, and the pedestal 16 are relatively smooth, and since they are rotating at high speed, they are jetted from the nozzle 25. The cutting fluid is scattered mainly in the part away from the processed part, as shown in FIG. 6 (b). Therefore, the cutting fluid supplied from the nozzle 25 is hardly supplied to the processed portion. The cutting fluid supplied to the portion other than the processing portion hardly contributes to removal of the processing waste, and the cooling of the processing portion also cools the portion of the workpiece 100 away from the processing portion, so that the cooling efficiency is high. Absent. Therefore, as shown in FIG. 6, by spraying from the lateral direction of the blade 1 toward the center of the blade 1, the compatibility of the cutting fluid with the blade 1 is good, but it contributes almost to the removal of machining waste and cooling of the machining part. Will not do.

[0010]

In an actual apparatus, a large amount of cooling liquid is supplied from the cooling liquid supply pipe 3 in order to cool the blade 1 and the workpiece 100 and remove machining waste. The used cooling liquid is recovered, purified, and reused, but the supply amount is large and the cost required for the cooling liquid is a big problem.

Moreover, even if a large amount of cooling liquid is supplied as described above, the cooling liquid jetted from the cooling liquid supply pipe 3 toward the processed portion is a thin groove at the processed portion, and therefore, FIG.
Even if the cooling liquid is jetted from the side, the inside of the groove is not efficiently contacted as shown in (3), and there is a problem that the processing waste cannot be sufficiently removed. In particular, it is the current situation that it is difficult to remove the processing chips that are firmly attached. In addition, the cutting fluid supplied from the nozzle 25 hardly contributes to the removal of machining chips and the cooling of the machined part under the present circumstances.

In the present invention, paying attention to such a point, the cutting fluid is efficiently supplied to the actual machining portion, and further, the cutting fluid is supplied to the machining portion with a strong pressure to supply the cutting fluid. The objective is to realize a thin groove processing machine that reduces the amount of waste and efficiently removes processing waste.

[0013]

The thin grooving machine of the present invention comprises:
It has a grindstone blade (blade) that rotates at a high speed, a pedestal that is fixed to the rotating shaft and to which the grindstone blade is attached, and a flange that fixes the grindstone blade to the pedestal. On the other hand, a plurality of grooves in the direction of radiation centered on the center of rotation are provided on the surface.

In the second aspect of the present invention, the flange or the pedestal provided with the groove has a shape in which the center portion is thicker than the peripheral portion, and the inner wall in the direction of radiation centering on the rotation center of the groove is Higher on the outer wall in the direction of radiation.

[0015]

In the conventional thin grooving machine, the surfaces of the blade, the flange and the pedestal are relatively smooth, and the cutting fluid adhering to the surface is difficult to be retained. On the other hand, in the thin grooving machine of the present invention, a groove is provided on the surface of at least one of the flange and the pedestal, and since this groove holds the cutting fluid, the cutting fluid is more easily retained than in the conventional case. Become. Since the cutting fluid held in the groove also rotates at a high speed, centrifugal force acts on the cutting fluid held in the groove. Therefore, the cutting fluid held in the groove is scattered at high speed in the tangential direction of rotation.
As a result, the cutting fluid can remove stains such as processing chips with a stronger force.

In particular, since the cutting fluid is jetted from the nozzle before the processing portion, the cutting fluid entering the groove there is scattered at a high speed toward the outside of the radiation, that is, toward the groove at the processing portion. As a result, the processing waste in the groove can be efficiently washed. In addition, since the cutting fluid is more easily retained than in the conventional case, the familiarity between the cutting fluid and the blade is improved.

Since the blade, the flange, and the pedestal rotate at high speed, the cutting fluid held in the groove is immediately scattered outward, so that the cutting fluid scattered outward in the machining portion is jetted from the nozzle. Most of the cutting fluid is used. Therefore, it is desirable that the jet of cutting fluid from the nozzle be as close to the processed portion as possible. In order for the cutting fluid held in the groove to be ejected at high speed in the outer direction of the radiation at the processing part,
It is desirable that the radial outward wall of the groove be lower than the other portions.

[0018]

1 is a view showing a blade and a flange in a thin groove machine of a first embodiment of the present invention, (a) is a view as seen from the direction of a rotary shaft, and (b) is a rotary shaft. It is the figure seen from the direction perpendicular to. The thin grooving machine of the embodiment as a whole has a cutting fluid supply pipe and the like as shown in FIG. 4, but illustration and description of the same parts as the conventional one will be omitted here. The blade is, for example, 60,000 rpm
It is rotating at a high speed.

In FIG. 1, reference numeral 1 is a blade, 2
Is a flange, 6 is a groove, 16 is a pedestal, 7 is a screw connecting the flange 2 and the pedestal 16, and 8 is a rotation shaft. As shown in the figure, a large number of grooves 6 are formed on the surfaces of the flange 2 and the pedestal 16, and the grooves 6 are radial grooves centered on the rotation center of the flange 2 and the pedestal 16. The groove may be formed in either the flange 2 or the pedestal 16.

The groove 6 can have various shapes. For example, even if the flange 2 has a plane perpendicular to the rotation axis, and even if the walls in each direction form grooves of the same height in the plane, the amount of cutting fluid retained by the flange 2 increases and is retained. The cutting fluid comes out of the groove even during one rotation from the processed portion. Since a part of it adheres to the blade, the compatibility between the cutting fluid and the blade is improved.

However, in order to remove the machining chips in the groove being machined, it is desirable that the cutting fluid be spattered at high speed toward the groove in the machined portion. The groove of the first embodiment has a shape suitable for scattering the cutting fluid at a high speed, and the groove shape will be described with reference to FIG. 2A and 2B are views showing a groove shape in the first embodiment, FIG. 2A is a view as seen from a direction perpendicular to a rotation shaft, and FIG. 2B is a cross-sectional view including the rotation shaft, both of which are partially shown. Indicates.

As shown in FIG. 1, generally, the flange 2 and the pedestal 16 are circular, the central portion is thicker than the peripheral portion, and the inclined surface is provided in the portion close to the peripheral portion. In this embodiment, a groove is formed on this inclined surface. In FIG. 2, reference numeral 61 is an inner wall in the radial direction centering on the rotation center of the groove, and 6
2 and 63 are circumferential walls. Since the groove is formed on the inclined surface, the outer side in the radial direction is open and there is no wall. Since the cutting fluid inside the groove is held by the walls in three directions, the cutting fluid rotates as the flange 2 and the pedestal 16 rotate at high speed. Due to the centrifugal force of this rotation, an external force is applied to the cutting fluid inside the groove. Since there is no wall on the outside, the cutting fluid inside the groove is spattered at high speed in the tangential direction of rotation.

As shown in FIG. 4, the cooling liquid is jetted from the lateral direction to the blade 1 by the nozzle 25. The cooling liquid injected here enters the groove and is scattered at high speed in the tangential direction of rotation. Since the time until the cooling liquid that has entered the groove is scattered outside is shorter as the rotation speed of the groove is higher, the position of the nozzle 25 is adjusted according to the rotation speed, and the cooling liquid held in the groove is processed. It is desirable to be scattered toward the inside of the groove inside. Therefore, in FIG. 4, the nozzle 25 is provided at a position of 90 ° with respect to the processed portion, but when the rotation speed is high, it is desirable to make this angle as small as possible.

Further, the number of rotations of the blade in the thin groove processing machine is very large, and sometimes reaches 60,000 rpm. In such a case, in the groove shape shown in FIGS. 1 and 2, it may happen that the cooling liquid does not sufficiently enter the groove. The second embodiment is designed to solve this problem. 3A and 3B are views showing a groove shape in the second embodiment, FIG. 3A is a view as seen from a direction perpendicular to the rotary shaft, and FIG. 3B is a cross-sectional view including the rotary shaft. Indicates.

As shown in FIG. 3, in the second embodiment, grooves are formed on the inclined surfaces of the flange 2 and the pedestal 16 as in the first embodiment, but the grooves are inclined in the circumferential direction. Therefore, one wall in the circumferential direction is eliminated, and the cooling liquid is more likely to enter the groove when rotated. The cutting fluid in the groove is the wall 6
It moves to the outside along 3 and is scattered. Although the embodiment of the present invention has been described above, it is apparent from the above description that various modifications can be made to the shape of the groove.

Further, the shape suitable for the cooling liquid sprayed from the nozzle to be sprayed toward the processing part before the processing part has been described, but as shown in FIG. 5, the cooling liquid is sprayed over the entire processing part. The cooling liquid is supplied from the supply pipe 3, and the groove according to the present invention also acts to apply the cooling liquid at a high speed toward the already processed thin groove,
It seems that it also contributes greatly to the removal of processing chips from the entire surface of the work piece.

[0027]

As is apparent from the above description, according to the present invention, the cooling liquid can be efficiently supplied to the processed portion and the cooling liquid can be supplied to the processed portion with a strong pressure. The supply amount of the liquid is reduced, and the processing waste can be efficiently removed. As a result, in the thin groove processing machine, it is possible to reduce the cost by reducing the supply amount of the cooling liquid and improve the processing accuracy by reducing the influence of the processing waste.

[Brief description of drawings]

FIG. 1 is a view of a blade, a flange and a pedestal portion of a first embodiment of the present invention.

FIG. 2 is a diagram showing in detail a groove shape in the first embodiment.

FIG. 3 is a diagram showing details of a groove shape in a second embodiment.

FIG. 4 is a perspective view showing a basic configuration of a conventional thin groove processing machine.

FIG. 5 is a diagram showing a supply state of a cooling liquid from a cooling liquid supply pipe in a conventional thin groove processing machine.

FIG. 6 is a view showing a conventional example in which cutting fluid is jetted from a nozzle beside a blade toward a center of rotation.

[Explanation of symbols]

 1 ... Whetstone blade (blade) 2 ... Flange 3 ... Cutting fluid supply pipe 6 ... Groove 16 ... Pedestal 25 ... Nozzle 100 ... Workpiece 101 ... Stage

Claims (3)

[Claims] 1. A grindstone blade (1) rotating at a high speed, a pedestal (16) fixed to a rotating shaft to which the grindstone blade (1) is attached, and the grindstone blade (1) fixed to the pedestal (16). A thin grooving machine comprising a flange (2), wherein at least one of the flange (2) or the pedestal (16) comprises a plurality of grooves (6) on the surface in the direction of radiation about the center of rotation. Thin groove processing machine characterized by that. 2. The flange (2) or the pedestal (16) comprising the plurality of grooves (6) has a central portion thicker than a peripheral portion, and a wall () inside the groove (6) in the radiation direction. 6
Thin groove machine according to claim 1, characterized in that 1) is higher on the outer wall in the direction of the radiation. 3. Thin groove machine according to claim 1 or 2, characterized in that one wall (63) of the groove in the direction of rotation of the flange is higher than the other wall (62).